CN104717851A - Electronic instrument - Google Patents
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- CN104717851A CN104717851A CN201310683454.9A CN201310683454A CN104717851A CN 104717851 A CN104717851 A CN 104717851A CN 201310683454 A CN201310683454 A CN 201310683454A CN 104717851 A CN104717851 A CN 104717851A
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Abstract
The embodiment of the invention discloses an electronic instrument. The electronic instrument comprises a shell which comprises one or more material layers distributed in a first state, and the one or more material layers distributed in the first state are integrally connected and molded through a first processing technology; each material layer in the one or more material layers comprises one or more materials; the one or more materials at least comprise a first material; the first material in the one or more material layers is continuously distributed; the first material has the insulativity. By means of the technical scheme in the embodiment, signal shielding caused by the fact that a shell of the electronic instrument is completely made of a conductor material is effectively avoided, the communication quality of the electronic instrument is guaranteed, and the industrial production cost is reduced.
Description
Technical field
The present invention relates to terminal equipment, be specifically related to a kind of electronic equipment.
Background technology
At present, portable electronic equipment is more and more higher for light-weighted requirement, and carbon fibre material has high strength and low-density feature, is also more and more applied on electronic equipment.But carbon fiber is natural conductor, the main material as shell can cause signal shielding, and the receiver of wireless signal cannot normally be worked.Although can adopt and imbed the signal shielding problem that jetting formation process solves carbon fiber skin, this technique is very high to the requirement of Tool and Die Technology, the making of mould needs very meticulous, and therefore industrial production cost is higher.
Summary of the invention
For solving the technical problem of existing existence, the embodiment of the present invention provides a kind of electronic equipment, the housing of electronic equipment can be avoided all to be made up of conductor material and the signal shielding caused, and reduce industrial cost.
For achieving the above object, the technical scheme of the embodiment of the present invention is achieved in that
Embodiments provide a kind of electronic equipment, described electronic equipment includes housing, described housing comprises the material layer more than with one deck of the first form arrangement, makes described to connect as one with material layer more than one deck of first form arrangement and shaping by the first treatment process;
Material layer in the above material layer of described one deck comprises more than one material;
More than one material described at least comprises the first material;
Wherein, the first material in the above material layer of described one deck is arranged continuously; Described first material has insulating properties.
The electronic equipment that the embodiment of the present invention provides, described electronic equipment includes housing, described housing comprises the material layer more than with one deck of the first form arrangement, by the first treatment process, the described more than one material layer with the first form arrangement is connected as one and shaping; Material layer in the above material layer of described one deck comprises more than one material; More than one material described at least comprises the first material; Wherein, the first material in the above material layer of described one deck is arranged continuously; Described first material has insulating properties.So, effectively prevent the housing of electronic equipment to be all made up of conductor material and the signal shielding caused, ensure that the communication quality of electronic equipment, and greatly reduce cost in industrial processes.
Accompanying drawing explanation
Fig. 1 is the generalized section one of the housing of embodiment of the present invention electronic equipment;
Fig. 2 is the generalized section two of the housing of embodiment of the present invention electronic equipment;
Fig. 3 is the generalized section three of the housing of embodiment of the present invention electronic equipment;
Fig. 4 is the generalized section four of the housing of embodiment of the present invention electronic equipment;
Fig. 5 is the generalized section five of the housing of embodiment of the present invention electronic equipment;
Fig. 6 is the generalized section six of the housing of embodiment of the present invention electronic equipment;
Fig. 7 is the generalized section seven of the housing of embodiment of the present invention electronic equipment;
Fig. 8 is the generalized section eight of the housing of embodiment of the present invention electronic equipment;
Fig. 9 is the generalized section nine of the housing of embodiment of the present invention electronic equipment;
Figure 10 is the generalized section ten of the housing of embodiment of the present invention electronic equipment;
Figure 11 is the generalized section 11 of the housing of embodiment of the present invention electronic equipment.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is further detailed explanation.
