CN104708930A - Nanometer metal particle-containing conductive ink-based printing method - Google Patents
Nanometer metal particle-containing conductive ink-based printing method Download PDFInfo
- Publication number
- CN104708930A CN104708930A CN201310680680.1A CN201310680680A CN104708930A CN 104708930 A CN104708930 A CN 104708930A CN 201310680680 A CN201310680680 A CN 201310680680A CN 104708930 A CN104708930 A CN 104708930A
- Authority
- CN
- China
- Prior art keywords
- conductive ink
- printing
- metal
- containing nano
- metal particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007639 printing Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 44
- 239000002923 metal particle Substances 0.000 title claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 60
- 238000007641 inkjet printing Methods 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000005245 sintering Methods 0.000 claims abstract description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 239000004332 silver Substances 0.000 claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 8
- 239000000976 ink Substances 0.000 claims description 81
- 238000010438 heat treatment Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000000889 atomisation Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 2
- 239000007921 spray Substances 0.000 claims 2
- 239000004411 aluminium Substances 0.000 claims 1
- 238000009768 microwave sintering Methods 0.000 claims 1
- 238000004064 recycling Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 206010035148 Plague Diseases 0.000 description 1
- 241000607479 Yersinia pestis Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
本发明公开了一种含有纳米金属颗粒的导电墨水的打印方法,包括:(1)提供含有纳米金属颗粒的导电墨水,并且所述导电墨水中固体的含量低于45wt%;(2)以气流喷印法将所述导电墨水喷射到基材上,形成具有疏松多孔结构的第一金属图案层;(3)以喷墨打印法将所述导电墨水打印到所述第一金属图案层上,至形成厚度超过1μm的均匀金属层,所述均匀金属层在烧结后方块电阻小于1Ω/□。优选的,步骤(2)还包括对所述第一金属图案层进行烧结的操作。本发明操作简单,成本低廉,并可基于现有金属墨水实现高导电金属图案的打印制备,无需额外增加金属墨水的粘度和金属固含量,所获金属导电图案不含树脂成分,与传统银浆所印的图案相比具有更高的导电性。
The invention discloses a printing method of conductive ink containing nano metal particles, comprising: (1) providing conductive ink containing nano metal particles, and the solid content in the conductive ink is lower than 45wt%; (2) using airflow spraying the conductive ink onto the substrate to form a first metal pattern layer with a loose porous structure; (3) printing the conductive ink onto the first metal pattern layer by an inkjet printing method, Until a uniform metal layer with a thickness exceeding 1 μm is formed, the sheet resistance of the uniform metal layer after sintering is less than 1Ω/□. Preferably, step (2) further includes the operation of sintering the first metal pattern layer. The invention is simple in operation and low in cost, and can realize the printing and preparation of highly conductive metal patterns based on the existing metal ink, without additionally increasing the viscosity and metal solid content of the metal ink, and the obtained metal conductive pattern does not contain resin components, which is different from traditional silver paste The printed pattern has a higher conductivity than the printed pattern.
Description
技术领域 technical field
本发明涉及一种导电墨水的打印方法,特别是涉及一种含有利用气流喷印和喷墨打印技术实现的含纳米金属颗粒导电墨水的打印方法。 The invention relates to a printing method of conductive ink, in particular to a printing method of conductive ink containing nanometer metal particles realized by air jet printing and inkjet printing technology.
