CN104600150A - Packaging method of photoelectric sensing device and application - Google Patents
Packaging method of photoelectric sensing device and application Download PDFInfo
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- CN104600150A CN104600150A CN201310530920.XA CN201310530920A CN104600150A CN 104600150 A CN104600150 A CN 104600150A CN 201310530920 A CN201310530920 A CN 201310530920A CN 104600150 A CN104600150 A CN 104600150A
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 230000005693 optoelectronics Effects 0.000 claims description 66
- 230000006698 induction Effects 0.000 claims description 64
- 239000004973 liquid crystal related substance Substances 0.000 claims description 40
- 230000000873 masking effect Effects 0.000 claims description 20
- 238000012856 packing Methods 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 10
- 241000218202 Coptis Species 0.000 claims description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 6
- 238000009501 film coating Methods 0.000 claims description 4
- 239000012788 optical film Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 abstract description 7
- 238000012858 packaging process Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract 1
- 208000034699 Vitreous floaters Diseases 0.000 description 35
- 230000000694 effects Effects 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 238000012536 packaging technology Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000009776 industrial production Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H01L31/1876—
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The invention provides a packaging method of a photoelectric sensing device and application, and aims at integrating the photoelectric sensing device to a display panel. The photoelectric sensing device is a device integrating a plurality of functions; a carrier board equipped with the photoelectric sensing device is connected with the display panel by a circuit connecting manner; the photoelectric sensing device can receive an environmental light signal and directly output a feedback control signal by photoelectric sensing; the photoelectric sensing device can receive and respond to a distance signal as well as timely feeding back a digital signal to as to achieve the functions of saving electricity and avoiding mis-operation. With the adoption of such packaging structure, the size of elements in electronic products can be effectively reduced, thus the whole display device can be reduced, and meanwhile, the general packaging process of a mobile phone can be effectively simplified by the novel packaging process.
Description
Technical field
The present invention relates to photoelectric sensor and encapsulation technology field, particularly relate to a kind of method for packing and application of optoelectronic induction device.
Background technology
The such as electronic equipment such as mobile phone, PC, except being provided as the display floater of display and operating platform, usually also comprises the optoelectronic induction device realizing various function.
Such as, PC possibility environment for use optical sensor is to measure the ambient light intensity in computer work environment.When a large amount of surround lightings being detected, control centre can be fed back to and control screen intensity increase to help to offset the impact of surround lighting.When some mobile phones comprise can detect phone near the proximity transducer of user's face.When screen is close to user's face, the display floater of mobile phone can be stopped touch controllable function and avoid misoperation.
As the mobile phone display floater of accompanying drawing 1, it comprises display floater 4 ' and is positioned at the optoelectronic induction device 3 ' exposed above display floater; Described display floater comprises central movable region 1 ' and is positioned at the inertia region 2 ' around described central movable region.
Continue with reference to the display floater shown in accompanying drawing 2, it comprises display floater 4 ' and is positioned at the display cover layer 7 ' on display floater; Masking layer 8 ' is provided with between described display floater 4 ' and display cover layer 7 '; Described masking layer 8 ' is provided with breach and makes the optoelectronic induction device 3 ' be positioned at below masking layer penetrate into display cover layer 7 '; Described display floater comprises liquid crystal display district 5 ' and is positioned at the support 6 around liquid crystal display district; Described optoelectronic induction device 3 ' is independent to be arranged.
Liquid crystal control panels, also referred to as display panels.Display floater can be covered by the display floater cover layer of such as glassy layer.The central movable region of display floater can be surrounded by inertia viewing area.The tectal downside of display floater in inertia region can be covered by opaque masking material.Below opaque masking material, the parts such as the driving of liquid crystal, frame support can be placed.
In prior art, optoelectronic induction device is positioned at outside display floater, is discrete system with display floater, is provided respectively by photoelectric device provider and display floater provider.Packaged optoelectronic induction device module, can comprise ambient light sensor, range sensor, gesture identification sensor multiple optoelectronic induction device unit.Packaged optoelectronic induction device module and display floater are connected with control centre respectively by independently circuit paths.General optoelectronic induction device module can be divided into light detecting chip, dedicated IC chip (ASIC), optical transmitting set chip.
