CN104614399B - A kind of hot physical property transient hot wire technique temperature probe of liquid - Google Patents
A kind of hot physical property transient hot wire technique temperature probe of liquid Download PDFInfo
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- CN104614399B CN104614399B CN201510086790.4A CN201510086790A CN104614399B CN 104614399 B CN104614399 B CN 104614399B CN 201510086790 A CN201510086790 A CN 201510086790A CN 104614399 B CN104614399 B CN 104614399B
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Abstract
The invention provides a kind of hot physical property transient hot wire technique temperature probe of liquid, including：Support for fixing heated filament；The heated filament is connected between the first wire group and the second wire group；The first wire group break-through is in the support；The first wire group is optionally powered to carrying out thermometric using different heat-pole methods from each wire in the second wire group.In accordance with the invention it is possible to which the measurement of thermal conductivity and thermal diffusivity is realized with different heat-pole methods on same probe.
Description
Technical field
The present invention relates to the technical field of liquid thermophysical property measurement, more particularly, to a kind of hot physical property transient hot wire technique of liquid
Temperature probe.
Background technology
The thermal conductivity factor and thermal diffusion coefficient of liquid are important physical parameters, in Chemical Manufacture, the energy and scientific research
Field has great importance.For example：The application of new heat-carrying matter and working medium, the utilization of solar energy and Ocean thermal energy, new storage
The application of heat and energy storage technology, bio-thermophysics are studied, liquid thermal conductivity study mechanism, and enhanced heat transfer mechanism research etc. is required for standard
True heat transfer and thermal diffusion coefficient data.
For gas and solid matter, its heat conducting law and mechanism are more clear by the research in century more than one,
There are the reliable predictor formula of comparative maturity and empirical equation to be used for actual production and scientific research.However, between solid-state and gaseous state it
Between liquid, its heat conducting law and thermal conduction mechanism be still unintelligible at present, and this not only needs the resonable opinion of Condensed Matter Physics scholar
Aspect is furtherd investigate, it is also desirable to which accurate reliable measurement apparatus is measured to its physical parameter.
China is in the research level of hot working fluid physical property, and new material preparation process level, the utilization ratio of new energy is accurate
All there is quite poor away from reason is China advanced with Foreign Advanced Lerel in terms of the designing and manufacturing level of measuring instrument
Foreign Advanced Lerel is also lagged behind in the manufacturing process of equipment and the preparation of basic material；And the manufacturing process and base of sophisticated equipment
The preparation of plinth material needs accurate reliable instrument to realize again, and the two develops with needing synchronous coordination, it is therefore desirable to while
Strengthen research in the preparation of material and the design of new instrument.
By years of researches and development, heat-pole method has become the current measurement liquid thermal conductivity factor generally acknowledged in the world
Standard method.Researcher both domestic and external is to begin one's study and build heat-pole method measuring instrument in last century 70, the eighties, measurement
Principle can be divided mainly into single line method, Double-Line Method, short line casting and parallel dual hot-wire method.It is reported that some of Japan, US and European
The measuring apparatus that laboratory is built can measure more than 1000 degree of high-temp liquid, highest measurement temperature up to 1500 degrees Celsius,
But pertinent literature negligible amounts, and the data of measurement are limited, it is impossible to it is mutually authenticated.
Existing business heat-pole method measuring instrument, there is 1 to 2 manufacturer's productions both at home and abroad, but it is limited in using scope
Near room temperature, highest measurement temperature can only reach 300 degrees Celsius, and measurable substance classes are extremely limited.According to existing heat
The support frame of the pertinent literature record display of line measurement instrument, sample cell and heated filament is generally glass or stainless steel, high temperature resistant
Not good enough with corrosion resistance, intensity cannot guarantee that.
The content of the invention
In view of the above-mentioned problems in the prior art, can be on same probe it is an object of the invention to provide one kind
The hot physical property transient hot wire technique temperature probe of liquid of the measurement of thermal conductivity and thermal diffusivity is realized with different heat-pole methods.