背景技术 Background technique
印刷电子 (printed electronics) 技术是指采用直接在基板上印刷导体、半导体、介电材料、绝缘材料等电子功能层的方法来制造电子产品的生产工艺。在过去的几十年里,降低成本、提高性价比始终是电子产业不断发展壮大的推动力。而相比较于传统电子行业刻蚀形成电路的减成法(subtractive manufacturing),以印刷为代表的加成法(additive manufacturing)将电子材料成膜与实现图案化两大过程合二为一,具有节约原料、工艺简单、绿色环保(所产生的工业废液少)等优势,而且易于配合新型材料实现大面积柔性器件,更加有利于满足电子产业降低成本、扩大市场的要求。目前印刷电子器件相关研究已经扩展到相当广泛的领域, 涉及导体、半导体、介电材料、电解质等种类的材料制成的有机器件。利用印刷方法生产电子产品可以有效降低生产成本,是目前世界各国的学术机构和企业研究的重点。鉴于传统的印刷工业已经非常成熟,一旦印刷电子产业的瓶颈得到解决,可望在相当短的时间内将电子制造业和印刷业相结合,从而带来电子产品成本的大幅下降和应用领域的极大扩展,并解决目前困扰电子行业的环境和资源问题,以及可持续发展问题。 Printed electronics (printed electronics) technology refers to the production process of manufacturing electronic products by directly printing electronic functional layers such as conductors, semiconductors, dielectric materials, and insulating materials on substrates. In the past few decades, reducing costs and improving cost performance has always been the driving force for the continuous development and growth of the electronics industry. Compared with the subtractive manufacturing method of etching and forming circuits in the traditional electronics industry, the additive manufacturing method represented by printing combines the two processes of film formation and patterning of electronic materials into one, which has the advantages of It has the advantages of saving raw materials, simple process, green and environmental protection (less industrial waste generated), and it is easy to cooperate with new materials to realize large-area flexible devices, which is more conducive to meeting the requirements of the electronics industry to reduce costs and expand the market. At present, the research on printed electronic devices has been extended to a wide range of fields, involving organic devices made of materials such as conductors, semiconductors, dielectric materials, and electrolytes. The use of printing methods to produce electronic products can effectively reduce production costs, and is currently the focus of research by academic institutions and companies around the world. In view of the fact that the traditional printing industry is very mature, once the bottleneck of the printed electronics industry is solved, it is expected to combine the electronics manufacturing industry and the printing industry in a relatively short period of time, which will bring about a significant reduction in the cost of electronic products and an extremely wide range of applications. Great expansion, and addressing the environmental and resource issues, as well as sustainability issues that currently plague the electronics industry.
印刷电子的研究领域中,打印金属导电图案是最为成熟的课题,但如何利用喷墨打印的方法获得方块电阻小于1欧的金属导电图案仍然是一个挑战。理论上,提高打印图案的导电性只需要增加打印厚度即可,按照现有印墨水固化烧结后的电导率计算,金属图案的厚度需要大于1μm才有可能获得理想的方块电阻。但喷墨打印所用的墨水具有低粘度、低固含量的特点,在多层打印过程中墨水经常会溶解破坏已经打印好的图案,使多次打印效果实质上类似于单次打印较多的墨水,从而使墨水很容易在干燥之前出现类似“咖啡环”等在基底上自发流动的现象。这种情况下,仅仅通过多次打印很难有效获得均匀的厚实金属层,反而容易进一步加剧大面积厚薄不均匀的现象,影响导电性的提高。每打印一层即进行烧结理论上可以显著改善大面积范围内厚薄不均匀的问题,但由于每次打印都必须严格控制墨量,多次“打印-烧结”的反复操作费时费力,代价较高。 In the research field of printed electronics, printing metal conductive patterns is the most mature subject, but how to use inkjet printing to obtain metal conductive patterns with a sheet resistance of less than 1 ohm is still a challenge. Theoretically, to improve the conductivity of the printed pattern, it is only necessary to increase the printing thickness. According to the conductivity of the existing printing ink after curing and sintering, the thickness of the metal pattern needs to be greater than 1 μm to obtain an ideal sheet resistance. However, the ink used in inkjet printing has the characteristics of low viscosity and low solid content. During the multi-layer printing process, the ink often dissolves and destroys the printed pattern, so that the effect of multiple printing is essentially similar to that of a single printing with more ink , so that the ink is prone to spontaneous flow on the substrate like "coffee rings" before drying. In this case, it is difficult to effectively obtain a uniform and thick metal layer only through multiple printings. On the contrary, it is easy to further aggravate the uneven thickness of large areas and affect the improvement of electrical conductivity. Sintering after each layer of printing can theoretically significantly improve the problem of uneven thickness in a large area, but since the amount of ink must be strictly controlled for each printing, repeated "printing-sintering" operations are time-consuming, laborious and costly .
发明内容 Contents of the invention
针对现有技术的不足,本发明的目的在于提供一种含有纳米金属颗粒的导电墨水的打印方法,以获得高质量的金属导电层。 Aiming at the deficiencies of the prior art, the object of the present invention is to provide a printing method of conductive ink containing nano metal particles, so as to obtain a high-quality metal conductive layer.
