CN104595777A - Lamp - Google Patents
Lamp Download PDFInfo
- Publication number
- CN104595777A CN104595777A CN201510071851.XA CN201510071851A CN104595777A CN 104595777 A CN104595777 A CN 104595777A CN 201510071851 A CN201510071851 A CN 201510071851A CN 104595777 A CN104595777 A CN 104595777A
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- CN
- China
- Prior art keywords
- heat conduction
- lampshade
- cooling stand
- light fixture
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a lamp. The lamp comprises a lampshade and a heat conduction head arranged inside the lampshade, wherein the heat conduction heat is provided with a plurality of luminescent chips. The lamp also comprises a heat conduction rod assembly which is fixedly connected with the heat conduction head, the heat conduction rod assembly is also connected with a heat radiating part outside the lampshade, and the lampshade is fixedly connected with the heat radiating assembly through a lampshade fixing frame. The lamp also comprises a power supply connector which is connected with an external alternating-current power supply, the power supply connector is connected with a chip drive circuit board, and the chip drive circuit board is used for driving the luminescent chips. By adopting the lamp, the luminescent chips are arranged on the heat conduction head, the heat conduction head is further connected with the heat radiating assembly outside the lampshade through the heat conduction rod, so that the heat of the luminescent chips can be transferred to the heat radiation assembly through the heat conduction head and the heat conduction rod, the heat produced by the luminescent chips can be effectively released, and the service life of the lamp can be prolonged.
Description
Technical field
The application relates to illumination articles for use technical field, more particularly, relates to a kind of light fixture.
Background technology
Lighting is widely used in the every field such as daily life, business activity, has brought a lot of convenience.Existing lighting generally comprises lampshade, is positioned at luminous component and the electric connecting member of lampshade inside.Due to luminous component meeting radiations heat energy while illumination, therefore the heat-sinking capability of luminous component governs the service life of whole lighting.The heat-conducting glue that existing lighting is generally applied by luminous component back dispels the heat, but this radiating effect is not ideal.
Summary of the invention
In view of this, this application provides a kind of light fixture, for solving the topic of existing lighting heat-sinking capability difference.
To achieve these goals, the existing scheme proposed is as follows:
A kind of light fixture, comprising:
Lampshade;
Be arranged on the heat conduction head of lampshade inside, described heat conduction head is provided with several luminescence chips;
The heat conducting bar assembly be fixedly connected with described heat conduction head, described heat conducting bar assembly is also connected with the radiating subassembly of lampshade outside;
Described lampshade is fixedly connected with described radiating subassembly by lampshade fixing frame;
The power connection of external AC power supply, described power connection is connected with chip drive circuit plate, and described chip drive circuit plate is for driving described luminescence chip.
Preferably, described heat conduction head is cube structure, and described cubical upper end face and side arrange several luminescence chips respectively, and described heat conducting bar assembly is fixedly connected with described cubical lower end face.
Preferably, described heat conduction head is the heat conduction head of ceramic material.
Preferably, described heat conducting bar assembly is the hollow heat conducting bar of metal material.
Preferably, thermal conductive sand and/or conductive fluid are equipped with in described heat conducting bar inside.
Preferably, described chip drive circuit plate is connected by wire with between described luminescence chip, and it is inner that described wire is positioned at described heat conducting bar.
Preferably, described radiating subassembly comprises:
Cooling stand, and be arranged on several fins on described cooling stand, wherein:
Described fin distributes radially, and the end of several fins is provided with a point fork fin.
Preferably, described radiating subassembly comprises:
Cooling stand, and be arranged on several fins on described cooling stand, wherein:
Described fin distributes radially, the cross section that the tie point of each fin and cooling stand and cooling stand axis are formed, and there is angle between this fin radiating surface.
Preferably, described radiating subassembly comprises:
Cooling stand, and be arranged on several fins on described cooling stand, wherein:
Described fin distributes radially, and the link of described fin and cooling stand increases gradually to the width of flight tip.
Preferably, described radiating subassembly comprises:
Cooling stand, and along several plate-like fin that cooling stand axis arranges.
