CN104676949A - Sintered heat pipe and semiconductor refrigeration refrigerator provided with same - Google Patents
Sintered heat pipe and semiconductor refrigeration refrigerator provided with same Download PDFInfo
- Publication number
- CN104676949A CN104676949A CN201510056236.1A CN201510056236A CN104676949A CN 104676949 A CN104676949 A CN 104676949A CN 201510056236 A CN201510056236 A CN 201510056236A CN 104676949 A CN104676949 A CN 104676949A
- Authority
- CN
- China
- Prior art keywords
- main leg
- heat pipe
- pipeline section
- sintered heat
- described main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a sintered heat pipe and a semiconductor refrigeration refrigerator provided with the same. The sintered heat pipe comprises a main pipe section with two ends enclosed; a branched pipe section extends from one portion of two sides opposite to the main pipe section or branched pipe sections respectively extend form a plurality of portions of two sides opposite to the main pipe section; the working cavity of each branched pipe section is communicated with the working cavity of the main pipe section. In addition, the invention further provides a semiconductor refrigeration refrigerator provided with the sintered heat pipe. Provided with the branched pipe sections, the sintered heat pipe and the semiconductor refrigeration refrigerator provided with the same have significant differences as compared with a traditional sintered heat pipe extending along a single path, heat dissipation or chill transferring efficiency is obviously improved for the sintered heat pipe, and the sintered heat pipe is especially suitable for heat dissipation of high heat flux of a semiconductor chilling plate and the like.
Description
Technical field
The present invention relates to sintered heat pipe, particularly relate to a kind of sintered heat pipe and there is the semiconductor freezer of this sintered heat pipe.
Background technology
Sintered heat pipe is a kind of high-performance heat transfer components, and it carrys out transferring heat by the phase transition process of the evaporation and condensation at Totally enclosed vacuum liquid in pipe, has high heat conductivility and excellent isothermal.Sintered heat pipe is made up of shell, liquid-sucking core and end cap, by being pumped into 1.3 in pipe × negative pressure of (10 negative 1-10 negative 4) Pa after fill with appropriate hydraulic fluid, make to be close to be full of liquid in the liquid-sucking core capillary-porous material of inside pipe wall after sealed.One end of sintered heat pipe is evaporator section (bringing-up section), and the other end is condensation segment (cooling section), needs can arrange adiabatic section two sections of centres according to application.Liquid carburation by evaporation when one end of sintered heat pipe is heated in Mao Renxin, steam flows to other end releasing heat and condenses into liquid under small pressure reduction, and liquid flows back to evaporator section along porous material by the effect of capillary force again.Circulation like this is not own, and heat reaches the other end by one end of sintered heat pipe.That is, existing sintered heat pipe extends to its other end from its one end along exclusive path, and this extension path can be straight line, L-type or U-shaped.But the thermal source for high heat fluxs such as semiconductor chilling plates dispels the heat, existing sintered heat pipe may not reach desirable effect.
Summary of the invention
An object of first aspect present invention is intended at least one defect overcoming existing sintered heat pipe, provides a kind of sintered heat pipe of novel structure.
As far as possible a further object of first aspect present invention to improve heat radiation or the biography cold efficiency of sintered heat pipe.
Another further object of first aspect present invention is the compact conformation that will make sintered heat pipe.
An object of second aspect present invention to provide a kind of semiconductor freezer with above-mentioned sintered heat pipe.
According to a first aspect of the invention, the invention provides a kind of sintered heat pipe, it comprises the main leg that two ends are all closed.Especially, a bifurcated pipeline section is extended described main leg respectively relative to one or more positions of both sides respectively; The working chamber of each described bifurcated pipeline section is connected with the working chamber of described main leg.
Alternatively, the liquid-sucking core in each described bifurcated pipeline section is connected with the liquid-sucking core in described main leg.
Alternatively, the axis of described main leg is space curve; Or the axis of described main leg is straight line, L-type line or U-shaped line.
Alternatively, each described bifurcated pipeline section extends outward from the corresponding site of described main leg along the direction perpendicular to described main leg.
Alternatively, the bifurcated pipeline section of the every side of described main leg is at least 3, and the initiating terminal of the bifurcated pipeline section of the every side of described main leg is arranged equally spacedly along the bearing of trend of described main leg on described main leg.
Alternatively, the quantity of the bifurcated pipeline section of described main leg side is equal with the quantity of the bifurcated pipeline section of described main leg's opposite side; And each described bifurcated pipeline section of described main leg side is on same straight line to a corresponding described bifurcated pipeline section of described main leg's opposite side.
Alternatively, described main leg comprises straight-tube portion, one end-enclosed; And the initiating terminal of each described bifurcated pipeline section is all positioned at the straight-tube portion of described main leg.