为实现上述发明目的,本发明采用了如下技术方案: In order to realize the above-mentioned purpose of the invention, the present invention has adopted following technical scheme:
一种含有纳米金属颗粒的导电墨水的打印方法,包括: A printing method of conductive ink containing nano metal particles, comprising:
(1)提供含有纳米金属颗粒的导电墨水,并且所述导电墨水中固体的含量低于45wt%; (1) Provide conductive ink containing nano-metal particles, and the solid content in the conductive ink is less than 45wt%;
(2)以气流喷印法将所述导电墨水喷射到基材上,形成具有疏松多孔结构的第一金属图案层; (2) spraying the conductive ink onto the substrate by air jet printing to form a first metal pattern layer with a loose porous structure;
(3)以喷墨打印法将所述导电墨水打印到所述第一金属图案层上,至形成厚度超过1μm的均匀金属层,所述均匀金属层在烧结后方块电阻小于1Ω/□,特别是小于50mΩ/□。 (3) Printing the conductive ink onto the first metal pattern layer by inkjet printing to form a uniform metal layer with a thickness exceeding 1 μm, and the sheet resistance of the uniform metal layer after sintering is less than 1Ω/□, especially is less than 50mΩ/□.
作为较为优选的实施方案之一,步骤(2)包括:将所述导电墨水雾化生产直径小于10μm的墨水雾滴,再利用送料气流将所述墨水雾滴送至喷嘴口,而后利用聚焦气流将墨水雾滴会聚成直径小于300μm的液流,并喷射到基底上。 As one of the more preferred embodiments, step (2) includes: atomizing the conductive ink to produce ink droplets with a diameter of less than 10 μm, and then using the feeding airflow to send the ink droplets to the nozzle opening, and then using the focused airflow to The ink droplets are converged into a liquid stream with a diameter of less than 300 μm and sprayed onto the substrate.
进一步的,步骤(2)包括: Further, step (2) includes:
通过改变雾化功率调节所述墨水雾滴的溶剂含量,从而控制被喷射的导电墨水的浓度,其中,雾化功率越小,被喷射出的导电墨水的浓度越高; Adjusting the solvent content of the ink droplets by changing the atomization power, thereby controlling the concentration of the ejected conductive ink, wherein the smaller the atomization power, the higher the concentration of the ejected conductive ink;
和/或,通过改变送料气流与聚焦气流的流量比例调节被喷射液流中墨水雾滴的溶剂含量,从而控制被喷射的导电墨水的浓度,其中,送料气流与聚焦气流的流量比例越低,被喷射出的导电墨水的浓度越高; And/or, adjust the solvent content of the ink droplets in the jetted liquid flow by changing the flow ratio of the feed air flow and the focused air flow, thereby controlling the concentration of the ejected conductive ink, wherein the lower the flow ratio of the feed air flow and the focused air flow, The higher the concentration of the conductive ink being ejected;
和/或,通过改变喷嘴口的温度调节被喷射液流中墨水雾滴的溶剂含量,从而控制被喷射的导电墨水的浓度,其中,喷嘴口的温度越高,被喷射出的导电墨水的浓度越高。 And/or, by changing the temperature of the nozzle opening to adjust the solvent content of the ink droplets in the jetted liquid flow, thereby controlling the concentration of the injected conductive ink, wherein the higher the temperature of the nozzle opening, the higher the concentration of the ejected conductive ink higher.
进一步的,所述第一金属图案层表面粗糙起伏度在0.5μm以上。此处的“起伏度”是指在该第一金属图案层表面,最高点的高度与最低点的高度的差值。 Further, the surface roughness of the first metal pattern layer is above 0.5 μm. The "difference" here refers to the difference between the height of the highest point and the height of the lowest point on the surface of the first metal pattern layer.
作为较为优选的实施方案之一,步骤(2)还包括:对所述第一金属图案层进行加热烧结处理,加热烧结温度在80-300 ℃。 As one of the more preferred embodiments, the step (2) further includes: performing heating and sintering treatment on the first metal pattern layer, and the heating and sintering temperature is 80-300°C.
进一步的,前述加热烧结处理的方式包括加热台、烘箱、热风、光波或微波加热烧结方式中的任意一种或者两种以上的组合,但不限于此。 Further, the aforementioned heating and sintering methods include any one or a combination of two or more of heating tables, ovens, hot air, light waves or microwave heating and sintering methods, but are not limited thereto.
