CN104673108A - Method for filling insulating glue in closed shell - Google Patents
Method for filling insulating glue in closed shell Download PDFInfo
- Publication number
- CN104673108A CN104673108A CN201510120676.9A CN201510120676A CN104673108A CN 104673108 A CN104673108 A CN 104673108A CN 201510120676 A CN201510120676 A CN 201510120676A CN 104673108 A CN104673108 A CN 104673108A
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- Prior art keywords
- glue
- housing
- interface
- shell
- insulation paste
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a method for filling insulating glue in a closed shell. An electronic device is arranged in a cavity of the shell; the space enclosed by the surface of the electronic device and the inner wall of the shell is formed into an insulating glue filling cavity; the method is characterized by comprising the following steps: first, coating an interface glue layer with a certain thickness on the surface of the insulating glue filling cavity in the shell; then, filling the rest space in the insulating glue filling cavity by using main glue; next, closing the shell; finally, placing the shell in a high-temperature environment, so that the interface glue layer and the main glue are cured by heating, wherein both the interface glue layer and the main glue are prepared by methyl vinyl silicone oil and methyl hydrogen-containing silicon oil according to a certain proportion; the ratios of the methyl vinyl silicone oil to the methyl hydrogen-containing silicon oil in the interface glue layer and the main glue are respectively set to be M:1 and N:1, and M is less than N. The method has the benefits that the problem of cracks in an insulating glue body and the positions between the glue body and other physical interfaces can be solved effectively; the method is simple in process and easy to implement; the product yield can be greatly improved.
Description
Technical field
The present invention relates to a kind of insulation paste encapsulation technology, particularly relate to a kind of method that insulation paste is set in closure casing.
Background technology
For the electronic product working in hyperbaric environment, in order to avoid electrical breakdown situation appears in interiors of products, generally will fill insulation paste in the housing of product, namely two-component insulating silica gel be a kind of conventional insulation paste type, Problems existing is: after insulation paste embedding is good, need to be heating and curing, and two-component insulating silica gel volume change when temperature variation is larger, inside will form internal stress, for totally enclosed housing, due to colloid by housings close interior, colloid internal stress discharges nowhere, colloid inside and colloid and hardware bonding plane place will be caused to occur ftractureing, when product work is under condition of high voltage, be easy to, at cracking place, electrical breakdown occurs, cause damage of product, therefore when product export, must detect the anti-electrical breakdown capability of product, due to the existence of problem of Cracking, cause finished product rate lower.
In order to solve insulation paste problem of Cracking in seal casinghousing, those skilled in the art have also carried out some and have explored, than if any technician just propose by reducing colloid hardness and reducing colloid solidification time internal stress, thus improve problem of Cracking, but be limited to the current situation of materialogy, the bond strength that the molecular chemistry key bond energy of two-component insulating silica gel can provide is limited, after colloid hardness reduces, its bond strength also can decrease, although foregoing approach can make colloid internal cleavage problem make moderate progress, but the bonding part of colloid and other physical interfaces can be caused more easy to crack, cannot tackle the problem at its root.
Summary of the invention
For the problem in background technology, the present invention proposes a kind of method arranging insulation paste in closure casing, comprise housing, be provided with electron device in the inner chamber of described housing, electron device surface and inner walls enclosed space form insulation paste and fill chamber; Its innovation is: first in housing, surface smear certain thickness interface, chamber glue-line filled by insulation paste, then fill with its complementary space that insulation paste to be filled in chamber by main glue, then by housings close, finally housing is placed in hot environment, makes interface glue-line and main glue by thermofixation; Described interface glue-line and main glue by methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid formulated by a certain percentage, if the ratio of methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid is respectively M ︰ 1 and N ︰ 1, then M < N in interface glue-line and main glue.
Methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid are two kinds of common insulation paste components, and in prior art, methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid can mix and mix two-component insulating silica gel by skilled person as required by a certain percentage; But the general fixed mixing ratio that adopts modulates two-component insulating silica gel in prior art, this just causes the physico-chemical property at the inner different positions place of colloid basically identical; For the insulation paste colloid in closure casing, the physico-chemical property that colloid different positions place needs is distinguished to some extent, at the intersection of colloid edge and inner walls, colloid is needed to possess stronger cohesive force to ensure the secure bond between colloid and housing, but after stronger cohesiveness can cause colloid to solidify, hardness is comparatively large, is unfavorable for absorption of stress, easily ftractures; In the middle part of colloid, because glue amount is more, the stress produced when colloid is heated is also larger, now need colloid that good flexibility can be provided to absorb stress, but flexibility can cause colloid cohesiveness to be deteriorated preferably, colloid is easily separated with inner walls, and the two-component insulating silica gel gone out in single ratio mixing preparation is difficult to meet the demands.
From the angle improving colloid different positions place physico-chemical property, the present invention is by regulating the content of methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid, the two kinds of colloids (i.e. interface glue-line and main glue) possessing different physico-chemical property are made, and these two kinds of colloids are used for the different sites of filling in housing, wherein, because Methyl Hydrogen Polysiloxane Fluid proportion is lower in main glue, colloid is more soft, elasticity is better, the stress produced when colloid is heated can be absorbed preferably, because Methyl Hydrogen Polysiloxane Fluid proportion is higher in the glue-line of interface, gel strength and solidification after hardness all relatively high, the secure bond of colloid and other physical interfaces can be ensured, and because the composition of main glue and interface glue-line is methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid, make, between winner's glue and interface glue-line, there is good affinity, its interface can ensure good bonding strength, after adopting the present invention program, the problem that effectively can suppress colloid internal cleavage and ftracture between colloid and other physical interfaces, ensures that product has good anti-electrical breakdown performance, improves yield rate.