Embodiment one
Fig. 1 is the generalized section one of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in Figure 1, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, by more than one the prepreg of material described by presetting the superposition of laying scheme, after having superposed by hot press forming technology by whole plate forming.
Wherein, more than one material described at least comprises the first material, and described first material has insulating properties, and the first material in the above material layer of described one deck is arranged continuously; Described first material can be the insulating material that the hardness such as glass fibre, non-conductive durometer plastic is higher, to protect electronic equipment.
Like this, the housing of electronic equipment can be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment.
Embodiment two
Fig. 2 is the generalized section two of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in Figure 2, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, and wherein, more than one material described at least comprises the first material, also comprises the second material; The first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; Wherein, the first material being positioned at described material layer side can be arranged at long limit and the both sides minor face of described housing; Preferably, when described electronic equipment is notebook computer, communication quality during the long limit of the long limit, both sides that the first material being arranged in described material layer side is arranged at described casting of electronic device away from rotating shaft side is optimum.
The prepreg of described first material and the second material is superposed by default laying scheme, after having superposed by hot press forming technology by whole plate forming; Described default laying scheme is in the above material layer of described one deck, the capacity of the first material of every layer of material and the prepreg of the second material, when every layer of material has equal length and thickness, characterized by the width of the first material in every layer of material and the second material.
In addition, more than one material described can also comprise other materials, Fig. 3 and Fig. 4 is generalized section three and the schematic diagram four of the housing of embodiment of the present invention electronic equipment, and more than one material described also comprises the other materials such as the 3rd material; Described 3rd material can intert laying with the second material and superpose, as shown in Figure 3, also can with the second material laid out in parallel, as shown in Figure 4; When comprising the 3rd material, the first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; In like manner, when comprising the other materials such as the 3rd material, the moulding process of described material layer is identical with the moulding process of above-mentioned bi-material, repeats no more herein.
Wherein, described first material has insulating properties; Wherein, described first material can be the insulating material that the hardness such as glass fibre, non-conductive durometer plastic is higher, to protect electronic equipment.
Like this, the housing of electronic equipment can be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment.
Embodiment three
Fig. 5 is the generalized section five of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in Figure 5, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, and wherein, more than one material described at least comprises the first material, also comprises the second material; The first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; Wherein, the first material being positioned at described material layer side can be arranged at long limit and the both sides minor face of described housing; Preferably, when described electronic equipment is notebook computer, communication quality during the long limit of the long limit, both sides that the first material being arranged in described material layer side is arranged at described casting of electronic device away from rotating shaft side is optimum.
The prepreg of described first material and the second material is superposed by default laying scheme, after having superposed by hot press forming technology by whole plate forming; Described default laying scheme is in the above material layer of described one deck, the capacity of the first material of every layer of material and the prepreg of the second material, when every layer of material has equal length and thickness, characterized by the width of the first material in every layer of material and the second material.
Wherein, in described more than one material layer, the first material in outermost material layer has the width of 12mm to 20mm; In described more than one material layer, the first material in the material layer except outermost material layer has 17mm to 25mm width; As shown in Figure 5, the width x of the first material in outermost material layer has the scope of 12mm to 20mm; The width y of the first material in the material layer except outermost material layer has the scope of 17mm to 25mm.
Wherein, described first material has insulating properties; Wherein, described first material can be the insulating material that the hardness such as glass fibre, non-conductive durometer plastic is higher, to protect electronic equipment.
Like this, the housing of electronic equipment can be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment.
Embodiment four
Fig. 6 is the generalized section six of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in Figure 6, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, and wherein, more than one material described at least comprises the first material, also comprises the second material; The first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; Wherein, the first material being positioned at described material layer side can be arranged at long limit and the both sides minor face of described housing; Preferably, when described electronic equipment is notebook computer, communication quality during the long limit of the long limit, both sides that the first material being arranged in described material layer side is arranged at described casting of electronic device away from rotating shaft side is optimum.