For preventing panel backlit light source to the interference of optoelectronic induction device in prior art, optoelectronic induction device and display floater are completely discrete.Optoelectronic induction device generally all can first encapsulate, and then whole functional module is independently installed on outside display floater.Therefore, on-screen display (osd) area that is visual and operation is limited.And packaged optoelectronic induction device module too increases the longitudinal size of whole system, affects device frivolous.
Therefore, be necessary to provide the packaging technology of a kind of integrated electro sensing device and display floater to solve the problems of the technologies described above.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of method for packing and application of optoelectronic induction device, adopt the display panels of this construction packages, can not only integrated multiple optoelectronic induction function, reach the brightness and electricity-saving function that control liquid crystal panel, and effectively can promote the efficiency of liquid crystal panel, effectively can expand its display area in identical situation.Overall package can reduce longitudinal size, makes device more frivolous.
For achieving the above object and other relevant objects, the invention provides a kind of method for packing of optoelectronic induction device, described method for packing comprises the following steps:
1) support plate is provided, the some contact points for being electrically connected of described support plate both sides distribution, are provided with the first chip, optoelectronic induction device and the dedicated IC chip between described first chip and described optoelectronic induction device between the contact point of described both sides, in the middle part of described support plate; Described first chip, optoelectronic induction device and dedicated IC chip adopt gold thread to be electrically connected with described solder joint as required;
2) provide a display panels, described display panels comprises is located at the glassy layer of bottom for being electrically connected with described support plate; The some ITO conductive layers corresponding with described contact point are coated with in described glassy layer both sides; Meanwhile, on the glassy layer of described display panels, the position corresponding with photoelectric sensor part on described support plate apply selective optical film coating;
3) be electrically connected described contact point and the ITO conductive layer corresponding with this contact point, realize the electrical connection loop of described support plate and described display panels.
Preferably, to be electrically connected the concrete steps of described contact point and the ITO conductive layer corresponding with this contact point as follows for described step 3):
A) on some contact points of described support plate both sides distribution, tin ball is formed;
B) by the mode of Reflow Soldering, described tin ball is electrically connected with the ITO on the glassy layer of described liquid crystal display control panel.
Preferably, to be electrically connected the concrete steps of described contact point and the ITO conductive layer corresponding with this contact point as follows for described step 3):
A) one conductive film is provided;
B) the described conductive film be positioned between described contact point and the ITO conductive layer corresponding with this contact point is utilized to realize being electrically connected.
Preferably, to be electrically connected the concrete steps of described contact point and the ITO conductive layer corresponding with this contact point as follows for described step 3):
The ITO conductive layer of contact point on described support plate with described liquid crystal display control panel is electrically connected by the mode of being welded by pin.
The present invention also provides a kind of encapsulating structure of the optoelectronic induction device adopting said method to be formed, and this encapsulating structure comprises the support plate of the some contact points for being electrically connected of both sides distribution; The first chip, optoelectronic induction device and the dedicated IC chip between described first chip and described optoelectronic induction device is provided with in the middle part of described support plate; Described first chip, optoelectronic induction device and dedicated IC chip adopt gold thread to be electrically connected with described solder joint as required; Bottom is provided with the display panels of glass plate; Described glassy layer both sides are coated with the some ITO conductive layers corresponding with described contact point; Meanwhile, on the glassy layer of described display panels, the position corresponding with photoelectric sensor part on described support plate apply selective optical film coating; Described contact point and the ITO conductive layer corresponding with this contact point are electrically connected.
The present invention also provides a kind of integrated panel applying above-mentioned optoelectronic induction device encapsulating structure, and described integrated panel comprises display floater and is positioned at the display cover layer on display floater; Masking layer is provided with between described display floater and display cover layer; Described masking layer is provided with breach; Described display floater comprises liquid crystal display district and is positioned at support around liquid crystal display district and some drive circuit modules; Described support is interior, the beneath window of masking layer is provided with the optoelectronic induction device together encapsulated.