As can be seen from above-mentioned technical scheme, the light fixture that the embodiment of the present application provides, comprises lampshade, and is arranged on the heat conduction head of lampshade inside, heat conduction head is provided with several luminescence chips.Also comprise the heat conducting bar assembly be fixedly connected with heat conduction head, heat conducting bar assembly is also connected with the thermal component of lampshade outside, and lampshade is fixedly connected with radiating subassembly by lampshade fixing frame.Also comprise the power connection of external AC power supply, it is connected with chip drive circuit plate, and chip drive circuit plate is for driving luminescence chip.Luminescence chip is arranged on heat conduction head by the light fixture that the application provides, heat conduction head is connected further by the radiating subassembly of heat conducting bar with lampshade outside, thus make the heat of luminescence chip be passed to radiating subassembly by heat conduction head, heat conducting bar, effectively discharge the heat that luminescence chip produces, improve the service life of light fixture.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only the embodiment of the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
Fig. 1 is a kind of fitting structure schematic diagram disclosed in the embodiment of the present application;
Fig. 2 a is a kind of radiating subassembly top view disclosed in the embodiment of the present application;
Fig. 2 b is a kind of radiating subassembly side view disclosed in the embodiment of the present application;
Fig. 3 a is another kind of radiating subassembly top view disclosed in the embodiment of the present application;
Fig. 3 b is another kind of radiating subassembly side view disclosed in the embodiment of the present application;
Fig. 4 a is the embodiment of the present application another radiating subassembly top view disclosed;
Fig. 4 b is the embodiment of the present application another radiating subassembly side view disclosed;
Fig. 5 a is the embodiment of the present application another radiating subassembly top view disclosed;
Fig. 5 b is the embodiment of the present application another radiating subassembly side view disclosed.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present application, be clearly and completely described the technical scheme in the embodiment of the present application, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the application's protection.
See Fig. 1, Fig. 1 a kind of fitting structure schematic diagram disclosed in the embodiment of the present application.
As shown in Figure 1, this light fixture comprises:
Lampshade 1;
Be arranged on the heat conduction 2 of lampshade 1 inside, described heat conduction 2 is provided with several luminescence chips 3;
With a described heat conduction 2 heat conducting bar assembly 4 be fixedly connected with, described heat conducting bar assembly 4 is also connected with the radiating subassembly 5 of lampshade 1 outside;
Described lampshade 1 is fixedly connected with described radiating subassembly 5 by lampshade fixing frame 6;
The power connection (power connection comprises lamp holder 7 and cableties 8) of external AC power supply, described power connection is connected with chip drive circuit plate 9, and described chip drive circuit plate 9 is for driving described luminescence chip 3.
It is to be understood that do not draw the annexation of chip drive circuit plate 9 and power connection and luminescence chip in Fig. 1.It will be appreciated by persons skilled in the art that lamp holder 7 and cableties 8 are started to exchange fire line and zero line respectively, alternating current is converted to low-voltage DC by chip drive circuit plate 9, lights to drive luminescence chip 3.
In addition, chip drive circuit plate 9 can select the below being arranged on radiating subassembly 4, fixes chip drive circuit plate 9 by circuit board upper cover 10 and circuit board lower cover 11.
The light fixture that the embodiment of the present application provides, comprises lampshade, and is arranged on the heat conduction head of lampshade inside, heat conduction head is provided with several luminescence chips.Also comprise the heat conducting bar assembly be fixedly connected with heat conduction head, heat conducting bar assembly is also connected with the thermal component of lampshade outside, and lampshade is fixedly connected with radiating subassembly by lampshade fixing frame.Also comprise the power connection of external AC power supply, it is connected with chip drive circuit plate, and chip drive circuit plate is for driving luminescence chip.Luminescence chip is arranged on heat conduction head by the light fixture that the application provides, heat conduction head is connected further by the radiating subassembly of heat conducting bar with lampshade outside, thus make the heat of luminescence chip be passed to radiating subassembly by heat conduction head, heat conducting bar, effectively discharge the heat that luminescence chip produces, improve the service life of light fixture.
Alternatively, above-mentioned heat conduction 2 can be set to cube structure, end face and four sides arranges several luminescence chips, for illumination on cubical.And heat conducting bar assembly 4 is fixedly connected with cubical lower end face.Or heat conducting bar assembly 4 can run through lower end face, be fixed on the inside of heat conduction 2.
Certainly, heat conduction 2 can also be set to other version, and such as cylinder, centrum etc., do not limit this application.
