CN102056431A - Local structure of case at wireless equipment - Google Patents
Local structure of case at wireless equipment Download PDFInfo
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- CN102056431A CN102056431A CN2009102128210A CN200910212821A CN102056431A CN 102056431 A CN102056431 A CN 102056431A CN 2009102128210 A CN2009102128210 A CN 2009102128210A CN 200910212821 A CN200910212821 A CN 200910212821A CN 102056431 A CN102056431 A CN 102056431A
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- conducing composite
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Abstract
The invention discloses a local structure of a case at wireless equipment. The part of the case at the wireless equipment is defined to be a case local, wherein the carbon fiber thickness of the case local is smaller than that of surrounding parts of the case, and the carbon fiber thickness of the case local has no influence on emitting and receiving signals of the wireless equipment; a part of the case local, which is thinner than the surrounding case, is filled with a non-conducting layer tightly connected with the surrounding carbon fiber layer, thus the thickness of the carbon fiber layer of the case at the wireless equipment is reduced so as to reduce the shielding of the carbon fibers to wireless signals; and the reduced part is replaced with other non-conducting materials so as to guarantee due thickness and strength of the case local.
Description
Technical field
The present invention relates to a kind of partial structurtes of conducing composite material casing, specifically relate to a kind of local casing structure that wireless device is outside and be beneficial to the reception of wireless device signal and launch that is positioned at.
Background technology
Electronic product such as notebook, mobile phone often adopts conducing composite material to make its casing, and the carbon fibre material thermal diffusivity in the conducing composite material is strong, intensity is high, shielding good.In nonmetallic materials, the intensity of carbon fiber is the highest, almost can regard as equal with metal material; Though carbon fiber be not metal thermal diffusivity and metal material are much at one or close because it is a conductor; Because carbon fiber is a conductor, can play pretty good shielding action, will get well compared with the shield effectiveness of ABS engineering plastics and makrolon material, carbon fibre material can be kept out general electromagnetic interference substantially.Therefore carbon fibre material is the casing preferred material of products such as notebook, mobile phone.But, can produce shielding, so can influence reception such as notebook or mobile phone and transmit electromagnetic wave just because of carbon fiber is an electric conducting material.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of casing partial structurtes that are positioned at the wireless device place, these casing partial structurtes that are positioned at the wireless device place have been reduced the conducing composite material layer thickness of the casing part that is positioned at the wireless device place, and with other electrically non-conductive material substitute by the reduction part, reduce the shielding of conducing composite material with this, guarantee local due thickness of casing and intensity simultaneously wireless signal.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of casing partial structurtes that are positioned at the wireless device place, the whole main conducing composite material that adopts of described casing, the position that described casing is positioned at the wireless device place is defined as the casing part, the conducing composite material layer thickness of described casing part is less than the conducing composite material layer thickness of casing around it, and the conducing composite material layer thickness of described casing part does not influence the emission and the reception of described wireless device signal, the partially filled of casing had non-conductive layer around described casing part was thinner than it, and described non-conductive layer closely is connected with its conducing composite material layer on every side.Promptly shortened the conducing composite material layer thickness of the casing part that is positioned at the wireless device place and substituted quilt reduction part, both guaranteed local due thickness of casing and intensity, reduced the shielding of conducing composite material again wireless signal with electrically non-conductive material.
Further technical scheme of the present invention is:
Described casing part can not have the conducing composite material layer, and described casing part all is made of described non-conductive layer.The conducing composite material layer thickness that is about to the casing part is reduced to zero, is substituted by non-conductive layer fully.
Described casing part also can be made up of described non-conductive layer and described conducing composite material layer.Be a certain amount of thickness that reduces the local conducing composite material layer of casing, reduce part and substitute with non-conductive layer.
The gross thickness of described casing part is identical or close with the thickness of casing around it.
Described conducing composite material is a carbon fiber.
The invention has the beneficial effects as follows: these casing partial structurtes that are positioned at the wireless device place have been reduced the conducing composite material layer thickness of the casing part that is positioned at the wireless device place, reduce the shielding of conducing composite material with this to wireless signal, and substitute by the reduction part with other electrically non-conductive material, guarantee local due thickness of casing and intensity with this.