The present invention is not only integrated by the multi-functional of optoelectronic induction, incorporates this photoelectric sensor and mobile phone display control panel simultaneously, becomes the part that mobile phone faceplate integration is produced.Not only effectively reduce the volume of photoelectric sensor, simplify the flow process that mobile phone is produced simultaneously.Optoelectronic induction device, oneself power consumption is very little, is exported, effectively can reduce the energy consumption of mobile phone screen, reach effect of economize on electricity by the timely feedback of digital signal.Be integrated with the liquid crystal display control panel of optoelectronic induction device, effectively can improve the viewing area of panel.Packaging technology of the present invention is simple, Be very effective, and is compatible with general semiconductor technology, is applicable to industrial production.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of existing TFT display floater.
Fig. 2 is shown as the sectional view of existing TFT display floater.
Fig. 3 is shown as the sectional view of TFT display floater of the present invention.
Fig. 4 is shown as the structural representation of support plate of the present invention.
Fig. 5 is the vertical view of Fig. 4.
Fig. 6 is shown as the upper device connection diagram of support plate of the present invention.
Fig. 7 is shown as the vertical view of display panels of the present invention.
The contact point that Fig. 8 is shown as support plate is provided with the structural representation of tin ball.
Fig. 9 is shown as the structural representation that support plate adopts tin ball to be connected with display panels.
Figure 10 is shown as the structural representation that support plate of the present invention and display panels use surface mounting technology to present as Electrode connection.
Element numbers explanation
1 ', 1 central movable region
2 ', 2 inertia regions
3 ', 3 optoelectronic induction devices
4 ', 4 display floaters
5 ', 5 liquid crystal display districts
6 ', 6 supports
7 ', 7 display cover layers
8 ', 8 masking layers
31 support plate assemblies
311 support plates
312 first chips
313 dedicated IC chips
314 optoelectronic induction chips
315 contact points
316 gold threads
32 display panels
321 glass plates
322 ITO conductive layers
323 coating
33 tin balls
34 conductive films/pin
Embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art the content disclosed by this specification can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.
Refer to shown in accompanying drawing.It should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present invention in a schematic way, then only the assembly relevant with the present invention is shown in graphic but not component count, shape and size when implementing according to reality is drawn, it is actual when implementing, and the kenel of each assembly, quantity and ratio can be a kind of change arbitrarily, and its assembly layout kenel also may be more complicated.
Refer to shown in Fig. 3, the invention provides new structure and the packaging process of a kind of integrated optoelectronic device and display panels, described new structure at least comprises following components:
A kind of display panels, comprises the liquid crystal display area 5 that is in display floater 4 center and the auxiliary area 6 around viewing area, center.Namely viewing area provides the screen of display and manipulation, and around auxiliary area provides space for installing the accessory such as display driver circuit, frame support.Also comprise display cover layer 7, provide the protection to display panels and supporting role, material can be transparent glass, sapphire or plastics.
Also comprise the opaque masking layer 8 of one deck, masking layer 8 is positioned at below display cover layer 7, above display surface flaggy 4, provides the masking action without the need to transmission region, and opaque ink or the opaque film of one deck can be used as masking layer.Described masking layer is provided with window.
Also comprise the optoelectronic induction device 3 be integrated in liquid crystal display area 5 periphery auxiliary area.By integrating the form of encapsulation, optoelectronic induction device and display driver circuit, frame support being encapsulated and is packaged in display floater periphery auxiliary area simultaneously.Optoelectronic induction device can comprise ambient light sensor, Proximity Sensor, gesture identification sensor.
Please refer to shown in accompanying drawing, in the present invention's encapsulation, main consider three of optoelectronic induction device to be partly integratedly encapsulated, comprise optical transmitting set 312, photo-detector 314 and dedicated IC chip 313.These devices can be discrete devices, namely provide different components by different chip, also can be Single-Chip Integration.Described packaging technology at least comprises the following steps:
1. providing can the support plate 311 of carries chips element, support plate has the position being specifically designed to chip placement.
