CN104679960B - A kind of statistical modeling method of radio frequency variodenser - Google Patents

A kind of statistical modeling method of radio frequency variodenser Download PDF

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CN104679960B
CN104679960B CN201510111705.5A CN201510111705A CN104679960B CN 104679960 B CN104679960 B CN 104679960B CN 201510111705 A CN201510111705 A CN 201510111705A CN 104679960 B CN104679960 B CN 104679960B
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radio frequency
value
variodenser
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CN104679960A (en
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刘林林
郭奥
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Shanghai IC R&D Center Co Ltd
Chengdu Image Design Technology Co Ltd
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Shanghai Integrated Circuit Research and Development Center Co Ltd
Chengdu Image Design Technology Co Ltd
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Abstract

The statistical modeling method of the radio frequency variodenser of the present invention, including:Determine that organs weight needs all model parameters extracted;Parameter is classified;Parameter testing is scattered to device, establishes the benchmark model not comprising technological fluctuation of device;Wave characteristic of the device scattering parameter in whole wafer is obtained, it is determined that fluctuation data division;Based on the network parameter for fluctuating the scattering parameter of data division and being converted by scattering parameter, the index that device carries out statistical modeling is configured to;Based on the index, each component value in sub-circuit model is calculated, sensitivity analysis and sequence of the units value of going forward side by side relative to desired value, chooses sensitivity highest element;To all kinds of populations of parameters in the scalable formula of element, sensitivity analysis and sequence of the parameter value for component value are carried out respectively;Sensitivity highest parameter is chosen, is fitted the statistical property distribution of device, obtains the statistical model of the global fluctuation distribution of device.The modeling process of the present invention is quickly clear.

Description

A kind of statistical modeling method of radio frequency variodenser
Technical field
The present invention relates to semiconductor devices modeling technique technical field, and in particular to a kind of statistical modeling of radio frequency variodenser Method.
Background technology
Variodenser (Varactor) has critically important as main capacitance adjustment device in RF IC design Effect, with the reduction of process node, its performance inconsistency as caused by technique on full wafer wafer is also more and more notable.It is and current The not disclosed report of modeling for the statistical property of variodenser radio-frequency performance.
The radio frequency modeling method of variodenser does not form unified standard, and different sub-circuit knots can be taken by showing as model Structure, and the element in circuit can also use different scalability (Scalable) formula.And most formula do not have strictly Physical significance, but the fitting based on mathematics, cause model parameter can not accurate respective devices fabrication process parameters.This is Choose and bring difficulty for characterizing the statistical model parameter of technological fluctuation.
For different foundries (foundry) technique, its technological fluctuation reason is different, i.e., is shown as in test data Different statistical distribution characteristic, it is difficult to choose the statistical modeling that unified fixed standard index carries out variodenser.
Therefore it provides a kind of statistical modeling method of the radio-frequency capacitor of simple possible seems particularly significant.
The content of the invention
In order to overcome problem above, the present invention is intended to provide a kind of statistical modeling method of radio frequency variodenser, to establish For the global statistics model of the variodenser of RF IC, the influence of the device performance caused by technological fluctuation is characterized, So as to make guidance to RF IC design.
To achieve these goals, the invention provides a kind of statistical modeling method of radio frequency variodenser, the radio frequency to become Container is distributed on the crystal grain of wafer, and it comprises the following steps:
Step 01:It is determined that the sub-circuit topological structure for organs weight, determines each circuit elements in the sub-circuit The scalability formula that part uses, for the modeling of different scale devices, so that it is determined that organs weight need to extract it is all Model parameter;
Step 02:Parameter is classified, is divided into basic parameter group, the population of parameters related to applied bias, with device chi Very little relevant parameter group, and the population of parameters unrelated with technological fluctuation;
Step 03:Based on radio frequency modeling demand, parameter testing, first selected section critical size device are scattered to device Part is scattered the mapping tests of parameter, i.e., is all scattered parameter testing to the selected scale device in all crystal grains, point The mapping test datas of scattering parameter are analysed, obtain wave characteristic of the device scattering parameter in whole wafer, by observing not With the scattering parameter distribution under working frequency, the scattering parameter under different applied bias is distributed, point of scattering parameter difference component Cloth, determine that there is the characteristic part of fluctuation or discreteness in the test data;
Step 04:Average value is calculated to the features described above data in all crystal grains, selects the characteristic of surveyed device most It is golden die close to the crystal grain corresponding to the average value, and tests the scattering ginseng of all device under tests in the golden die Number, using the device test data of the golden die as fit object, extracts the model parameter in the step 01, establishes The benchmark model not comprising technological fluctuation of device;
Step 05:Scattering parameter based on the characteristic part and the network converted by scattering parameter are joined Number, it is configured to one or one group of index that device carries out statistical modeling;
Step 06:Based on the benchmark model in These parameters and step 04, each component value in sub-circuit model is calculated, is gone forward side by side Sensitivity analysis and sequence of the units value relative to desired value, then choose sensitivity highest element;
Step 07:Based on selected element, to all kinds of ginsengs in the scalable formula of the element in the step 02 Several groups, sensitivity analysis and sequence of the parameter value relative to component value are carried out respectively, chooses sensitivity highest parameter;
Step 08:Based on selected parameter, the statistical property distribution of device is fitted, it is complete for characterizing device so as to obtain The statistical model of office's fluctuation distribution.