Heat conduction 2, in order to better dispel the heat, can the material that be easy to heat conduction such as Ceramics material or aluminium material be made.
Further, heat conducting bar assembly 4 can select metal material to make, such as aluminium material etc.And in order to better carry out heat transmission, heat conducting bar can be set to hollow structure, in heat conducting bar inside filling thermal conductive sand and/or conductive fluid, accelerate heat transmission further.
Be understandable that, the length of heat conducting bar assembly 4 is less, then heat-conducting effect is better.But, if heat conducting bar assembly 4 length is too small, then the height of heat conduction 2 can be caused too low, thus affect the transmission angle of the light that luminescence chip is launched.Therefore, these two can be considered because usually choosing the length of a moderate heat conducting bar assembly.
Optionally, the structure of the lampshade 1 of the application can support that transparency range is between 0-270 degree.
Optionally, be connected between luminescence chip with chip drive circuit plate by wire, wire can arbitrarily be arranged.And as a kind of ratio preferably mode, by the inside of wire arrangements at the heat conducting bar of hollow structure, space can be saved like this.Heat-barrier material can be wrapped up in wire outside, prevents high temperature failure.
Next, the structure of radiating subassembly 5 is introduced.
Radiating subassembly 5 can select various structures form, and multiple material.As preferably mode, radiating subassembly radiating subassembly 5 being set to ceramic material can be selected.
See Fig. 2-Fig. 5, it individually discloses the radiating subassembly of four kinds of different structures.
The first, as shown in Figure 2 a and 2 b, radiating subassembly 5 can comprise: cooling stand 50, and is arranged on several fins 51 on described cooling stand, wherein:
Described fin 51 distributes radially, and wherein the end of several fins 51 is provided with a point fork fin 510.
By this setup, increase area of dissipation, can dispel the heat better.
The second, as shown in Figure 3 a and Figure 3 b shows, described radiating subassembly 5 comprises:
Cooling stand 52, and be arranged on several fins 53 on described cooling stand 52, wherein:
Described fin 53 distributes radially, the cross section that each fin 53 is formed with tie point and the cooling stand axis of cooling stand 52, and there is angle between this fin 53 radiating surface.θ angle as shown in Figure 3 a.
3rd, as shown in figures 4 a and 4b, described radiating subassembly 5 comprises:
Cooling stand 54, and be arranged on several fins 55 on described cooling stand 54, wherein:
Described fin 55 distributes radially, and the link of described fin 55 and cooling stand 54 increases gradually to the width of fin 55 end.
4th, as shown in figure 5 a and 5b, described radiating subassembly 5 comprises:
Cooling stand 56, and along several plate-like fin 57 that cooling stand 56 axis arranges.
The radiating subassembly of comprehensive above-mentioned several structure is known, and the structure of radiating subassembly should be allow area of dissipation maximize as much as possible, thus carries out heat diffusion faster.Certainly; above-mentioned four kinds of heat radiation assembly structures are only a kind of examples; in addition radiating subassembly can also be designed to other structure, those skilled in the art according to above-mentioned four kinds of structures other version of going out of direct derivation or association can also belong to the claimed scope of the application.
Finally, also it should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
In this description, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the application.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from the spirit or scope of the application, can realize in other embodiments.Therefore, the application can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a light fixture, is characterized in that, comprising:
Lampshade;
Be arranged on the heat conduction head of lampshade inside, described heat conduction head is provided with several luminescence chips;
The heat conducting bar assembly be fixedly connected with described heat conduction head, described heat conducting bar assembly is also connected with the radiating subassembly of lampshade outside;
Described lampshade is fixedly connected with described radiating subassembly by lampshade fixing frame;
The power connection of external AC power supply, described power connection is connected with chip drive circuit plate, and described chip drive circuit plate is for driving described luminescence chip.
2. light fixture according to claim 1, is characterized in that, described heat conduction head is cube structure, and described cubical upper end face and side arrange several luminescence chips respectively, and described heat conducting bar assembly is fixedly connected with described cubical lower end face.
3. light fixture according to claim 2, is characterized in that, described heat conduction head is the heat conduction head of ceramic material.
4. light fixture according to claim 1, is characterized in that, described heat conducting bar assembly is the hollow heat conducting bar of metal material.