The prepreg of described first material and the second material is superposed by default laying scheme, after having superposed by hot press forming technology by whole plate forming; Described default laying scheme is in the above material layer of described one deck, the capacity of the first material of every layer of material and the prepreg of the second material, when every layer of material has equal length and thickness, characterized by the width of the first material in every layer of material and the second material.
Wherein, in described more than one material layer, the first material in outermost material layer has the width of 12mm to 20mm; In described more than one material layer, the first material in the material layer except outermost material layer has 17mm to 25mm width; As shown in Figure 6, the width x of the first material in outermost material layer has the scope of 12mm to 20mm; The width y of the first material in the material layer except outermost material layer has the scope of 17mm to 25mm.
Wherein, in described more than one material layer, described first material and described second material are respectively by presetting fiber direction arrangement, and as shown in Figure 6, housing comprises eight layer of material; Wherein, in ground floor material layer, the fiber direction of the first material is set to 0 degree, and the fiber direction of the second material is set to 90 degree; In second layer material layer, the fiber direction of the first material is set to 90 degree, and the fiber direction of the second material is set to 0 degree; In third layer material layer, the fiber direction of the first material is set to 90 degree, and the fiber direction of the second material is set to 90 degree; In 4th layer of material, the fiber direction of the first material is set to 0 degree, and the fiber direction of the second material is set to 90 degree; In layer 5 material layer, the fiber direction of the first material is set to 0 degree, and the fiber direction of the second material is set to 90 degree; In layer 6 material layer, the fiber direction of the first material is set to 90 degree, and the fiber direction of the second material is set to 90 degree; In layer 7 material layer, the fiber direction of the first material is set to 90 degree, and the fiber direction of the second material is set to 0 degree; In 8th layer of material, the fiber direction of the first material is set to 0 degree, and the fiber direction of the second material is set to 90 degree; Wherein, the fiber direction of described material is relative direction, if the fiber direction setting a certain material is 0 degree, then the direction that the fiber direction of described material is vertical is 90 degree.
Wherein, described first material has insulating properties; Wherein, described first material can be the insulating material that the hardness such as glass fibre, non-conductive durometer plastic is higher, to protect electronic equipment.
Like this, the housing of electronic equipment can be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment.
Embodiment five
Fig. 7 is the generalized section seven of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in Figure 7, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, and wherein, more than one material described at least comprises the first material, also comprises the second material; The first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; Wherein, the first material being positioned at described material layer side can be arranged at long limit and the both sides minor face of described housing; Preferably, when described electronic equipment is notebook computer, communication quality during the long limit of the long limit, both sides that the first material being arranged in described material layer side is arranged at described casting of electronic device away from rotating shaft side is optimum.
The prepreg of described first material and the second material is superposed by default laying scheme, after having superposed by hot press forming technology by whole plate forming; Described default laying scheme is in the above material layer of described one deck, the capacity of the first material of every layer of material and the prepreg of the second material, when every layer of material has equal length and thickness, characterized by the width of the first material in every layer of material and the second material.
Wherein, in described more than one material layer, the first material in outermost material layer has the width of 12mm to 20mm; In described more than one material layer, the first material in the material layer except outermost material layer has 17mm to 25mm width; As shown in Figure 7, the width x of the first material in outermost material layer has the scope of 12mm to 20mm; The width y of the first material in the material layer except outermost material layer has the scope of 17mm to 25mm.
Wherein, described first material has insulating properties; In the present embodiment, described first material is glass fibre, to ensure communication quality;
Wherein, described second material is carbon fiber, the second material in described more than one material layer is tensile modulus is 24 tons of carbon fibers to any one in 80 tons, and the second material in outermost material layer is tensile modulus is 65 tons of carbon fibers to any one in 80 tons; In the present embodiment, to be tensile modulus the be carbon fiber of 65 tons of the second material in outermost material layer, to be tensile modulus the be carbon fiber of 24 tons of the second material in all the other each material layers.
Like this, the housing of electronic equipment can be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment; In addition, by adopting the higher carbon fibre material of hardness as outermost layer, effectively electronic equipment can be protected.