Preferably, in the step 03, the described characteristic part with fluctuation or discreteness is:The test The ratio between difference and the minimum value of maxima and minima of the data in different crystal grain are more than as the ripple set by modeling requirement The characteristic part of dynamic threshold value.
Preferably, in the step 05, the index can reflect characteristic of the device under the conditions of radio frequency operation;The spy Property includes effective capacitance value.
Preferably, in the step 06, sensitivity analysis and sequence of the component value relative to desired value, specific bag are carried out Include:Near the component value, more all elements are become as index in the step 05 caused by the identical change ratio of component value The scale of change and sequence.
Preferably, in the step 06, when choosing sensitivity highest element, selected sensitivity highest element Quantity is to reach the minimum number of elements needed for fit object.
Preferably, the step 07 includes:Respectively to basic parameter group, biasing relevant parameter group, the related ginseng of device size Several groups carry out sensitivity analysis and sort.
Preferably, the step 07 includes:When choosing sensitivity highest parameter, selected sensitivity highest ginseng Number quantity is to reach the minimum parameters quantity needed for fit object.
Preferably, in the step 08, used approximating method is to selected parameter addition statistical function and adjusts system Count functional dependence parameter.
Preferably, the fit procedure in the step 08 specifically includes:First, it is non-for being brought by device size reduction Index when the minimum device of preferable effect is without applied bias, uses the spirit in basic parameter group selected in the step 07 Sensitivity highest parameter is fitted;Then, whether indicator-specific statistics characteristic when observing device applied bias meets that fitting requires, As do not met, continue addition and entered using the sensitivity highest parameter in biasing relevant parameter group selected in the step 07 Row fitting;Then, whether the indicator-specific statistics characteristic for observing different scale devices meets that fitting requires, does not meet such as, continues to add It is fitted using the sensitivity highest parameter in device size relevant parameter group selected in the step 07;In completion Fit procedure is stated, that is, obtains the statistical model for characterizing the global fluctuation distribution of device.
Preferably, the radio frequency variodenser is MOS varactor.
The statistical modeling method of the radio frequency variodenser of the present invention, for different sub-circuit structures, different scalable formula institutes The model of composition, the present invention are all suitable for;Also, mapping test data analysis is based on, selection can reflect device key performance Index, the principal statistical characteristic distribution for the process characteristic both can be effectively held, and ensure that establishing model can react again The statistical distribution of circuit designers Primary Component performance of concern;Furthermore based on parameter value to component value, component value is to index The sensitivity analysis of value, and parametric classification is carried out, can fast selecting maximally effective statistical model on the basis of current base model Parameter;Meanwhile for the independence of different parameters group, extract statistical parameter value successively respectively based on corresponding performance indications, make Modeling process is quickly clear.
Brief description of the drawings
Fig. 1 is the cross-sectional view of N-type MOS varactor
Fig. 2 is the sub-circuit topological structure schematic diagram of the preferred embodiment of the present invention
Fig. 3 is the schematic flow sheet of the statistical modeling method of the radio frequency variodenser of the preferred embodiment of the present invention
Embodiment
To make present disclosure more clear understandable, below in conjunction with Figure of description, present disclosure is made into one Walk explanation.Certainly the invention is not limited in the specific embodiment, the general replacement known to those skilled in the art Cover within the scope of the present invention.
