CN104627953B - A kind of be base material with SU-8 photoresist and PDMS micro-fluidic chip bonding method - Google Patents
A kind of be base material with SU-8 photoresist and PDMS micro-fluidic chip bonding method Download PDFInfo
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Abstract
The invention provides a kind of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS, first one SU-8 substrate and a PDMS substrate are provided, adopt isopropanol and deionized water that described SU-8 substrate and PDMS substrate are carried out, then the bonding face of described PDMS substrate is carried out oxygen plasma process, then adopt APTES aqueous solution that the bonding face of described SU-8 substrate and PDMS substrate is carried out silylating reagent process, finally by bonded to each other for the bonding face of described SU-8 substrate and PDMS substrate and carry out pressing heating, to be bonded described SU-8 substrate and PDMS substrate, form complete micro-fluidic chip.Having the advantages that 1) the method can use the cheap apparatus such as common low-power plasma machine or corona discharge device that the bonding face of PDMS substrate is modified；2) operating process is simple, and the controllability of technique, stability, repeatability are high, and bond strength, yield rate are high, be not susceptible to leakage；3) SU-8 substrate and PDMS substrate be bonded with the micro-fluidic chip helping realize multifunctional accurate labyrinth.
Description
Technical field
The invention provides a kind of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS.Belong to micro-fluidic chip field.
Technical background
Microflow control technique (Microfluidics) is the brand-new research application of the multi-crossed disciplines such as biology, chemistry, medical science, physics, electronics, material, a machinery.Micro-fluidic chip is also called chip lab (Lab-on-a-chip), is that the basic operation units such as biology, chemistry, the sample preparation of medical analysis process, reaction, separation, detection are integrated on the chip of one piece of micro-nano-scale.Micro-fluidic chip forms network with microchannel, micro structure, runs through whole system with controlled fluid, in order to replace the various functions of standard biologic, chemistry, medical analysis laboratory, it is achieved the microminiaturization of analytical equipment, portability and multifunction.Micro-fluidic chip relates to manipulating, at micro-nano-scale, the fluid rising to picoliters volume and integrated multiple electricity, optics, the biochemistry detection means received, micro structure therein, microchannel and microcavity body often adopt the bonding of different materials to be achieved, and the fine or not degree of chip bonding greatly have impact on quality and the function of chip.
At present, the processing of micro-fluidic chip, frequently with soft lithography, makes microchannel formpiston with SU-8 photoresist, is bonded by after polydimethylsiloxane (PDMS) curing molding reverse mould forms chip with glass or organic polymer substrate.SU-8 photoresist, with the mechanical performance of its excellence, heat stability, electrical insulating property and corrosion resistance, has from leveling, black light is sensitive and absorb the advantages such as minimum, shows great advantage in the micro electronmechanical manufacture of MEMS and assembling；SU-8 photoresist has good bio-compatibility simultaneously, it is adaptable to manufacture BioMEMS bio-microelectromechanical device.PDMS is organic high molecular polymer conventional in micro-fluidic chip, is generally mixed according to certain mass ratio by PDMS performed polymer and firming agent and is polymerized.PDMS has bio-compatibility and the gas permeability of excellence, and has the good characteristics such as optical clear, electrical insulation, chemical inertness and Heat stability is good, and its cost is low simultaneously, easy to use, is the wide variety of rapidoprint of micro-fluidic chip.
But, PDMS micro-fluidic chip has certain limitation because of its material behavior: 1) due to the high resiliency of PDMS, it is impossible to carry out wafer level processing；2) bonding of PDMS chip cannot pass through photo etched mask alignment machine and suprabasil fine structure (such as, microelectrode) and accurately be directed at, and limits the integrated of high precision test function on PDMS chip.And SU-8 photoresist effectively overcomes these shortcomings of PDMS.Although SU-8 is difficult to form micro-fluidic chip with the other materials Direct Bonding such as PDMS, abroad scholar's research is still had to utilize SU-8 photoresist directly to process the process of micro-fluidic chip, propose, by the method for simple vapour deposition 3-aminopropyl triethoxysilane (APTES), SU-8 substrate surface is carried out silanization treatment, separately in 200W ~ 400W power bracket, PDMS substrate is carried out surface modification with high power Oxygen plasma ashing stove, but the method has the disadvantage that 1) need high power plasma ashing stove, expensive, non-general micro-fluidic chip user can bear；2) in bonding technology, it is necessary to use weight to be compressed on the chip of heating, easily cause the deformation of PDMS substrate；3) oxygen plasma controllability, poor stability in high power range, the yield rate causing manufacture is low, and bond strength is low, process repeatability is poor, chip is susceptible to leakage.
Summary of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS, be used for solving SU-8 substrate in prior art and be bonded difficulty, yield rate, device therefor costliness and the problem such as poor controllability, bonding effect generation leakage poor, easy with PDMS substrate.
For achieving the above object and other relevant purposes, the invention provides a kind of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS, at least include step: adopt oxygen plasma that the bonding face of described PDMS substrate carries out hydrophobicity extremely hydrophilically modified process, then adopt certain density APTES aqueous solution that the bonding face of described SU-8 substrate and PDMS substrate is carried out silylating reagent process, be finally bonded described SU-8 substrate and PDMS substrate.
As a kind of preferred version of the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention, at least comprise the following steps:
Step 1: a SU-8 substrate and a PDMS substrate are provided, described SU-8 substrate and PDMS substrate are carried out；
Step 2: adopt oxygen plasma that the bonding face of described PDMS substrate is carried out Cement Composite Treated by Plasma；
Step 3: adopt certain density APTES aqueous solution that the bonding face of described SU-8 substrate and PDMS substrate is carried out silylating reagent process；
Step 4: by bonded to each other for the bonding face of described SU-8 substrate and PDMS substrate and carry out pressing heating, to be bonded described SU-8 substrate and PDMS substrate, formed be base material with SU-8 photoresist and PDMS complete micro-fluidic chip.
Further, above-mentioned steps 1 comprises the following steps:
Step 1-1: a SU-8 substrate and a PDMS substrate are provided, with isopropanol, described SU-8 substrate and PDMS substrate are carried out；
Step 1-2: adopt deionized water that described SU-8 substrate and PDMS substrate are carried out, and dry up with clean air or nitrogen.
Further, a kind of preferred version as the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention, the time that the bonding face of described PDMS substrate carries out in above-mentioned steps 2 oxygen plasma process can according to the power bracket adjustment of plasma ashing stove used, plasma washing machine or corona discharge device, and the process time is 10 ~ 60s.
Further, above-mentioned steps 3 comprises the following steps:
Step 3-1: immerse in certain density APTES aqueous solution by described SU-8 substrate and through the PDMS substrate that oxygen plasma is modified；
Step 3-2: adopt deionized water that described SU-8 substrate and PDMS substrate are carried out, and dry up with clean air or nitrogen.
Further, the time immersing APTES aqueous solution as a kind of preferred version of the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention, SU-8 substrate described in above-mentioned steps 3-1 and PDMS substrate is 20min.
Further, as a kind of preferred version of the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention, the volume by volume concentration of APTES aqueous solution described in above-mentioned steps 3-1 is 3% ~ 5%.
Further, as a kind of preferred version of the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention, the temperature of post-heating of in above-mentioned steps 4, described SU-8 substrate and PDMS substrate being fitted is 90 DEG C, and heat time heating time is 10 ~ 60min.
As mentioned above, the invention provides a kind of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS, first one SU-8 substrate and a PDMS substrate are provided, adopt isopropanol and deionized water that described SU-8 substrate and PDMS substrate are carried out, then adopt oxygen plasma that the bonding face of described PDMS substrate is carried out Cement Composite Treated by Plasma, then adopt certain density APTES aqueous solution that the bonding face of described SU-8 substrate and PDMS substrate is carried out silylating reagent process, finally by bonded to each other for the bonding face of described SU-8 substrate and PDMS substrate and carry out pressing heating, to be bonded described SU-8 substrate and PDMS substrate, form the complete micro-fluidic chip being base material with SU-8 photoresist and PDMS.
The method have the advantages that 1) the method use oxygen plasma purpose be only that the bonding face to PDMS substrate changes hydrophilic into from hydrophobicity, therefore without expensive high power plasma ashing stove, the cheap apparatus such as common low-power plasma washing machine or corona discharge device can be used；2) this operating process is simple, it is not necessary to weight is compressed on the chip of laminating, and the controllability of technique, stability, repeatable height, bond strength, yield rate are high, and finished product micro-fluidic chip is not susceptible to leakage；3) due to SU-8 base chip manufacture technical maturity, complicated fine structure can be manufactured, and be prone to carry out accurately integrated with the structure such as microelectrode, being bonded with of SU-8 substrate and PDMS substrate help to realize multifunctional accurate structure micro-fluidic chip.
Accompanying drawing explanation
Fig. 1 is shown as the schematic flow sheet of the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention.
Fig. 2 ~ Fig. 3 is shown as the schematic diagram that presents of the step 1 of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention.
Fig. 4 is shown as the schematic diagram that presents of the step 2 of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention.
Fig. 5 ~ Fig. 6 is shown as the schematic diagram that presents of the step 3 of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention.
Fig. 7 is shown as the schematic diagram that presents of the step 4 of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS of the present invention.
Element numbers explanation
101SU-8 substrate
The SU-8 photoresist of 102SU-8 substrate
The substrate of 103SU-8 substrate, can adopt glass or silicon materials
104PDMS substrate
105APTES aqueous solution
Detailed description of the invention
Below by way of specific instantiation, embodiments of the present invention being described, those skilled in the art the content disclosed by this specification can understand other advantages and effect of the present invention easily.The present invention can also be carried out by additionally different detailed description of the invention or apply, the every details in this specification can also based on different viewpoints and application, without departing from carrying out various modification or change under principles of the invention.
Refer to Fig. 1 ~ Fig. 7.It should be noted that, the diagram provided in the present embodiment only illustrates the ultimate principle of the present invention, work process and effect by way of illustration, then only display component count with relevant assembly in the present invention but not when implementing according to reality, formation and size drafting in diagram, during its actual enforcement, the kenel of each assembly, quantity and ratio can change, and its assembly layout kenel also can be increasingly complex.
As shown in Fig. 1 ~ Fig. 7, the present embodiment provides a kind of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS, at least include step: adopt oxygen plasma that the bonding face of described PDMS substrate 104 carries out hydrophobicity extremely hydrophilically modified process, then adopt certain density APTES aqueous solution 105 that the bonding face of described SU-8 substrate 101 and PDMS substrate 104 is carried out silylating reagent process, be finally bonded described SU-8 substrate 101 and PDMS substrate 104.
Specifically, the bonding method of described SU-8 substrate 101 and PDMS substrate 104 at least comprises the following steps:
As shown in Fig. 1 ~ Fig. 3, first carry out step 1, i.e. S1 ~ S2, it is provided that SU-8 substrate 101 and a PDMS substrate 104, described SU-8 substrate 101 and PDMS substrate 104 be carried out.
Further, step 1 comprises the following steps:
Step 1-1: SU-8 substrate 101 and a PDMS substrate 104 is provided, with isopropanol, described SU-8 substrate 101 and PDMS substrate 104 is carried out；
Step 1-2: adopt deionized water that described SU-8 substrate 101 and PDMS substrate 104 are carried out, and dry up with clean air or nitrogen.
In the present embodiment, isopropanol and deionized water is adopted to clean the scavenging period of SU-8 substrate 101 and PDMS substrate 104 without clearly limiting；Washing order must be first clean with isopropanol, it is therefore an objective to removes described SU-8 substrate 101 and PDMS substrate 104 surface Organic substance that may be present and impurity particle, then cleans with deionized water, it is therefore an objective to remove isopropanol and the impurity particle of residual；Carry out drying up with clean air or nitrogen and can shorten the process implementing time.In a specific embodiment, adopting isopropanol scavenging period is 30 ~ 60s, and adopting deionized water scavenging period is 1 ~ 2min.
As Figure 1 and Figure 4, then carry out step 2, i.e. S3, adopt oxygen plasma that the bonding face of described PDMS substrate 104 is carried out Cement Composite Treated by Plasma, it is therefore an objective to by the bonding face of PDMS substrate 104 from hydrophobic modified for hydrophilic.
In the present embodiment, adopt the time that the bonding face of described PDMS substrate 104 is carried out Cement Composite Treated by Plasma by oxygen plasma can be adjusted according to the power bracket of plasma apparatus used, the process time is 10s ~ 60s, its Adjustment principle is that the high-power equipment process time is short, and it is long that low-power equipment processes the time.In a concrete implementation process, adopting the power that the bonding face of described PDMS substrate 104 is carried out Cement Composite Treated by Plasma by microwave plasma ashers stove is 200 ~ 400W, and the time of process is 10 ~ 15s；In the implementation process that another is concrete, adopting the power that the bonding face of described PDMS substrate 104 is carried out Cement Composite Treated by Plasma by low-power plasma washing machine is 30W, and the time of process is 30 ~ 60s.
As shown in Fig. 1, Fig. 5 ~ Fig. 6, then step 3 is carried out, i.e. S4 ~ S5, immerses described SU-8 substrate 101 and PDMS substrate 104 in certain density APTES aqueous solution 105, it is therefore an objective to the bonding face of SU-8 substrate 101 and PDMS substrate 104 is carried out silylating reagent process.
Further, above-mentioned steps 3 comprises the following steps:
Step 3-1: immerse in certain density APTES aqueous solution 105 by described SU-8 substrate 101 and through the PDMS substrate 104 that oxygen plasma is modified；
Step 3-2: adopt deionized water that described SU-8 substrate 101 and PDMS substrate 104 are carried out, and dry up with clean air or nitrogen.
In the present embodiment, the volume by volume concentration of APTES aqueous solution 105 used is 3% ~ 5%.In a specific embodiment, pure for 2.5mL liquid APTES is dissolved in 75mL deionized water, it is thus achieved that the APTES aqueous solution 105 of 3.2%；In another specific embodiment, pure for 3mL liquid APTES is dissolved in 60mL deionized water, it is thus achieved that the APTES aqueous solution 105 of 4.8%；The time that described SU-8 substrate 101 and PDMS substrate 104 immerse APTES aqueous solution 105 is 20min, to reach surface silanization modification effectively；Adopting the scavenging period that deionized water cleans SU-8 substrate 101 and PDMS substrate 104 is 1 ~ 2min, it is therefore an objective to remove the APTES aqueous solution 105 remaining on substrate.
It should be noted that in the present embodiment, the PDMS substrate 104 modified through oxygen plasma can not be exposed in air for a long time, then immerses APTES aqueous solution 105.In a specific embodiment, through immersing in APTES aqueous solution 105 within the modified PDMS substrate 104 of oxygen plasma is in 1 ~ 5min, it is therefore an objective in order to prevent hydrophilic PDMS substrate 104 from becoming again hydrophobicity after overlong time in atmosphere because exposing.
As shown in Figure 1, Figure 7 shows, finally carry out step 4, i.e. S6, by bonded to each other for the bonding face of described SU-8 substrate 101 and PDMS substrate 104 and carry out pressing heating, to be bonded described SU-8 substrate 101 and PDMS substrate 104, form complete micro-fluidic chip.
In the present embodiment, pressing of described SU-8 substrate 101 and PDMS substrate 104 being fitted is placed on hot plate heating, and hot plate temperature is 90 DEG C, and heat time heating time is 10 ~ 60min.
It should be noted that when the micro-fluidic chip after laminating is placed in hot plate heating, contact hot plate with the glass of SU-8 substrate 101 or silicon materials substrate 103, it is not necessary to weight is compressed on the PDMS substrate 104 on top.The final step of this bonding method completes on 90 DEG C of hot plates, can effectively accelerate bonding process on the one hand, it is achieved high bond strength, and this bonding process is irreversible；On the other hand, temperature arranges rationally, far below the vitrification point of SU-8 photoresist and PDMS material, on rapidoprint used without impact.
In sum, the invention provides a kind of micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS, first one SU-8 substrate and a PDMS substrate are provided, adopt isopropanol and deionized water that described SU-8 substrate and PDMS substrate are carried out, then adopt oxygen plasma that the bonding face of described PDMS substrate is carried out Cement Composite Treated by Plasma, then adopt certain density APTES aqueous solution that the bonding face of described SU-8 substrate and PDMS substrate is carried out silylating reagent process, finally by bonded to each other for the bonding face of described SU-8 substrate and PDMS substrate and carry out pressing heating, to be bonded described SU-8 substrate and PDMS substrate, form complete micro-fluidic chip.Have the advantages that 1) the method use oxygen plasma purpose be only that the bonding face to PDMS substrate changes hydrophilic into from hydrophobicity, therefore without expensive high power plasma ashing stove, the cheap apparatus such as common low-power plasma washing machine or corona discharge device can be used；2) this operating process is simple, it is not necessary to weight is compressed on the chip of laminating, and the controllability of technique, stability, repeatable height, bond strength, yield rate are high, and finished product micro-fluidic chip is not susceptible to leakage；3) due to SU-8 base chip manufacture technical maturity, complicated fine structure can be manufactured, and be prone to carry out accurately integrated with the structure such as microelectrode, being bonded with of SU-8 substrate and PDMS substrate help to realize multifunctional accurate structure micro-fluidic chip.So, the present invention effectively overcomes shortcoming of the prior art, and has height value in micro-fluidic chip industry.
Above-described embodiment only describes the ultimate principle of the present invention, technical process and effect illustratively, not for the application of the restriction present invention.Above-described embodiment all under principles of the invention, can be modified or change by the personnel of any skilled this technology of grasp.Therefore, art has all equivalences that usually intellectual completes under without departing from disclosed philosophy and technique thought such as and modifies or change, must be contained by the claim of the present invention.
Claims (8)
1. the micro-fluidic chip bonding method that a kind is base material with SU-8 photoresist and PDMS, it is characterized in that, at least include step: adopt oxygen plasma that the bonding face of described PDMS substrate carries out hydrophobicity extremely hydrophilically modified process, then adopt certain density APTES aqueous solution that the bonding face of described SU-8 substrate and PDMS substrate is carried out silylating reagent process, be finally bonded described SU-8 substrate and PDMS substrate.
2. according to claim 1 be base material with SU-8 photoresist and PDMS micro-fluidic chip bonding method, it is characterised in that: at least comprise the following steps:
Step 1: a SU-8 substrate and a PDMS substrate are provided, described SU-8 substrate and PDMS substrate are carried out；
Step 2: adopt oxygen plasma that the bonding face of described PDMS substrate is carried out Cement Composite Treated by Plasma；
Step 3: adopt certain density APTES aqueous solution that the bonding face of described SU-8 substrate and PDMS substrate is carried out silylating reagent process；
Step 4: by bonded to each other for the bonding face of described SU-8 substrate and PDMS substrate and carry out pressing heating, to be bonded described SU-8 substrate and PDMS substrate, formed be base material with SU-8 photoresist and PDMS complete micro-fluidic chip.
3. according to claim 2 be base material with SU-8 photoresist and PDMS micro-fluidic chip bonding method, it is characterised in that: step 1 at least comprises the following steps:
Step 1-1: a SU-8 substrate and a PDMS substrate are provided, with isopropanol, described SU-8 substrate and PDMS substrate are carried out；
Step 1-2: adopt deionized water that described SU-8 substrate and PDMS substrate are carried out, and dry up with clean air or nitrogen.
4. according to claim 2 be base material with SU-8 photoresist and PDMS micro-fluidic chip bonding method, it is characterized in that: the time that the bonding face of described PDMS substrate carries out oxygen plasma process can according to the power bracket adjustment of plasma ashing stove used, plasma washing machine or corona discharge device, and the process time is 10 ~ 60s.
5. according to claim 2 be base material with SU-8 photoresist and PDMS micro-fluidic chip bonding method, it is characterised in that: step 3 at least comprises the following steps:
Step 3-1: immerse in certain density APTES aqueous solution by described SU-8 substrate and through the PDMS substrate that oxygen plasma is modified；
Step 3-2: adopt deionized water that described SU-8 substrate and PDMS substrate are carried out, and dry up with clean air or nitrogen.
6. the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS according to claim 1 ~ 5 any one, it is characterised in that: the time of described SU-8 substrate and PDMS substrate immersion APTES aqueous solution is 20min.
7. the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS according to claim 1 ~ 5 any one, it is characterised in that: the volume by volume concentration of described APTES aqueous solution is 3% ~ 5%.
8. the micro-fluidic chip bonding method being base material with SU-8 photoresist and PDMS according to claim 1 ~ 5 any one, it is characterised in that: the temperature of described SU-8 substrate and PDMS substrate laminating post-heating is 90 DEG C, and heat time heating time is 10 ~ 60min.
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| CN109107623A (en) * | 2018-08-28 | 2019-01-01 | 中国科学院深圳先进技术研究院 | A kind of micro-fluidic chip and preparation method |
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| US20040091392A1 (en) * | 2002-08-09 | 2004-05-13 | Mcbride Sterling Eduard | Method and apparatus for employing a tunable microfluidic device for optical switching, filtering and assaying of biological samples |
| CN100480757C (en) * | 2007-12-07 | 2009-04-22 | 南京邮电大学 | Manufacture method for electric control optical switch array micro-fluidic chip |
| CN102060262B (en) * | 2010-12-03 | 2012-09-26 | 合肥工业大学 | Method for manufacturing micro-nano fluid control system by using low-pressure bonding technology |
| CN102411060A (en) * | 2011-12-06 | 2012-04-11 | 东南大学 | Microfluidic chip with high-aspect-ratio micro-fluidic channel and fabrication method thereof |
| CN103145089A (en) * | 2012-10-01 | 2013-06-12 | 合肥工业大学 | Reverse thermal bonding technology for making micro and nano fluid system with controllable size |
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