Embodiment six
Fig. 8 is the generalized section eight of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in Figure 8, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, and wherein, more than one material described at least comprises the first material, also comprises the second material; The first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; Wherein, the first material being positioned at described material layer side can be arranged at long limit and the both sides minor face of described housing; Preferably, when described electronic equipment is notebook computer, communication quality during the long limit of the long limit, both sides that the first material being arranged in described material layer side is arranged at described casting of electronic device away from rotating shaft side is optimum.
The prepreg of described first material and the second material is superposed by default laying scheme, after having superposed by hot press forming technology by whole plate forming; Described default laying scheme is in the above material layer of described one deck, the capacity of the first material of every layer of material and the prepreg of the second material, when every layer of material has equal length and thickness, characterized by the width of the first material in every layer of material and the second material.
Wherein, in described more than one material layer, the first material in outermost material layer has the width of 12mm to 20mm; In described more than one material layer, the first material in the material layer except outermost material layer has 17mm to 25mm width; As shown in Figure 8, the width x of the first material in outermost material layer has the scope of 12mm to 20mm; The width y of the first material in the material layer except outermost material layer has the scope of 17mm to 25mm.
Wherein, described first material has insulating properties; In the present embodiment, described first material is glass fibre, to ensure communication quality;
Wherein, described second material is carbon fiber, the second material in described more than one material layer is tensile modulus is 24 tons of carbon fibers to any one in 80 tons, and the second material in outermost material layer is tensile modulus is 65 tons of carbon fibers to any one in 80 tons; In the present embodiment, to be tensile modulus the be carbon fiber of 80 tons of the second material in outermost material layer.
Like this, the housing of electronic equipment can be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment; In addition, by adopting the higher carbon fibre material of hardness as outermost layer, effectively electronic equipment can be protected.
Embodiment seven
Fig. 9 is the generalized section nine of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in Figure 9, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, and wherein, more than one material described at least comprises the first material, also comprises the second material; The first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; Wherein, the first material being positioned at described material layer side can be arranged at long limit and the both sides minor face of described housing; Preferably, when described electronic equipment is notebook computer, communication quality during the long limit of the long limit, both sides that the first material being arranged in described material layer side is arranged at described casting of electronic device away from rotating shaft side is optimum.
The prepreg of described first material and the second material is superposed by default laying scheme, after having superposed by hot press forming technology by whole plate forming; Described default laying scheme is in the above material layer of described one deck, the capacity of the first material of every layer of material and the prepreg of the second material, when every layer of material has equal length and thickness, characterized by the width of the first material in every layer of material and the second material.
Wherein, in described more than one material layer, the first material in outermost material layer has the width of 12mm to 20mm; In described more than one material layer, the first material in the material layer except outermost material layer has 17mm to 25mm width; As shown in Figure 9, the width x of the first material in outermost material layer has the scope of 12mm to 20mm; The width y of the first material in the material layer except outermost material layer has the scope of 17mm to 25mm.
Wherein, described first material has insulating properties; In the present embodiment, described first material is glass fibre, to ensure communication quality;
Wherein, described second material is carbon fiber, the second material in described more than one material layer is tensile modulus is 24 tons of carbon fibers to any one in 80 tons, and the second material in outermost material layer is tensile modulus is 65 tons of carbon fibers to any one in 80 tons; In the present embodiment, to be tensile modulus the be carbon fiber of 65 tons of the second material in outermost material layer, to be tensile modulus the be carbon fiber of 24 tons of the second material except outermost material layer.
Wherein, in described more than one material layer, described glass fiber material and described carbon fibre material are respectively by presetting fiber direction arrangement, and as shown in Figure 9, housing comprises ten layer of material; Wherein, in ground floor material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 65 tons is set to 90 degree; In second layer material layer, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 0 degree; In third layer material layer, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In 4th layer of material, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In layer 5 material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In layer 6 material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In layer 7 material layer, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In 8th layer of material, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In 9th layer of material, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 0 degree; In tenth layer of material, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 65 tons is set to 90 degree; Wherein, the fiber direction of described material is relative direction, if the fiber direction of setting material is 0 degree, then the direction that described fiber direction is vertical is 90 degree.