进一步的,所述导电墨水中所含金属元素可以包括金、银、铜、镍、铝、铂中的任意一种或者两种以上的组合,但不限于此。 Further, the metal element contained in the conductive ink may include any one or a combination of two or more of gold, silver, copper, nickel, aluminum, platinum, but is not limited thereto.
作为较为优选的实施方案之一,在前述气流喷印和/或喷墨打印过程中,还对基底进行了加热处理,加热温度为35-150 ℃。 As one of the more preferred embodiments, during the air jet printing and/or inkjet printing process, the substrate is also heated, and the heating temperature is 35-150°C.
进一步的,所述基底包括绝缘基底。 Further, the base includes an insulating base.
进一步的,步骤(3)包括:将所述导电墨水以喷墨打印方法在第一金属图案层上打印一遍以上。 Further, step (3) includes: printing the conductive ink on the first metal pattern layer for more than one time by inkjet printing method.
相比于现有技术,本发明的有益效果至少包括: Compared with the prior art, the beneficial effects of the present invention at least include:
(1)利用本发明的方法,可以立足现有的金属墨水实现高导电金属图案的打印制备,不需要额外增加金属墨水的粘度和金属固含量; (1) By using the method of the present invention, the printing preparation of highly conductive metal patterns can be realized based on the existing metal ink, without additionally increasing the viscosity and metal solid content of the metal ink;
(2)利用本发明的方法所获得金属导电图案不含树脂成分,与传统银浆所印的图案相比具有更高的导电性。 (2) The metal conductive pattern obtained by the method of the present invention does not contain resin components, and has higher conductivity than the pattern printed by traditional silver paste.
附图说明 Description of drawings
图1是本发明中气流喷印设备打印疏松多孔金属图案的原理示意图,其中,11为喷嘴,12为沉积在基底上的金属层,13为基底; 1 is a schematic diagram of the principle of printing a loose porous metal pattern by an air jet printing device in the present invention, wherein 11 is a nozzle, 12 is a metal layer deposited on a substrate, and 13 is a substrate;
图2是本发明实施例1中通过气流喷印形成的疏松多孔银图案的显微镜照片。 Fig. 2 is a microscope photo of the loose and porous silver pattern formed by air jet printing in Example 1 of the present invention.
具体实施方式 Detailed ways
如前所述,因喷墨打印墨水固有特性等方面的限制,使得业界较难通过喷墨打印方法获得较为均匀的厚实金属层,例如,方块电阻小于1欧,特别是小于50毫欧的金属导电图案层。 As mentioned earlier, due to the limitations of the inherent characteristics of inkjet printing inks, it is difficult for the industry to obtain a relatively uniform thick metal layer through inkjet printing methods, for example, metals with a sheet resistance of less than 1 ohm, especially less than 50 milliohms Conductive pattern layer.
鉴于现有技术的不足,本案发明人经长期研究和大量实践,提出了本发明的技术方案,其主要是基于气流喷印技术和喷墨打印工艺实现的。 In view of the deficiencies in the prior art, the inventor of this case proposed the technical solution of the present invention after long-term research and a lot of practice, which is mainly realized based on air jet printing technology and inkjet printing process.
概括的讲,本发明的技术方案包括: Generally speaking, technical scheme of the present invention comprises:
(1)提供含有纳米金属颗粒的导电墨水,并且所述导电墨水中固体的含量低于45wt%; (1) Provide conductive ink containing nano-metal particles, and the solid content in the conductive ink is less than 45wt%;
(2)以气流喷印法将所述导电墨水喷射到基材上,形成具有疏松多孔结构的第一金属图案层,表面粗糙起伏度可以超过0.5μm; (2) Jetting the conductive ink onto the substrate by air jet printing to form a first metal pattern layer with a loose porous structure, and the roughness of the surface can exceed 0.5 μm;
(3)以喷墨打印法将所述导电墨水打印到所述第一金属图案层上,直至形成厚度超过1μm的均匀金属层,所述均匀金属层在烧结后方块电阻小于1Ω/□,特别是小于50mΩ/□。 (3) Print the conductive ink onto the first metal pattern layer by inkjet printing until a uniform metal layer with a thickness exceeding 1 μm is formed, and the sheet resistance of the uniform metal layer after sintering is less than 1Ω/□, especially is less than 50mΩ/□.