Preferably, the numerical value that the numerical value of described M gets 8, N gets 13.
Advantageous Effects of the present invention is: obviously can improve the problem ftractureed in insulation paste colloid inside and colloid and other physical interfaces, technique is simple, is easy to realize, can significantly improves finished product rate.
Accompanying drawing explanation
Situation schematic diagram that the inner and colloid of Fig. 1, micelle colloid ftractures with other physical interfaces (mark the breach that A place is colloid inside in figure, mark B place and be breach between colloid and inner walls);
The diagrammatic cross-section of the product that Fig. 2, employing the present invention program obtain;
In figure each mark corresponding to title be respectively: housing 1, interface glue-line 2, main glue 3.
Embodiment
In closure casing, arrange a method for insulation paste, comprise housing 1, be provided with electron device in the inner chamber of described housing 1, electron device surface and housing 1 inwall enclosed space form insulation paste and fill chamber; Its innovation is: first in housing 1, surface smear certain thickness interface, chamber glue-line 2 filled by insulation paste, then fill with its complementary space that insulation paste to be filled in chamber by main glue 3, then housing 1 is closed, finally housing 1 is placed in hot environment, make interface glue-line 2 and main glue 3 by thermofixation; Described interface glue-line 2 and main glue 3 by methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid formulated by a certain percentage, if the ratio of methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid is respectively M ︰ 1 and N ︰ 1, then M < N in interface glue-line 2 and main glue 3.
Further, the numerical value that the numerical value of described M gets 8, N gets 13.
Through test, after adopting the present invention program, the success ratio that product is tested by anti-electrical breakdown can reach more than 90%, and the test success ratio of prior art products obtained therefrom only has about 60%.
Claims (2)
1. in closure casing, arrange a method for insulation paste, comprise housing (1), be provided with electron device in the inner chamber of described housing (1), electron device surface and housing (1) inwall enclosed space form insulation paste and fill chamber; It is characterized in that: first in housing (1), surface smear certain thickness interface glue-line, chamber (2) filled by insulation paste, then fill with its complementary space that insulation paste to be filled in chamber by main glue (3), then housing (1) is closed, finally housing (1) is placed in hot environment, makes interface glue-line (2) and main glue (3) by thermofixation; Described interface glue-line (2) and main glue (3) by methyl vinyl silicon oil and Methyl Hydrogen Polysiloxane Fluid formulated by a certain percentage, if the ratio of interface glue-line (2) and the middle methyl vinyl silicon oil of main glue (3) and Methyl Hydrogen Polysiloxane Fluid is respectively M ︰ 1 and N ︰ 1, then M < N.
2. the method arranging insulation paste in closure casing according to claim 1, is characterized in that: the numerical value that the numerical value of described M gets 8, N gets 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510120676.9A CN104673108B (en) | 2015-03-19 | 2015-03-19 | The method that insulating cement is set in closed housing body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510120676.9A CN104673108B (en) | 2015-03-19 | 2015-03-19 | The method that insulating cement is set in closed housing body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104673108A true CN104673108A (en) | 2015-06-03 |
| CN104673108B CN104673108B (en) | 2016-09-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510120676.9A Active CN104673108B (en) | 2015-03-19 | 2015-03-19 | The method that insulating cement is set in closed housing body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104673108B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107462777A (en) * | 2017-09-15 | 2017-12-12 | 中国电力科学研究院 | A kind of system and method for being used to carry out multichannel power frequency electric field measurement under high humidity conditions |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141369A (en) * | 1977-05-16 | 1978-12-09 | Mitsubishi Electric Corp | Treatment of article with thermosetting resin |
| US5626771A (en) * | 1994-06-02 | 1997-05-06 | International Business Machines Corporation | Design of high density structures with laser etch stop |
| WO2000070676A1 (en) * | 1999-05-18 | 2000-11-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
| CN2691051Y (en) * | 2003-11-11 | 2005-04-06 | 威宇半导体（香港)有限公司 | Package base board structure capable of reducing cutting stress |
| CN103065986A (en) * | 2011-10-22 | 2013-04-24 | 无锡世一电力机械设备有限公司 | Semiconductor packaging technology capable of reducing humidity level |
| CN103682030A (en) * | 2012-09-07 | 2014-03-26 | 深圳市龙岗区横岗光台电子厂 | LED, LED device and LED manufacture technology |
-
2015
- 2015-03-19 CN CN201510120676.9A patent/CN104673108B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141369A (en) * | 1977-05-16 | 1978-12-09 | Mitsubishi Electric Corp | Treatment of article with thermosetting resin |
| US5626771A (en) * | 1994-06-02 | 1997-05-06 | International Business Machines Corporation | Design of high density structures with laser etch stop |
| WO2000070676A1 (en) * | 1999-05-18 | 2000-11-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
| CN2691051Y (en) * | 2003-11-11 | 2005-04-06 | 威宇半导体（香港)有限公司 | Package base board structure capable of reducing cutting stress |
| CN103065986A (en) * | 2011-10-22 | 2013-04-24 | 无锡世一电力机械设备有限公司 | Semiconductor packaging technology capable of reducing humidity level |
| CN103682030A (en) * | 2012-09-07 | 2014-03-26 | 深圳市龙岗区横岗光台电子厂 | LED, LED device and LED manufacture technology |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107462777A (en) * | 2017-09-15 | 2017-12-12 | 中国电力科学研究院 | A kind of system and method for being used to carry out multichannel power frequency electric field measurement under high humidity conditions |
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| Publication number | Publication date |
|---|---|
| CN104673108B (en) | 2016-09-14 |
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