The statistical modeling method of the radio frequency variodenser of the present invention, the radio frequency variodenser are distributed on the crystal grain of wafer, its Comprise the following steps:
It is determined that the sub-circuit topological structure for organs weight, determine that each circuit element in the sub-circuit uses Scalability formula, for the modeling of different scale devices, so that it is determined that organs weight needs all model parameters extracted;
Parameter is classified, is divided into basic parameter group, the population of parameters related to applied bias, ginseng related to device size Several groups, and population of parameters uncorrelated to technological fluctuation;
Based on radio frequency modeling demand, parameter testing is scattered to device, selected section critical size device first is carried out The mapping tests of scattering parameter, i.e., be all scattered parameter testing to the selected scale device in all crystal grains (die), point The mapping test datas of scattering parameter are analysed, obtain wave characteristic of the device scattering parameter in whole wafer, by observing not With the scattering parameter distribution under working frequency, the scattering parameter under different applied bias is distributed, point of scattering parameter difference component Cloth, determine the characteristic part fluctuated in the test data or dispersion degree is larger;
Average value is calculated to the features described above data in all crystal grains, the characteristic for selecting surveyed device is flat near this Crystal grain corresponding to average is golden die, and tests the scattering parameter of all device under tests in the golden die, with this Golden die device test data is fit object, extracts the model parameter in the step 01, establishes device Benchmark model not comprising technological fluctuation;
Scattering parameter based on the characteristic part and the network parameter converted by scattering parameter, construction are used One or one group of index of statistical modeling are carried out in device;
Based on These parameters and above-mentioned benchmark model, each component value in sub-circuit model, units value phase of going forward side by side are calculated Sensitivity analysis and sequence for desired value, then choose sensitivity highest element;
Based on selected element, to all kinds of populations of parameters in the above-mentioned scalable formula of the element, joined respectively Sensitivity analysis and sequence of the numerical value relative to component value, choose sensitivity highest parameter;
Based on selected parameter, the statistical property distribution of device is fitted, so as to obtain being used for characterizing the global fluctuation of device The statistical model of distribution.
The statistical modeling method of the radio frequency variodenser of the present invention is made below in conjunction with accompanying drawing 1-3 and specific embodiment further Describe in detail.It should be noted that accompanying drawing uses very simplified form, using non-accurately ratio, and only to convenient, clear Reach the purpose for aiding in illustrating the present embodiment clearly.
Referring to Fig. 3, the statistical modeling method of the radio frequency variodenser of the present embodiment, comprises the following steps:
Step 01:It is determined that the sub-circuit topological structure for organs weight, determines that each circuit element makes in sub-circuit Scalability formula, for the modeling of different scale devices, so that it is determined that organs weight needs all models extracted Parameter;
Specifically, referring to Fig. 1, for a kind of cross-sectional view of N-type MOS varactor, formed in P type substrate 1 There is N-type trap 2, the grid oxide layer 4 in N-type trap 2, the grid 5 being covered on grid oxide layer 4, and the N-type positioned at the both sides of grid 5 Source/drain region 3 in trap 2.Modeling of the industry for variodenser at present uses the form of sub-circuit, the sub-circuit for modeling mostly Topographical form is various.The sub-circuit topological structure that the present embodiment is taken is as shown in Figure 2.The topological circuit structure includes 10 altogether Individual circuit element, it is Lg, Rg, Cs, Cf, Rch, Rsd, Rwell, Csub1, Rsub and Csub2 respectively.
Specifically, in order to meet the needs that are emulated to different scale devices, it is necessary to establish the scalable model of device, Scalable formula is established to each circuit element to be fitted the test data of different scale devices.Such as Lg=a1*Wa2* La3, a1, a2, a3 be in the formula it needs to be determined that model parameter.These formula can be by modeling personnel according to device physicses work Make mechanism and test data voluntarily determines.Acceptor circuit structure does not limit the method for the invention, also not each in by sub-circuit The form limitation of the fitting formula of circuit element.The model parameter extracted is all model parameters.
Step 02:Parameter is classified, is divided into basic parameter group, the population of parameters related to applied bias, with device chi Very little relevant parameter group, and the population of parameters unrelated with technological fluctuation;Here, the population of parameters unrelated with technological fluctuation can be temperature Property dependent parameter group.