本发明中,因采用了气流喷印技术,在同样使用低粘度、低固含量金属导电墨水的情况下,所喷射出的并非与喷墨打印类似的单个墨滴,而是喷出含有大量费升(fL)级别液滴的气流。由于具有更大的比表面积,这些超细小液滴通过适当的参数控制(如改变雾化功率、送料气流与聚焦气流的比例或者喷嘴温度)可以降低所喷射墨水的溶剂含量,从而获得比较厚但疏松多孔的金属图案层,而且当在这些金属图案上进行喷墨打印时,导电墨水会渗进金属图案中,其自发流动因为表面张力作用会受到严格的限制。在此情况下,大面积厚薄不均匀的现象将被显著遏制,从而有利于获得厚度超过1μm的均匀金属层,进而显著提高打印金属层的导电性。 In the present invention, due to the adoption of air jet printing technology, in the same case of using low-viscosity, low-solid-content metal conductive ink, what is ejected is not a single ink drop similar to inkjet printing, but a jet containing a large amount of waste. Airflow of liquid droplets at the liter (fL) level. Due to the larger specific surface area, these ultra-fine droplets can reduce the solvent content of the jetted ink through appropriate parameter control (such as changing the atomization power, the ratio of the feed air flow to the focus air flow, or the nozzle temperature), thereby obtaining a thicker ink. However, the loose and porous metal pattern layer, and when inkjet printing is performed on these metal patterns, the conductive ink will penetrate into the metal pattern, and its spontaneous flow will be strictly restricted due to the effect of surface tension. In this case, the phenomenon of large-area uneven thickness will be significantly curbed, which is conducive to obtaining a uniform metal layer with a thickness of more than 1 μm, thereby significantly improving the conductivity of the printed metal layer.
例如,作为较佳的实施方案之一,在前述气流喷印的过程中,可以首先将导电墨水雾化生产直径小于10μm的墨水雾滴,再利用送料气流将墨水雾滴送至喷嘴口,而后利用聚焦气流将墨水雾滴会聚成直径小于300μm的液流,并喷射到基底上。 For example, as one of the preferred implementations, in the aforementioned air jet printing process, the conductive ink can be atomized first to produce ink droplets with a diameter of less than 10 μm, and then the ink droplets can be sent to the nozzle opening by the feeding air flow, and then The ink droplets are converged into a liquid stream with a diameter of less than 300 μm by using focused airflow, and sprayed onto the substrate.
并且,较为优选的,还可对所述第一金属图案层进行加热烧结处理,加热烧结温度在80-300 ℃,而后进行喷墨打印操作。此处所涉及的加热烧结处理的方式可借助业界习用的各类设备或方法实施,例如,可以选用加热台、烘箱、热风、光波或微波加热烧结方式等,且不限于此。 Moreover, more preferably, the first metal pattern layer can also be heated and sintered at a heating and sintering temperature of 80-300° C., and then the inkjet printing operation is performed. The heating and sintering methods mentioned here can be implemented by various equipment or methods commonly used in the industry, for example, heating tables, ovens, hot air, light wave or microwave heating and sintering methods can be selected, and are not limited thereto.
又及,前述喷墨打印的遍数可以是一遍,也可以是多遍,其依据实际应用的需求而定。 Furthermore, the number of inkjet printing can be one pass or multiple passes, which depends on the requirements of practical applications.
又及,而依据实际应用的需要,前述导电墨水中所含金属元素可以选自但不限于金、银、铜、镍、铝、铂中的任意一种或者两种以上的组合。 And, according to the needs of practical applications, the metal elements contained in the aforementioned conductive ink can be selected from, but not limited to, any one or a combination of two or more of gold, silver, copper, nickel, aluminum, and platinum.
再及,较为优选的,在前述气流喷印和/或喷墨打印过程中,还可以同时对基底进行加热处理,加热温度为35-150 ℃。 Furthermore, preferably, during the aforementioned air jet printing and/or inkjet printing process, the substrate can also be heated at the same time, and the heating temperature is 35-150°C.
前述基底可以选用满足应用需求的各类基底,特别是绝缘基底,例如聚酰亚胺薄膜、具有绝缘层的硅片等,但不限于此。 The aforementioned substrates can be selected from various types of substrates that meet the application requirements, especially insulating substrates, such as polyimide films, silicon wafers with insulating layers, etc., but not limited thereto.