2.ASIC(application-specific integrated circuit (ASIC) 313) be positioned at the centre of support plate, be convenient to the reception of signal and the direct output of control signal.
3. on support plate, there is the contact point 315 being specifically designed to circuit and connecting;
4. stick optical transmitting set chip 312 and optical sensing chip 314 at the correspondence position of support plate.By the mode of gold thread 316 by bonding or ball bonding, optical transmitting set chip 312 is connected with PAD point with optical sensing chip 314 and application-specific integrated circuit (ASIC) 313.
5. the correspondence position that bottom glassy layer 321 is being connected with the support plate 311 of carries chips element of liquid crystal panel has ITO conductive layer (namely corresponding with described contact point 315 position arranges transparency electrode), make it that there is conducting function, for the output of connecting circuit and digital signal.
6. the mode that the contact point 315 on support plate 311 is connected by circuit is connected with the glassy layer 321 of display floater, is convenient to the background work of electro-optical system and timely output feedback signal.
7. overall package structure is positioned at the beneath window of opaque masking layer 8, at least makes the optical transmitting set position corresponding with photo-detector come out from reserved masking layer window, can launch from reflector to make light and be entered in detector by window.
In the new structure and packaging technology of integrated optoelectronic device of the present invention and display floater, in order to prevent optoelectronic induction device due to panel self with backlight to its interference effect, need to place it in the region not having backlight.In the present embodiment, the integrated circuit of chip and the special purpose with optoelectronic induction function can be adopted on a single die integrated.
In the present embodiment, photoelectric device can comprise multiple efficacies, is not only utilizing emitted light signal and receiving feedback signals, can make corresponding adjustment simultaneously, thus reach effect of economize on electricity according to feedback signal.Optoelectronic induction device, after environment of accepting visible ray, by the timely feedback reception of signal, and is adjusted in time by the brightness of integrated circuit to display screen of special purpose, reaches effect of economize on electricity.
In the present embodiment, the liquid-crystalline glasses panel be connected with photoelectric device did preliminary treatment, had ITO at correspondence position, was convenient to be connected and Signal transmissions with the circuit of optoelectronic induction device.The region that photoelectric sensor part is corresponding on display floater glass, needs to apply anti-reflection layer in advance, and (such as epoxy resin) prevents optoelectronic induction device from producing interference effect to it due to the backlight of panel self.
It should be noted that, structure of the present invention is connected on the bottom glass of liquid crystal panel, because liquid crystal panel is made up of double glazing, include backlight and liquid crystal layer, in order to prevent backlight, interference effect is produced to the optoelectronic induction device arrived involved in the present invention, therefore in the alternatively non-transparent district in liquid crystal display district, a zonule can be set, as the special area of photoelectric sensor effect.
Concrete, please refer to accompanying drawing 4 to shown, first the support plate 311(such as pcb board that can carry required chip 312,314 and application-specific integrated circuit (ASIC) 313 is provided) as substrate, respectively required chip 312,314 and application-specific integrated circuit (ASIC) 313 are placed on corresponding interval, film adhesive tape or gluingly connecing of cohering can be used.
Refer to shown in Fig. 5, application-specific integrated circuit (ASIC) 313 is ASIC(Application Specific IntegratedCircuit), it is placed in the middle of two chips, can use film adhesive tape or gluingly connecing of cohering.In the present embodiment, there are 8 PAD points (contact point 315) in the both sides of support plate 311, for the connection of electrode and circuit.
Refer to shown in Fig. 6, according to demand, adopt gold thread 316 to be connected with described PAD point 315 respectively by the electrode on required chip 312,314 and application-specific integrated circuit (ASIC) 313.
Refer to shown in Fig. 7, the glassy layer 321 of the liquid crystal panel bottom is in the region be connected with support plate, needs are anticipated, and the position (position corresponding to contact point) be connected on this glassy layer, with support plate needs to plate ITO conductive layer, as the connection of electrode and circuit.At zone line, corresponding is required chip 312,314 and application-specific integrated circuit (ASIC) 313 region, need coating can select the coating (such as epoxy resin) of reception environment light, to prevent the mutual interference of signal transmitting and receiving between chip, the effect of impact detection.
