CN104681274A - Preparation method of inner electrode of chip electronic component - Google Patents
Preparation method of inner electrode of chip electronic component Download PDFInfo
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- CN104681274A CN104681274A CN201510059867.9A CN201510059867A CN104681274A CN 104681274 A CN104681274 A CN 104681274A CN 201510059867 A CN201510059867 A CN 201510059867A CN 104681274 A CN104681274 A CN 104681274A
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Abstract
The invention discloses a preparation method of an inner electrode of a chip electronic component. The preparation method comprises the following steps: step (1), printing a layer of smooth sensitive conductive metal slurry on a surface of a clean and smooth tablet and drying the sensitive conductive metal slurry; step (2), using a first mask with a pattern consistent to the pattern of the inner electrode to perform ultraviolet exposure on the sensitive conductive metal slurry; step (3), developing and drying the exposed tablet, and forming a preliminary inner electrode pattern on the tablet; step (4), spinning a layer of uniform sensitive slurry on one side of the tablet with the preliminary inner electrode pattern and drying the sensitive slurry; step (5), using a second mask with a pattern consistent to the pattern of the inner electrode to perform ultraviolet exposure on the sensitive slurry; step (6), developing and drying the exposed tablet, and forming a complete inner electrode pattern on the tablet. According to the preparation method of the inner electrode of the chip electronic component disclosed by the invention, no thickness difference occurs between the formed inner electrode and the tablet, so that the problems of inner electrode deformation and lamination deviation which easily occur in the process of inner electrode lamination can be solved.
Description
Technical field
The present invention relates to the preparation of chip electronic component, particularly a kind of preparation method of internal electrode of chip-type electronic component.
Background technology
In recent years, along with the progress of science and technology, electronic devices and components obtain applying more and more widely, along with electronic product is more and more toward multi-functional and small size future development, to its use key fitment---the volume of electronic devices and components also requires more and more less.
In traditional electronic devices and components make, the method for electrode adopts silk screen printing, interior electrode is formed at web surface, but by the restriction of screen printing technique, the minimum feature of the interior electrode made is 30 μm, Line-width precision require can only reach ± 3 μm, be difficult to the high-precision requirement meeting components and parts, and the manufacture method of electrode (< 30 μm) and high-precision requirement (Line-width precision requires ± 1 μm) interior electrode is first paved with silver slurry with screen printing mode by needing the region of printed patterns in existing hachure, and then use ultraviolet light to coordinate corresponding mask plate pattern to solidify it, development, washing, interior electrode pattern needed for finally being formed, but the method forms electrode on the surface of tablet, there is certain thickness difference in electrode and tablet, lamination procedure so below after the pressurizing interior electrode just has the risk be crushed out of shape, simultaneously because thickness difference easily causes lamination off normal in lamination process, can cause scrapping loss large.
Summary of the invention
In order to make up above-mentioned the deficiencies in the prior art, the present invention proposes a kind of preparation method of internal electrode of chip-type electronic component.
Technical problem of the present invention is solved by following technical scheme:
A preparation method for internal electrode of chip-type electronic component, comprises the steps:
(1) on the surface of totally smooth tablet, print the smooth conductive photoreceptor metal paste of one deck and dry;
(2) utilize first mask plate with the pattern consistent with interior electrode pattern, uv-exposure is carried out to described conductive photoreceptor metal paste;
(3) to through described step (2) exposure after tablet develop and dry, described tablet is formed preliminary in electrode pattern;
(4) tablet have preliminary in electrode pattern one side on the uniform photosensitive pulp of spin coating one deck drying;
(5) utilize second mask plate with the pattern consistent with interior electrode pattern, uv-exposure is carried out to described photosensitive pulp;
(6) to through described step (5) exposure after tablet develop and dry, described tablet is formed complete in electrode pattern.
Preferably:
The viscosity of described conductive photoreceptor metal paste is 10000 ± 1000CPS.
The exposure energy of step (2) medium ultraviolet exposure is between 150-500mJ.
The exposure energy of step (5) medium ultraviolet exposure is between 100-300mJ.
The thickness of the described conductive photoreceptor metal paste in step (1) is 10-12 μm; The thick 1-2 of thickness μm or equal with the thickness of the described conductive photoreceptor metal paste in step (1) of described conductive photoreceptor metal paste in the Thickness Ratio step (1) of the described photosensitive pulp in step (4).
Described photosensitive pulp in the formula of described tablet, adds emulsion be made into, and in described photosensitive pulp, the mass percent of emulsion is 3% ~ 5%; Viscosity≤the 10000CPS of described photosensitive pulp.