显然,本发明的方法操作简单,成本低廉,并可基于现有金属墨水实现高导电金属图案的打印制备,无需额外增加金属墨水的粘度和金属固含量,所获金属导电图案不含树脂成分,且与传统银浆所打印的图案相比具有更高导电性。 Obviously, the method of the present invention is simple to operate, low in cost, and can realize the printing preparation of highly conductive metal patterns based on the existing metal ink, without additionally increasing the viscosity and metal solid content of the metal ink, and the obtained metal conductive pattern does not contain resin components. And it has higher conductivity than the pattern printed by traditional silver paste.
为了更清楚地说明本发明的技术方案,下面将结合附图和优选实施例对本发明作进一步的详细描述,显而易见地,下面的描述仅仅是本发明的部分实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些实施例获得其他的发明。 In order to illustrate the technical solution of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and preferred embodiments. Obviously, the following descriptions are only some embodiments of the present invention. In other words, other inventions can also be obtained based on these embodiments without paying creative efforts.
实施例1Example 1
将切割成长100毫米、宽40毫米、厚度为0.12毫米的无色透明聚酰亚胺薄膜先后浸泡在乙醇、异丙醇和水中各超声清洗10-30分钟,取出后用高纯氮气吹干。然后利用气流喷印设备在薄膜上打印以乙二醇和水为溶剂的商品化银墨水,打印过程中雾化器实际功率18-25瓦,喷嘴温度范围40-90 ℃,基底加热温度范围50-120 ℃,送料气流和聚焦气流的流量比例范围1:5到1:15。然后将获得的图案在150-160℃的加热台上烧结30分钟。所获得的金属图案厚度为2-3微米,平均粗糙起伏度超过0.8微米。 Soak a colorless transparent polyimide film cut to a length of 100 mm, a width of 40 mm, and a thickness of 0.12 mm in ethanol, isopropanol, and water, and ultrasonically clean it for 10-30 minutes, and blow dry it with high-purity nitrogen after taking it out. Then use air jet printing equipment to print commercial silver ink with ethylene glycol and water as solvents on the film. During the printing process, the actual power of the atomizer is 18-25 watts, the nozzle temperature range is 40-90 ℃, and the substrate heating temperature range is 50- 120 ℃, the flow ratio of feed air flow and focus air flow ranges from 1:5 to 1:15. The obtained pattern was then sintered on a heating table at 150-160° C. for 30 minutes. The obtained metal pattern has a thickness of 2-3 microns and an average roughness of over 0.8 microns.
在完成烧结的银图案上用喷墨打印设备再次进行打印,打印点间距(dot spacing)设为10微米,共计喷墨打印3-6遍,所打印的银墨水受到第一层粗糙金属图案的限制,在干燥后仍然保持大面积范围内的厚度平整。再次用150-160℃的加热台进行30分钟烧结后,方块电阻低于0.05 Ω/□。 Print again with an inkjet printing device on the sintered silver pattern, set the dot spacing to 10 microns, print a total of 3-6 times with inkjet printing, and the printed silver ink is subjected to the rough metal pattern of the first layer Restricted, the thickness remains flat over a large area after drying. After sintering again with a 150-160°C heating table for 30 minutes, the sheet resistance was lower than 0.05 Ω/□.
实施例2Example 2
将切割成长20毫米见方、厚度为0.12毫米的带二氧化硅绝缘层硅片先后浸泡在乙醇、异丙醇和水中各超声清洗10-30分钟,取出后用高纯氮气吹干。然后利用气流喷印设备在薄膜上打印以醚类为溶剂主要成分的商品化金墨水,打印过程中雾化器实际功率15-20瓦,喷嘴温度范围40-60 ℃,基底加热温度范围50-75 ℃,送料气流和聚焦气流的流量比例范围1:3到1:12。然后将获得的图案在150-160℃的加热台上烧结15-30分钟。所获得的金属图案厚度为1-2微米,平均粗糙起伏度超过0.5微米。 Soak the silicon wafer with a silicon dioxide insulating layer cut into 20 mm square and 0.12 mm thick in ethanol, isopropanol and water for 10-30 minutes, and blow dry with high-purity nitrogen after taking it out. Then use air jet printing equipment to print commercial gold ink with ether as the main component of the solvent on the film. During the printing process, the actual power of the atomizer is 15-20 watts, the nozzle temperature range is 40-60 ℃, and the substrate heating temperature range is 50- 75 ℃, the flow ratio of feed air flow and focus air flow ranges from 1:3 to 1:12. The obtained pattern is then sintered on a heating table at 150-160° C. for 15-30 minutes. The obtained metal pattern has a thickness of 1-2 microns and an average roughness of over 0.5 microns.
