CN104614945A - Spin coater chuck system for spin-coating of sticky photoresist - Google Patents

Spin coater chuck system for spin-coating of sticky photoresist Download PDF

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Publication number
CN104614945A
CN104614945A CN201510056757.7A CN201510056757A CN104614945A CN 104614945 A CN104614945 A CN 104614945A CN 201510056757 A CN201510056757 A CN 201510056757A CN 104614945 A CN104614945 A CN 104614945A
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CN
China
Prior art keywords
chuck
spin coating
photoresist
support chuck
spin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510056757.7A
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Chinese (zh)
Inventor
阮久福
张称
卢怡如
杨军
邓光晟
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Hefei University of Technology
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Hefei University of Technology
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Publication date
Application filed by Hefei University of Technology filed Critical Hefei University of Technology
Priority to CN201510056757.7A priority Critical patent/CN104614945A/en
Publication of CN104614945A publication Critical patent/CN104614945A/en
Pending legal-status Critical Current

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a spin coater chuck system for spin-coating of sticky photoresist; the spin coater chuck system comprises a rotating shaft, a suction cup, a support chuck and E-shaped chucks; the rotating shaft is positioned on the central axis of a spin coater chuck system body; the support chuck is connected with the rotating shaft through a rivet; the support chuck is fixed through the rivet at the position in which the support chuck up and down moves along the rotating shaft; the suction cup is put on the top end of the rotating shaft; the E-shaped chucks surround the periphery of a square chuck; the lower parts of the E-shaped chucks and a support platform are fixed through rivets; and the E-shaped chucks are staggered with one another and can horizontally move through rivets. According to the system, an adhesive film having good flatness can be obtained while spin-coating of the high-viscosity photoresist is carried out; furthermore, the spin coater chuck system is applied to carrying out the photoresist spin-coating on square substrates of different sizes and thicknesses, and thus, the spin coater chuck system can be widely used in the fields, such as micromachining and micro electro-mechanical systems.

Description

A kind of spin coating instrument chuck system for spin coating thickness photoresist
Technical field
The present invention relates to micromachining device field, specifically a kind of spin coating instrument chuck system for spin coating thickness photoresist.
Background technology
in the micro Process manufacture process of microdevice and MEMS (micro electro mechanical system) (MEMS) etc., the normally requisite step of spin coating of photoresist, its objective is and obtain the good photoresist glued membrane of flatness.The planarization of glued membrane directly determines the quality of subsequent technique, and then affects the total quality of micro element and micro-system.The concrete principle of this processing step and method are: first drip resist coating at the center of substrate, when the surface tension of the centrifugal force that the substrate of High Rotation Speed produces and photoresist film reaches balance, can obtain the uniform photoresist glued membrane of one deck at substrate surface.This processing step is realized by spin coating instrument.
The primary structure of the instrument of commercialization spin coating in the market comprises: motor, chuck, vacuum pump.The rotation that motor provides can produce the centrifugal force balanced each other with film surface tension force, and vacuum pump provides the vacuum of absorption required for substrate, and chuck places substrate and the platform of fixed substrate, and its center has aperture to communicate with vacuum pump.The chuck simple circular flat structure often of business-like spin coating instrument configuration.
In theory, no matter the target thickness of photoresist glued membrane is how many, and on market, business-like spin coating instrument all can be completely achieved above-mentioned spin coating function, thus obtains the good photoresist glued membrane of flatness.And actual conditions are: for the photoresist glued membrane of thinner (tens nanometer ~ tens micron), use the configuration of commercialization spin coating instrument can obtain thickness easily and reach as high as tens microns, the good thin adhesive layer of flatness.
And for the microstructure of some ultra-thicks (magnitude of hundreds of micron), superelevation depth-to-width ratio, in spin coating proceeding, need the target film thickness obtained also correspondingly to increase.For meeting above-mentioned requirements, SU-8 etc. is generally selected to compare the photoresist of thickness.Because of the viscosity that it is high, in such photoresist spin coating process, following two kinds of phenomenons can be there are: (1), after photoresist is subject to centrifugal force disengaging substrate, form the fiber fines silk of photoresist, they are caught air electric current and land at substrate surface.After front baking, these filaments just form relatively large pit at film surface.(2) because discontinuous shearing force causes excessive pearl photoresist to assemble at substrate edge, thus formation edge is thick, the out-of-flatness glued membrane of intermediate thin.These two kinds of phenomenons all make glued membrane flatness be deteriorated, and have a strong impact on the quality of subsequent technique.
For above-mentioned the second phenomenon and edge effect, the general edge bead remover that uses is eliminated.But edge bead remover is chemical noxious product, and be highly flammable, therefore this method is not perfect solution.Even if edge effect can be removed by this way, but the glued membrane out-of-flatness that the first phenomenon causes still cannot be avoided.Therefore, comparatively large at the target thickness of glued membrane, when need use high viscosity photoresist, the good glued membrane of planarization be obtained and there is larger difficulty.
summary of the inventionthe object of this invention is to provide a kind of spin coating instrument chuck system for spin coating thickness photoresist, to solve prior art commercialization spin coating instrument irregular problem of institute's glued membrane that obtains when spin coating thickness photoresist, when can realize the photoresist of spin coating high viscosity, obtain the good photoresist glued membrane of planarization.
In order to achieve the above object, the technical solution adopted in the present invention is:
A kind of spin coating instrument chuck system for spin coating thickness photoresist, it is characterized in that: the turning axle including support chuck, hollow, described support chuck is installed on the rotary shaft by central through hole, turning axle top is provided with sucker, sucker center is provided with and the small through hole be communicated with in turning axle, support chuck end face is also provided with four E type chucks, and the vertical cross section of each E type chuck is E font, and to be that mutual rectangle is staggered at support chuck end face be centered around around sucker for four E type chucks.
Described a kind of spin coating instrument chuck system for spin coating thickness photoresist, it is characterized in that: described support chuck bottom center forms circular bosses, support chuck central through hole is along the through support chuck of support chuck central axial direction and circular bosses, described support chuck is installed on the rotary shaft by central through hole, and the rivet interlacement by being screwed into from circular bosses sidepiece between circular bosses and turning axle.
Described a kind of spin coating instrument chuck system for spin coating thickness photoresist, is characterized in that: bottom four E type chucks respectively by rivet interlacement at support chuck end face.
Described a kind of spin coating instrument chuck system for spin coating thickness photoresist, is characterized in that: the upper plane at the middle part of described E type chuck to be adjustable to the upper plane of square substrate at same plane, becomes the extension plane on four limits of substrate plane.
Advantage of the present invention is:
(1) pearl photoresist that discontinuous shearing force causes, can be eliminated to assemble at substrate edge and the glued membrane out-of-flatness phenomenon that formed: by plane on the middle part that is looped around four E type chucks of square chuck surrounding, extend the surf zone extending substrate, make edge pearl photoresist buildup effect appear on the chuck of extension, ensure that the flatness of photoresist glued membrane on target substrate.
(2), disengaging substrate that excessive centrifugal force causes can be eliminated after the pit phenomenon that formed in adhering to again of substrate surface of the thread photoresist of fiber fines that formed: catch by the topmost of E type chuck the photoresist leaving substrate surface, thus prevent they in atmosphere the filamental photoresist that formed of absorbed air electrostatic in the attachment again of substrate surface.
(3), can the application of substrate spin coating of compatible broad ranges of thicknesses: realize it by regulating the rivet on brace table and move up and down along turning axle, thus the substrate of different-thickness can be carried.
(4), can the application of substrate spin coating of compatible different size: realize it by regulating the rivet of E type chuck bottom and move horizontally along brace table, thus make the substrate of the square chuck carrying different size at center.
Accompanying drawing explanation
Fig. 1 is cross-sectional view of the present invention.
Fig. 2 is the vertical view of four E type chucks.
Fig. 3 be generic card spiral be coated with thickness photoresist time edge effect schematic diagram.
Fig. 4 is the effect schematic diagram of the present invention for spin coating thickness photoresist.
Embodiment
As shown in Figure 1, a kind of spin coating instrument chuck system for spin coating thickness photoresist, include the turning axle 3 of support chuck 1, hollow, support chuck 1 is arranged on turning axle 3 by central through hole, turning axle 3 top is provided with sucker 4, sucker 4 center is provided with and the small through hole be communicated with in turning axle, support chuck 1 end face is also provided with four E type chucks 5, the vertical cross section of each E type chuck 5 is E font, and to be that mutual rectangle is staggered at support chuck 1 end face be centered around around sucker 4 for four E type chucks 5.
Support chuck 1 bottom center forms circular bosses, support chuck 1 central through hole is along the through support chuck 1 of support chuck 1 central axial direction and circular bosses, support chuck 1 is arranged on turning axle 3 by central through hole, and the rivet 2 by being screwed into from circular bosses sidepiece between circular bosses with turning axle 3 is connected.
Support chuck 1 end face is connected to respectively by rivet 6 bottom four E type chucks 5.
The upper plane at the middle part of E type chuck 5 to be adjustable to the upper plane of square substrate at same plane, becomes the extension plane on four limits of substrate plane.
The present invention includes turning axle 3, sucker 4, support chuck 1, E type chuck 5, described turning axle 3 inner hollow, is connected with the vacuum system of outside; Support chuck 1 is connected with turning axle 3 by rivet 2, and support chuck 1 realizes moving up and down along turning axle 3 by the shift in position of rivet; Sucker 4 is placed in the top of turning axle 3, and there is aperture at sucker 4 center, communicates, and be connected with the vacuum system of outside with the axial hollow of turning axle 3 inside, and sucker 4 and square substrate (dotted line position in Fig. 1) realize fitting tightly by atmospheric pressure; E type chuck 5 is looped around the surrounding of square substrate (dotted line position in Fig. 1), and the bottom of E type chuck 5 and brace table are fixed by rivet 6, and realize moving horizontally by rivet.Four E type chucks are interlaced, and their position relationship is as shown in the vertical view in Fig. 2, and surrounding represents four E type chucks, around the blank parts of centre be square substrate.
Principle of work of the present invention is as follows:
1., by regulating, the upper plane of the upper plane of the center section of E type chuck 5 and substrate can be made at grade.When spin coating thickness photoresist, the pearl photoresist caused due to discontinuous shearing force is assembled at edge, the extension (i.e. the midplane of E type chuck 5) of substrate plane makes the edge effect of photoresist spin coating (as shown in Figure 3) drop on E type chuck 5, because this eliminating the edge effect caused by the uncontinuity of substrate edge.Last spin coating effect as shown in Figure 4, pearl photoresist in the middle part of E type chuck on the most edge of plane pile up, and in fact substrate edge place assembles without photoresist, defines even photoresist glued membrane.In Fig. 3 and 4, black part is divided into the distributional pattern of photoresist.
2. the pit phenomenon that the thread photoresist of fiber fines formed after can eliminating the disengaging substrate that excessive centrifugal force causes was formed in adhering to again of substrate surface: catch the photoresist leaving substrate surface by the topmost of E type chuck, thus prevent their absorbed air electrostatic and form the again attachment of filamental photoresist at substrate surface in atmosphere.
3. support chuck 1 is moved up and down by its underpart rivet 2 along turning axle 3 and fixes, if the thickness of substrate is bigger than normal or less than normal, support chuck can be regulated by regulating the rivet 2 of support chuck 1, plane is gone up in same level, spin coating thickness photoresist on the substrate that so just can be implemented in different-thickness in the middle part of the upper plane and the E type chuck that ensure substrate.
4. the distribution of four E type chucks 5 is interlaced, be centered around the surrounding of square substrate (dotted line position in Fig. 1), if sizes of substrate is bigger than normal or less than normal, four interlaced E type chucks 5 can be regulated by regulating rivet 6, thus realize the application of different size substrate spin coating photoresist.

Claims (4)

1. the spin coating instrument chuck system for spin coating thickness photoresist, it is characterized in that: the turning axle including support chuck, hollow, described support chuck is installed on the rotary shaft by central through hole, turning axle top is provided with sucker, sucker center is provided with and the small through hole be communicated with in turning axle, support chuck end face is also provided with four E type chucks, and the vertical cross section of each E type chuck is E font, and to be that mutual rectangle is staggered at support chuck end face be centered around around sucker for four E type chucks.
2. a kind of spin coating instrument chuck system for spin coating thickness photoresist according to claim 1, it is characterized in that: described support chuck bottom center forms circular bosses, support chuck central through hole is along the through support chuck of support chuck central axial direction and circular bosses, described support chuck is installed on the rotary shaft by central through hole, and the rivet interlacement by being screwed into from circular bosses sidepiece between circular bosses and turning axle.
3. a kind of spin coating instrument chuck system for spin coating thickness photoresist according to claim 1, is characterized in that: bottom four E type chucks respectively by rivet interlacement at support chuck end face.
4. a kind of spin coating instrument chuck system for spin coating thickness photoresist according to claim 1, it is characterized in that: the upper plane at the middle part of described E type chuck to be adjustable to the upper plane of square substrate at same plane, becomes the extension plane on four limits of substrate plane.
CN201510056757.7A 2015-02-03 2015-02-03 Spin coater chuck system for spin-coating of sticky photoresist Pending CN104614945A (en)

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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111842016A (en) * 2020-06-22 2020-10-30 上海工程技术大学 Rotary film coating device capable of recycling precursor solution
CN113385360A (en) * 2021-06-30 2021-09-14 高严福 Coating type coating equipment for preparing optical lens

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086870A (en) * 1977-06-30 1978-05-02 International Business Machines Corporation Novel resist spinning head
TW391893B (en) * 1997-05-30 2000-06-01 Fairchild Corp Method and apparatus for spin-coating chemicals
CN1501442A (en) * 2002-11-12 2004-06-02 阿泰技术有限公社 Photoresist deposition apparatus and method for forming photoresist film with the same
CN1539560A (en) * 2002-10-03 2004-10-27 尔必达存储器株式会社 Machine and method for coating
CN1952781A (en) * 2005-10-21 2007-04-25 东京毅力科创株式会社 Resist coating method and resist coating apparatus
KR100727608B1 (en) * 2005-12-19 2007-06-14 주식회사 대우일렉트로닉스 Spin coating apparatus in organic electro luminescent emitting device
CN101090064A (en) * 2006-06-16 2007-12-19 东京毅力科创株式会社 Liquid processing apparatus and method
CN101581885A (en) * 2008-05-13 2009-11-18 东京毅力科创株式会社 Coating apparatus and method
CN204389875U (en) * 2015-02-03 2015-06-10 合肥工业大学 A kind of spin coating instrument chuck system for spin coating thickness photoresist

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086870A (en) * 1977-06-30 1978-05-02 International Business Machines Corporation Novel resist spinning head
TW391893B (en) * 1997-05-30 2000-06-01 Fairchild Corp Method and apparatus for spin-coating chemicals
CN1539560A (en) * 2002-10-03 2004-10-27 尔必达存储器株式会社 Machine and method for coating
CN1501442A (en) * 2002-11-12 2004-06-02 阿泰技术有限公社 Photoresist deposition apparatus and method for forming photoresist film with the same
CN1952781A (en) * 2005-10-21 2007-04-25 东京毅力科创株式会社 Resist coating method and resist coating apparatus
KR100727608B1 (en) * 2005-12-19 2007-06-14 주식회사 대우일렉트로닉스 Spin coating apparatus in organic electro luminescent emitting device
CN101090064A (en) * 2006-06-16 2007-12-19 东京毅力科创株式会社 Liquid processing apparatus and method
CN101581885A (en) * 2008-05-13 2009-11-18 东京毅力科创株式会社 Coating apparatus and method
CN204389875U (en) * 2015-02-03 2015-06-10 合肥工业大学 A kind of spin coating instrument chuck system for spin coating thickness photoresist

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111842016A (en) * 2020-06-22 2020-10-30 上海工程技术大学 Rotary film coating device capable of recycling precursor solution
CN113385360A (en) * 2021-06-30 2021-09-14 高严福 Coating type coating equipment for preparing optical lens

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