Step 03:Based on radio frequency modeling demand, parameter testing, first selected section critical size device are scattered to device Part is scattered the mapping tests of parameter, i.e., is all scattered parameter testing to the selected scale device in all crystal grains, point The mapping test datas of scattering parameter are analysed, obtain wave characteristic of the device scattering parameter in whole wafer, by observing not With the scattering parameter distribution under working frequency, the scattering parameter under different applied bias is distributed, point of scattering parameter difference component Cloth, determine that there is the characteristic part of fluctuation or discreteness in test data, selection fluctuation or discrete journey in the embodiment Spend larger characteristic part;Specifically identified degree of fluctuation can flexibly be determined by the distribution situation of actual test data, Degree of fluctuation in the present embodiment is defined as the difference and minimum of maxima and minima of the test data in different crystal grain The ratio between value is more than fluctuation threshold set in advance.The threshold value can be flexibly true by the actual distribution feature of modeling requirement and test data Fixed, the present embodiment is taken as 5%.Here, crystal grain industry is commonly referred to as die.
Step 04:Average value or median are calculated to the features described above data in all crystal grains, select the spy of surveyed device It is golden die that data, which are levied, near the crystal grain corresponding to the average value or median, and tests in the golden die and own The scattering parameter of device under test, using the device test data of the golden die as fit object, extract in the step 01 Model parameter, establish the benchmark model not comprising technological fluctuation of device;Here, golden die are properly termed as optimal crystal grain.
Step 05:The S parameter of feature based data division and the network parameter converted by S parameter, are configured to Device carries out one or one group of index of statistical modeling;
Specifically, here, it is determined that the evaluation index for global statistics modeling.The index should reflect the main of test data Statistical distribution characteristic, and key property of the device in the range of radio frequency operation such as effective capacitance value can be reflected, can be one Individual or one group of index.It is distributed by observing the S parameter under different operating frequency, the S parameter distribution under different applied bias, S ginsengs The distribution of the different components of number, determines to fluctuate larger data division in device test data.And based on S parameter and by S parameter Other network parameters such as impedance parameter (Z parameter), admittance parameter (Y parameter) etc. converted, is configured to device and is united Count one or one group of index of modeling.The present embodiment uses
As the index for judging variodenser radio frequency statistical property.Wherein, Z parameter is impedance parameter, for two-port network, Four components of Z parameter are plural number, respectively Z11, Z12, Z21, Z22;Imag function representations take imaginary part, that is, take (Z11- Z12 imaginary part);ω is angular frequency, and ω=2 π * f, f are frequency;ω be able to can also be selected with the key job frequency of selector One group of ω is selected, seeks the weighted average of F under different ω as index.Preferably, the present embodiment calculates this using the π * 5E9 of ω=2 and referred to Mark.
Step 06:Based on the benchmark model in These parameters and step 04, each component value in sub-circuit model is calculated, is gone forward side by side Sensitivity analysis and sequence of the units value relative to desired value, then choose sensitivity highest element;
Specifically, sensitivity analysis and sequence of the component value relative to desired value are carried out, including:Near component value, than More all elements are as the scale of index change and calculating of sorting in the step 05 caused by the identical change ratio of component value Sensitivity and sequence of each component value to the index, choose sensitivity highest element and carry out statistical modeling.When selection sensitivity During highest element, selected sensitivity highest number of elements is to reach the minimum number of elements needed for fit object, It is that selected element is that can meet fitting demand, the minimal number of element chosen successively by sensitivity height.For example, according to reality Border fit solution, fit object can be reached if only needing an element, just only with one, can not such as meet to add successively sensitive The second high, the 3rd high element is spent, until disclosure satisfy that fitting demand or new addition element can not play a significant role.
It should be noted that there are many kinds for the computational methods of sensitivity.The strict calculating of sensitivity should take statistics to refer to Scale value treats analysis element and carries out derivation respectively, but immediate derivation is more tired in such a more complicated sub-circuit structure It is difficult.A kind of numerical method is taken in the present embodiment, i.e., based on benchmark model, calculates all component values, element to be analyzed is in the base Change certain proportion on the basis of quasi-mode offset a0, such as i.e. two of change are worth component value up and down at a given proportion on the basis of a0, A1=a0 (1- Δs), a2=a0 (1+ Δs) are can be expressed as, here Δ=5%, remaining component value is constant, counting statistics index F0's Change ratio (two of change are worth component value up and down at a given proportion on the basis of a0), that is, calculating F1, (component value is counted when being a1 The statistical indicator of calculation), F2 (statistical indicator that component value calculates when being a2).The calculating of sensitivity is exactly the change ratio of statistical indicator The change ratio of example divided by component value to be analyzed;Sensitivity α can calculate according to following formulas:
α=︱ (F1-F2)/F0 ︱/︱ (a 1-a2)/a0 ︱.