Wherein, the number of plies of described more than one material layer is relevant with the selection of the second material, in the present embodiment, described outer field carbon fibre material have chosen the carbon fibre material that tensile modulus is 65 tons, after the fiber direction optimizing every layer material, make the number of plies of described more than one material layer be ten layers, the thickness of shell of ten layers is about 1.3mm, reaches and can reduce again the object of industrial production cost by available protecting electronic equipment; Further, the housing of electronic equipment can also be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment.
Embodiment eight
Figure 10 is the generalized section ten of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in Figure 10, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, and wherein, more than one material described at least comprises the first material, also comprises the second material; The first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; Wherein, the first material being positioned at described material layer side can be arranged at long limit and the both sides minor face of described housing; Preferably, when described electronic equipment is notebook computer, communication quality during the long limit of the long limit, both sides that the first material being arranged in described material layer side is arranged at described casting of electronic device away from rotating shaft side is optimum.
The prepreg of described first material and the second material is superposed by default laying scheme, after having superposed by hot press forming technology by whole plate forming; Described default laying scheme is in the above material layer of described one deck, the capacity of the first material of every layer of material and the prepreg of the second material, when every layer of material has equal length and thickness, characterized by the width of the first material in every layer of material and the second material.
Wherein, in described more than one material layer, the first material in outermost material layer has the width of 12mm to 20mm; In described more than one material layer, the first material in the material layer except outermost material layer has 17mm to 25mm width; As shown in Figure 10, the width x of the first material in outermost material layer has the scope of 12mm to 20mm; The width y of the first material in the material layer except outermost material layer has the scope of 17mm to 25mm.
Wherein, described first material has insulating properties; In the present embodiment, described first material is glass fibre, to ensure communication quality;
Wherein, described second material is carbon fiber, the second material in described more than one material layer is tensile modulus is 24 tons of carbon fibers to any one in 80 tons, and the second material in outermost material layer is tensile modulus is 65 tons of carbon fibers to any one in 80 tons; In the present embodiment, to be tensile modulus the be carbon fiber of 80 tons of the second material in outermost material layer.
Wherein, in described more than one material layer, described glass fiber material and described carbon fibre material are respectively by presetting fiber direction arrangement, and as shown in Figure 9, housing comprises eight layer of material; Wherein, in ground floor material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 80 tons is set to 90 degree; In second layer material layer, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 80 tons is set to 0 degree; In third layer material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In 4th layer of material, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In layer 5 material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In layer 6 material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In layer 7 material layer, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 80 tons is set to 0 degree; In 8th layer of material, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 80 tons is set to 90 degree; Wherein, the fiber direction of described material is relative direction, if the fiber direction of setting material is 0 degree, then the direction that described fiber direction is vertical is 90 degree.
Wherein, the number of plies of described more than one material layer is relevant with the selection of the second material, in the present embodiment, described outer field carbon fibre material have chosen the carbon fibre material that tensile modulus is 80 tons, after the fiber direction optimizing every layer material, make the number of plies of described more than one material layer be reduced to eight layers, the thickness of shell of eight layers is about 1mm, and reaching can the available protecting electronic equipment object that the housing of electronic equipment can be made again frivolous; Further, the housing of electronic equipment can also be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment.
Embodiment nine
Figure 11 is the generalized section 11 of the housing of embodiment of the present invention electronic equipment, and described electronic equipment can be notebook computer, panel computer, mobile phone etc.; As shown in figure 11, described housing comprises the material layer of more than one deck, and material layer more than described one deck is by the first form arrangement, and described first form is the form of upper and lower laying; The described more than one material layer with the first form arrangement to be connected as one by the first treatment process and shaping, and described first treatment process can be hot press forming technology.
