CN104635964B - Contact panel - Google Patents
Contact panel Download PDFInfo
- Publication number
- CN104635964B CN104635964B CN201310549308.7A CN201310549308A CN104635964B CN 104635964 B CN104635964 B CN 104635964B CN 201310549308 A CN201310549308 A CN 201310549308A CN 104635964 B CN104635964 B CN 104635964B
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- layer
- base material
- contact panel
- patterned
- visible area
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention discloses a kind of contact panel, including：The first base material, the second base material, bonding layer, patterned layer, barrier layer.Bonding layer is between the first base material and the second base material；Patterned layer is located at the first base material relative on a lower surface of the bonding layer；Barrier layer is located between the patterned layer and the bonding layer, and at least covers the patterned layer.Thereby, the present invention can effectively obstruct bonding layer and directly be contacted with patterned layer, and then avoid bonding layer from penetrating into simultaneously etch figures pattern layer, and it is heterochromatic to produce patterned layer, and then influence contact panel outward appearance.
Description
Technical field
The present invention relates to a kind of contact panel.
Background technology
With touch technology (Touch control) evolution, contact panel (touch panel) is widely used to respectively
Kind of consumer electronics device, for example, intelligent mobile phone (smart phone), tablet PC (tablet computer), camera,
The portable electric product such as e-book or MP3 player, or applied to operational control unit and the display screen of Automatic Teller Machine
Curtain.
Contact panel generally includes cover plate, sensing plate, liquid glue, patterned layer, and wherein liquid glue is located at cover plate and sensing plate
Between be used to be bonded the two, and patterned layer is located at one side of the cover plate with respect to liquid glue, for make contact panel show trade mark or
Specific functional pattern such as indicator lamp, main menu or return key icon.In this structure, liquid glue inevitably touches
Patterned layer, and liquid glue generally has corrosivity, meeting etch figures pattern layer produces patterned layer heterochromatic, so as to influence contact panel
Outward appearance.
The content of the invention
In view of it is above-mentioned, contact panel disclosed in this invention, it is covered in using a barrier layer in patterned layer, obstructs bonding layer
Directly contacted with patterned layer, to reduce bonding layer etch figures pattern layer, improve the outward appearance of contact panel.
A wherein embodiment of the invention discloses a kind of contact panel, including：The first base material, the second base material, bonding layer, pattern
Layer, barrier layer.Bonding layer is between the first base material and the second base material；Patterned layer is located at the first base material relative to the bonding layer
On a lower surface；Barrier layer is located between the patterned layer and the bonding layer, and at least covers the patterned layer.
The embodiment of the present invention is directly contacted in one layer of barrier layer of covering in patterned layer with obstructing bonding layer with patterned layer, and then
Bonding layer is avoided to penetrate into simultaneously etch figures pattern layer, and it is heterochromatic to produce patterned layer, and then influence contact panel outward appearance.
In order to be further understood that the technology of the present invention, described further below and schema is referred to.However, institute's accompanying drawings
Only provide with annex and used with reference to explanation, be not used for being any limitation as the present invention.
Brief description of the drawings
Figure 1A shows the top view of the contact panel of the embodiment of the present invention.
Figure 1B shows the local overlooking schematic diagram of the touch control layer of the embodiment of the present invention.
Fig. 1 C show the diagrammatic cross-section of A-A along Figure 1A contact panel.
Fig. 2 shows the diagrammatic cross-section of the contact panel of another embodiment of the present invention.
Fig. 3 shows the diagrammatic cross-section of the contact panel of another embodiment of the present invention.
Fig. 4 shows the diagrammatic cross-section of the contact panel of further embodiment of this invention.
Embodiment
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.
