CN104629365A - Method for preparing carbon fiber-polyimide composite material - Google Patents
Method for preparing carbon fiber-polyimide composite material Download PDFInfo
- Publication number
- CN104629365A CN104629365A CN201510086537.9A CN201510086537A CN104629365A CN 104629365 A CN104629365 A CN 104629365A CN 201510086537 A CN201510086537 A CN 201510086537A CN 104629365 A CN104629365 A CN 104629365A
- Authority
- CN
- China
- Prior art keywords
- dianhydride
- carbon fiber
- bis
- polyimide
- dicarboxyphenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 59
- 239000004642 Polyimide Substances 0.000 title claims abstract description 55
- 239000002131 composite material Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title abstract description 8
- 229910052799 carbon Inorganic materials 0.000 title abstract description 8
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 68
- 239000004917 carbon fiber Substances 0.000 claims abstract description 68
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 59
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 29
- 238000003756 stirring Methods 0.000 claims abstract description 20
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 19
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 238000004132 cross linking Methods 0.000 claims abstract description 11
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims abstract description 11
- 230000005855 radiation Effects 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 7
- 239000003960 organic solvent Substances 0.000 claims abstract description 6
- 238000000748 compression moulding Methods 0.000 claims abstract description 4
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 48
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims description 30
- 150000008064 anhydrides Chemical class 0.000 claims description 17
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 15
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 15
- -1 tetracarboxylic anhydride Chemical class 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 claims description 8
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 5
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 5
- TYKLCAKICHXQNE-UHFFFAOYSA-N 3-[(2,3-dicarboxyphenyl)methyl]phthalic acid Chemical compound OC(=O)C1=CC=CC(CC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O TYKLCAKICHXQNE-UHFFFAOYSA-N 0.000 claims description 5
- NMGBFVPQUCLJGM-UHFFFAOYSA-N 3-ethylphthalic acid Chemical compound CCC1=CC=CC(C(O)=O)=C1C(O)=O NMGBFVPQUCLJGM-UHFFFAOYSA-N 0.000 claims description 5
- UNIBAJHMJGXVHL-UHFFFAOYSA-N 3-phenylbenzene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C(C=2C=CC=CC=2)=C1C(O)=O UNIBAJHMJGXVHL-UHFFFAOYSA-N 0.000 claims description 5
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 claims description 5
- IJJNNSUCZDJDLP-UHFFFAOYSA-N 4-[1-(3,4-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 IJJNNSUCZDJDLP-UHFFFAOYSA-N 0.000 claims description 5
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 claims description 5
- LVRNKEBRXQHJIN-UHFFFAOYSA-N 4-ethylphthalic acid Chemical compound CCC1=CC=C(C(O)=O)C(C(O)=O)=C1 LVRNKEBRXQHJIN-UHFFFAOYSA-N 0.000 claims description 5
- AQVOMFPTJXMAQE-UHFFFAOYSA-N 4-propylphthalic acid Chemical compound CCCC1=CC=C(C(O)=O)C(C(O)=O)=C1 AQVOMFPTJXMAQE-UHFFFAOYSA-N 0.000 claims description 5
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 5
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 5
- 239000005977 Ethylene Substances 0.000 claims description 5
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 claims description 5
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 claims description 5
- 238000001723 curing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 9
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 239000000835 fiber Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- DIKBFYAXUHHXCS-UHFFFAOYSA-N bromoform Chemical compound BrC(Br)Br DIKBFYAXUHHXCS-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- UBOXGVDOUJQMTN-UHFFFAOYSA-N 1,1,2-trichloroethane Chemical compound ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- PAAZPARNPHGIKF-UHFFFAOYSA-N 1,2-dibromoethane Chemical compound BrCCBr PAAZPARNPHGIKF-UHFFFAOYSA-N 0.000 description 2
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 2
- VQZRLBWPEHFGCD-UHFFFAOYSA-N 3-chloro-4-methylphenol Chemical compound CC1=CC=C(O)C=C1Cl VQZRLBWPEHFGCD-UHFFFAOYSA-N 0.000 description 2
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 2
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- CAHQGWAXKLQREW-UHFFFAOYSA-N Benzal chloride Chemical compound ClC(Cl)C1=CC=CC=C1 CAHQGWAXKLQREW-UHFFFAOYSA-N 0.000 description 2
- SFAZBJLFDAGITE-UHFFFAOYSA-N C1(C=2C(C(=O)O1)=CC=CC2)=O.C2(=CC=CC=C2)C#C Chemical compound C1(C=2C(C(=O)O1)=CC=CC2)=O.C2(=CC=CC=C2)C#C SFAZBJLFDAGITE-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 229950005228 bromoform Drugs 0.000 description 2
- 238000003889 chemical engineering Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 description 2
