The content of the invention
The present invention provides a kind of experimental rig for testing high voltage cooler performance, solves wet-wound group main pump supporting
The heat exchange amount test problem of HP cooler, can be accurately determined the cooling water expense of HP cooler, facilitate scene
Design of Cooling System, provides specific test data for the optimization of HP cooler, is provided for the design of HP cooler
Study foundation.
In order to achieve the above object, the present invention provides a kind of experimental rig for testing high voltage cooler performance, comprising
The primary side return circuit testing device of pipeline connection HP cooler and the secondary side circuit test dress of pipeline connection HP cooler
Put;
Described primary side return circuit testing device is included:Side-entrance of HP cooler and once is connected to by pipeline
Hot-water cylinder, the second pump and first flowmeter between side outlet, and side-entrance of HP cooler is connected to by pipeline
The first pressure transmitter and the first temperature sensor at end, the HP cooler primary side port of export is connected to also by pipeline
Second pressure transmitter and second temperature sensor;
Described secondary side circuit test device is included:The secondary side-entrance of HP cooler is connected to and secondary by pipeline
Plate type heat exchanger, the 3rd pump and second flowmeter between side outlet, and HP cooler secondary side is connected to by pipeline
The 3rd pressure transmitter and three-temperature sensor of entrance point, the secondary side outlet of HP cooler is connected to also by pipeline
4th pressure transmitter and the 4th temperature sensor at end.
The described experimental rig for testing high voltage cooler performance also connects the heating circuit of hot-water cylinder comprising pipeline
Device, the heating circuit device includes the heater and the first pump that pipeline is connected.
The described experimental rig for testing high voltage cooler performance also includes the cooling of pipeline connecting plate type heat exchanger
Loop apparatus, the cooling circuit device includes the cooling tower and the 4th pump that pipeline is connected.
Safety valve is set on described hot-water cylinder.
5th temperature sensor is set on described hot-water cylinder.
The secondary side-entrance of described HP cooler also connects cooling water by cooling water inlet valve pipeline.
Sensing rod for temperature is set on described heater.
Described primary side return circuit testing device also includes some flow control valves being arranged on pipeline;Described is secondary
Side loop test device also includes some flow control valves being arranged on pipeline;Described heating circuit device is also comprising some
It is arranged on the flow control valve on pipeline;Described cooling circuit device also includes some Flow-rate adjustments being arranged on pipeline
Valve.
The present invention solves the heat exchange amount test problem of the supporting HP cooler of wet-wound group main pump, can be accurately determined
The cooling water expense of HP cooler, facilitates live design of Cooling System, is provided specifically for the optimization of HP cooler
Test data, for HP cooler design provide research foundation.
Embodiment
Presently preferred embodiments of the present invention is illustrated below according to Fig. 1.
As shown in figure 1, the present invention provides a kind of experimental rig for testing high voltage cooler performance, comprising:Pipeline connects
The primary side return circuit testing device and pipeline for connecing HP cooler 5 connect the secondary side circuit test device of HP cooler 5.
Described primary side return circuit testing device is included:Side-entrance of HP cooler and once is connected to by pipeline
Hot-water cylinder 1, the second pump 02 and first flowmeter F01 between side outlet, and HP cooler is connected to once by pipeline
The first pressure transmitter P01 at side-entrance end and the first temperature sensor T01, HP cooler one is connected to also by pipeline
The second pressure transmitter P02 and second temperature sensor T02 at secondary side outlet end.
Described primary side return circuit testing device also includes some flow control valves 06 being arranged on pipeline.
The temperature sensor T05 of safety valve 08 and the 5th is set on described hot-water cylinder 1.
Described secondary side circuit test device is included:The secondary side-entrance of HP cooler is connected to and secondary by pipeline
Plate type heat exchanger 3, the 3rd pump 03 and second flowmeter F02 between side outlet, and HP cooler is connected to by pipeline
3rd pressure transmitter P03 and three-temperature sensor T03 of secondary side entrance point, high pressure cooling is connected to also by pipeline
The 4th pressure transmitter P04 and the 4th temperature sensor T04 of the device secondary side port of export.
Described secondary side circuit test device also includes some flow control valves 06 being arranged on pipeline.
The secondary side-entrance of described HP cooler also connects cooling water by the pipeline of cooling water inlet valve 07.