Refer to shown in Fig. 8-Fig. 9, by the mode of Reflow Soldering, the tin ball 33 on support plate 311 is connected with the ITO conductive layer on liquid crystal panel bottom glassy layer, forms effective loop.When under the effect of liquid crystal display control panel at electric current, optoelectronic induction device is also simultaneously in background work.The power of the surround lighting that timely basis receives adjusts the screen intensity of liquid crystal panel, makes its softization, reaches effective economize on electricity.In addition, range finder can control the screen of liquid crystal panel according to the infrared signal power received.When converse time, face closely liquid crystal panel time, screen can be closed in time, prevent misoperation.
Refer to shown in Figure 10, by the mode of conductive film 34, the electrode on support plate is connected with the ITO conductive layer of liquid crystal display control panel, forms effective loop.When under the effect of liquid crystal display control panel at electric current, optoelectronic induction device also can carry out work according to the signal received, and effectively economizes on electricity.The ITO of electrode on support plate with liquid crystal display control panel is connected by the mode also can welded by pin pin, forms effective loop.
In a word, about the connection of circuit, several diverse ways can be had;
1.PAD point is connected with tin ball, and tin ball is the connection function as electrode and circuit equally.
2. use the mode of conductive film to be connected with liquid crystal panel top electrode by optoelectronic induction device.
3. use the paster mode of surface mount technology to be connected with liquid crystal panel by photoelectric device.
In sum, optoelectronic induction device method for packing of the present invention can effectively by the whole same device of dual light effects of environment light sensor and distance-sensor.Structurally substantially reduce volume and the size of light sensitive device self.Simultaneously because the liquid crystal panel of routine is all made up of backlight and liquid crystal layer, the light therefore self sent can produce interference to light sensitive device, both cannot be integrated.Photoelectric sensor can be integrated on liquid crystal control panels by the present invention, becomes a part for liquid crystal panel large-scale production.
The liquid crystal panel being integrated with optoelectronic induction device adopting the present invention to prepare has very high controllability and reliability, also can control effective transmitting and receiving of light, and envoy's electric control is corresponding with distance controlling can very effectively with in time.Preparation method's technique of the present invention is simple, Be very effective, and is compatible with general semiconductor technology, is applicable to industrial production.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
As mentioned above, packaging technology of the present invention is not only integrated by the multi-functional of optoelectronic induction, incorporates this photoelectric sensor and mobile phone display control panel simultaneously, becomes the part that mobile phone faceplate integration is produced.Not only effectively reduce the volume of photoelectric sensor, simplify the flow process that mobile phone is produced simultaneously.Optoelectronic induction device, oneself power consumption is very little, is exported, effectively can reduce the energy consumption of mobile phone screen, reach effect of economize on electricity by the timely feedback of digital signal.Be integrated with the liquid crystal display control panel of optoelectronic induction device, effectively can improve the viewing area of panel.Packaging technology of the present invention is simple, Be very effective, and is compatible with general semiconductor technology, is applicable to industrial production.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (7)
1. a method for packing for optoelectronic induction device, is characterized in that: described method for packing comprises the following steps:
1) support plate is provided, the some contact points for being electrically connected of described support plate both sides distribution, are provided with the first chip, optoelectronic induction device and the dedicated IC chip between described first chip and described optoelectronic induction device between the contact point of described both sides, in the middle part of described support plate; Described first chip, optoelectronic induction device and dedicated IC chip adopt gold thread to be electrically connected with described solder joint as required;
2) provide a display panels, described display panels comprises is located at the glassy layer of bottom for being electrically connected with described support plate; The some ITO conductive layers corresponding with described contact point are coated with in described glassy layer both sides; Meanwhile, on the glassy layer of described display panels, the position corresponding with photoelectric sensor part on described support plate apply selective optical film coating;
3) be electrically connected described contact point and the ITO conductive layer corresponding with this contact point, realize the electrical connection loop of described support plate and described display panels.