Alternatively, described main leg also comprises: another straight-tube portion, and its one end is closed, and be arranged in parallel with described straight-tube portion; Divide with connecting straight section (s), be connected between described straight-tube portion and another straight-tube portion described, all arrange in the angle of 100 ° to 170 ° with described straight-tube portion and another straight-tube portion described.
Alternatively, the diameter of each described bifurcated pipeline section equals the diameter of described main leg.
According to a second aspect of the invention, the invention provides a kind of semiconductor freezer, it comprises inner bag, semiconductor chilling plate and heat-exchanger rig.Especially, described heat-exchanger rig comprises many any one sintered heat pipe above-mentioned; And the main leg of sintered heat pipe described in every root partly or entirely with the hot junction of described semiconductor chilling plate or cold junction thermally coupled; The bifurcated pipeline section of sintered heat pipe described in every root be used in surrounding air heat radiation or to described inner bag storing between room pass cold.
Sintered heat pipe of the present invention and during there is its semiconductor freezer because sintered heat pipe has bifurcated pipeline section, its structure has significant difference compared with the existing conventional sintering heat pipe extended along exclusive path, and the sintered heat pipe in the present invention significantly improves its heat radiation or passes cold efficiency.
Further, sintered heat pipe of the present invention and thermal source that in having its semiconductor freezer, the sintered heat pipe of new structure is specially adapted to the high heat fluxs such as semiconductor chilling plate dispel the heat.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic elevational view of sintered heat pipe according to an embodiment of the invention;
Fig. 2 is the show in schematic partial sections at A place in Fig. 1;
Fig. 3 is the left side schematic elevational view of sintered heat pipe shown in Fig. 1;
Fig. 4 is the schematic right-side view of semiconductor freezer according to an embodiment of the invention;
Fig. 5 is the schematic rear view of semiconductor freezer according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 is the schematic elevational view of sintered heat pipe according to an embodiment of the invention.As shown in Figure 1, and with reference to figure 2; Embodiments provide a kind of sintered heat pipe 200 of novel structure, it has higher heat radiation or passes cold efficiency, and can be applicable in various heat-exchanger rig, the thermal source being specially adapted to high heat flux such as semiconductor chilling plate 150 grade dispels the heat.Particularly, this sintered heat pipe 200 can comprise the main leg 210 all closed at two ends.Especially, extend a bifurcated pipeline section 220 respectively at one or more positions of the relative both sides of main leg 210 respectively, to improve the heat radiation of sintered heat pipe 200 or to pass cold efficiency.The working chamber 230 of each bifurcated pipeline section 220 can be connected with the working chamber 230 of main leg 210, so that the vapor flow in sintered heat pipe 200.Multiple bifurcated pipeline sections 220 of sintered heat pipe 200 are positioned at the relative both sides of main leg 210, also can make the compact conformation of this sintered heat pipe 200.
In embodiment further more of the present invention, as shown in Figure 2, the liquid-sucking core 240 in each bifurcated pipeline section 220 can be connected with the liquid-sucking core 240 in main leg 210.Liquid-sucking core 240 in each bifurcated pipeline section 220 is all close to respective tube inwall, so that the flowing of hydraulic fluid with the liquid-sucking core 240 in main leg 210.Further, the diameter of each bifurcated pipeline section 220 can equal the diameter of main leg 210.In alternate embodiment more of the present invention, the diameter of each bifurcated pipeline section 220 also can be less than the diameter of main leg 210.
The axis of main leg 210 can be space curve, so that the layout of sintered heat pipe 200.Known by those skilled in the art, the axis of main leg 210 also can be plane curve, such as straight line, L-type line or U-shaped line.Each bifurcated pipeline section 220 extends outward from the corresponding site of main leg 210 along the direction perpendicular to main leg 210.The bifurcated pipeline section 220 of the every side of main leg 210 is at least 3, and the initiating terminal of the bifurcated pipeline section 220 of the every side of main leg 210 is arranged equally spacedly along the bearing of trend of main leg 210 on main leg 210.
In some embodiments of the invention, the quantity of the bifurcated pipeline section 220 of main leg 210 side is equal with the quantity of the bifurcated pipeline section 220 of main leg 210 opposite side; And each bifurcated pipeline section 220 of main leg 210 side is on same straight line to a corresponding bifurcated pipeline section 220 of main leg 210 opposite side.In alternate embodiment more of the present invention, the bifurcated pipeline section 220 of main leg 210 side is arranged spaced reciprocally with the bifurcated pipeline section 220 of main leg 210 opposite side.