5. light fixture according to claim 4, is characterized in that, thermal conductive sand and/or conductive fluid are equipped with in described heat conducting bar inside.
6. light fixture according to claim 4, is characterized in that, described chip drive circuit plate is connected by wire with between described luminescence chip, and it is inner that described wire is positioned at described heat conducting bar.
7. the light fixture according to any one of claim 1-6, is characterized in that, described radiating subassembly comprises:
Cooling stand, and be arranged on several fins on described cooling stand, wherein:
Described fin distributes radially, and the end of several fins is provided with a point fork fin.
8. the light fixture according to any one of claim 1-6, is characterized in that, described radiating subassembly comprises:
Cooling stand, and be arranged on several fins on described cooling stand, wherein:
Described fin distributes radially, the cross section that the tie point of each fin and cooling stand and cooling stand axis are formed, and there is angle between this fin radiating surface.
9. the light fixture according to any one of claim 1-6, is characterized in that, described radiating subassembly comprises:
Cooling stand, and be arranged on several fins on described cooling stand, wherein:
Described fin distributes radially, and the link of described fin and cooling stand increases gradually to the width of flight tip.
10. the light fixture according to any one of claim 1-6, is characterized in that, described radiating subassembly comprises:
Cooling stand, and along several plate-like fin that cooling stand axis arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510071851.XA CN104595777A (en) | 2015-02-11 | 2015-02-11 | Lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510071851.XA CN104595777A (en) | 2015-02-11 | 2015-02-11 | Lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104595777A true CN104595777A (en) | 2015-05-06 |
Family
ID=53121733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510071851.XA Pending CN104595777A (en) | 2015-02-11 | 2015-02-11 | Lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104595777A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1277665A (en) * | 1998-09-17 | 2000-12-20 | 皇家菲利浦电子有限公司 | LED Lamp |
| CN101614344A (en) * | 2009-07-29 | 2009-12-30 | 江苏国星电器有限公司 | High-power LED bulb |
| CN101871584A (en) * | 2009-04-23 | 2010-10-27 | 富士迈半导体精密工业（上海）有限公司 | Lighting device |
| CN201628121U (en) * | 2010-03-15 | 2010-11-10 | 厦门聚萤光电科技有限公司 | High-power led illuminating device |
| CN102418913A (en) * | 2010-09-27 | 2012-04-18 | 金松山 | Radiator for light-emitting diode (LED) lamp |
| CN202719402U (en) * | 2012-06-05 | 2013-02-06 | 甘华 | Light emitting diode (LED) lamp |
| CN203431618U (en) * | 2013-08-26 | 2014-02-12 | 韦运动 | LED bulb lamp |
| CN103822195A (en) * | 2012-11-19 | 2014-05-28 | 合肥杰事杰新材料股份有限公司 | LED lamp radiating shell |
| CN204513006U (en) * | 2015-02-11 | 2015-07-29 | 宁波澎湃电子科技有限公司 | A kind of light fixture |
-
2015
- 2015-02-11 CN CN201510071851.XA patent/CN104595777A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1277665A (en) * | 1998-09-17 | 2000-12-20 | 皇家菲利浦电子有限公司 | LED Lamp |
| CN101871584A (en) * | 2009-04-23 | 2010-10-27 | 富士迈半导体精密工业（上海）有限公司 | Lighting device |
| CN101614344A (en) * | 2009-07-29 | 2009-12-30 | 江苏国星电器有限公司 | High-power LED bulb |
| CN201628121U (en) * | 2010-03-15 | 2010-11-10 | 厦门聚萤光电科技有限公司 | High-power led illuminating device |
| CN102418913A (en) * | 2010-09-27 | 2012-04-18 | 金松山 | Radiator for light-emitting diode (LED) lamp |
| CN202719402U (en) * | 2012-06-05 | 2013-02-06 | 甘华 | Light emitting diode (LED) lamp |
| CN103822195A (en) * | 2012-11-19 | 2014-05-28 | 合肥杰事杰新材料股份有限公司 | LED lamp radiating shell |
| CN203431618U (en) * | 2013-08-26 | 2014-02-12 | 韦运动 | LED bulb lamp |
| CN204513006U (en) * | 2015-02-11 | 2015-07-29 | 宁波澎湃电子科技有限公司 | A kind of light fixture |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150506 |
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| RJ01 | Rejection of invention patent application after publication |