By calculating, the present embodiment chooses Cs, and statistical model modeling is carried out with two elements of Rch.
Step 07:Based on selected element, to all kinds of populations of parameters in the scalable formula of element in step 02, difference Sensitivity analysis and sequence of the parameter value relative to component value are carried out, chooses sensitivity highest parameter;
Specifically, the parameter for statistical modeling is determined, respectively to basic parameter group, biasing relevant parameter group, Yi Jiqi Part size relevant parameter group is analyzed and sorted, and selects sensitivity highest parameter;When choosing sensitivity highest parameter, Selected sensitivity highest number of parameters is to reach the minimum parameters quantity needed for fit object, that is to say selected ginseng Number is that can meet fitting demand, the minimal number of parameter chosen successively by sensitivity height.For example, it is fitted feelings according to actual Condition, fit object can be reached if only needing a parameter, just only with one, can not such as meet to add sensitivity second successively Height, the 3rd high element, until disclosure satisfy that fitting demand or new addition parameter can not play a significant role.
For the element of selection, influence of the parameter in the scalable formula of the element to element value changes is analyzed respectively, So that it is determined that the parameter of statistical disposition should be done.In the present embodiment below equation is used for Cs and Rch:
In above-mentioned formula, w, l, area, pj are the physical dimension of device, and Vgs is the operating voltage of device, and T is device Temperature during work, remaining variables are model parameter, and model parameter can be divided into several groups, and the first kind is basic parameter such as Cmp Cml Cma dCp dCl dCa, Rch0 Rbeta etc., the second class is with biasing relevant parameter such as dvgs0 vgn0 dVch KaccDeng the 3rd It with device size relevant parameter such as dl, the 4th class is the parameter unrelated with technological fluctuation that class, which is, such as temperature characterisitic relevant parameter Such as dvgs_temp, vgn_temp etc..
It should be noted that Parameter Sensitivity Analysis can equally take the numerical analysis method in above-mentioned steps 06.
Step 08:Based on selected parameter, the statistical property distribution of device is fitted, it is complete for characterizing device so as to obtain The statistical model of office's fluctuation distribution.
Specifically, used approximating method is to add statistical function to selected parameter and adjust statistical function correlation to join Number, here, adjusts each parameter and finds out their 3 σ values, determine their fluctuation pattern.Use P=P0+P_3 σ * agauss (0,1,3) original parameter P0 is replaced, wherein, P_3 σ represent to need the parameter for adjusting fitting, and agauss is normal distyribution function, is also cried Gauss of distribution function.0 represents mean μ represents 3 times of σ of standard deviation 3 as 1 as 0,1 and 3.P_3 σ numerical value is adjusted, model is imitated The true statistical distribution for making model emulation data levels off to the statistical distribution of the test data in institute's step 03;
Fit procedure specifically includes:
First, (it is usually institute for reducing the minimum device of the non-ideal effects brought by size in device device under test Design test structure in size maximum device, hereinafter referred large-size device) without applied bias when index, using in step 07 Sensitivity highest parameter in selected basic parameter group is fitted;Then, index during device applied bias is observed Whether statistical property meets that fitting requires, does not meet such as, continues addition and uses biasing relevant parameter group selected in step 07 In sensitivity highest parameter be fitted;Then, whether the indicator-specific statistics characteristic for observing different scale devices meets to be fitted It is required that as do not met, continue addition and use the sensitivity highest in device size relevant parameter group selected in step 07 Parameter is fitted;Above-mentioned fit procedure is completed, that is, obtains the statistical model for characterizing the global fluctuation distribution of device.