In some embodiments of the invention, as shown in Figure 3, main leg 210 can comprise straight-tube portion 211, one end-enclosed; And the initiating terminal of each bifurcated pipeline section 220 is all positioned at the straight-tube portion 211 of main leg 210.Further, in embodiments of the present invention, the main leg 210 of this sintered heat pipe 200 also can comprise another straight-tube portion 212 of closing one end and the connecting straight section (s) be connected between described straight-tube portion 211 and another straight-tube portion 212 described divides 213.Another straight-tube portion 212 described can be arranged in parallel with described straight-tube portion 211, and connecting straight section (s) divides 213 all to arrange in the angle of 100 ° to 170 ° with described straight-tube portion 211 and another straight-tube portion 212 described.Described another straight sections 212 points can be used for thermal source or low-temperature receiver thermally coupled, described straight-tube portion 211 and bifurcated pipeline section 220 can be used for heat radiation or pass cold.
Fig. 4 is the left side schematic elevational view of semiconductor freezer according to an embodiment of the invention.As shown in Figure 4, and with reference to figure 5, the embodiment of the present invention additionally provides a kind of semiconductor freezer, and it comprises inner bag 100, semiconductor chilling plate 150 and heat-exchanger rig.Heat-exchanger rig is used for the heat in the hot junction from semiconductor chilling plate 150 to be dispersed in surrounding air, or room between the storing cold of the cold junction from semiconductor chilling plate 150 being passed to inner bag 100.Especially, heat-exchanger rig can have the sintered heat pipe 200 in many above-mentioned any embodiment.And hot junction or the cold junction of the part or all of and semiconductor chilling plate 150 of the main leg 210 of every root sintered heat pipe 200 are thermally coupled; The bifurcated pipeline section 220 of every root sintered heat pipe 200 is for heat radiation in surrounding air or pass cold to room between storing.
In order to improve heat radiation further or pass cold efficiency, the bifurcated pipeline section 220 of every root sintered heat pipe 200 can be provided with plate type radiator fin 300.Heat-exchanger rig also can comprise blower fan 400, it can be arranged on the homonymy of multiple bifurcated pipeline section 220, such as be arranged on the top of fin 300, be configured to: suck air-flow from its air intake district and blow to the gap between every two adjacent fins 300, or suck air-flow from the gap between every two adjacent fins 300 and blow to its blow zones.In alternate embodiment more of the present invention, the bifurcated pipeline section 220 of every root sintered heat pipe 200 spirals a sheathed helical fin.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1. a sintered heat pipe, is characterized in that, comprises the main leg that two ends are all closed; And
A bifurcated pipeline section is extended respectively relative to one or more positions of both sides respectively described main leg;
The working chamber of each described bifurcated pipeline section is connected with the working chamber of described main leg.
2. sintered heat pipe according to claim 1, is characterized in that,
Liquid-sucking core in each described bifurcated pipeline section is connected with the liquid-sucking core in described main leg.
3. sintered heat pipe according to claim 1, is characterized in that,
The axis of described main leg is space curve; Or
The axis of described main leg is straight line, L-type line or U-shaped line.
4. sintered heat pipe according to claim 1, is characterized in that,
Each described bifurcated pipeline section extends outward from the corresponding site of described main leg along the direction perpendicular to described main leg.
5. sintered heat pipe according to claim 1, is characterized in that,
The bifurcated pipeline section of the every side of described main leg is at least 3, and the initiating terminal of the bifurcated pipeline section of the every side of described main leg is arranged equally spacedly along the bearing of trend of described main leg on described main leg.
6. sintered heat pipe according to claim 1, is characterized in that,
The quantity of the bifurcated pipeline section of described main leg side is equal with the quantity of the bifurcated pipeline section of described main leg's opposite side; And
The each described bifurcated pipeline section of described main leg side described bifurcated pipeline section corresponding to of described main leg's opposite side is on same straight line.
7. sintered heat pipe according to claim 1, is characterized in that,
Described main leg comprises straight-tube portion, one end-enclosed; And
The initiating terminal of each described bifurcated pipeline section is all positioned at the straight-tube portion of described main leg.
8. sintered heat pipe according to claim 7, is characterized in that, described main leg also comprises:
Another straight-tube portion, its one end is closed, and be arranged in parallel with described straight-tube portion; With
Connecting straight section (s) is divided, and is connected between described straight-tube portion and another straight-tube portion described, all arranges in the angle of 100 ° to 170 ° with described straight-tube portion and another straight-tube portion described.
9. sintered heat pipe according to claim 1, is characterized in that,
The diameter of each described bifurcated pipeline section equals the diameter of described main leg.