Material layer in the above material layer of described one deck comprises more than one material, and wherein, more than one material described at least comprises the first material, also comprises the second material; The first material in the above material layer of described one deck is all arranged at the side of described material layer, and the first material in the above material layer of described one deck is arranged continuously; Wherein, the first material being positioned at described material layer side can be arranged at long limit and the both sides minor face of described housing; Preferably, when described electronic equipment is notebook computer, communication quality during the long limit of the long limit, both sides that the first material being arranged in described material layer side is arranged at described casting of electronic device away from rotating shaft side is optimum.
The prepreg of described first material and the second material is superposed by default laying scheme, after having superposed by hot press forming technology by whole plate forming; Described default laying scheme is in the above material layer of described one deck, the capacity of the first material of every layer of material and the prepreg of the second material, when every layer of material has equal length and thickness, characterized by the width of the first material in every layer of material and the second material.
Wherein, in described more than one material layer, the first material in outermost material layer has the width of 12mm to 20mm; In described more than one material layer, the first material in the material layer except outermost material layer has 17mm to 25mm width (in the present embodiment, except the 4th material layer and the 5th material layer); As shown in figure 11, the width x of the first material in outermost material layer has the scope of 12mm to 20mm; The width y of the first material in the material layer except outermost material layer has the scope of 17mm to 25mm.
Wherein, described first material has insulating properties; In the present embodiment, described first material is glass fibre, to ensure communication quality;
Wherein, described second material is carbon fiber, the second material in described more than one material layer is tensile modulus is 24 tons of carbon fibers to any one in 80 tons, and the second material in outermost material layer is tensile modulus is 65 tons of carbon fibers to any one in 80 tons; In the present embodiment, to be tensile modulus the be carbon fiber of 80 tons of the second material in outermost material layer.
In the present embodiment, in described more than one material layer, described glass fiber material and described carbon fibre material are respectively by presetting fiber direction arrangement, and as shown in Figure 9, housing comprises eight layer of material; Wherein, in ground floor material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 80 tons is set to 90 degree; In second layer material layer, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 80 tons is set to 0 degree; In third layer material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; 4th layer of material and layer 5 material layer are glass fiber material, comprise the glass fiber material that fiber direction is set to 0 degree; In layer 6 material layer, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 24 tons is set to 90 degree; In layer 7 material layer, the fiber direction of glass fiber material is set to 90 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 80 tons is set to 0 degree; In 8th layer of material, the fiber direction of glass fiber material is set to 0 degree, and tensile modulus is that the fiber direction of the carbon fibre material of 80 tons is set to 90 degree; Wherein, the fiber direction of described material is relative direction, if the fiber direction of setting material is 0 degree, then the direction that described fiber direction is vertical is 90 degree.
Wherein, the number of plies of described more than one material layer is relevant with the selection of the second material, in the present embodiment, described outer field carbon fibre material have chosen the carbon fibre material that tensile modulus is 80 tons, after the fiber direction optimizing every layer material, make the number of plies of described more than one material layer be reduced to eight layers, the thickness of shell of eight layers is about 1mm, and reaching can the available protecting electronic equipment object that the housing of electronic equipment can be made again frivolous; Further, the housing of electronic equipment can also be avoided all to be made up of conductor material and the signal shielding caused, thus ensure that the communication quality of electronic equipment; In addition, in the 4th layer of centre and layer 5 material layer, all have chosen glass fiber material, effectively reduce industrial cost.
In several embodiments that the application provides, should be understood that, disclosed equipment can realize by another way.Apparatus embodiments described above is only schematic, and actual can have other dividing mode, as some features can be ignored when realizing.In addition, the coupling each other of shown or discussed each part or direct-coupling or communication connection can be by some interfaces, and the indirect coupling of equipment or unit or communication connection can be electrical, machinery or other form.