The hot physical property transient hot wire technique temperature probe of liquid of the present invention, including：Support for fixing heated filament；The heated filament
It is connected between the first wire group and the second wire group；The first wire group break-through is in the support；The first wire group
Optionally it is powered to carrying out thermometric using different heat-pole methods from each wire in the second wire group.
It is different by being accessed in external test circuitry according to the hot physical property transient hot wire technique temperature probe of liquid of the present invention
Electrified wire, thermometric can be implemented according to single heat-pole method, dual hot-wire method and parallel dual hot-wire method respectively, you can according to 3 kinds of hot lines
The test philosophy of method, realizes the measurement of thermal conductivity and thermal diffusivity on same probe.
Also, in the present invention or, one end of top end from the support of the first wire group is extended, institute
Extend to be connected between the one or both ends of the heated filament from the other end of the support in the end for stating the first wire group
At position, the other end of the heated filament is connected with the end of the second wire group.
According to the present invention, can effectively 3 kinds of heat-pole methods including single heat-pole method, dual hot-wire method and parallel dual hot-wire method it
Between selected.
Also, in the present invention or, the end of the first wire group and the second wire group for it is laminar, forked,
The shape of hook or channel-shaped.
According to the present invention, the end of wire group is formed as the shape of laminar, forked, hook or channel-shaped, can be conducive to
Heated filament is attached.
Also, in the present invention or, the heated filament be 10~100 microns of diameter platinum filament or tantalum wire.
According to the present invention, heated filament is the platinum filament or tantalum wire of 10~100 microns of diameter, with certain tensile strength.
Also, in the present invention or, the end of the first wire group and the second wire group by welding with it is described
Heated filament is connected.For example, the end of wire group can have the function of mark solder joint and fixed heated filament.
According to the present invention, effectively wire group and heated filament can be attached by welding.
Also, in the present invention or, the surface of the heated filament carries out plated film with membrane material, and the membrane material includes
Inorganic non-metallic material.
According to the present invention, the surface of heated filament can carry out plated film with membrane material, and the membrane material includes inorganic non-metallic material,
The method such as optional magnetron sputtering, electrochemistry or spraying plates aluminium nitride film to adapt to the measurement of high temperature corrosion liquid.
Also, in the present invention or, the support is made of ceramic materials, the ceramic material include aluminum oxide
Ceramics, zirconia ceramics.
According to the present invention, timbering material is low thermal expansion, chemical resistance is good, resistant to elevated temperatures ceramics, be can be applied to
High temperature measurement.
Also, in the present invention or, the support be sectional forming or integrally formed square column or cylinder.
According to the present invention, support is sectional forming or integrally formed square column or cylinder, and if stent section make,
Each section complete after can be fixed with high temperature inorganic gemel connection.
Also, in the present invention or, in the duct of inside of the first wire group break-through in the support or set
In the groove on the outer surface of the support.
According to the present invention, duct and groove can effectively make the first wire group break-through in support.
Also, in the present invention or, the first wire group includes at least three wires.
According to the present invention, the physical cabling that the setting of the wire group can effectively meet 3 kinds of heat-pole method measuring principles will
Ask.
According to following embodiments and refer to the attached drawing, the above and other mesh of the present invention is better understood with
, feature and advantage.
Brief description of the drawings
Fig. 1 shows that the structure of the hot physical property transient hot wire technique temperature probe of liquid of the embodiment according to the present invention is shown
It is intended to；
Fig. 2 shows the line system schematic diagram of the hot physical property transient hot wire technique temperature probe of liquid shown in Fig. 1；
Fig. 3 shows the circuit of the hot physical property transient hot wire technique temperature probe of liquid of another embodiment according to the present invention
System schematic.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing and following embodiments, it should be appreciated that accompanying drawing and following embodiments
The present invention is merely to illustrate, is not intended to limit the present invention.
For the current measuring apparatus narrow application range of solution, the low defect of observable temperature, it is an object of the invention to provide one
The hot physical property transient hot wire technique temperature probe of liquid is planted, including：Support for fixing heated filament；The heated filament is connected to the first wire
Between group and the second wire group；The first wire group break-through is in the support；Optionally to the first wire group and institute
Each wire in the second wire group is stated to be powered to carrying out thermometric using different heat-pole methods.
It is different by being accessed in external test circuitry according to the hot physical property transient hot wire technique temperature probe of liquid of the present invention
Electrified wire, thermometric can be implemented according to single heat-pole method, dual hot-wire method and parallel dual hot-wire method respectively, you can according to 3 kinds of hot lines
The test philosophy of method, measures thermal conductivity and thermal diffusivity on same probe.
Fig. 1 shows that the structure of the hot physical property transient hot wire technique temperature probe of liquid of the embodiment according to the present invention is shown
It is intended to, and Fig. 2 shows the line system schematic diagram of the hot physical property transient hot wire technique temperature probe of liquid shown in Fig. 1.
As depicted in figs. 1 and 2, the hot physical property transient hot wire technique temperature probe of the liquid of this embodiment includes being used for fixed heat
The support 11 of silk 12.Referring to Fig. 2, the heated filament 12 is connected between the first wire group 3~5 and the second wire group 1~2, and first
The break-through of wire group 3~5 is in support 11.Optionally each wire in the first wire group 3~5 and the second wire group 1~2 is led to
Electricity is with using different heat-pole method progress thermometrics.
Specifically, as depicted in figs. 1 and 2, one end of top end from the support 11 of the first wire group 3~5 is extended, and first leads
Extend the position to be connected between the one or both ends of heated filament 12 from the other end 15,16 of support 11 in the end of line group 3~5
At A（Referring specifically to the first heated filament 6 and the connection schematic diagram of the second heated filament 7 shown in Fig. 2）, the other end of heated filament 12 with
The end of second wire group 1~2 is connected.
Also, the wire in the first wire group 3~5 and the second wire group 1~2（Wire 10 i.e. shown in Fig. 1）End
Be formed as the shape of laminar, forked, hook or channel-shaped, can be conducive to being attached with heated filament.And the first wire group 3~5
It is connected with the end of the second wire group 1~2 by welding with heated filament.For example, the end of each wire group can have mark solder joint and
The function of fixed heated filament.And, in this embodiment, heated filament can be the platinum filament or tantalum wire of 10~100 microns of diameter.In addition, hot
Silk surface can also membrane material carry out plated film, the membrane material can be good insulating, it is corrosion-resistant and with high heat conductance nothing
Machine nonmetal film, such as aluminum oxide, zirconium oxide, aluminium nitride, silicon nitride.Magnetron sputtering, electrochemistry or spraying for example may be selected
Plate aluminium nitride film to adapt to the measurement of high temperature corrosion liquid etc. method.
Also, in this embodiment, support 11 is made of ceramic materials, ceramic material includes aluminium oxide ceramics, zirconium oxide
Ceramics.Timbering material is low thermal expansion, chemical resistance is good, resistant to elevated temperatures ceramics, can be applied to high temperature measurement.And support
11 can be sectional forming or integrally formed square column or cylinder.If stent section make, each section complete after can with height
Warm inorganic glue is connected.In addition, the break-through of the first wire group 3~5 is in the duct of the inside of the support 11 or located at described
In groove on the outer surface of support.In this embodiment, in order to which the physical cabling for effectively meeting 3 kinds of measuring principles will
Ask, the first wire group at least includes three wires.Fig. 3 shows the liquid hot physical property wink of another embodiment according to the present invention
The line system schematic diagram of state heat-pole method temperature probe, arrangement when illustrated therein is the first wire group including 4 wires.
Hereinafter, the present invention is further illustrated according to specific embodiment.
