CN104658958A

CN104658958A - Wafer grabbing arm

Info

Publication number: CN104658958A
Application number: CN201510076361.9A
Authority: CN
Inventors: 杜春辉; 沈家敏; 冯建炜
Original assignee: Suzhou Industrial Park Co Ltd Of Industries Based On Nanotechnology Institute For Research And Technology
Current assignee: Suzhou Industrial Park Co Ltd Of Industries Based On Nanotechnology Institute For Research And Technology
Priority date: 2015-02-13
Filing date: 2015-02-13
Publication date: 2015-05-27
Anticipated expiration: 2035-02-13
Also published as: CN104658958B

Abstract

The invention relates to a mechanical arm, in particular to a wafer grabbing arm. A driving device is used for controlling an action. The wafer grabbing arm comprises a flat arm body, clamping pieces arranged on the upper end surface of the arm body and a detector arranged on the arm body, wherein the clamping pieces are used for fixing the edge of a wafer, and the detector is used for detecting the wafer. According to the wafer grabbing arm, the wafer can be grabbed and sensed accurately after vacuum is eliminated, the structure and operation are simple, and grabbing is accurate.

Description

Wafer grabbing arm

Technical field

The present invention relates to a kind of mechanical arm, particularly relate to a kind of wafer grabbing arm.

Background technology

MEMS (micro electro mechanical system) (MEMS, Micro-Electro-Mechanical System) manufacturing process in, wafer is absolutely necessary one of device, in the building process of MEMS framework, usually processing wafer being carried out to multiple operation is needed, most of operation all needs to capture wafer, at present, the arm getting wafer generally adopts the mode of vacuum suction to draw wafer, and the wafer after dark silicon etching, the area thickness be etched is low to moderate 20 μm, because thickness is too little, chip sucking can be broken by vacuum, cause damage, and cause chip detection system wafer to be detected.Arm extends wafer rack when getting wafer, draw position in the centre position of wafer, because the size of wafer is less, therefore the size of arm is also less, if cancel vacuum, cannot get sheet smoothly, in addition, after closing vacuum, chip detection system cannot detect, and the board of processed wafer does not receive signal, acquiescence, without wafer, cannot carry out the transmission of wafer.Therefore can only by manually passing sheet, operating personnel use tweezers to pinch and get wafer, wafer is put into reaction chamber and processes, manually take out after terminating again, not only at substantial manpower, and have a strong impact on production efficiency.

Because above-mentioned defect, the design people, actively in addition research and innovation, to founding a kind of wafer grabbing arm, make it have more value in industry.

Summary of the invention

For solving the problems of the technologies described above, the object of this invention is to provide a kind of wafer grabbing arm, still can accurately capture and sense wafer after cancellation vacuum.

The wafer grabbing arm that the present invention proposes, by drive unit control action, comprise the arm body of flat, be arranged on the holding part of described arm body upper surface, the detector be arranged on described arm body, described holding part is used for fixed wafer edge, and described detector is for detecting wafer.

Further, the upper surface of described arm body is provided with the groove placing wafer, and the side wall profile of described groove and the edge of wafer coincide, and the sidewall of described groove forms the holding part at fixed wafer edge.

Further, the degree of depth of described groove is not less than the thickness of wafer.

Further, the edge bottom material of described groove is rubber.

Further, the middle part of the grasping end of described arm body caves inward formation two tentacles.

Further, described arm body upper surface is provided with the adjusting hole connecting described drive unit.

Further, described adjusting hole is strip distribution along the longitudinally of arm body, and its quantity is two, and opposing parallel setting.

Further, described detector is fibre-optical probe, and the light source transmit direction of described fibre-optical probe points to the center of wafer, and described fibre-optical probe is connected with signal processor, sets up Signal transmissions between described signal processor and described drive unit.

Further, the quantity of described fibre-optical probe is two.

Further, the material of described arm body is stainless steel.

By such scheme, the present invention at least has the following advantages: different from the mode drawn, and the present invention uses and asks the mode of getting to capture wafer, is flat, expands the contact area with wafer, make crawl more steady by arm body design; Because wafer is comparatively light thinner, easily cracked, the edge of holding part for fixed wafer is set, prevents the movement of wafer from breaking; Detector being set to detect wafer, for judging whether that success obtains wafer, reaching the object of automatic capturing wafer; This wafer grabbing arm simplicity of design is reasonable, solves the problem that vacuum suction wafer can cause broken wafers, avoids unnecessary loss, improve production efficiency.

Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of specification, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.

Accompanying drawing explanation

Fig. 1 is structural representation of the present invention;

Fig. 2 is the schematic diagram of the present invention when getting wafer.

Embodiment

Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.

See Fig. 1 to 2, a kind of wafer grabbing arm described in a preferred embodiment of the present invention, material is stainless steel, use and ask the mode of getting to obtain wafer 1, by drive unit 2 control action, comprise the arm body 3 of flat, the upper surface of arm body 3 is provided with the groove placing wafer 1, the side wall profile of groove and the edge of wafer 1 coincide, the sidewall of groove forms the holding part 4 at fixed wafer 1 edge, the edge bottom material of groove is rubber, increase the friction between wafer 1, make crawl wafer 1 more stable, the degree of depth of groove is not less than the thickness of wafer 1, namely, after wafer 1 falls in groove, wafer 1 can not higher than arm body 3, the gap (as shown in Fig. 2 label a) stacked due to wafer 1 is about 5mm, therefore the thickness of arm body 3 has strict restriction, after obtaining wafer 1, its total height can not exceed the thickness of arm body 3.