Figure 1A be refer to 1C.Figure 1A shows the top view of the contact panel of the embodiment of the present invention.Figure 1B display present invention
The local overlooking schematic diagram of the touch control layer of embodiment.Fig. 1 C show the diagrammatic cross-section of A-A along Figure 1A contact panel.Please be first
Reference picture 1C, contact panel 1 include the first base material 10, the second base material 11, bonding layer 12, patterned layer 131 and barrier layer 14.Engagement
Layer 12 is between the base material 11 of the first base material 10 and second, for engaging the base material 11 of the first base material 10 and second.Patterned layer 131
In on lower surface 10b of the first base material 10 relative to bonding layer 12.Barrier layer 14 between patterned layer 131 and bonding layer 12,
And at least coverage diagram pattern layer 131.It should be noted that barrier layer 14 refers to obstruct between patterned layer 131 and bonding layer 12
Layer 14 can separate patterned layer 131 and bonding layer 12 on locus, to avoid the two directly contact.Thereby, hinder
Interlayer 14 can obstruct bonding layer 12 and directly be contacted with patterned layer 131, and then avoid bonding layer 12 from penetrating into simultaneously etch figures pattern layer 131,
And it is heterochromatic to produce patterned layer 131, and then influence contact panel outward appearance.
Contact panel 1 also includes a shielding layer 130, positioned at the first base material 10 wherein on a surface, by contact panel 1
Define a non-visible area NA.Accordingly, contact panel 1 also has a non-visible area NA corresponding with visible area VA, its
Middle non-visible area NA is located at visible area VA at least side, in the present embodiment, visible area VA week is surrounded with non-visible area NA
Illustrate exemplified by side, but be not limited thereto.Shielding layer 130 can be located at the upper surface 10a or the first base material 10 of the first base material 10
On the 10b of lower surface, non-visible area NA some opaque components, such as the line of follow-up introduction are located at for covering contact panel 1
Road floor.Shielding layer 13 surrounds visible area VA, and forms a blocked areas.In addition, shielding layer 130 has void region, patterned layer
131 are formed in void region.The material of shielding layer 130 may, for example, be ink or polyimides.Can first with wire mark or
Spray printing mode forms shielding layer 130, then ink with mirror effect or infrared ray ink is coated in hollow-out parts again, to form pattern
Layer 131.
The material of patterned layer 131 includes opaque ink, such as can be an ink with mirror effect, to be used for specific shape
Trade name, trade mark (logo) or key legend is presented., can when user is observed by the upper surface 10a of the first base material 10
See the pattern shown by patterned layer 131.In other embodiments, the material of patterned layer 131 includes an infrared ray ink, and red
Outside line ink can allow the infra-red signal that electronic installation is sent by so that electronic installation can be received and dispatched from patterned layer 131 it is red
Outside line signal.In addition, the patterned layer 131 formed by infrared ray ink can also obstruct visible ray and ultraviolet light, so infrared ray
The patterned layer 131 that ink is formed can be opaque in the case where ensureing penetrance.
Bonding layer 12 visible area VA be partially located in the base material 11 of the first base material 10 and second between, in non-visible area NA portions
Part, the overlay masking layer 130 of bonding layer 12 and barrier layer 14, that is to say, that at least subregion of bonding layer 12 is positioned at masking
Between layer 130 and second substrate 11.Bonding layer 12 can be optic-solidified adhesive or heat-curable glue, for example, liquid optical cement (liquid
Optical clear adhesive, LOCA), it is uncured it is preceding be liquid, and there is mobility, can after irradiating ultraviolet light
Solidification.Bonding layer 12 can be formed in a manner of being coated with or printing.
Barrier layer 14 is normally solid before patterned layer 131 is covered in, and with the shape determined.Therefore, barrier is worked as
After layer 14 is bonded patterned layer 131, curing process need not be passed through again.14 specific material of barrier layer includes adhesive tape or pad, its
Such as high temperature gummed tape, silicone band, silicagel pad or acryl glue band.In other embodiments, barrier layer 14 is optical cement
(optical clear adhesive, OCA), such as printing opacity glue or infrared-transparent glue.For example, when patterned layer 131 is
During infrared ray ink layer, barrier layer 14 is infrared-transparent glue.When patterned layer 131 is ink with mirror effect layer, barrier layer 14 can be
Printing opacity glue either and adhesive tape or pad similar in ink with mirror effect layer color, can avoid the color of barrier layer 14 and patterned layer 131
Difference, and influence the outward appearance of contact panel 1.The thickness range of barrier layer 14 is generally 75 μm to 300 μm.