The described experimental rig for testing high voltage cooler performance also connects the heating circuit of hot-water cylinder 1 comprising pipeline
Device, the heating circuit device includes the pump 01 of heater 2 and first that pipeline is connected.
Described heating circuit device also includes some flow control valves 06 being arranged on pipeline.
Sensing rod for temperature 05 is set on described heater 2.
The described experimental rig for testing high voltage cooler performance also includes the cooling of pipeline connecting plate type heat exchanger 3
Loop apparatus, the cooling circuit device includes the pump 04 of cooling tower 4 and the 4th that pipeline is connected.
Described cooling circuit device also includes some flow control valves 06 being arranged on pipeline.
As seen from Figure 1, this experimental rig constitutes four loops using four loop apparatus:
1st, primary side return circuit testing device:Primary side return circuit testing device is primarily to when simulated high-pressure cooler works
A side loop, it is driven into by the second pump 02 by the water that electric heater 2 is heated in heating circuit device is passed through
Side-entrance of HP cooler 5, the flow of primary side return circuit testing device is determined by first flowmeter F01, by the
One pressure transmitter P01 and second pressure transmitter P02 determine the pressure of the primary side of HP cooler 5 import and export respectively, pass through
First temperature sensor T01 and second temperature sensor T02 determine the temperature of the primary side of HP cooler 5 import and export respectively.
2nd, secondary side circuit test device:Secondary side circuit test device is primarily to when simulated high-pressure cooler works
Secondary side circuit, its by the 3rd pump 03 by pass through cooling circuit device cool down water be driven into HP cooler 5
Secondary side-entrance, the flow of secondary side circuit test device is determined by second flowmeter F02, passes through the 3rd pressure transmitter
P03 and the 4th pressure transmitter P04 determine the pressure of the secondary side of HP cooler 5 import and export respectively, pass through the 3rd TEMP
Device T03 and the 4th temperature sensor T04 determine the temperature of the secondary side of HP cooler 5 import and export respectively.
3rd, heating circuit device:Heating circuit device is primarily to ensure that the primary side import of HP cooler 5 can
The constant temperature angle value of designed operating mode is kept, it sets required temperature by electric heater 2, by the temperature-sensitive of electric heater 2
System drive electric heater 2 works automatically, keeps the primary side inlet temperature of HP cooler 5 constant.
4th, cooling circuit device:Cooling circuit device is primarily to ensure that the secondary side import of HP cooler 5 can
The constant temperature angle value of design conditions is kept, it is board-like to control by the flow control valve aperture for adjusting board-like heat-exchanger circuit
The cooling water inflow of heat exchanger 3, so as to maintain the secondary side inlet temperature of HP cooler 5 constant.
When being tested, it should first start the equipment in heating circuit device, when the first temperature sensor T01 temperature is shown
After the temperature for needed for, start the flow control valve 06 in primary side return circuit testing device, regulation primary side return circuit testing device, really
The reading for protecting first flowmeter F01 is the flow value for presetting operating condition of test, and subsequent start-up secondary side circuit test device is adjusted
Save the flow control valve 06 in secondary side circuit test device, it is ensured that second flowmeter F02 reading is to preset experiment work
The flow value of condition, then starts the flow control valve 06 in cooling circuit device, regulation cooling circuit device, until the 3rd temperature
Sensor T03 can stablize in operating condition of test value set in advance.After all measurement value stabilizations, the first temperature sensor is recorded
T01, first pressure transmitter P01, first flowmeter F01, second temperature sensor T02, second pressure transmitter P02, the 3rd
Temperature sensor T03, the 3rd pressure transmitter P03, second flowmeter F02, the 4th temperature sensor T04 and the 4th pressure inverting
Device P04 value, and utilize the heat exchange amount of these numerical computations heat exchangers, the coefficient of heat transfer etc..
The design for the whole experimental rig that the present invention is provided is simple, for producing the producer of pump, and has possessed pump examination
For the producer for testing platform, it is only necessary to just can carry out HP cooler functional trial in original testing stand slight modification, and pass through this
Experimental rig carries out the function test of HP cooler, not only ensure that the reliable cooling effect for core main pump, even more has
Have and contrasted with design calculation result, the meaning of optimization design.
Although present disclosure is discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read the above, for the present invention's
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.