Arm body 3 upper surface is provided with the adjusting hole 5 of connecting drive device 2, and adjusting hole 5 is strip distribution along the longitudinally of arm body 3, and its quantity is two, and opposing parallel setting.Arm body 3 is connected by screw rod with drive unit 2, is fastened on by screw rod in adjusting hole 5, by the threaded engagement between screw rod and drive unit 2, arm body 3 and drive unit 2 is fixed.When getting wafer 1 to make arm body 3 holder, groove can be aimed at wafer 1, can adjust the position of screw rod in adjusting hole 5 to calibrate the front and back position of arm body 3, makes arm body 3 can obtain wafer 1 accurately.

Cave inward in the middle part of the grasping end of arm body 3 formation two tentacles 6, and the groove side relative with tentacle 6 extends two protuberances 7 along the edge of wafer 1 respectively, and these two protuberances 7 expand the contact area of recess sidewall and wafer 1, enhance fixation.

Arm body 3 detects wafer 1 by Fibre Optical Sensor, and Fibre Optical Sensor comprises fibre-optical probe (not shown) and signal processor, and fibre-optical probe is connected with signal processor, sets up Signal transmissions between signal processor and drive unit 2.The quantity of fibre-optical probe is two, be separately positioned on two protuberances 7, the light source transmit direction of fibre-optical probe points to the center of wafer 1, the reflection whether being subject to wafer 1 according to the light beam launched judges whether arm body 3 has wafer 1, after testing result is fed back to drive unit 2 by signal processor, drive unit 2 controls the action of arm body 3, reaches the object of automatic capturing.

In other embodiments, detecting the mode of wafer 1 also can be photoelectric sensor, capacitive proximity sensor or capacitive touch sensors, as long as can the transducer of perceptual object all can be applicable on this wafer grabbing arm.

See Fig. 2, wafer 1 is stacked in wafer rack 8, wafer rack 8 is arranged on lifting platform 9, and when getting wafer 1, drive unit 2 controls arm body 3 and stretches to below wafer 1, then lifting platform 9 declines certain altitude, arm body 3 holds up wafer 1, and wafer 1 just in time falls in the groove of arm body 3, and Fibre Optical Sensor senses wafer 1, arm body 3 is regained, and takes out wafer 1 smoothly and wafer 1 is moved to next station.

See Fig. 1, in the reaction chamber of processed wafer 1, three of distribution triangular in shape thimbles 10 are used to carry out bearing wafer 1, when getting wafer 1, arm body 3 is when extending below wafer 1, arm body 3 passes from the centre of two thimbles 10, the sunk part of arm body 3 grasping end just in time inserts the 3rd thimble 10, two tentacles 6 pass from the both sides of the 3rd thimble 10 respectively, and drive unit 2 controls arm body 3 and rises, and hold up wafer 1, wafer 1 is made just in time to fall into groove, Fibre Optical Sensor senses wafer 1, and arm body 3 is regained, and takes out wafer 1 smoothly.When wafer 1 is moved to reaction chamber, the arm body 3 that wafer 1 is got in holder drops to below three thimbles 10, and make wafer 1 drop on thimble 10, after Fibre Optical Sensor senses and arm body 3 does not have wafer 1, arm body 3 is regained.

In sum, the mode that wafer grabbing arm of the present invention captures wafer 1 is different from vacsorb, and this arm uses and asks the mode of getting to capture wafer 1, arm body 3 is designed to flat, expands the contact area with wafer 1, make crawl more steady; Because wafer 1 is more frivolous, easily cracked, the edge of holding part 4 for fixed wafer 1 is set, prevents the movement of wafer 1 from breaking; Detector being set to detect wafer 1, for judging whether that success obtains wafer 1, reaching the object of automatic capturing wafer 1; This wafer grabbing arm simplicity of design is reasonable, solves the problem that vacuum suction wafer 1 can cause wafer 1 fragmentation, avoids unnecessary loss, improve production efficiency, and this arm is more frivolous than the arm of vacsorb, Fibre Optical Sensor easy for installation, cost is low.

The above is only the preferred embodiment of the present invention; be not limited to the present invention; should be understood that; for those skilled in the art; under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.

Claims

1. a wafer grabbing arm, by drive unit control action, it is characterized in that: comprise the arm body of flat, be arranged on the holding part of described arm body upper surface, the detector be arranged on described arm body, described holding part is used for fixed wafer edge, and described detector is for detecting wafer.

2. wafer grabbing arm according to claim 1, it is characterized in that: the upper surface of described arm body is provided with the groove placing wafer, the side wall profile of described groove and the edge of wafer coincide, and the sidewall of described groove forms the holding part at fixed wafer edge.

3. wafer grabbing arm according to claim 2, is characterized in that: the degree of depth of described groove is not less than the thickness of wafer.

4. wafer grabbing arm according to claim 2, is characterized in that: the edge bottom material of described groove is rubber.

5. wafer grabbing arm according to claim 1, is characterized in that: the middle part of the grasping end of described arm body caves inward formation two tentacles.

6. wafer grabbing arm according to claim 1, is characterized in that: described arm body upper surface is provided with the adjusting hole connecting described drive unit.

7. wafer grabbing arm according to claim 6, is characterized in that: described adjusting hole is strip distribution along the longitudinally of arm body, and its quantity is two, and opposing parallel setting.

8. wafer grabbing arm according to claim 1, it is characterized in that: described detector is fibre-optical probe, the light source transmit direction of described fibre-optical probe points to the center of wafer, described fibre-optical probe is connected with signal processor, sets up Signal transmissions between described signal processor and described drive unit.

9. wafer grabbing arm according to claim 8, is characterized in that: the quantity of described fibre-optical probe is two.

10. wafer grabbing arm according to claim 1, is characterized in that: the material of described arm body is stainless steel.