Described conductive photoreceptor metal paste has forward exposure performance, and described photosensitive pulp has negative sense exposure performance; Or described conductive photoreceptor metal paste has negative sense exposure performance, and described photosensitive pulp has forward exposure performance.
Described spin coating in step (4) carries out in spin-coating equipment, the speed of rotation >1000rpm of described spin-coating equipment and have suction vacuum function, to ensure that tablet can not be thrown out of when spin coating.
Described first mask plate and the second mask plate are chromium plate.
Described emulsion is DAAM.
Beneficial effect of the present invention: in technical scheme of the present invention, it is shaping that interior electrode carries out double exposure development respectively by conductive photoreceptor metal paste and photosensitive pulp, there is not thickness difference between the interior electrode formed and tablet, solve the interior electrode deformation that easily causes in interior polar stack process and lamination off normal etc. bad; Within prepared by technique scheme, electrode can keep high-precision requirement simultaneously, interior electrode pattern minimum feature can reach 15 μm, Line-width precision (i.e. live width extreme difference) can be controlled in ± and 1 μm, meet the high-precision requirement of chip components and parts, the present invention is particularly useful in the middle of the chip components and parts industry of electrode in all application gold-tinted technological formings.
Accompanying drawing explanation
Fig. 1 is the schematic diagram after the tablet printing photosensitive silver slurry in one embodiment of the present invention;
Fig. 2 is the photosensitive silver slurry exposure schematic diagram in one embodiment of the present invention;
Fig. 3 is tablet schematic diagram after the development in one embodiment of the present invention;
Fig. 4 is the schematic diagram after the tablet spin coating photosensitive pulp in one embodiment of the present invention;
Fig. 5 is the schematic diagram after the photosensitive pulp development in one embodiment of the present invention.
Embodiment
Below contrast accompanying drawing and combine preferred embodiment the invention will be further described.
The invention provides a kind of preparation method of internal electrode of chip-type electronic component, comprise the steps:
(1) on the surface of totally smooth tablet, print the smooth conductive photoreceptor metal paste of one deck and dry;
(2) utilize first mask plate with the pattern consistent with interior electrode pattern, uv-exposure is carried out to described conductive photoreceptor metal paste;
(3) to through described step (2) exposure after tablet develop and dry, described tablet is formed preliminary in electrode pattern;
(4) tablet have preliminary in electrode pattern one side on the uniform photosensitive pulp of spin coating one deck drying;
(5) utilize second mask plate with the pattern consistent with interior electrode pattern, uv-exposure is carried out to described photosensitive pulp;
(6) to through described step (5) exposure after tablet develop and dry, described tablet is formed complete in electrode pattern.
In a preferred embodiment, the preparation method of internal electrode of chip-type electronic component specifically comprises the steps:
One, tablet is prepared
(1) ceramic casting slurry is prepared with ball milling batching mode
Ceramic powder, solvent, plasticizer, dispersant are added mixing in the ratio of this area routine, with the speed Stirring dispersion certain hour of ball mill by this area routine, is mixed with the ceramic casting slurry of the applicable curtain coating with certain viscosity.Concrete, adopt in this example Pyrex add alumina series ceramic powder, ethyl acetate (solvent), isopropyl alcohol (solvent), adipic acid dibutyl ester (plasticizer), German Bi Ke company BYK-110 dispersant by weight ratio for the ratio of 1:0.3:0.2:0.1:0.02 mixes, drum's speed of rotation is 40 ~ 50r/min, and Ball-milling Time is 39 ~ 41h.
(2) curtain coating ceramic green tape
By the ceramic casting slurry casting machine curtain coating for preparing on release film, as PET release film, certain thickness ceramic green sheet is formed after drying, be the ceramic green sheet of thickness 15 μm in this example, the ceramic green sheet smooth surface of formation is smooth, and consistency of thickness is good, thickness extreme difference controls at ± 0.5 μm, outward appearance free of pinholes, bubble, cut etc. are bad.
(3) ceramic green sheet is cut off
Ceramic green sheet automatic cutting off table after curtain coating being cut into the tablet of one fixed width and length, is the tablet of 152*152mm in this example, is convenient to the production of follow-up printing lamination procedure.
The formula preparing tablet in above step (1)-(3) is not limited to above enumerating, and itself and technological parameter are all this area routines, repeat no more.
Two, electrode in preparation
1) conductive photoreceptor metal paste is printed
In this example, conductive photoreceptor metal paste adopts Du Pont L6127 photosensitive silver slurry (hereinafter referred to as photosensitive silver slurry), and this photosensitive silver slurry has forward exposure performance, and viscosity is 10000 ± 1000CPS.