What deserves to be explained is the thickness of shielding layer 130 is more than or equal to the thickness of patterned layer 131.Bonding layer 12 is by first
When the base material 11 of base material 10 and second is bonded with each other, it is located at due to shielding layer 130 on the lower surface 10b of the first base material 10, therefore is engaged
Layer 12 inevitably touches shielding layer 130.When bonding layer 12 is using conventional sticky material such as liquid glue, liquid
When glue is uncured it is liquid and generally there is the composition of etch resistant ink, therefore when bonding layer 12 is penetrated into shielding layer 130, engages
Layer 12 can chemically react with shielding layer 130, cause shielding layer 130 to be corroded.But because shielding layer 130 needs to have preferably
The other components of masking effect, usual thickness is thicker and color is deeper, so even to be engaged the part of layer 12 rotten for shielding layer 130
Erosion, the color of shielding layer 130 do not have very big change, thus for contact panel 1 outward appearance compared with without influence.But pattern
131 thinner thickness of layer and usual color is shallower, if the direct contact engagement layer 12 of patterned layer 131, are easy to engaged layer 12
Corrosion, patterned layer 131 are engaged the part of the corrosion of layer 12, and color can be different with original color, so as to influence touch surface
The outward appearance of plate 1.Particularly when patterned layer 131 is the formation of infrared ray ink layer material, follow-up temperature-pressure processing procedure (such as
Deaeration processing procedure) in, the influence caused by making the patterned layer 131 of the corrosion infrared ray ink formation of bonding layer 12 becomes apparent from, such as：
The patterned layer for forming infrared ray ink is faded and can penetrated by visible ray.In the present embodiment, covered completely using barrier layer 14
Lid patterned layer 131, directly contacted with patterned layer 131 with obstructing bonding layer 12, can prevent bonding layer 12 from penetrating into simultaneously etch figures pattern layer
131, avoid patterned layer 131 from producing heterochromatic.Certainly, in other embodiments, barrier layer 14 is except being covered in patterned layer 131 it
Outside, also can partly overlay masking layer 130.
The first base material 10 can be transparent base, but be not limited to rigid (rigid) base material or pliability（flexible）
Base material.Rigid base material is, for example, glass plate or polymethyl methacrylate（Polymethylmethacrylate, PMMA, that is, press
Gram force, Acrylic）Substrate.Flexible substrate is, for example, to use PET（Polyethylene
Terephthalate, PET）Or polyimides（Polyimide, PI）Made polymeric substrate.The first base material 10 also has
The one upper surface 10a relative with lower surface 10b.In the present embodiment, upper surface 10a can be as the table for receiving user's touching
Face, is then used for being formed the other assemblies of contact panel 1 on the 10b of lower surface, and detailed aspects will be illustrated in subsequent content.
In addition, in the present embodiment, the upper surface 10a of the first base material 10 can for example first pass through reinforcing, it is scratch resistant, resist dizzy, antibacterial and/or
Antireflection etc. is surface-treated, so that the first base material 10 has protection concurrently, resists the functions such as dizzy, antireflection.
Second base material 11 has the first surface 11a and second surface 11b relative with first surface 11a, here, the first table
Face 11a is upper table of second base material 11 relative to the lower surface 10b of first substrate 10 surface, also referred to as the second base material 11
Face, and second surface 11b then can be described as the lower surface of the second base material 11.In addition, before the material for forming the second base material 11 may be selected
State rigid base material or bendable base material one of which.
