CN104608507A - Print semiconductor integration manufacture device - Google Patents
Print semiconductor integration manufacture device Download PDFInfo
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- CN104608507A CN104608507A CN201510035707.0A CN201510035707A CN104608507A CN 104608507 A CN104608507 A CN 104608507A CN 201510035707 A CN201510035707 A CN 201510035707A CN 104608507 A CN104608507 A CN 104608507A
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Abstract
Disclosed is a print semiconductor integration manufacture device. The print semiconductor integration manufacture device comprises a device bottom seat (11), wherein a transverse displacement platform (13), a mobile base seat, a heating platform (14), a flexible substrate coil device (18) used to unwind print semiconductor flexible substrate material, cut the print semiconductor substrate material according to size demands, and move and heat the print semiconductor substrate material and a platform used to integrally manufacture a print semiconductor on the flexible substrate material are arranged on the device bottom seat (11), a print system and a UV (ultraviolet) lamp (12) are additionally arranged on the device bottom seat (11), and furthermore a computer control system is arranged on the device bottom seat (11), and used to control movement, positioning and work of the mobile base seat and the heating platform (14) on the transverse displacement platform (13) and work of the print system and the UV lamp (12). The mobile base seat is ingeniously designed, and integrates all the above components to work, and therefore rapid alignment in a production process can be achieved without need of moving the device bottom seat. Simultaneously, all the above components are integrated in the print semiconductor integration manufacture device, and therefore cost is reduced, and simplification of operation is achieved.
Description
Technical field
The present invention is the integration apparatus that a kind of integrated multiple typography prepares semiconductor electronic and opto-electronic device and circuit, in an equipment, namely completes all multiple process routes of electronic device and circuit, belong to semiconductor manufacturing facility field.
Background technology
Printed semiconductor technology prepares various semiconductor devices and circuit by typography, and without the need to high temperature and vacuum equipment, processing step is simple, can reduce facility significantly and drop into and production maintenance cost, shorten the production cycle; And be conducive to realizing light weight, pliable and tough, flexible electronic device products application based on flexible substrate material; And comprising sensing unit, Electronic Paper display backboard, the aspects such as radiofrequency markers identification label have achieved actual application.Along with people are to the continuous growth of the low price of electronic product, diversity and portability demand, printed semiconductor will more be paid attention to and be developed.
Thin-film semiconductor device is primarily of conductive layer, and insulating barrier, semiconductor layer and encapsulated layer are formed, and present stage whole technological process need complete in different equipment, there is the high loaded down with trivial details problem of alignment precision requirement, consuming time longer aborning.So all technological processes completing thin-film semiconductor device within one device can have centralized Control, simplify the operation, time saving advantage.By common-base in different kinds of process flow, thus without moving device substrate, realize made with high precision and improve yields.
Summary of the invention
The present invention seeks to, aligning for the technological process of thin-film semiconductor device is loaded down with trivial details, the problem such as consuming time, a kind of equipment semiconductor electronic and opto-electronic device technological process prepared by all printings and integrate is proposed, realize centralized Control, simplify the operation and realize rapid alignment by common-base.
Technical scheme of the present invention is, printed semiconductor Integrated manufacture equipment, comprise plant bottom case (11), plant bottom case (11) is provided with lateral displacement platform (13), mobile foundation and heating platform (14), to cut by size with flexible substrates volume equipment (18) for unreeling of printed semiconductor flexible base material and fix and can move, heating, and the platform of printed semiconductor Integrated manufacture on flexible base material base, plant bottom case is separately provided with print system and UV lamp (12), slot die coating system (15), flexible scraper coating system (17), gravu re system (16) is separately provided with computerized control system, for controlling mobile foundation and heating platform (14) movement in lateral displacement platform (13), location, work, print system and UV lamp (12), slot die coating system (15), gravu re system (16), the work of flexible scraper coating system (17).Print system is ink-jet print system.
Beneficial effect of the present invention: the printed electronic all-in-one provided, has the following advantages,
First, the equipment of semiconductor electronic and opto-electronic device prepared by described printing: comprise print system and UV lamp (12), lateral displacement platform (13), mobile foundation and heating platform (14), slot die coating system (15), gravu re system (16), flexible scraper coating system (17), be integrated in an equipment, can space be saved, reduce costs simultaneously.
The second, because all facilities all integrate control, also handled easily.
3rd, due to when selecting different facility staff, only need be controlled by the position of computer to mobile foundation, not needing moving device substrate, like this when different process makes, convenient aligning, also can improve making precision.
4th, described printed electronic integrated equipment can increase according to thin-film device needs or it replaces coating system needed for other, as screen printing system, and gravu re system etc.
By design mobile foundation, said system is integrated work, and without the need to moving device substrate, realizes the rapid alignment of production process.Within one device by said system control integration, reduce cost simultaneously, achieve the simplification of operation.