Description of drawings
Fig. 1 is one of structural representation of the present invention (described casing part is made up of non-conductive layer and conducing composite material layer, and described non-conductive layer is than the more close described wireless device of described conducing composite material layer);
Fig. 2 is two (described casing part is made up of non-conductive layer and conducing composite material layer, and described conducing composite material layer is than the more close described wireless device of described non-conductive layer) of structural representation of the present invention;
Fig. 3 is three (described casing part all is made of non-conductive layer) of structural representation of the present invention;
Fig. 4 is four (described casing part all is made of non-conductive layer, and described casing part is positioned at the edge of casing) of structural representation of the present invention;
Fig. 5 is that the wireless device of notebook is at the middle part of casing schematic diagram;
Fig. 6 is that the wireless device of notebook is at cabinet cover rotating shaft place schematic diagram;
Fig. 7 is that the wireless device of mobile phone is at casing middle and upper part schematic diagram;
Fig. 8 is that the wireless device of mobile phone is at casing middle and lower part schematic diagram;
Fig. 9 is the edge schematic diagram of the wireless device of notebook at casing;
Figure 10 for the wireless device of notebook at the edge of casing and be positioned at loam cake rear schematic diagram.
Embodiment
Embodiment: a kind of casing partial structurtes that are positioned at the wireless device place, the described casing 1 whole main conducing composite material that adopts, the position that described casing is positioned at wireless device 2 places is defined as casing part 3, the conducing composite material layer thickness of described casing part is less than the conducing composite material layer thickness of casing around it, and the conducing composite material layer thickness of described casing part does not influence the emission and the reception of described wireless device signal, the partially filled of casing had non-conductive layer 31 around described casing part was thinner than it, and described non-conductive layer closely is connected with its conducing composite material layer on every side.Promptly shortened the conducing composite material layer thickness of the casing part that is positioned at the wireless device place and substituted quilt reduction part, both guaranteed local due thickness of casing and intensity, reduced the shielding of conducing composite material again wireless signal with electrically non-conductive material.
Described casing part can not have the conducing composite material layer, and described casing part all is made of described non-conductive layer.The conducing composite material layer thickness that is about to the casing part is reduced to zero, is substituted by non-conductive layer fully.
Described casing part also can be made up of described non-conductive layer and described conducing composite material layer.Be a certain amount of thickness that reduces the local conducing composite material layer of casing, reduce part and substitute with non-conductive layer.
The gross thickness of described casing part is identical or close with the thickness of casing around it.
Described conducing composite material can be a carbon fiber.The structure of carbon fiber layer comprises plain weave, twill weave and unidirectional weaving carbon fiber (UD).
Described non-conductive layer 31 material that is adopted can be one deck or which floor glass fibre or other various plastic materials.
Described wireless device comprises wireless network card that products such as notebook, mobile phone use or bluetooth etc.
Enumerate several structure of the present invention and manufacture method below:
1, structure as shown in Figure 1, described casing part is made up of non-conductive layer and conducing composite material layer, and described non-conductive layer is than the more close described wireless device of described conducing composite material layer, processing procedure is: the size that mills out non-conductive layer structure by CNC milling machine at conducing composite material layer structure inner surface, and bond in order to fill non-conductive layer structure by modes such as injection mouldings, get product;
2, structure as shown in Figure 2, described casing part is made up of non-conductive layer and conducing composite material layer, and described conducing composite material layer is than the more close described wireless device of described non-conductive layer, processing procedure is: pre-type piles up structure as described in Figure 2, general non-conductive layer material adopts glass fiber material to replace, and obtains finished product then after moulding;
3, the structure shown in Fig. 3,4, described casing part all is made of non-conductive layer, processing procedure can adopt following two kinds of methods: first method is the size that mills out non-conductive layer structure by CNC milling machine on the conducing composite material layer structure of casing, bond in order to the non-conductive layer structure of filling by modes such as injection mouldings, get product; Second method is that pre-type piles up as Fig. 3,4 described structures, and general non-conductive layer material adopts glass fiber material to replace, and directly obtains finished product after hot-forming then.The wireless device of notebook is at the middle part of casing among Fig. 5, and promptly the cross-section structure at the 3A shown in Fig. 5,3B place as shown in Figure 3; The wireless device of notebook is positioned at cabinet cover rotating shaft place among Fig. 6, and promptly the cross-section structure at the 3C place shown in Fig. 6 as shown in Figure 3; The wireless device of mobile phone is positioned at the middle and upper part of casing among Fig. 7, and promptly the cross-section structure at the 3D place shown in Fig. 7 as shown in Figure 3; The wireless device of mobile phone is positioned at the middle and lower part of casing among Fig. 8, and promptly the cross-section structure at the 3E place shown in Fig. 8 as shown in Figure 3.The wireless device of notebook is positioned at the casing edge among Fig. 9, and promptly the cross-section structure at the 3F among Fig. 9,3G, 3H, 3I place as shown in Figure 4; The wireless device of notebook is positioned at the casing edge and is positioned at the loam cake rear among Figure 10, and promptly the cross-section structure at the 3J place shown in Figure 10 as shown in Figure 4.