2. the method for packing of optoelectronic induction device according to claim 1, is characterized in that: the concrete steps that described step 3) is electrically connected described contact point and the ITO conductive layer corresponding with this contact point are as follows:
A) on some contact points of described support plate both sides distribution, tin ball is formed;
B) by the mode of Reflow Soldering, described tin ball is electrically connected with the ITO on the glassy layer of described liquid crystal display control panel.
3. the method for packing of optoelectronic induction device according to claim 1, is characterized in that: the concrete steps that described step 3) is electrically connected described contact point and the ITO conductive layer corresponding with this contact point are as follows:
A) one conductive film is provided;
B) the described conductive film be positioned between described contact point and the ITO conductive layer corresponding with this contact point is utilized to realize being electrically connected.
4. the method for packing of optoelectronic induction device according to claim 1, is characterized in that: the concrete steps that described step 3) is electrically connected described contact point and the ITO conductive layer corresponding with this contact point are as follows:
The ITO conductive layer of contact point on described support plate with described liquid crystal display control panel is electrically connected by the mode of being welded by pin.
5. the optoelectronic induction device encapsulating structure adopting the method described in Claims 1-4 any one to be formed, is characterized in that: this encapsulating structure comprises
The support plate of the some contact points for being electrically connected of both sides distribution; The first chip, optoelectronic induction device and the dedicated IC chip between described first chip and described optoelectronic induction device is provided with in the middle part of described support plate; Described first chip, optoelectronic induction device and dedicated IC chip adopt gold thread to be electrically connected with described solder joint as required;
Bottom is provided with the display panels of glass plate; Described glassy layer both sides are coated with the some ITO conductive layers corresponding with described contact point; Meanwhile, on the glassy layer of described display panels, the position corresponding with photoelectric sensor part on described support plate apply selective optical film coating;
Described contact point and the ITO conductive layer corresponding with this contact point are electrically connected.
6. application rights requires an integrated panel for the optoelectronic induction device encapsulating structure described in 5, it is characterized in that: described integrated panel comprises
Display floater and the display cover layer be positioned on display floater;
Masking layer is provided with between described display floater and display cover layer; Described masking layer is provided with window;
The support that described display floater comprises liquid crystal display district and is positioned at around liquid crystal display district;
Described support is interior, the beneath window of masking layer is provided with packaged optoelectronic induction device.
7. integrated panel according to claim 6, is characterized in that: the beneath window of described masking layer is provided with packaged optoelectronic induction device and adopts method according to claim 1 to be formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310530920.XA CN104600150B (en) | 2013-10-30 | 2013-10-30 | The method for packing of a kind of optoelectronic induction device and application |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310530920.XA CN104600150B (en) | 2013-10-30 | 2013-10-30 | The method for packing of a kind of optoelectronic induction device and application |
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| CN104600150A true CN104600150A (en) | 2015-05-06 |
| CN104600150B CN104600150B (en) | 2016-12-07 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017092499A1 (en) * | 2015-12-02 | 2017-06-08 | 小米科技有限责任公司 | Liquid crystal display assembly and electronic device |
| CN107704024A (en) * | 2017-09-29 | 2018-02-16 | 维沃移动通信有限公司 | Display screen and terminal device |
| WO2020001157A1 (en) * | 2018-06-29 | 2020-01-02 | 京东方科技集团股份有限公司 | Display panel, display module, fabrication method therefor, and display device |
Citations (5)
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| WO2020001157A1 (en) * | 2018-06-29 | 2020-01-02 | 京东方科技集团股份有限公司 | Display panel, display module, fabrication method therefor, and display device |
| US11301068B2 (en) | 2018-06-29 | 2022-04-12 | Beijing Boe Optoelectronics Technology Co., Ltd. | Display panel, display assembly and manufacturing method thereof, and display device |
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| CN104600150B (en) | 2016-12-07 |
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