Whole printing 10 μm of thick photosensitive silver slurries 3 on the tablet 2 being formed in PET release film 1 are also dried, and will ensure the planarization on surface, and ensure the uniformity of thickness in printing process, printing photosensitive silver starch and tablet after drying as shown in Figure 1.
2) expose
Using chromium plate 4 as mask plate, chromium plate have the pattern consistent with interior electrode pattern, uv-exposure equipment is utilized to expose, exposure energy is set as 350mJ, and in exposure process, the region (namely having the region of interior electrode pattern) that ultraviolet lighting is mapped to light occurs and decomposes or degradation reaction, character is changed, to be dissolved in positivity developer solution in developing process, unexposed part is then retained, electrode pattern in being formed.The schematic diagram of tablet exposure as shown in Figure 2.
3) develop
Automatic developing apparatus is utilized to develop to the tablet after exposure and dry, the positivity developer solution of development can adopt the sodium carbonate liquor of 0.4wt%, pattern after development on chromium plate is retained on tablet, other parts are rinsed, form the preliminary interior electrode pattern 5 that design needs, there is certain thickness difference between the interior electrode pattern formed and tablet 2, the thickness of the photosensitive silver slurry that namely this thickness difference prints, the tablet schematic diagram after development as shown in Figure 3.
4) spin coating photosensitive pulp, the formula of photosensitive pulp in the formula preparing tablet, adds emulsion be made into, in photosensitive pulp, the mass percent of emulsion is 3% ~ 5%, in the formula of tablet, DAAM is added in this example, the mass percent of DAAM in photosensitive pulp is 4%, photosensitive pulp has negative sense exposure performance, and viscosity is 10000CPS.
Tablet 2 have preliminary in electrode pattern one side on the uniform thickness of spin coating one deck be the photosensitive pulp 6 of 12 μm and dry.Specific as follows: this spin-coating equipment has suction vacuum function, during spin coating, tablet to be placed on spin coating platform and to open vacuum suction, arranging of vacuum degree has difference according to different spin-coating equipments, and the size of vacuum degree is advisable to ensure that tablet can not be thrown out of when spin coating.The photosensitive pulp of constant weight is gone up on tablet, start High Rotation Speed, speed of rotation >1000rpm, be 1500rpm in this example, centrifugal principle is utilized photosensitive pulp to be evenly coated on tablet, by controlling the thickness of spin coating speed and time controlled photosensitive pulp processed, the tablet schematic diagram after spin coating photosensitive pulp as shown in Figure 4.
5) expose
Using chromium plate as mask plate (when the design of this mask plate and photosensitive silver are starched and exposed, mask plate designs the same), uv-exposure equipment is utilized to expose, exposure energy is set as 200mJ, negativity developer solution will be dissolved in developing process by the region (namely electrode pattern region) that ultraviolet lighting is mapped in exposure process, in making to be covered by photosensitive pulp, electrode pattern reveals, and the part (blank parts without interior electrode pattern) be exposed then remains.
6) develop
Automatic developing apparatus is utilized to develop to the tablet after exposure and dry, the sodium sulphite solution of 0.8wt% selected by the negativity developer solution of development, complete the revealing of electrode pattern in after development, except other parts of the part at interior electrode pattern place are then retained, after development, tablet schematic diagram as shown in Figure 5.
Lamination process to be formed by layer stacking mode have certain thickness product by forming the tablet after full electrode, the requirement of lamination is that the interior electrode pattern formed between different layers must on same vertical curve, simultaneously in order to ensure the bond strength between different layers, pressurization is needed in lamination process, in pressure process, if have certain thickness difference between tablet and electrode, electrode is easily out of shape when pressurized thus causes electrical deviation with design configuration deviation on the one hand, on the other hand due to difference in height, tablet between levels easily occurs sliding in pressure process thus to cause between lamination rear electrode and electrode not on same vertical curve, also can cause and design deviation, and the thickness starched due to photosensitive pulp and photosensitive silver in the present invention differs very little, and the main body formula of photosensitive pulp is identical with the formula of tablet, only increase photosensitive property, therefore relative to the tablet only carrying out a photosensitive silver slurry exposure imaging, but through the exposure imaging of photosensitive pulp, can eliminate and only carry out the interior electrode of photosensitive silver slurry exposure imaging formation and the thickness difference of tablet, after photosensitive pulp development, web surface planarization is good, in can ensureing in lamination process, electrode pattern is not crushed and ensures lamination contraposition effect simultaneously.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For those skilled in the art, without departing from the inventive concept of the premise, some equivalent to substitute or obvious modification can also be made, and performance or purposes identical, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a preparation method for internal electrode of chip-type electronic component, is characterized in that, comprises the steps:
(1) on the surface of totally smooth tablet, print the smooth conductive photoreceptor metal paste of one deck and dry;
(2) utilize first mask plate with the pattern consistent with interior electrode pattern, uv-exposure is carried out to described conductive photoreceptor metal paste;
(3) to through described step (2) exposure after tablet develop and dry, described tablet is formed preliminary in electrode pattern;
(4) tablet have preliminary in electrode pattern one side on the uniform photosensitive pulp of spin coating one deck drying;
(5) utilize second mask plate with the pattern consistent with interior electrode pattern, uv-exposure is carried out to described photosensitive pulp;
(6) to through described step (5) exposure after tablet develop and dry, described tablet is formed complete in electrode pattern.