Said structure and processing procedure only are better explanation creation of the present invention, are not limitation of the present invention, and other scheme that falls in the claim scope of the present invention all belongs to protection scope of the present invention.
Claims (6)
1. casing partial structurtes that are positioned at the wireless device place, the whole main conducing composite material that adopts of described casing (1), it is characterized in that: described casing is positioned at the position that wireless device (2) locates is defined as casing part (3), the conducing composite material layer thickness of described casing part is less than the conducing composite material layer thickness of casing around it, and the conducing composite material layer thickness of described casing part does not influence the emission and the reception of described wireless device signal, described casing part is thinner than casing around it partially filledly has a non-conductive layer (31), and described non-conductive layer closely is connected with its conducing composite material layer on every side.
2. the casing partial structurtes that are positioned at the wireless device place according to claim 1 is characterized in that: the local no described conducing composite material layer of described casing, and described casing part all is made of described non-conductive layer.
3. the casing partial structurtes that are positioned at the wireless device place according to claim 1 is characterized in that: described casing part is made up of described non-conductive layer and described conducing composite material layer.
4. the casing partial structurtes that are positioned at the wireless device place according to claim 1 is characterized in that: the gross thickness of described casing part is identical with the thickness of casing around it.
5. the casing partial structurtes that are positioned at the wireless device place according to claim 1 is characterized in that: thickness of casing is close around the gross thickness of described casing part and its.
6. according to the described casing partial structurtes that are positioned at the wireless device place of one of claim 1 to 5, it is characterized in that: described conducing composite material is a carbon fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102128210A CN102056431A (en) | 2009-10-29 | 2009-10-29 | Local structure of case at wireless equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102128210A CN102056431A (en) | 2009-10-29 | 2009-10-29 | Local structure of case at wireless equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102056431A true CN102056431A (en) | 2011-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102128210A Pending CN102056431A (en) | 2009-10-29 | 2009-10-29 | Local structure of case at wireless equipment |
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| CN (1) | CN102056431A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037642A (en) * | 2011-09-30 | 2013-04-10 | 深圳富泰宏精密工业有限公司 | Shell, electronic device using the same and manufacturing method thereof |
| CN103847110A (en) * | 2012-12-04 | 2014-06-11 | 联想(北京)有限公司 | Method for manufacturing housing, housing and electronic equipment |
| CN103935045A (en) * | 2013-01-21 | 2014-07-23 | 汉达精密电子(昆山)有限公司 | Carbon fiber processing method and carbon fiber product |
| CN104160684A (en) * | 2012-03-12 | 2014-11-19 | 日本电气株式会社 | Portable terminal device |
| CN104717851A (en) * | 2013-12-12 | 2015-06-17 | 联想(北京)有限公司 | Electronic instrument |
-
2009
- 2009-10-29 CN CN2009102128210A patent/CN102056431A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037642A (en) * | 2011-09-30 | 2013-04-10 | 深圳富泰宏精密工业有限公司 | Shell, electronic device using the same and manufacturing method thereof |
| CN104160684A (en) * | 2012-03-12 | 2014-11-19 | 日本电气株式会社 | Portable terminal device |
| CN103847110A (en) * | 2012-12-04 | 2014-06-11 | 联想(北京)有限公司 | Method for manufacturing housing, housing and electronic equipment |
| CN103935045A (en) * | 2013-01-21 | 2014-07-23 | 汉达精密电子(昆山)有限公司 | Carbon fiber processing method and carbon fiber product |
| CN104717851A (en) * | 2013-12-12 | 2015-06-17 | 联想(北京)有限公司 | Electronic instrument |
| CN104717851B (en) * | 2013-12-12 | 2018-07-06 | 联想(北京)有限公司 | A kind of electronic equipment |
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Application publication date: 20110511 |