For example, carry out statistical model fitting, it is first determined sensitivity sequence of the basic parameter group to component value, select sensitive Spend highest parameter and carry out models fitting.Here, dC is selected respectivelylStatistical property fitting is carried out to large-size device with Rbeta. Then observe whether the model can be fitted data of the device in applied bias, as that can not be fitted, it is related to be continuing with bias Population of parameters carries out models fitting, equally enters line sensitivity sequence, and the present embodiment chooses vgn0 and KaccIt is fitted.Observe afterwards Whether the statistical property of different scale devices is fitted, and the fitting of size relevant parameter, this implementation should be continuing with by such as failing fitting Example is fitted using dl.The present embodiment does not consider statistical property difference during different temperatures characteristic.By said process, the system Meter model meets the statistical property distribution of the lower device of the different biasings of different sizes.
In summary, the statistical modeling method of radio frequency variodenser of the invention, for different sub-circuit structures, difference can stretch The model that contracting formula is formed, the present invention are all suitable for;Also, mapping test data analysis is based on, selection can reflect that device closes The index of key energy, both can effectively hold the principal statistical characteristic distribution for the process characteristic, ensure to establish model energy again Enough statistical distributions for having reacted circuit designers Primary Component performance of concern;Furthermore based on parameter value to component value, element Be worth sensitivity analysis to desired value, and carry out parametric classification, can fast selecting it is maximally effective on the basis of current base model Statistical model parameter;Meanwhile for the independence of different parameters group, statistics ginseng is extracted successively respectively based on corresponding performance indications Numerical value, make modeling process quickly clear.
Although the present invention is disclosed as above with preferred embodiment, the right embodiment illustrated only for the purposes of explanation and , the present invention is not limited to, if those skilled in the art can make without departing from the spirit and scope of the present invention Dry change and retouching, the protection domain that the present invention is advocated should be to be defined described in claims.

Claims (10)

1. a kind of statistical modeling method of radio frequency variodenser, the radio frequency variodenser are distributed on the crystal grain of wafer, its feature exists In comprising the following steps:
Step 01:It is determined that the sub-circuit topological structure for organs weight, determines that each circuit element makes in the sub-circuit Scalability formula, for the modeling of different scale devices, so that it is determined that organs weight needs all models extracted Parameter;
Step 02:Parameter is classified, is divided into basic parameter group, the population of parameters related to applied bias, with device size phase Related parameter group, and the population of parameters unrelated with technological fluctuation;
Step 03:Based on radio frequency modeling demand, parameter testing is scattered to device, selected section critical size device first enters The mapping tests of row scattering parameter, i.e., be all scattered parameter testing to the selected scale device in all crystal grains, and analysis dissipates The mapping test datas of parameter are penetrated, wave characteristic of the device scattering parameter in whole wafer are obtained, by observing different works Scattering parameter under working frequency is distributed, the scattering parameter distribution under different applied bias, the distribution of scattering parameter difference component, really There is the characteristic part of fluctuation or discreteness in the fixed test data;
Step 04:Average value is calculated to the features described above data in all crystal grains, select the characteristic of surveyed device near Crystal grain corresponding to the average value is optimal crystal grain golden die, and is tested all to be measured in the optimal crystal grain golden die The scattering parameter of device, using the device test data of the optimal crystal grain golden die as fit object, extract the step 01 In the model parameter, establish the benchmark model not comprising technological fluctuation of device;
Step 05:Scattering parameter based on the characteristic part and the network parameter converted by scattering parameter, structure Make one or the one group of index that statistical modeling is carried out for device;
Step 06:Based on the benchmark model in These parameters and step 04, each component value in sub-circuit model is calculated, and carry out member Sensitivity analysis and sequence of the part value relative to desired value, then choose sensitivity highest element;
Step 07:Based on selected element, to all kinds of populations of parameters in the scalable formula of the element in the step 02, Sensitivity analysis and sequence of the parameter value relative to component value are carried out respectively, choose sensitivity highest parameter;
Step 08:Based on selected parameter, the statistical property distribution of device is fitted, so as to obtain being used for characterizing device overall situation ripple The statistical model of dynamic distribution.
2. the statistical modeling method of radio frequency variodenser according to claim 1, it is characterised in that in the step 03, institute The characteristic part with fluctuation or discreteness stated is:Maximum of the test data in different crystal grain and minimum The ratio between difference and the minimum value of value are more than as the characteristic part of the fluctuation threshold set by modeling requirement.
3. the statistical modeling method of radio frequency variodenser according to claim 1, it is characterised in that in the step 05, institute Characteristic of the device under the conditions of radio frequency operation can be reflected by stating index;The characteristic includes effective capacitance value.