Accompanying drawing explanation
Fig. 1 is present device structural representation;
Fig. 2 is flexible substrates volume equipment schematic diagram.
Detailed description of the invention:
More fully the present invention program is described below in conjunction with Fig. 1.
Structure of the present invention as shown in Figure 1, by designing lateral displacement platform (13) and mobile foundation and heating platform (14) cleverly, by print system (12), slit extrusion coated system (15), gravu re system (16), flexible scraper coating system (17), flexible substrates volume equipment (18) integrates work, and do not need moving device substrate (flexible substrates volume equipment is fixed on mobile foundation after flexible substrates being cut), thus realize the quick alignment in the middle of different process making.By by print system (12), slit extrusion coated system (15), gravu re system (16), flexible scraper coating system (17), the control integration of flexible substrates volume equipment (18) together, can simplify the operation like this, save time.
Plant bottom case (11) is fixed with print system and UV lamp (12), lateral displacement platform (13), EDI company of U.S. slot die coating system (Slot Die) (15), the gravu re system (16) of Shan Ying Automation Co., Ltd and flexible scraper coating system (17), flexible substrates volume equipment (18).Flexible substrates volume equipment (18) is fixed on mobile foundation after flexible substrates being cut: what described flexible substrates volume equipment (18) was rolling flexible base material unreels or add the equipment by size cutting again, frame cutting equipment as shown in Figure 2, can according to the flexible substrates of mobile foundation size (or on request) cutting flexible substrates volume, and vacuum suction the flexible substrates cut down be utilized to be fixed on above mobile foundation and heating platform (14).As shown in Figure 2.Can be scale framework and automatic or manual cutter or frame cutting by the equipment of size cutting.
Be mobile foundation and heating platform (14) on lateral displacement platform (13), mobile foundation and heating platform have vacuum suction and heating function (being up to 200 DEG C or higher).Mobile foundation and heating platform are Metal Substrate or pottery, glass plate, have (distribution of uniform adsorption pore) vacuum suction surface and heating function (metal substrate be provided with PTC pottery Metal Substrate flat board, temperature be up to 200 DEG C or more).
Mobile foundation and heating platform (14) can accurately move and locate on lateral displacement platform (13), and lateral displacement platform (13) is provided with precise guide rail and stepping or servo motor device.
Print system (12), squash type coating slot die coating system (Slot Die) (15), gravu re system (16) and flexible scraper coating system (17) can cooperatings together with mobile foundation and heating platform (14) respectively.All control all concentrates on a computer, is connected with the system that will work by mobile foundation.Increase or system needed for other of replacing can also be needed as screen printing system according to device.Described printed electronic integrated equipment can be prepared: OTFT, oxide thin film transistor, photovoltaic film device etc.
Described printed electronic integrated equipment, by print system and UV lamp (12), slot die coating system (SlotDie) (15), gravu re system (16) and flexible scraper coating system (17), flexible substrates are rolled up the control integration of equipment (18) in a computer, simplifies the operation.
Described printed semiconductor Integrated manufacture equipment according to device technology needs, can increase or replace other coating apparatus as serigraphy, intaglio printing etc.
The manageable thin-film device of the present invention comprises: thin film transistor (TFT) with, photovoltaic device, organic light emitting diode device etc.
Contact organic field effect tube to push up at the bottom of grid below, introduce described equipment workflow.First utilize flexible substrates roll up equipment (18) will flexible substrates cut after be fixed on mobile foundation, the first step prints source-drain electrode, then directly on base, completes annealing steps.An initial point can be printed of substrate jiao when printing, aim at when printing grid after convenient.Second step, squash type coating slot die coating (Slot Die) (15) is selected according to device material characteristic, gravu re system (16) or flexible scraper are coated with the one in (17), make semiconductor layer and insulating barrier successively, UV lamp can be used after often making one deck as required to carry out UV be cross-linked, and annealing steps.3rd step, prints gate electrode, and anneals.4th step, encapsulation, can select coating method as required.
Claims (9)
1. printed semiconductor Integrated manufacture equipment, it is characterized in that comprising plant bottom case (11), plant bottom case (11) is provided with lateral displacement platform (13), mobile foundation and heating platform (14) and flexible substrates volume equipment (18) to be cut by size for unreeling of printed semiconductor flexible base material and fix and can move, heating, and the platform of printed semiconductor Integrated manufacture on flexible base material base, plant bottom case is separately provided with print system and UV lamp (12), be provided with computerized control system, for controlling mobile foundation and heating platform (14) movement in lateral displacement platform (13), location, work, the work of print system and UV lamp (12).
2. printed semiconductor Integrated manufacture equipment according to claim 1, it is characterized in that plant bottom case (11) is provided with slot die coating system (15) and flexible scraper coating system (17), computerized control system controls slot die coating system (15) and flexible scraper coating system (17) work.
3. printed semiconductor Integrated manufacture equipment according to claim 1, is characterized in that print system is ink-jet print system.