10. a semiconductor freezer, comprises inner bag, semiconductor chilling plate and heat-exchanger rig, it is characterized in that,
Described heat-exchanger rig comprises the sintered heat pipe according to any one of many claims 1 to 9; And
Hot junction or the cold junction of the part or all of and described semiconductor chilling plate of the main leg of sintered heat pipe described in every root are thermally coupled;
The bifurcated pipeline section of sintered heat pipe described in every root be used in surrounding air heat radiation or to described inner bag storing between room pass cold.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510056236.1A CN104676949B (en) | 2015-02-03 | 2015-02-03 | Sintered heat pipe and there is its semiconductor freezer |
| PCT/CN2015/091095 WO2016123996A1 (en) | 2015-02-03 | 2015-09-29 | Sintered heat pipe and semiconductor cooling refrigerator having same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510056236.1A CN104676949B (en) | 2015-02-03 | 2015-02-03 | Sintered heat pipe and there is its semiconductor freezer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104676949A true CN104676949A (en) | 2015-06-03 |
| CN104676949B CN104676949B (en) | 2016-11-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510056236.1A Active CN104676949B (en) | 2015-02-03 | 2015-02-03 | Sintered heat pipe and there is its semiconductor freezer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104676949B (en) |
| WO (1) | WO2016123996A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016123996A1 (en) * | 2015-02-03 | 2016-08-11 | 青岛海尔股份有限公司 | Sintered heat pipe and semiconductor cooling refrigerator having same |
| CN110793365A (en) * | 2018-04-14 | 2020-02-14 | 青岛科技大学 | Heat pipe |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6662340B2 (en) * | 2017-03-30 | 2020-03-11 | マツダ株式会社 | Heat pipe equipment |
| CN112747521A (en) * | 2019-10-30 | 2021-05-04 | 青岛海尔电冰箱有限公司 | Semiconductor refrigerator |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5522455A (en) * | 1994-05-05 | 1996-06-04 | Northrop Grumman Corporation | Heat pipe manifold with screen-lined insert |
| JPH11257882A (en) * | 1998-03-12 | 1999-09-24 | Sharp Corp | Heat pipe and heat-collecting device |
| CN201053839Y (en) * | 2007-04-10 | 2008-04-30 | 中山伟强科技有限公司 | Sintering type heat pipe |
| CN102510990A (en) * | 2009-07-17 | 2012-06-20 | 史泰克公司 | Heat pipes and thermoelectric cooling devices |
| US20120186787A1 (en) * | 2011-01-25 | 2012-07-26 | Khanh Dinh | Heat pipe system having common vapor rail |
| CN202634325U (en) * | 2011-06-29 | 2012-12-26 | 罗斯蒙德公司 | Integrated thermoelectric generator and system for wireless devices |
| CN204612225U (en) * | 2015-02-03 | 2015-09-02 | 青岛海尔股份有限公司 | Sintered heat pipe and there is its semiconductor freezer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104676949B (en) * | 2015-02-03 | 2016-11-23 | 青岛海尔股份有限公司 | Sintered heat pipe and there is its semiconductor freezer |
-
2015
- 2015-02-03 CN CN201510056236.1A patent/CN104676949B/en active Active
- 2015-09-29 WO PCT/CN2015/091095 patent/WO2016123996A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5522455A (en) * | 1994-05-05 | 1996-06-04 | Northrop Grumman Corporation | Heat pipe manifold with screen-lined insert |
| JPH11257882A (en) * | 1998-03-12 | 1999-09-24 | Sharp Corp | Heat pipe and heat-collecting device |
| CN201053839Y (en) * | 2007-04-10 | 2008-04-30 | 中山伟强科技有限公司 | Sintering type heat pipe |
| CN102510990A (en) * | 2009-07-17 | 2012-06-20 | 史泰克公司 | Heat pipes and thermoelectric cooling devices |
| US20120186787A1 (en) * | 2011-01-25 | 2012-07-26 | Khanh Dinh | Heat pipe system having common vapor rail |
| CN202634325U (en) * | 2011-06-29 | 2012-12-26 | 罗斯蒙德公司 | Integrated thermoelectric generator and system for wireless devices |
| CN204612225U (en) * | 2015-02-03 | 2015-09-02 | 青岛海尔股份有限公司 | Sintered heat pipe and there is its semiconductor freezer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016123996A1 (en) * | 2015-02-03 | 2016-08-11 | 青岛海尔股份有限公司 | Sintered heat pipe and semiconductor cooling refrigerator having same |
| CN110793365A (en) * | 2018-04-14 | 2020-02-14 | 青岛科技大学 | Heat pipe |
| CN110793365B (en) * | 2018-04-14 | 2021-05-14 | 青岛科技大学 | Heat pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104676949B (en) | 2016-11-23 |
| WO2016123996A1 (en) | 2016-08-11 |
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