In one embodiment, contact panel 1 further includes touch control layer, touch control layer be located at the base material 11 of the first base material 10 and second it
Between.Touch control layer is formed at first surface 11a namely the upper surface of the second base material 11.Figure 1B and 1C is refer to, touch control layer includes sense
Electrode layer 200 and line layer 210, wherein sensing electrode layer 200 is surveyed to be disposed in visible area VA, and line layer 210 be disposed in it is non-
In visible area NA.That is, line layer 210 is located at the periphery of sensing electrode layer 200, and it is electrically connected with sensing electrode layer 200,
For by the sensing signal transmission of sensing electrode layer 200 to controller（It is not shown）To determine position of touch.
Specifically, sensing electrode layer 200 includes a plurality of first electrode 200a, a plurality of second electrode 200b, plural number
Individual first connecting portion 201 and a plurality of second connecting portions 202.These first electrodes 200a lines up multirow (row), and these
Two electrode 200b line up multiple row (column).With first connecting portion between the first electrode 200a adjacent positioned in same a line two
201 are connected, and are connected in same row between two adjacent second electrode 200b with second connecting portion 202.In this reality
Apply in example, a plurality of insulation divisions 203 may be provided between first connecting portion 201 and second connecting portion 202, so that first connecting portion
201 and second connecting portion 202 be electrically insulated.
In previous embodiment, first electrode 200a is formed, second electrode 200b material can be transparent conductive material, example
Such as tin indium oxide (indium tin oxide, ITO), indium zinc oxide (indium zinc oxide, IZO), cadmium tin
(cadmium tin oxide, CTO), aluminum zinc oxide (aluminum zinc oxide, AZO), indium oxide zinc-tin (indium
Tin zinc oxide, ITZO), zinc oxide (zinc oxide), cadmium oxide (cadmium oxide), hafnium oxide (hafnium
Oxide, HfO), indium gallium zinc (indium gallium zinc oxide, InGaZnO), indium gallium zinc-magnesium (indium
Gallium zinc magnesium oxide, InGaZnMgO), indium gallium magnesium (indium gallium magnesium
Oxide, InGaMgO) or indium gallium aluminium (indium gallium aluminum oxide, InGaAlO) etc..Form circuit
Layer 210 material can select with first electrode 200a, second electrode 200b identical transparent conductive materials, also may be selected gold,
Silver, copper, nickel, aluminium, chromium or above-mentioned any combination (such as molybdenum aluminium molybdenum layered structure, wherein aluminium lamination is between two molybdenum layers).Work as making
When foregoing sensing electrode layer 200 and line layer 210, sensing electrode layer 200 can be manufactured by processing procedures such as deposition, lithographic and etchings
And line layer 210.
Certainly, the electrode layer of contact panel is not limited to single-layer type, and is not limited to only be configured at as shown in Figure 1 C
On the first surface of two base materials 11.Fig. 2 is refer to, shows the diagrammatic cross-section of the contact panel of another embodiment of the present invention.This
Embodiment difference compared with the embodiment shown in Fig. 1 C is that in the present embodiment, sensing electrode layer includes being located at the second base material
First electrode 200a on 11 first surface 11a, and the second electrode 200b on the second surface 11b of the second base material 11.
Specifically, line layer 210 and first electrode 200a are disposed in the first surface 11a of the second base material 11, wherein line layer jointly
210 are disposed in non-visible area NA, and first electrode 200a is substantially distributed in visible area VA and is electrically connected with line layer 210.The
Two electrode 200b are disposed in the second surface 11b of the second base material 11, and are electrically connected with line layer 210.In other embodiments,
Line layer 210 can also be configured on the second surface 11b of the second base material 11.It is real shown in other parts and Fig. 1 C of the present embodiment
It is essentially identical to apply example, therefore repeats no more.
Fig. 3 is refer to, shows the diagrammatic cross-section of the contact panel of another embodiment of the present invention.The present embodiment and Fig. 1 C institutes
The embodiment shown is that in the present embodiment, sensing electrode layer 200 is formed at the lower surface of the first base material 10 compared to difference
10b, line layer 210 are then formed on shielding layer 130.Specifically, shielding layer 13 is first formed to the following table of the first base material 10
After the 10b of face, then line layer 210 is formed to the surface of shielding layer 13.In addition, foregoing barrier layer 14 is formed at line layer
On 210, and between bonding layer 12 and line layer 210.Specifically, when barrier layer 14 is formed on line layer 210, resistance
The position of interlayer 14 and the location overlap of patterned layer 131.