2. the preparation method of internal electrode of chip-type electronic component as claimed in claim 1, is characterized in that: the viscosity of described conductive photoreceptor metal paste is 10000 ± 1000CPS.
3. the preparation method of internal electrode of chip-type electronic component as claimed in claim 1, is characterized in that: the exposure energy of step (2) medium ultraviolet exposure is between 150-500mJ.
4. the preparation method of internal electrode of chip-type electronic component as claimed in claim 1, is characterized in that: the exposure energy of step (5) medium ultraviolet exposure is between 100-300mJ.
5. the preparation method of internal electrode of chip-type electronic component as claimed in claim 1, is characterized in that: the thickness of the described conductive photoreceptor metal paste in step (1) is 10-12 μm; The thick 1-2 of thickness μm or equal with the thickness of the described conductive photoreceptor metal paste in step (1) of described conductive photoreceptor metal paste in the Thickness Ratio step (1) of the described photosensitive pulp in step (4).
6. the preparation method of internal electrode of chip-type electronic component as claimed in claim 1, is characterized in that: described photosensitive pulp in the formula of described tablet, adds emulsion be made into, and in described photosensitive pulp, the mass percent of emulsion is 3% ~ 5%; Viscosity≤the 10000CPS of described photosensitive pulp.
7. the preparation method of internal electrode of chip-type electronic component as claimed in claim 1, is characterized in that: described conductive photoreceptor metal paste has forward exposure performance, and described photosensitive pulp has negative sense exposure performance; Or described conductive photoreceptor metal paste has negative sense exposure performance, and described photosensitive pulp has forward exposure performance.
8. the preparation method of internal electrode of chip-type electronic component as claimed in claim 1, it is characterized in that: the described spin coating in step (4) carries out in spin-coating equipment, the speed of rotation >1000rpm of described spin-coating equipment and have suction vacuum function, to ensure that tablet can not be thrown out of when spin coating.
9. the preparation method of internal electrode of chip-type electronic component as claimed in claim 7, is characterized in that: described first mask plate and the second mask plate are chromium plate.
10. the preparation method of internal electrode of chip-type electronic component as claimed in claim 6, is characterized in that: described emulsion is DAAM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510059867.9A CN104681274A (en) | 2015-02-04 | 2015-02-04 | Preparation method of inner electrode of chip electronic component |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510059867.9A CN104681274A (en) | 2015-02-04 | 2015-02-04 | Preparation method of inner electrode of chip electronic component |
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| CN201510059867.9A Pending CN104681274A (en) | 2015-02-04 | 2015-02-04 | Preparation method of inner electrode of chip electronic component |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988008360A1 (en) * | 1987-04-27 | 1988-11-03 | Siemens Aktiengesellschaft | Process for manufacturing a structured ceramic film or a ceramic object composed of such films |
| CN1665373A (en) * | 2004-03-03 | 2005-09-07 | Tdk株式会社 | Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board |
| CN1745441A (en) * | 2003-01-31 | 2006-03-08 | Tdk株式会社 | Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet |
| CN103325675A (en) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | Method for manufacturing electronic element of narrow-line-width electrode |
-
2015
- 2015-02-04 CN CN201510059867.9A patent/CN104681274A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988008360A1 (en) * | 1987-04-27 | 1988-11-03 | Siemens Aktiengesellschaft | Process for manufacturing a structured ceramic film or a ceramic object composed of such films |
| CN1745441A (en) * | 2003-01-31 | 2006-03-08 | Tdk株式会社 | Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet |
| CN1665373A (en) * | 2004-03-03 | 2005-09-07 | Tdk株式会社 | Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board |
| CN103325675A (en) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | Method for manufacturing electronic element of narrow-line-width electrode |
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Application publication date: 20150603 |
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