The above-mentioned unit illustrated as separating component or can may not be and physically separates, and the parts as unit display can be or may not be physical location; Part or all of unit wherein can be selected according to the actual needs to realize the object of the present embodiment scheme.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (10)
1. an electronic equipment, described electronic equipment includes housing, it is characterized in that, described housing comprises the material layer more than with one deck of the first form arrangement, makes described to connect as one with material layer more than one deck of first form arrangement and shaping by the first treatment process;
Material layer in the above material layer of described one deck comprises more than one material;
More than one material described at least comprises the first material;
Wherein, the first material in the above material layer of described one deck is arranged continuously; Described first material has insulating properties.
2. electronic equipment according to claim 1, is characterized in that, more than one material described also comprises the second material;
The first material in the above material layer of described one deck is all arranged at the side of described material layer.
3. electronic equipment according to claim 2, is characterized in that,
In described more than one material layer, the first material in outermost material layer has the width of 12mm to 20mm;
In described more than one material layer, the first material in the material layer except outermost material layer has 17mm to 25mm width.
4. electronic equipment according to claim 3, is characterized in that, in described more than one material layer, described first material and described second material are respectively by presetting fiber direction arrangement.
5. electronic equipment according to claim 4, is characterized in that, in described more than one material layer, the second material in outermost material layer is tensile modulus is 65 tons of carbon fibers to any one in 80 tons.
6. electronic equipment according to claim 5, it is characterized in that, when the second material in described outermost material layer be tensile modulus is the carbon fiber of 65 tons, in described more than one material layer, to be tensile modulus the be carbon fiber of 24 tons of the second material in the material layer except outermost material layer.
7. electronic equipment according to claim 5, it is characterized in that, when the second material in described outermost material layer be tensile modulus is the carbon fiber of 80 tons, in described more than one material layer, to be tensile modulus the be carbon fiber of 80 tons of the second material in first time cladding material layer;
To be tensile modulus the be carbon fiber of 24 tons of the second material except described outermost material layer and first time cladding material layer.
8. electronic equipment according to claim 4, is characterized in that, described more than one material layer comprises eight layers; In described more than one material layer, the 4th layer is formed by described first material with layer 5;
Ground floor, the second layer, third layer, layer 6, layer 7, the 8th layer formed by the first material and the second material.
9. electronic equipment according to claim 8, is characterized in that, ground floor, the first material in the 8th layer have the width of 12mm to 20mm;
The first material in the second layer, third layer, layer 6, layer 7 has 17mm to 25mm width.
10. electronic equipment according to claim 9, is characterized in that, ground floor, the second layer, layer 7, the second material in the 8th layer to be tensile modulus the be carbon fiber of 80 tons;
To be tensile modulus the be carbon fiber of 24 tons of the second material in third layer, layer 6.
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| CN201310683454.9A CN104717851B (en) | 2013-12-12 | 2013-12-12 | A kind of electronic equipment |
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| CN104717851B CN104717851B (en) | 2018-07-06 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056431A (en) * | 2009-10-29 | 2011-05-11 | 昆山同寅兴业机电制造有限公司 | Local structure of case at wireless equipment |
| US20120162921A1 (en) * | 2010-12-23 | 2012-06-28 | Compal Electronics, Inc. | Shell structure and electronic device having the same |
| CN202587628U (en) * | 2011-11-25 | 2012-12-05 | 曾凯熙 | Composite material housing of electronic product for preventing signal block |
| CN102970837A (en) * | 2011-08-31 | 2013-03-13 | 华硕电脑股份有限公司 | Rigid reinforced composite material and manufacturing method thereof |
-
2013
- 2013-12-12 CN CN201310683454.9A patent/CN104717851B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056431A (en) * | 2009-10-29 | 2011-05-11 | 昆山同寅兴业机电制造有限公司 | Local structure of case at wireless equipment |
| US20120162921A1 (en) * | 2010-12-23 | 2012-06-28 | Compal Electronics, Inc. | Shell structure and electronic device having the same |
| CN102970837A (en) * | 2011-08-31 | 2013-03-13 | 华硕电脑股份有限公司 | Rigid reinforced composite material and manufacturing method thereof |
| CN202587628U (en) * | 2011-11-25 | 2012-12-05 | 曾凯熙 | Composite material housing of electronic product for preventing signal block |
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