The structure of sensing electrode layer 200 and line layer 210 is as shown in Figure 1B.When line layer 210 be formed at shielding layer 130 and
When in patterned layer 131, because line layer is spaced plural wires composition, so line layer 210 can't be by pattern
Layer 131 is completely covered.Barrier layer 14 can still pass through line layer 210 and coverage diagram pattern layer 131, in order to avoid work as the first base material 10 and second
When base material 11 is engaged with bonding layer 12, bonding layer 12 penetrates into patterned layer 131, and the outward appearance of contact panel 1 is had undesirable effect.This
Other parts of embodiment and Fig. 1 C illustrated embodiments are essentially identical, therefore repeat no more.
Fig. 4 is refer to, shows the diagrammatic cross-section of the contact panel of further embodiment of this invention.The present embodiment and Fig. 1 C institutes
The embodiment shown is that in the present embodiment, bonding layer 12 has an opening, and barrier layer 14 is filled in the opening compared to difference
It is interior.Further, the upper surface coverage diagram pattern layer 131 of barrier layer 14, or can further be covered on shielding layer 130, and obstruct
The lower surface of layer 14 is then on line layer 210, and in other words, bonding layer 12 has been separated into a left side by barrier layer 14 through the opening
The part of the right side two.When the first base material 10 will be engaged with the second base material 11 with bonding layer 12, the part of barrier layer 14 has been bonded
It is not coated with bonding layer 12.Other parts of the present embodiment and Fig. 1 C illustrated embodiments are essentially identical, therefore repeat no more.
In summary, the embodiment of the present invention obstructs bonding layer in covering one layer of barrier layer in patterned layer through barrier layer
Contacted with patterned layer, and then avoid bonding layer from penetrating into simultaneously etch figures pattern layer, and it is heterochromatic to prevent that patterned layer from producing.In addition, when figure
When pattern layer is infrared ray ink, barrier layer can slow down patterned layer in deaeration processing procedure, situation about fading.
Although the present invention is disclosed above with previous embodiment, so it is not limited to the present invention.It is any to be familiar with alike skill
Skill person, without departing from the spirit and scope of the invention, change and the equivalence replacement of retouching, still the patent guarantor for the present invention
In the range of shield.
Claims (11)
- A kind of 1. contact panel, it is characterised in that including：One the first base material；One second base material；One bonding layer, between the first base material and second base material；One patterned layer, on a lower surface of the first base material relative to the bonding layer；One barrier layer, between the patterned layer and the bonding layer, and at least cover the patterned layer；One shielding layer, the shielding layer are located on the lower surface of the first base material, and to define a non-visible area, and shielding layer has There is a void region, non-visible area has a visible area corresponding with the non-visible area, visible area and non-visible area at least side Connection, the patterned layer are located in the void region, and shielding layer surrounds visible area, and forms a blocked areas；The barrier layer is located at Outside void region and cover the patterned layer；Wherein, the material of the bonding layer is optic-solidified adhesive or heat-curable glue, and barrier layer is the adhesive tape or pad of solid-state.
- 2. contact panel according to claim 1, it is characterised in that the material of the patterned layer includes opaque ink.
- 3. contact panel according to claim 2, it is characterised in that the ink is an infrared ray ink, and the barrier layer Material includes the transparent sticky material of an infrared ray.
- 4. contact panel according to claim 2, it is characterised in that the ink is an ink with mirror effect, and the barrier layer material Expect for a printing opacity glue or with the ink with mirror effect color identical adhesive tape.
- 5. contact panel according to claim 1, it is characterised in that the bonding layer has an opening, barrier layer filling In in the opening.
- 6. contact panel according to claim 1, it is characterised in that the barrier layer is high temperature gummed tape, silicone band or pressure gram Power adhesive tape.