4. printed semiconductor Integrated manufacture equipment according to claim 1, it is characterized in that it being mobile foundation and heating platform (14) on lateral displacement platform (13), mobile foundation and heating platform have vacuum suction and heating function, mobile foundation and heating platform are Metal Substrate or pottery, glass plate, have uniform adsorption pore distributes vacuum air absorption surface.
5. printed semiconductor Integrated manufacture equipment according to claim 1, is characterized in that being provided with PTC pottery or resistance heater is installed in Metal Substrate dull and stereotyped.
6. according to the printed semiconductor Integrated manufacture equipment one of claim 1-5 Suo Shu, it is characterized in that mobile foundation and heating platform (14) can accurately move and locate on lateral displacement platform (13), lateral displacement platform (13) is provided with precise guide rail and stepping or servo motor device.
7. according to the printed semiconductor Integrated manufacture equipment one of claim 1-5 Suo Shu, it is characterized in that described printed electronic integrated equipment by by the control integration of print system and UV lamp (12), slot die coating system (Slot Die) (15), gravu re system (16) and flexible scraper coating system (17), flexible substrates volume equipment (18) at a computer.
8., according to the printed semiconductor Integrated manufacture equipment one of claim 1-5 Suo Shu, it is characterized in that increasing or replace coating apparatus comprises serigraphy, intaglio printing.
9. according to the printed semiconductor Integrated manufacture equipment one of claim 1-7 Suo Shu for the preparation of thin-film device comprise: thin film transistor (TFT) with, photovoltaic device, organic light emitting diode device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510035707.0A CN104608507A (en) | 2015-01-23 | 2015-01-23 | Print semiconductor integration manufacture device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510035707.0A CN104608507A (en) | 2015-01-23 | 2015-01-23 | Print semiconductor integration manufacture device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104608507A true CN104608507A (en) | 2015-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510035707.0A Pending CN104608507A (en) | 2015-01-23 | 2015-01-23 | Print semiconductor integration manufacture device |
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| CN (1) | CN104608507A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109610003A (en) * | 2019-01-02 | 2019-04-12 | 天津大学 | A kind of novel controllable organic crystal growth apparatus and its method for preparing organic single-crystal |
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| US20060088353A1 (en) * | 2004-10-25 | 2006-04-27 | Lintec Corporation | Code label printer, method thereof and readouted printed-code verifying system |
| CN102555462A (en) * | 2010-11-30 | 2012-07-11 | 精工爱普生株式会社 | Printing method and printer |
| CN103050578A (en) * | 2013-01-04 | 2013-04-17 | 普尼太阳能(杭州)有限公司 | Cutting equipment and cutting method of flexible thin film solar cell |
| CN203004537U (en) * | 2012-12-18 | 2013-06-19 | 武汉大学 | Circuit board printing system |
| CN103707641A (en) * | 2012-10-01 | 2014-04-09 | 精工爱普生株式会社 | Liquid ejecting apparatus |
| CN103895345A (en) * | 2014-03-27 | 2014-07-02 | 华中科技大学 | System and method for multifunctional electric fluid ink-jet printing |
| CN103921541A (en) * | 2014-05-06 | 2014-07-16 | 中南大学 | Reel-to-reel multifunctional printing equipment used for printing electronics and application thereof |
| CN104190778A (en) * | 2014-07-31 | 2014-12-10 | 上海永太汽车零部件厂 | Coiled material cutting device |
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2015
- 2015-01-23 CN CN201510035707.0A patent/CN104608507A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060088353A1 (en) * | 2004-10-25 | 2006-04-27 | Lintec Corporation | Code label printer, method thereof and readouted printed-code verifying system |
| CN102555462A (en) * | 2010-11-30 | 2012-07-11 | 精工爱普生株式会社 | Printing method and printer |
| CN103707641A (en) * | 2012-10-01 | 2014-04-09 | 精工爱普生株式会社 | Liquid ejecting apparatus |
| CN203004537U (en) * | 2012-12-18 | 2013-06-19 | 武汉大学 | Circuit board printing system |
| CN103050578A (en) * | 2013-01-04 | 2013-04-17 | 普尼太阳能(杭州)有限公司 | Cutting equipment and cutting method of flexible thin film solar cell |
| CN103895345A (en) * | 2014-03-27 | 2014-07-02 | 华中科技大学 | System and method for multifunctional electric fluid ink-jet printing |
| CN103921541A (en) * | 2014-05-06 | 2014-07-16 | 中南大学 | Reel-to-reel multifunctional printing equipment used for printing electronics and application thereof |
| CN104190778A (en) * | 2014-07-31 | 2014-12-10 | 上海永太汽车零部件厂 | Coiled material cutting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109610003A (en) * | 2019-01-02 | 2019-04-12 | 天津大学 | A kind of novel controllable organic crystal growth apparatus and its method for preparing organic single-crystal |
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Application publication date: 20150513 |