4. the statistical modeling method of radio frequency variodenser according to claim 1, it is characterised in that in the step 06, enter Sensitivity analysis and sequence of the units value relative to desired value, are specifically included:Near the component value, more all elements The scale changed as index in the step 05 caused by the identical change ratio of component value and sequence.
5. the statistical modeling method of radio frequency variodenser according to claim 4, it is characterised in that in the step 06, when When choosing sensitivity highest element, selected sensitivity highest number of elements is to reach the minimum member needed for fit object Number of packages amount.
6. the statistical modeling method of radio frequency variodenser according to claim 1, it is characterised in that the step 07 includes: Sensitivity analysis is carried out to basic parameter group, biasing relevant parameter group, device size relevant parameter group respectively and sorted.
7. the statistical modeling method of radio frequency variodenser according to claim 6, it is characterised in that the step 07 includes: When choosing sensitivity highest parameter, selected sensitivity highest number of parameters is to reach minimum needed for fit object Number of parameters.
8. the statistical modeling method of radio frequency variodenser according to claim 1, it is characterised in that in the step 08, institute The approximating method used is adds statistical function to selected parameter and adjusts statistical function relevant parameter.
9. the statistical modeling method of radio frequency variodenser according to claim 8, it is characterised in that the plan in the step 08 Conjunction process specifically includes:When first, for reducing the minimum device of the non-ideal effects brought without applied bias by device size Index, be fitted using the sensitivity highest parameter in basic parameter group selected in the step 07;Then, see Whether indicator-specific statistics characteristic when examining device applied bias meets that fitting requires, does not meet such as, continues addition and uses the step Sensitivity highest parameter in 07 in selected biasing relevant parameter group is fitted;Then, different scale devices are observed Indicator-specific statistics characteristic whether meet that fitting requires, do not meet such as, continue addition and use selected device in the step 07 Sensitivity highest parameter in size relevant parameter group is fitted;Above-mentioned fit procedure is completed, that is, obtains being used for tokenizer The statistical model of the global fluctuation distribution of part.
10. the statistical modeling method of radio frequency variodenser according to claim 1, it is characterised in that the radio frequency variodenser For MOS varactor.
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CN111859844A (en) * 2019-04-26 2020-10-30 长鑫存储技术有限公司 Feature chip selection method and device model establishment method in modeling process
CN110222087B (en) * 2019-05-15 2023-10-17 平安科技(深圳)有限公司 Feature extraction method, device and computer readable storage medium
CN114841099B (en) * 2022-07-04 2022-10-11 浙江铖昌科技股份有限公司 Method, device, equipment and system for constructing characterization model

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244452A (en) * 2000-02-28 2001-09-07 Japan Radio Co Ltd Method and apparatus for extracting high-frequency semiconductor device model parameter, and recording medium
CN101196936A (en) * 2006-12-05 2008-06-11 上海华虹Nec电子有限公司 Fast modeling method of MOS transistor electricity statistical model
CN101655882A (en) * 2009-07-24 2010-02-24 上海宏力半导体制造有限公司 Modelling method based on worst condition of statistic model
CN102117352A (en) * 2010-01-05 2011-07-06 上海华虹Nec电子有限公司 Method for simulating radio frequency metal oxide semiconductor (MOS) varactor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244452A (en) * 2000-02-28 2001-09-07 Japan Radio Co Ltd Method and apparatus for extracting high-frequency semiconductor device model parameter, and recording medium
CN101196936A (en) * 2006-12-05 2008-06-11 上海华虹Nec电子有限公司 Fast modeling method of MOS transistor electricity statistical model
CN101655882A (en) * 2009-07-24 2010-02-24 上海宏力半导体制造有限公司 Modelling method based on worst condition of statistic model
CN102117352A (en) * 2010-01-05 2011-07-06 上海华虹Nec电子有限公司 Method for simulating radio frequency metal oxide semiconductor (MOS) varactor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
基于BSIM3模型的毫米波MOS变容管建模;夏立诚 等;《微电子学》;20071231;第37卷(第6期);第833-837页 *
射频集成(RFIC)压控振荡器(VCO)的设计与研究;易新敏;《中国优秀博硕士学位论文全文数据库(硕士)信息科技辑》;20061215(第12期);第I135-343页 *

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