- 7. contact panel according to claim 1, it is characterised in that the material of the shielding layer includes opaque ink.
- 8. contact panel according to claim 1, it is characterised in that the thickness of the shielding layer is more than or equal to the patterned layer Thickness.
- 9. contact panel according to claim 1, it is characterised in that further include a sensing electrode layer and one and sensing electricity The line layer that pole layer is electrically connected with, wherein the sensing electrode layer are disposed in the visible area, and it is non-visual that the line layer is disposed in this In area, and the sensing electrode layer and the line layer are located on the surface of second base material.
- 10. contact panel according to claim 9, it is characterised in that the sensing electrode layer and the line layer be located at this One upper surface of two base materials.
- 11. contact panel according to claim 1, it is characterised in that further include a sensing electrode layer and one and the sensing The line layer that electrode layer is electrically connected with, wherein the sensing electrode layer are disposed in the visible area, and positioned at the following table of the first base material On face, the line layer is disposed in the non-visible area, and between the barrier layer and the shielding layer.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310549308.7A CN104635964B (en) | 2013-11-07 | 2013-11-07 | Contact panel |
| TW103126601A TWI541692B (en) | 2013-11-07 | 2014-08-04 | Touch panel |
| TW103213813U TWM491208U (en) | 2013-11-07 | 2014-08-04 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310549308.7A CN104635964B (en) | 2013-11-07 | 2013-11-07 | Contact panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104635964A CN104635964A (en) | 2015-05-20 |
| CN104635964B true CN104635964B (en) | 2018-03-16 |
Family
ID=52576246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310549308.7A Active CN104635964B (en) | 2013-11-07 | 2013-11-07 | Contact panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104635964B (en) |
| TW (2) | TWI541692B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108509088B (en) * | 2018-03-09 | 2020-10-16 | Oppo广东移动通信有限公司 | Electronic device and method for manufacturing the same |
| CN109688248B (en) * | 2018-12-21 | 2021-04-13 | 业成科技（成都）有限公司 | High infrared ray penetration rate structure and mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102955598A (en) * | 2011-08-25 | 2013-03-06 | 联胜（中国）科技有限公司 | Touch panel and touch display device |
| CN203054787U (en) * | 2013-01-14 | 2013-07-10 | 深圳欧菲光科技股份有限公司 | Glass cover-plate assembly used for touch screen and touch screen |
| JP2013171128A (en) * | 2012-02-20 | 2013-09-02 | Dainippon Printing Co Ltd | Wired front face protective plate for display device, method for manufacturing the same, and display device |
-
2013
- 2013-11-07 CN CN201310549308.7A patent/CN104635964B/en active Active
-
2014
- 2014-08-04 TW TW103126601A patent/TWI541692B/en active
- 2014-08-04 TW TW103213813U patent/TWM491208U/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102955598A (en) * | 2011-08-25 | 2013-03-06 | 联胜（中国）科技有限公司 | Touch panel and touch display device |
| JP2013171128A (en) * | 2012-02-20 | 2013-09-02 | Dainippon Printing Co Ltd | Wired front face protective plate for display device, method for manufacturing the same, and display device |
| CN203054787U (en) * | 2013-01-14 | 2013-07-10 | 深圳欧菲光科技股份有限公司 | Glass cover-plate assembly used for touch screen and touch screen |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201519045A (en) | 2015-05-16 |
| CN104635964A (en) | 2015-05-20 |
| TWM491208U (en) | 2014-12-01 |
| TWI541692B (en) | 2016-07-11 |
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Effective date of registration: 20170809 Address after: 361009, Fujian, Xiamen torch hi tech Zone information photoelectric Park, 199 Shang Lu Road Applicant after: XIANGDA OPTICAL (XIAMEN) CO., LTD. Address before: 361009 RST factory area, No. 195 Sakamoto Road, torch hi tech Zone, Xiamen, Fujian, Xiamen Applicant before: Chenzheng Photoelectric (Xiamen) Co., Ltd. |
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