在完成烧结的金图案上用喷墨打印设备再次进行打印,打印点间距(dot spacing)设为20微米,共计喷墨打印5-8遍,所打印的银墨水受到第一层粗糙金属图案的限制,在干燥后仍然保持大面积范围内的厚度平整。再次用150-160℃的加热台进行15-30分钟烧结后,方块电阻低于0.2 Ω/□。 Print again with an inkjet printing device on the sintered gold pattern, set the dot spacing to 20 microns, print a total of 5-8 times with inkjet printing, and the printed silver ink is subjected to the rough metal pattern of the first layer Restricted, the thickness remains flat over a large area after drying. After sintering again with a heating table at 150-160°C for 15-30 minutes, the sheet resistance is lower than 0.2 Ω/□.
以上所述仅是本发明的具体实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。 The foregoing is only a specific embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, some improvements and modifications can also be made without departing from the principle of the present invention. It should be regarded as the protection scope of the present invention.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310680680.1A CN104708930B (en) | 2013-12-12 | 2013-12-12 | The Method of printing of the conductive ink containing nano-metal particle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310680680.1A CN104708930B (en) | 2013-12-12 | 2013-12-12 | The Method of printing of the conductive ink containing nano-metal particle |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104708930A true CN104708930A (en) | 2015-06-17 |
CN104708930B CN104708930B (en) | 2017-03-15 |
Family
ID=53408876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310680680.1A Active CN104708930B (en) | 2013-12-12 | 2013-12-12 | The Method of printing of the conductive ink containing nano-metal particle |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104708930B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107690269A (en) * | 2016-08-31 | 2018-02-13 | 江苏汉印机电科技股份有限公司 | The inkjet printing manufacture method of electro-magnetic screen layer |
CN108001062A (en) * | 2017-12-05 | 2018-05-08 | 华南理工大学 | It is a kind of to repair the excessive method of large area high uniformity inkjet printing film surface fluctuating |
CN108115138A (en) * | 2016-10-27 | 2018-06-05 | 厦门三维天空信息科技有限公司 | Printing material and printing device |
CN112513735A (en) * | 2018-08-22 | 2021-03-16 | 尼瓦洛克斯-法尔股份有限公司 | Method for manufacturing a timepiece component and component obtained by such a method |
CN113838799A (en) * | 2020-06-24 | 2021-12-24 | 天津大学 | Method for preparing high-resolution through hole in situ on flexible substrate based on electrofluid ink-jet printer |
CN114279280A (en) * | 2021-12-27 | 2022-04-05 | 南京理工大学 | Ink-jet printing microstructure transducer element and preparation method thereof |
CN116160766A (en) * | 2021-11-25 | 2023-05-26 | 中国科学院大连化学物理研究所 | A Method for Electrohydrodynamic Jet Printing on Insulating Substrates |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102616033A (en) * | 2012-04-13 | 2012-08-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | Method for quickly manufacturing high-light-transmission conductive patterns |
CN102938397A (en) * | 2012-12-05 | 2013-02-20 | 苏州纳格光电科技有限公司 | Conductive electrode provided with linear material, electronic device and manufacturing method thereof |
WO2013163194A1 (en) * | 2012-04-23 | 2013-10-31 | Seagate Technology Llc | Bonding agent for heat-assisted magnetic recording and method of application |
-
2013
- 2013-12-12 CN CN201310680680.1A patent/CN104708930B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102616033A (en) * | 2012-04-13 | 2012-08-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | Method for quickly manufacturing high-light-transmission conductive patterns |
WO2013163194A1 (en) * | 2012-04-23 | 2013-10-31 | Seagate Technology Llc | Bonding agent for heat-assisted magnetic recording and method of application |
CN102938397A (en) * | 2012-12-05 | 2013-02-20 | 苏州纳格光电科技有限公司 | Conductive electrode provided with linear material, electronic device and manufacturing method thereof |
Non-Patent Citations (3)
Title |
---|
方一: "喷墨导电墨水技术的现状与发展", 《数码印刷》 * |
李景涛: "喷墨纳米银导电墨水的制备及性能研究", 《中国优秀博硕士学位论文全文数据库(硕士) 工程科技Ⅰ辑》 * |
高志强等: "提高喷墨印刷精度的技术发展", 《印刷杂志》 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107690269A (en) * | 2016-08-31 | 2018-02-13 | 江苏汉印机电科技股份有限公司 | The inkjet printing manufacture method of electro-magnetic screen layer |