As shown in figure 1, support 11 can be L-shaped, it is made up of refractory ceramics, because wanting break-through electric lead and wire in support
Bending is needed, is punched after ceramics bracket is sintered in select location, aperture is processed as wire straight according to the specification of selected wire
1.2~1.5 times of footpath.
Ceramics bracket sectional makes, and can also be integrally formed and be fabricated to designed structure, the support that sectional making is completed
Part is fixed by high temperature inorganic glue sticking.
Platinum filament or copper wire of the line selection with more than 10 times of a diameter of heated filament diameter are perforated in support, wire end passes through machine
Tool processing forms it into laminar, forked or groove, needs to mark pad if laminar and forked.
Wire is fixed by high temperature inorganic glue sticking after putting on and seals aperture, and selected heated filament is welded on into wire by spot welding
On pad on the thin slice of end, the heated filament after being welded for guarantee is tensioned state, it is necessary to tense heated filament, therefore institute in welding
Heated filament is selected to need certain tensile strength.
According to testing requirement, magnetron sputtering film process can be implemented to heated filament, optional plated film target is aluminum oxide, oxidation
The thermal conductivities such as zirconium, aluminium nitride, silicon nitride are good, the inorganic non-metallic material of high temperature resistant and corrosion resistance and good.
Hole corresponding with bracket cross section shape, spacing and the L-shaped branch in hole are done on such as Fig. 1, the ceramic cap 14 of fixed support 11
The width of frame lower end is corresponding, to ensure that support is corresponding with the hole upper-lower position on another ceramics pole 13.The shape of ceramic cap 14
Can be different shape and pattern according to the Vessel Design of splendid attire sample.
The threading mode and pad of wire at wire 1,5 two ends as shown in Fig. 2 be powered then as single heat wire method；In wire
2nd, 4 two ends are powered, and it is then double heat wire methods that wire 2,3 and 4 ends are connected into voltage-measuring equipment or bridge circuit respectively；By wire
1st, 2 ends or wire 3,4 ends are connected, and two heated filaments is powered simultaneously, are then parallel pair of heat wire method.
Using a temperature probe example of the invention, built with reference to self-built test circuit, constant-current source and universal meter
Heat-pole method liquid thermal property tester, preferable measurement result is can obtain through preliminary test, and table 1 below shows that thermal conductivity is tested
As a result with the contrast of standard value.And the testing procedure is as follows：
1. testing sample is loaded into shuttle；2. temperature probe is placed in sample and a period of time is stood；3. open
Constant-current source and universal meter are preheated 30 minutes or so；4. opening test program, the communication port of instrument and computer is set；5. set
Test voltage, electric current, testing time, data acquisition amount and data storing path；6. the virtual push button clicked on computer is out
Begin to test.
TableFor the contrast of thermal conductivity test result and standard value：
The temperature probe of the present invention is firm in structure reliable, and corrosion-and high-temp-resistant is good；Thermometric heated filament is applicable sample scope extensively,
Measurement temperature is interval big（With reference to the shuttle manufactured with probe same material, sample heating furnace such as tube furnace or induction furnace can be real
Existing more than 1000 degree measurement request）；The conductive track of internal stent combines a variety of test philosophies, it is adaptable to a variety of hot physical property
The measurement of parameter.Probe has the following advantages that：Sound construction, applicability is wide, and thermometric is interval big, with a variety of physical parameters of test
Ability.
In the case where not departing from the objective of essential characteristic of the present invention, the present invention can be presented as in diversified forms, therefore the present invention
Embodiment be to be illustrative rather than definitive thereof, be defined by the claims rather than limited by specification due to the scope of the present invention,
And all changes fallen in the scope defined in claim, or the full scope of equivalents of its scope defined are understood to include
In detail in the claims.
Claims (9)
1. a kind of hot physical property transient hot wire technique temperature probe of liquid, it is characterised in that including：
Support for fixing heated filament；
The heated filament is connected between the first wire group and the second wire group；
The first wire group break-through is in the support, and the first wire group includes the wire of more than three, described second
Wire group includes two wires, and the heated filament includes the first heated filament and the second heated filament, first heated filament and second heated filament
End of the one end respectively with two wires of the second wire group be connected；
Each wire in the first wire group and the second wire group be optionally powered with using single line method, Double-Line Method or
Make first heated filament with second heated filament while the parallel dual hot-wire method being powered is measured.
2. the hot physical property transient hot wire technique temperature probe of liquid according to claim 1, it is characterised in that first wire
One end of top end from the support of group is extended, the end of the first wire group from the other end of the support extend with
It is connected at the position between the one or both ends of the heated filament.
3. the hot physical property transient hot wire technique temperature probe of liquid according to claim 2, it is characterised in that first wire
The end of group and the second wire group is laminar, forked, hook or the shape of channel-shaped.
4. the hot physical property transient hot wire technique temperature probe of liquid according to any one of claim 1 to 3, it is characterised in that
The heated filament is the platinum filament or tantalum wire of 10~100 microns of diameter.
5. the hot physical property transient hot wire technique temperature probe of liquid according to Claims 2 or 3, it is characterised in that described first
The end of wire group and the second wire group is connected by welding with the heated filament.
6. the hot physical property transient hot wire technique temperature probe of liquid according to any one of claim 1 to 3, it is characterised in that
The surface of the heated filament carries out plated film with membrane material, and the membrane material includes inorganic non-metallic material.
7. the hot physical property transient hot wire technique temperature probe of liquid according to any one of claim 1 to 3, it is characterised in that
The support is made of ceramic materials, and the ceramic material includes aluminium oxide ceramics, zirconia ceramics.
8. the hot physical property transient hot wire technique temperature probe of liquid according to any one of claim 1 to 3, it is characterised in that
The support is sectional forming or integrally formed square column or cylinder.
9. the hot physical property transient hot wire technique temperature probe of liquid according to claim 2, it is characterised in that first wire
Group break-through is in the duct of the inside of the support or in the groove on the outer surface of the support.
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106483162B (en) * | 2016-09-14 | 2017-10-20 | 西安交通大学 | The device and method for solving and measuring method of a kind of use transient state Thermomembrane method measurement stream body thermal conductivity factor |
| CN106568803A (en) * | 2016-11-14 | 2017-04-19 | 中国锅炉水处理协会 | Method for measuring heat conductivity coefficient of conduction oil |
| CN108169278B (en) * | 2017-11-30 | 2019-02-05 | 山东大学 | A kind of hot physical property probe |
| CN109521047B (en) * | 2018-11-27 | 2021-04-27 | 河南科技大学 | Transient hot wire method measuring device for two-phase flow heat conductivity coefficient |
| CN109521046B (en) * | 2018-11-27 | 2021-04-27 | 河南科技大学 | Liquid heat conductivity coefficient measuring device |
| CN111982960A (en) * | 2020-08-13 | 2020-11-24 | 中国科学院合肥物质科学研究院 | High-temperature-resistant heat probe device for online measurement of heat conductivity coefficient based on hot wire method |
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| CN101806760A (en) * | 2009-02-17 | 2010-08-18 | 西安夏溪电子科技有限公司 | Hot wire fixing structures for transient hot wire method measurement |
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| KR101236284B1 (en) * | 2010-08-20 | 2013-02-22 | 한국에너지기술연구원 | Thermal conductivity measuring device of nanofluid using transient hot-wire method |
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| CN101806760A (en) * | 2009-02-17 | 2010-08-18 | 西安夏溪电子科技有限公司 | Hot wire fixing structures for transient hot wire method measurement |
| CN101839875A (en) * | 2010-04-30 | 2010-09-22 | 东北大学 | Boron-rich slag transient thermal conductance detector and measuring method |
| CN101871900A (en) * | 2010-05-31 | 2010-10-27 | 西安夏溪电子科技有限公司 | Sensor for measuring heat conduction coefficient |
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