- 238000007723 die pressing method Methods 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- ONQBOTKLCMXPOF-UHFFFAOYSA-N 1-ethylpyrrolidine Chemical compound CCN1CCCC1 ONQBOTKLCMXPOF-UHFFFAOYSA-N 0.000 description 1
- AVFZOVWCLRSYKC-UHFFFAOYSA-N 1-methylpyrrolidine Chemical compound CN1CCCC1 AVFZOVWCLRSYKC-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- TWBPWBPGNQWFSJ-UHFFFAOYSA-N 2-phenylaniline Chemical group NC1=CC=CC=C1C1=CC=CC=C1 TWBPWBPGNQWFSJ-UHFFFAOYSA-N 0.000 description 1
- NFSQGQXKVFGKSO-UHFFFAOYSA-N 3-(2-phenylphenoxy)aniline Chemical group NC1=CC=CC(OC=2C(=CC=CC=2)C=2C=CC=CC=2)=C1 NFSQGQXKVFGKSO-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- NNKQLUVBPJEUOR-UHFFFAOYSA-N 3-ethynylaniline Chemical compound NC1=CC=CC(C#C)=C1 NNKQLUVBPJEUOR-UHFFFAOYSA-N 0.000 description 1
- OBOSIGICWQKDEC-UHFFFAOYSA-N 3-ethynylphthalic acid Chemical compound OC(=O)C1=CC=CC(C#C)=C1C(O)=O OBOSIGICWQKDEC-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- XUKLTPZEKXTPBT-UHFFFAOYSA-N 3-oxatricyclo[5.2.1.01,5]dec-5-ene-2,4-dione Chemical compound C1CC2C=C3C(=O)OC(=O)C13C2 XUKLTPZEKXTPBT-UHFFFAOYSA-N 0.000 description 1
- JPVBXQAUQXVQGJ-UHFFFAOYSA-N 4-(2-phenylethynyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C#CC1=CC=CC=C1 JPVBXQAUQXVQGJ-UHFFFAOYSA-N 0.000 description 1
- ZWQOXRDNGHWDBS-UHFFFAOYSA-N 4-(2-phenylphenoxy)aniline Chemical group C1=CC(N)=CC=C1OC1=CC=CC=C1C1=CC=CC=C1 ZWQOXRDNGHWDBS-UHFFFAOYSA-N 0.000 description 1
- KHYXYOGWAIYVBD-UHFFFAOYSA-N 4-(4-propylphenoxy)aniline Chemical compound C1=CC(CCC)=CC=C1OC1=CC=C(N)C=C1 KHYXYOGWAIYVBD-UHFFFAOYSA-N 0.000 description 1
- MVQLIXUQBRPZGS-UHFFFAOYSA-N 4-[4-[2-[4-(2,4-diaminophenoxy)phenyl]propan-2-yl]phenoxy]benzene-1,3-diamine Chemical compound NC1=C(C=CC(=C1)N)OC1=CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)OC1=C(C=C(C=C1)N)N MVQLIXUQBRPZGS-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- JXYITCJMBRETQX-UHFFFAOYSA-N 4-ethynylaniline Chemical compound NC1=CC=C(C#C)C=C1 JXYITCJMBRETQX-UHFFFAOYSA-N 0.000 description 1
- VETOZLDSVKEYKO-UHFFFAOYSA-N 4-phenyl-2-benzofuran-1,3-dione Chemical compound O=C1OC(=O)C2=C1C=CC=C2C1=CC=CC=C1 VETOZLDSVKEYKO-UHFFFAOYSA-N 0.000 description 1
- BZXWRVPVZZZAKB-UHFFFAOYSA-N 5-ethynyl-1,2,3-trifluorobenzene Chemical group FC1=CC(C#C)=CC(F)=C1F BZXWRVPVZZZAKB-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- GUTLYIVDDKVIGB-OUBTZVSYSA-N Cobalt-60 Chemical compound [60Co] GUTLYIVDDKVIGB-OUBTZVSYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-O N-dimethylethanolamine Chemical compound C[NH+](C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-O 0.000 description 1
- HTLZVHNRZJPSMI-UHFFFAOYSA-N N-ethylpiperidine Chemical compound CCN1CCCCC1 HTLZVHNRZJPSMI-UHFFFAOYSA-N 0.000 description 1
- AHVYPIQETPWLSZ-UHFFFAOYSA-N N-methyl-pyrrolidine Natural products CN1CC=CC1 AHVYPIQETPWLSZ-UHFFFAOYSA-N 0.000 description 1
- GRSMWKLPSNHDHA-UHFFFAOYSA-N Naphthalic anhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=CC3=C1 GRSMWKLPSNHDHA-UHFFFAOYSA-N 0.000 description 1
- 229920006282 Phenolic fiber Polymers 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 244000178289 Verbascum thapsus Species 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- WRPSKOREVDHZHP-UHFFFAOYSA-N benzene-1,4-diamine Chemical compound NC1=CC=C(N)C=C1.NC1=CC=C(N)C=C1 WRPSKOREVDHZHP-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000002783 friction material Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- KNRCVAANTQNTPT-UHFFFAOYSA-N methyl-5-norbornene-2,3-dicarboxylic anhydride Chemical compound O=C1OC(=O)C2C1C1(C)C=CC2C1 KNRCVAANTQNTPT-UHFFFAOYSA-N 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
- C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/247—Heating methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/28—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention provides a method for preparing a carbon fiber-polyimide composite material. The method comprises the following steps: (1) putting tetramine and an organic solvent into a reaction kettle, adding C=C-unsaturated-bond-containing carboxylic acid anhydride solid powder, stirring at room temperature until the solid powder is completely dissolved, continuing stirring to react, adding tetracarboxylic acid anhydride, and stirring to react at 2-5 DEG C; (2) preparing a polyamic acid solution into a solution in which the polyamic acid accounts for 35-60 wt%, wetting carbon fiber, heating to 200 DEG C, and baking to obtain the primary composite carbon fiber; (3) uniformly mixing thermosetting polyimide with the primary composite carbon fiber; and (4) carrying out compression molding, crosslinking and solidification on the polyimide-carbon fiber composite raw material obtained in the step (3), and carrying out further radiation crosslinking to obtain the polyimide-carbon fiber composite material. The carbon fiber is firstly coated with the polyamic acid and then compounded with the common thermosetting polyimide to obtain the material with excellent properties.
Description
Technical Field
The invention relates to a method for preparing a carbon fiber-polyimide composite material.
Background
Polyimide (PI) is a high polymer material with higher heat resistance developed in the 50 th century, is high-temperature resistant and radiation resistant, has excellent mechanical property and tribological property, is known as the king of plastics, particularly has excellent antifriction and lubricating properties under severe environments of high temperature, high pressure, high speed and the like, and is widely applied to the high-tech fields of aviation, aerospace, electrical appliances, machinery, chemical engineering, microelectronics and the like. The fiber reinforced Polyimide (PI) resin-based composite material has the characteristics of high specific modulus, high specific strength, radiation resistance, excellent mechanical property at high temperature, wide use temperature range (-269 ℃ to +400 ℃) and the like, and can be selected to use the PI composite material under the condition that metal materials or other engineering plastics in aerospace aircrafts, modern weapon systems, chemical and medical industries, textile industries, automobile industries, mine industries, precision machinery industries and the like cannot meet the requirements. However, pure PI is not suitable for being used alone as a friction material due to relatively low tensile and compressive strengths, and a PI composite material with excellent mechanical properties and tribological properties can be obtained after adding a reinforcing fiber.
The carbon fiber is inorganic polymer fiber with carbon content higher than 90%. Wherein the carbon content is more than 99 percent, namely graphite fiber. The carbon fiber can be respectively prepared by carbonizing polyacrylonitrile fiber, pitch fiber, viscose or phenolic fiber; divided into filaments, staple fibers and chopped fibers according to the state; the material is divided into a general type and a high-performance type according to mechanical properties. The general-purpose carbon fiber has a strength of 1000 megapascals (MPa) and a modulus of about 100 GPa. High-performance carbon fibers are classified into high-strength carbon fibers (strength 2000MPa, modulus 250GPa) and high-model carbon fibers (modulus more than 300 GPa). The strength is more than 4000MPa and is also called ultra-high strength type; moduli greater than 450GPa are referred to as ultra-high models. The carbon fiber has the characteristics of high temperature resistance, high strength, high elastic modulus, creep resistance and the like, is the most commonly used reinforcing fiber for preparing high-performance resin matrix composite materials, and is used for modifying polyimide.
However, the surface of the carbon fiber is inert, and the bonding strength of the interface between the untreated composite material fiber and the resin is weak, thereby influencing the application of the material. Therefore, before the polyimide is reinforced with carbon fibers, the scientific and technological community generally performs a surface treatment on the carbon fibers to generate more active functional groups and form ravines. The crystal nucleus can be added into a high polymer material to be used as a crystal nucleus to induce the crystallization of a high polymer around the crystal nucleus, so that the order of macromolecules of the high polymer material can be improved, the aggregation state structure of the high polymer is changed, and the performance of the high polymer material is influenced. Most of the carbon fiber modification methods adopted at home and abroad at present have complex processes and harsh conditions, such as an air oxidation method (requiring ablation for 40 minutes at 450 ℃ in a muffle furnace), a nitric acid oxidation method (soaking carbon fibers in nitric acid for treatment for a period of time), low-temperature liquid nitrogen treatment (soaking in liquid nitrogen (-196 ℃) for 10 minutes), and the like. The method has complex conditions, the treatment time is not easy to control, and the modulus and the breaking strength of the carbon fiber are easy to reduce, thereby greatly reducing the performance of the composite material.
Therefore, there is a need for a novel carbon fiber and polyimide composite material that can be directly compounded without changing the surface structure of the carbon fiber and has more excellent properties.
Disclosure of Invention
The invention aims to provide a method for preparing a carbon fiber and polyimide composite material, which can obtain a material with good mechanical property.
The purpose of the invention is realized as follows:
(1) putting tetramine and an organic solvent into a reaction kettle, stirring and dissolving completely at room temperature, adding carbon-carbon unsaturated double bond-containing carboxylic anhydride solid powder, stirring at room temperature until the carboxylic anhydride solid powder is completely dissolved, continuing stirring and reacting, adding tetracarboxylic anhydride, and stirring and reacting at 2-5 ℃ to obtain a viscous polyamic acid solution;
(2) preparing a polyamic acid solution into a solution with the mass fraction of polyamic acid accounting for 35-60%, infiltrating carbon fiber, heating to 200 ℃, and drying to obtain primarily compounded carbon fiber;
(3) uniformly mixing thermosetting polyimide with the primarily compounded carbon fiber;
(4) and (4) carrying out compression molding, crosslinking and curing on the polyimide carbon fiber composite raw material obtained in the step (3), and then further carrying out radiation crosslinking to obtain the polyimide carbon fiber composite material.
The present invention may further comprise:
1. the structure of the polyamic acid is as follows:
wherein R is1Is a group containing a carbon-carbon unsaturated double bond; r2Is one or more of the following structures:wherein X is selected from one or more of the following divalent groups: -CO-, -O-, -S-, -SO2-、-CH2-、-C(CH3)2-、-C(CF3)2-。
2. The carboxylic anhydride containing carbon-carbon unsaturated double bond is one or more of the following structures:
3. the tetracarboxylic acid anhydride is selected from pyromellitic dianhydride, 2, 3, 6, 7-naphthalenetetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -biphenyltetracarboxylic dianhydride, 1,2, 5, 6-naphthalenetetracarboxylic dianhydride, 2 ', 3, 3 ' -biphenyltetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -benzophenonetetracarboxylic dianhydride, 4, 4 ' -oxydiphthalic dianhydride, 2-bis (3, 4-dicarboxyphenyl) propane dianhydride, 3,4, 9, 10-perylenetetracarboxylic dianhydride, bis (3, 4-dicarboxyphenyl) propane dianhydride, 1-bis (2, 3-dicarboxyphenyl) ethane dianhydride, 1-bis (3, 4-dicarboxyphenyl) ethane dianhydride, bis (2, 3-dicarboxyphenyl) methane dianhydride, bis (3-dicarboxyphenyl) methane dianhydride, One or more of bis (3, 4-dicarboxyphenyl) ethane dianhydride, oxydiphthalic dianhydride, bis (3, 4-dicarboxyphenyl) sulfone dianhydride, p-phenylene bis (trimellitic acid monoester anhydride), ethylene bis (trimellitic acid monoester anhydride) and bisphenol A bis (trimellitic acid monoester anhydride).
The thermosetting polyimide is synthesized from tetracarboxylic dianhydride, diamine and a capping reagent, wherein the capping reagent of the thermosetting polyimide is fluorine-containing phenylacetylene phthalic anhydride.
The polyamic acid is adopted to coat the carbon fiber, and then is compounded with the common thermosetting polyimide to obtain the material with excellent performance.
Drawings
FIG. 1 is an infrared spectrum of some embodiments.
Detailed Description
The method for preparing the carbon fiber-polyimide composite material comprises the following steps:
(1) putting tetramine and an organic solvent into a reaction kettle, stirring and dissolving completely at room temperature, adding carbon-carbon unsaturated double bond-containing carboxylic anhydride solid powder, stirring at room temperature until the carboxylic anhydride solid powder is completely dissolved, continuing stirring and reacting, adding tetracarboxylic anhydride, and stirring and reacting at 2-5 ℃ to obtain a viscous polyamic acid solution;
(2) preparing polyamic acid into a solution with the mass fraction of polyamic acid accounting for 35-60%, infiltrating carbon fiber, heating to 200 ℃, and drying to obtain primary composite carbon fiber;
(3) providing thermosetting polyimide and the preliminarily compounded carbon fiber, and uniformly mixing;
(4) and (3) carrying out compression molding, crosslinking and curing on the polyimide carbon fiber composite material, and then carrying out further radiation crosslinking to obtain the polyimide carbon fiber composite material.
Preferably, the mass ratio of the polyamic acid to the carbon fiber is 1/10-1/1; more preferably, the mass ratio of the polyamic acid to the carbon fiber is 2/10.
Preferably, the thermosetting polyimide accounts for 10-100% of the mass of the composite material; more preferably, the thermosetting polyimide accounts for 40% of the mass fraction of the composite material.
Wherein the structure of the polyamic acid is as follows:
the R is1Is a group containing a carbon-to-carbon unsaturated double bond, R2One or more of the following structures:
wherein,
x is selected from one or more of the following divalent groups: -CO-, -O-, -S-, -SO2-、-CH2-、-C(CH3)2-、-C(CF3)2-。
The tetracarboxylic acid anhydrides mentioned above are commercially available and are available directly from reagent companies.
The carboxylic anhydride containing carbon-carbon unsaturated double bond has one or more of the following structures:
(4- (4-methyl-3-pentene) -4-cyclohexene-1, 2-dicarboxylic anhydride),(tetrapropenylene succinic anhydride),
The carboxylic acid anhydrides containing carbon-carbon unsaturated double bonds are commercially available and can be purchased directly from reagent companies.
The method for producing a carbon fiber-polyimide composite material according to the first aspect, wherein the tetracarboxylic acid anhydride is selected from the group consisting of pyromellitic dianhydride, 2, 3, 6, 7-naphthalenetetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -biphenyltetracarboxylic dianhydride, 1,2, 5, 6-naphthalenetetracarboxylic dianhydride, 2 ', 3, 3 ' -biphenyltetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -benzophenonetetracarboxylic dianhydride, 4, 4 ' -oxydiphthalic dianhydride, 2-bis (3, 4-dicarboxyphenyl) propane dianhydride, 3,4, 9, 10-perylenetetracarboxylic dianhydride, bis (3, 4-dicarboxyphenyl) propane dianhydride, 1-bis (2, 3-dicarboxyphenyl) ethane dianhydride, 1-bis (3, 4-dicarboxyphenyl) ethane dianhydride, bis (2, 3-dicarboxyphenyl) methane dianhydride, bis (3, 4-dicarboxyphenyl) ethane dianhydride, oxydiphthalic dianhydride, bis (3, 4-dicarboxyphenyl) sulfone dianhydride, p-phenylene bis (trimellitic acid monoester anhydride), ethylene bis (trimellitic acid monoester anhydride), bisphenol A bis (trimellitic acid monoester anhydride).
The organic solvent to be used may be selected from N-methyl-2-pyrrolidone, N-dimethylacetamide, N-diethylacetamide, N-dimethylformamide, N-diethylformamide, N-methylcaprolactam, hexamethylphosphoramide, tetramethylene sulfone, dimethyl sulfoxide, m-cresol, phenol, p-chlorophenol, 2-chloro-4-hydroxytoluene, diglyme, triglyme, tetraglyme, dioxane, gamma-butyrolactone, dioxolane, cyclohexanone, cyclopentanone, dichlorotoluene, chloroform, 1, 2-dichloroethane, 1, 2-trichloroethane, dibromomethane, tribromomethane, 1, 2-dibromoethane, 1, 2-tribromoethane, etc., two or more kinds may be used in combination.
As the carbon fiber, carbon fibers of all kinds can be used according to the use, but carbon fibers having a tensile elastic modulus of at most 400GPa are preferable from the viewpoint of impact resistance. In addition, from the viewpoint of strength, since a composite material having high rigidity and mechanical strength can be obtained, carbon fibers having a tensile strength of preferably 4.4 to 6.5GPa are used. In addition, tensile elongation is also an important factor, and high-strength and high-elongation carbon fibers of 1.7 to 2.3% are preferable. Therefore, a carbon fiber having a tensile elastic modulus of at least 230GPa, a tensile strength of at least 4.4GPa, and a tensile elongation of at least 1.7% is most preferable.
Commercially available carbon fibers include Torayca T800G-24K, Torayca T800S-24K, Torayca T700G-24K, Torayca T300-3K, and Torayca T700S-12K.
The thermosetting polyimide is synthesized from tetracarboxylic dianhydride, diamine and a blocking agent, wherein the blocking agent of the thermosetting polyimide is fluorine-containing phenylacetylene phthalic anhydride. The flame retardant property of the material can be improved by substituting fluorine.
The tetracarboxylic dianhydrides used in the present invention for the preparation of polyimide include pyromellitic dianhydride, 2, 3, 6, 7-naphthalenetetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -biphenyltetracarboxylic dianhydride, 1,2, 5, 6-naphthalenetetracarboxylic dianhydride, 2 ', 3, 3 ' -biphenyltetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -benzophenonetetracarboxylic dianhydride, 4, 4 ' -oxydiphthalic dianhydride, 2-bis (3, 4-dicarboxyphenyl) propane dianhydride, 3,4, 9, 10-perylenetetracarboxylic dianhydride, bis (3, 4-dicarboxyphenyl) propane dianhydride, 1-bis (2, 3-dicarboxyphenyl) ethane dianhydride, 1-bis (3, 4-dicarboxyphenyl) ethane dianhydride, bis (2, 3-dicarboxyphenyl) methane dianhydride, Bis (3, 4-dicarboxyphenyl) ethane dianhydride, oxydiphthalic dianhydride, bis (3, 4-dicarboxyphenyl) sulfone dianhydride, p-phenylene bis (trimellitic acid monoester anhydride), ethylene bis (trimellitic acid monoester anhydride), bisphenol a bis (trimellitic acid monoester anhydride) and the like of these, and these may be preferably used alone or in a mixture of any proportions.
The diamine used for the preparation of the polyimide of the present invention includes, for example, 4 ' -diaminodiphenylpropane, 4 ' -diaminodiphenylmethane, benzidine, 3 ' -dichlorobenzidine, 3 ' -dimethylbenzidine, 2 ' -dimethylbenzidine, 3 ' -dimethoxybenzidine, 2 ' -dimethoxybenzidine, 4 ' -diaminodiphenyl sulfide, 3 ' -diaminodiphenyl sulfone, 4 ' -diaminodiphenyl ether, 3 ' -diaminodiphenyl ether, 3,4 ' -diaminodiphenyl ether, 1, 5-diaminonaphthalene, 4 ' -diaminodiphenyldiethylsilane, 4 ' -diaminodiphenylsilane, 4 ' -diaminodiphenylsilane, and mixtures thereof, 4, 4 ' -diaminodiphenylethylphosphine oxide, 4 ' -diaminodiphenyl-N-methylamine, 4 ' -diaminodiphenyl-N-aniline, 1, 4-diaminobenzene (p-phenylenediamine), 1, 3-diaminobenzene, 1, 2-diaminobenzene, bis {4- (4-aminophenoxy) phenyl } sulfone, bis {4- (4-aminophenoxy) phenyl } propane, bis {4- (3-aminophenoxy) phenyl } sulfone, 4 ' -bis (4-aminophenoxy) biphenyl, 4 ' -bis (3-aminophenoxy) biphenyl, 1, 3-bis (3-aminophenoxy) benzene, 1, 3-bis (4-aminophenoxy) benzene, 1, 3-bis (4-aminophenoxy) benzene, 1, 3-bis (3-aminophenoxy) benzene, 3 '-diaminobenzophenone, 4' -diaminobenzophenone, and the like.
As the end capping component of polyimide, dicarboxylic anhydride, monoamine, and the like can be used. Examples of the dicarboxylic anhydride include phthalic anhydride, naphthalic anhydride, biphenyldicarboxylic anhydride, 1,2, 3, 6-tetrahydrophthalic anhydride, 1, 2-cyclohexanedicarboxylic anhydride, 5-norbornene-2, 3-dicarboxylic anhydride, methyl-5-norbornene-2, 3-dicarboxylic anhydride, citraconic anhydride, maleic anhydride, 3-ethynylphthalic acid, 4-phenylethynylphthalic acid, and 3-fluoro-4-phenylethynylphthalic anhydride. Examples of the monoamine include aniline, aminonaphthalene, aminobiphenyl, 3-ethynylaniline, and 4-ethynylaniline. Preferably, the end capping agent is fluoro phenyl ethynyl phthalic anhydride, which can inhibit the candle wick effect. Of course, the end-capping agent is not limited thereto. These may be used alone or in combination of two or more.
The organic solvent to be used may be selected from N-methyl-2-pyrrolidone, N-dimethylacetamide, N-diethylacetamide, N-dimethylformamide, N-diethylformamide, N-methylcaprolactam, hexamethylphosphoramide, tetramethylene sulfone, dimethyl sulfoxide, m-cresol, phenol, p-chlorophenol, 2-chloro-4-hydroxytoluene, diglyme, triglyme, tetraglyme, dioxane, gamma-butyrolactone, dioxolane, cyclohexanone, cyclopentanone, dichlorotoluene, chloroform, 1, 2-dichloroethane, 1, 2-trichloroethane, dibromomethane, tribromomethane, 1, 2-dibromoethane, 1, 2-tribromoethane, etc., two or more kinds may be used in combination.
The catalyst is preferably a tertiary amine compound, and specific examples thereof include trimethylamine, Triethylamine (TEA), tripropylamine, tributylamine, triethanolamine, N-dimethylethanolamine, N-diethylethanolamine, triethylenediamine, N-methylpyrrolidine, N-ethylpyrrolidine, N-methylpiperidine, N-ethylpiperidine, imidazole, pyridine, quinoline, and isoquinoline. The reaction may be carried out in the presence of at least one catalyst selected from these tertiary amine compounds. When the catalyst is used, the amount of the catalyst used is preferably 0.1 to 100 mol% based on the tetracarboxylic acid component (Y), from the viewpoint of a small amount and a short reaction time as possible.
The preparation process of the composite material comprises the following steps:
adding a small amount of coupling agent (containing 1 percent of the total resin) into the thermosetting polyimide resin, uniformly mixing, mixing with the primarily compounded carbon fiber, putting into an oven at 80 ℃ for pretreatment, after 1 hour, heating to 160 ℃ for 3 hours after the solution is volatilized, and heating to 200 ℃ for 4 hours. And then putting the fiber into a vacuum oven at 250 ℃ for treatment for 5 hours to obtain a prepressing material.
Die pressing process
Starting contact, heating to 280 ℃, pressurizing, closing the mold, continuously heating to 380 ℃, keeping the temperature for 1 hour, blowing for cooling, and demolding at 150 ℃. And (4) processing the strip after demolding, drying the obtained strip by heat treatment of a box at 120 ℃, taking out, standing for 24 hours, and testing.
Test method
Unnotched impact strength test: hebei Chengde testing machine, Xa-500, 50J, GB 1043.
And (3) testing tensile strength: lloyd, Lloyd-LR-50K, GB1040, UK.
And (3) testing the bending strength: lloyd, Lloyd-LR-50K, GB9341, UK.
And (3) testing medium resistance: GBn 547.
Flame retardance: UL 94.
The invention is described in more detail below by way of example.
Example 1
Putting 0.2 mol of 2, 2-bis [4- (2, 4-diaminophenoxy) phenyl ] propane and 1000 ml of N, N-dimethylacetamide into a reaction kettle, stirring and dissolving completely at room temperature, adding 0.4 mol of 4- (4-methyl-3-pentene) -4-cyclohexene-1, 2-dicarboxylic anhydride, stirring at room temperature until the mixture is dissolved completely, continuing to stir for reaction for 0.5 hour, adding 0.2 mol of pyromellitic dianhydride, stirring and reacting at 2-5 ℃ for 2 hours, controlling the viscosity at 2-5 ℃ to be 10000 centipoises, and stopping stirring to obtain a viscous polyamide acid solution.
Preparing polyamic acid into a solution with the mass fraction of polyamic acid being 50%, infiltrating carbon fiber (Torayca T800G-24K), heating to 200 ℃, and drying (the mass ratio of polyamic acid to carbon fiber is 10:1) to obtain modified carbon fiber A1.
The preparation process of the composite material comprises the following steps:
adding a small amount of coupling agent KH570 (containing 1 percent of the total resin) into thermosetting polyimide resin pmr-15, uniformly mixing, mixing with modified carbon fiber A1 (53 percent of the total resin), putting into an oven at 80 ℃ for pretreatment, after 1 hour, heating to 160 ℃ for 3 hours after the solution is volatilized, and heating to 200 ℃ for 4 hours. And then putting the fiber into a vacuum oven at 250 ℃ for treatment for 5 hours to obtain a prepressing material.
Die pressing process
Starting contact, heating to 280 ℃, pressurizing, closing the mold, continuously heating to 380 ℃, keeping the temperature for 1 hour, blowing for cooling, and demolding at 150 ℃. And (4) processing the strip after the mould is removed, drying the obtained strip by heat treatment in a box at 120 ℃, taking out the strip, standing for 24 hours, and performing radiation crosslinking (a cobalt-60 isotope radiation source, the dose of which is 8000Gy) to obtain a strip B1 test.
Example 2
Carboxylic anhydride containing carbon-carbon unsaturated double bond:
tetracarboxylic acid anhydride: 2, 3, 6, 7-naphthalenetetracarboxylic dianhydride
Controlling the viscosity: 10000
Mass fraction of polyamic acid: 60 percent of
Thermosetting polyimide resin: 3,4, 5-Trifluorophenylacetylene phthalic anhydride-terminated polyimide resin (same as PMR-15 monomer)
Preparation method is the same as example, and sample B2 is obtained
Example 3
Carboxylic anhydride containing carbon-carbon unsaturated double bond:
tetracarboxylic acid anhydride: 2, 3, 6, 7-naphthalenetetracarboxylic dianhydride
Controlling the viscosity: 9000
Mass fraction of polyamic acid: 35 percent of
Preparation method is the same as example, and sample B3 is obtained
Example 4
Carboxylic anhydride containing carbon-carbon unsaturated double bond:
tetracarboxylic acid anhydride: 2, 3, 6, 7-naphthalenetetracarboxylic dianhydride
Controlling the viscosity: 20000
Mass fraction of polyamic acid: 35 percent of
Preparation method is the same as example, and sample B4 is obtained
Example 5
Carboxylic anhydride containing carbon-carbon unsaturated double bond:
tetracarboxylic acid anhydride: 3, 3 ', 4, 4' -biphenyltetracarboxylic dianhydride
Controlling the viscosity: 18000
Mass fraction of polyamic acid: 35 percent of
Preparation method is the same as example, and sample B5 is obtained
Example 6
Carboxylic anhydride containing carbon-carbon unsaturated double bond: norbornene dicarboxylic anhydride. Otherwise, as in example 1, a sample B6 was obtained.
Example 7
Carboxylic anhydride containing carbon-carbon unsaturated double bond: maleic anhydride. Otherwise, as in example 1, a sample B7 was obtained.
Comparative example 1
Same as example 1, but without the radiation crosslinking step. Sample bar D1 is obtained
Comparative example 2
The viscosity was controlled to 30000, and the procedure was repeated in the same manner as in example 1 to obtain a sample D2.
The test results are shown in table 1:
TABLE 1
The results in table 1 show that the polyimide carbon fiber composite materials all have very excellent mechanical properties (the tensile strength is greater than 490MPa), and the mechanical properties of the composite materials can be further improved through radiation crosslinking. In addition, the experimental result also shows that the polyimide carbon fiber composite material has very excellent flame retardant property (meeting the UL-0 or UL-1 standard). In view of the excellent mechanical and flame retardant properties of the polyimide carbon fiber composite material, the polyimide carbon fiber composite material can be widely applied to the high-tech fields of aviation, aerospace, electrical appliances, machinery, chemical engineering, microelectronics and the like.
Claims (9)
1. A method for preparing a carbon fiber and polyimide composite material is characterized by comprising the following steps:
(1) putting tetramine and an organic solvent into a reaction kettle, stirring and dissolving completely at room temperature, adding carbon-carbon unsaturated double bond-containing carboxylic anhydride solid powder, stirring at room temperature until the carboxylic anhydride solid powder is completely dissolved, continuing stirring and reacting, adding tetracarboxylic anhydride, and stirring and reacting at 2-5 ℃ to obtain a viscous polyamic acid solution;
(2) preparing a polyamic acid solution into a solution with the mass fraction of polyamic acid accounting for 35-60%, infiltrating carbon fiber, heating to 200 ℃, and drying to obtain primarily compounded carbon fiber;
(3) uniformly mixing thermosetting polyimide with the primarily compounded carbon fiber;
(4) and (4) carrying out compression molding, crosslinking and curing on the polyimide carbon fiber composite raw material obtained in the step (3), and then further carrying out radiation crosslinking to obtain the polyimide carbon fiber composite material.
2. The method for preparing a carbon fiber and polyimide composite material according to claim 1, wherein the polyamic acid has the following structure:
wherein R is1Is a group containing a carbon-carbon unsaturated double bond; r2 isOne or more of the following structures:wherein X is selected from one or more of the following divalent groups: -CO-, -O-, -S-, -SO2-、-CH2-、-C(CH3)2-、-C(CF3)2-。
3. The method for preparing the carbon fiber and polyimide composite material as claimed in claim 1 or 2, wherein the carboxylic anhydride containing carbon-carbon unsaturated double bond is one or more of the following structures:
4. the method for preparing a carbon fiber and polyimide composite according to claim 1 or 2, characterized in that the tetracarboxylic acid anhydride is selected from the group consisting of pyromellitic dianhydride, 2, 3, 6, 7-naphthalenetetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -biphenyltetracarboxylic dianhydride, 1,2, 5, 6-naphthalenetetracarboxylic dianhydride, 2 ', 3, 3 ' -biphenyltetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -benzophenonetetracarboxylic dianhydride, 4, 4 ' -oxydiphthalic dianhydride, 2-bis (3, 4-dicarboxyphenyl) propane dianhydride, 3,4, 9, 10-perylenetetracarboxylic dianhydride, bis (3, 4-dicarboxyphenyl) propane dianhydride, 1-bis (2, 3-dicarboxyphenyl) ethane dianhydride, 1-bis (3, 4-dicarboxyphenyl) ethane dianhydride, bis (2, 3-dicarboxyphenyl) methane dianhydride, bis (3, 4-dicarboxyphenyl) ethane dianhydride, oxydiphthalic dianhydride, bis (3, 4-dicarboxyphenyl) sulfone dianhydride, p-phenylene bis (trimellitic acid monoester anhydride), ethylene bis (trimellitic acid monoester anhydride), bisphenol A bis (trimellitic acid monoester anhydride).
5. The method for preparing a carbon fiber and polyimide composite according to claim 3, wherein the tetracarboxylic acid anhydride is selected from the group consisting of pyromellitic dianhydride, 2, 3, 6, 7-naphthalenetetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -biphenyltetracarboxylic dianhydride, 1,2, 5, 6-naphthalenetetracarboxylic dianhydride, 2 ', 3, 3 ' -biphenyltetracarboxylic dianhydride, 3, 3 ', 4, 4 ' -benzophenonetetracarboxylic dianhydride, 4, 4 ' -oxydiphthalic dianhydride, 2-bis (3, 4-dicarboxyphenyl) propane dianhydride, 3,4, 9, 10-perylenetetracarboxylic dianhydride, bis (3, 4-dicarboxyphenyl) propane dianhydride, 1-bis (2, 3-dicarboxyphenyl) ethane dianhydride, 1-bis (3, 4-dicarboxyphenyl) ethane dianhydride, bis (2, 3-dicarboxyphenyl) methane dianhydride, bis (3, 4-dicarboxyphenyl) ethane dianhydride, oxydiphthalic dianhydride, bis (3, 4-dicarboxyphenyl) sulfone dianhydride, p-phenylene bis (trimellitic acid monoester anhydride), ethylene bis (trimellitic acid monoester anhydride), bisphenol A bis (trimellitic acid monoester anhydride).
6. The method for preparing a carbon fiber and polyimide composite material according to claim 1 or 2, wherein: the mass ratio of the polyamic acid to the carbon fiber is 1/10-1/1; the thermosetting polyimide accounts for 10-100% of the composite material by mass.
7. The method of preparing a carbon fiber and polyimide composite as claimed in claim 3, wherein: the mass ratio of the polyamic acid to the carbon fiber is 1/10-1/1; the thermosetting polyimide accounts for 10-100% of the composite material by mass.
8. The method of preparing a carbon fiber and polyimide composite as claimed in claim 4, wherein: the mass ratio of the polyamic acid to the carbon fiber is 1/10-1/1; the thermosetting polyimide accounts for 10-100% of the composite material by mass.
9. The method of preparing a carbon fiber and polyimide composite as claimed in claim 5, wherein: the mass ratio of the polyamic acid to the carbon fiber is 1/10-1/1; the thermosetting polyimide accounts for 10-100% of the composite material by mass.
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105015566A (en) * | 2015-07-31 | 2015-11-04 | 株洲时代新材料科技股份有限公司 | Safety bracket used for linear motor railway train and production method thereof |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101062985A (en) * | 2006-04-28 | 2007-10-31 | 宋成根 | Processing technique of low-constriction polyimide film |
CN101062979A (en) * | 2006-04-28 | 2007-10-31 | 宋成根 | Preparation method of nano type polyamic acid resin |
CN101230196A (en) * | 2008-02-26 | 2008-07-30 | 东南大学 | In-situ polymerization PI modified nylon composite material |
US20090263640A1 (en) * | 2005-09-16 | 2009-10-22 | E.I. Du Pont De Nemours And Company | Polycyclic polyimides and compositions and methods relating thereto |
CN103694487A (en) * | 2013-12-13 | 2014-04-02 | 青岛海洋新材料科技有限公司 | Preparation method of carbon fiber-polyimide composite film |
-
2015
- 2015-02-17 CN CN201510086537.9A patent/CN104629365B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090263640A1 (en) * | 2005-09-16 | 2009-10-22 | E.I. Du Pont De Nemours And Company | Polycyclic polyimides and compositions and methods relating thereto |
CN101062985A (en) * | 2006-04-28 | 2007-10-31 | 宋成根 | Processing technique of low-constriction polyimide film |
CN101062979A (en) * | 2006-04-28 | 2007-10-31 | 宋成根 | Preparation method of nano type polyamic acid resin |
CN101230196A (en) * | 2008-02-26 | 2008-07-30 | 东南大学 | In-situ polymerization PI modified nylon composite material |
CN103694487A (en) * | 2013-12-13 | 2014-04-02 | 青岛海洋新材料科技有限公司 | Preparation method of carbon fiber-polyimide composite film |
Non-Patent Citations (1)
Title |
---|
王大明: "乙炔基封端聚酰亚胺及其复合材料的增韧研究", 《中国博士学位论文全文数据库 工程科技Ⅰ辑》 * |
Cited By (11)
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CN109545578A (en) * | 2018-11-22 | 2019-03-29 | 中南民族大学 | The derivative one-dimensional nitrogen-doped nanometer carbon electrode material of acylamide polymer and preparation method |
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