CN108115138A (en) * | 2016-10-27 | 2018-06-05 | 厦门三维天空信息科技有限公司 | Printing material and printing device |
CN108115138B (en) * | 2016-10-27 | 2021-02-26 | 厦门三维天空信息科技有限公司 | Printing material and printing device |
CN108001062A (en) * | 2017-12-05 | 2018-05-08 | 华南理工大学 | It is a kind of to repair the excessive method of large area high uniformity inkjet printing film surface fluctuating |
CN112513735A (en) * | 2018-08-22 | 2021-03-16 | 尼瓦洛克斯-法尔股份有限公司 | Method for manufacturing a timepiece component and component obtained by such a method |
US11181868B2 (en) | 2018-08-22 | 2021-11-23 | Nivarox-Far S.A. | Method for manufacturing a timepiece component and component obtained by this method |
CN113838799A (en) * | 2020-06-24 | 2021-12-24 | 天津大学 | Method for preparing high-resolution through hole in situ on flexible substrate based on electrofluid ink-jet printer |
CN116160766A (en) * | 2021-11-25 | 2023-05-26 | 中国科学院大连化学物理研究所 | A Method for Electrohydrodynamic Jet Printing on Insulating Substrates |
CN116160766B (en) * | 2021-11-25 | 2024-08-20 | 中国科学院大连化学物理研究所 | A method for realizing electrohydrodynamic jet printing on insulating substrate |
CN114279280A (en) * | 2021-12-27 | 2022-04-05 | 南京理工大学 | Ink-jet printing microstructure transducer element and preparation method thereof |
CN114279280B (en) * | 2021-12-27 | 2024-04-05 | 南京理工大学 | Ink-jet printing microstructure transduction element and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN104708930B (en) | 2017-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104708930B (en) | The Method of printing of the conductive ink containing nano-metal particle | |
Huang et al. | Printing conductive nanomaterials for flexible and stretchable electronics: A review of materials, processes, and applications | |
JP3774638B2 (en) | Circuit pattern forming method using inkjet printing method | |
CN101919063B (en) | Solar cell metallization method, hot melt aerosol ink and aerosol jet printing system | |
TWI608498B (en) | Method for producing conductive film, printed circuit board | |
TWI584708B (en) | Structure of conductive lines and method of manufacturing the same | |
Zhu et al. | Highly conductive nano-silver circuits by inkjet printing | |
US20090053400A1 (en) | Ink jet printable compositions for preparing electronic devices and patterns | |
CN101553084B (en) | Circuit substrate and method for manufacturing circuit substrate | |
CN110248477B (en) | Manufacturing method of embedded flexible conductive circuit | |
CN101640979A (en) | Manufacturing method of conducting circuit | |
CN108084799A (en) | A kind of material for radio frequency discrimination RFID antenna conductive patterns | |
US20070281091A1 (en) | Polyimide insulative layers in multi-layered printed electronic features | |
JP2004119790A (en) | Method for forming fine wiring pattern using dispersion of nanoparticles in supercritical fluid | |
JP6071913B2 (en) | Conductive ink composition for inkjet | |
CN106274110B (en) | A kind of method of low temperature ink jet printing nano metal pattern | |
CN102529479A (en) | Post-treatment method for improving printing evenness of electronic material | |
CN204291617U (en) | Printed circuit board | |
WO2016047306A1 (en) | Process for producing film of metal oxide particles and process for producing metal film | |
JP2011142259A (en) | Method for manufacturing amorphous si solar cell substrate | |
Wu et al. | Fabrication of polymer silver conductor using inkjet printing and low temperature sintering process | |
Son et al. | Optimization of dispersant-free colloidal ink droplets for inkjet patterning without the coffee-ring effect using 1-octanethiol-coated copper nano-ink with a Standard Clean-1-treated substrate | |
JP2012153820A (en) | Liquid composition for printing and conductor wiring obtained by using the same, and forming method thereof, heat conduction channel, and jointing material | |
CN108963102A (en) | The preparation method of OLED device | |
JP2014201618A (en) | Conductive ink containing metal particulate dispersion and base material with conductor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |