CN104593838A - Copper plating technology on graphite powder surface - Google Patents
Copper plating technology on graphite powder surface Download PDFInfo
- Publication number
- CN104593838A CN104593838A CN201310525298.3A CN201310525298A CN104593838A CN 104593838 A CN104593838 A CN 104593838A CN 201310525298 A CN201310525298 A CN 201310525298A CN 104593838 A CN104593838 A CN 104593838A
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- Prior art keywords
- graphite
- plating
- neutrality
- washed
- concentration
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Fuel Cell (AREA)
Abstract
The invention discloses a copper plating technology on graphite powder surface. The technology is as below: soaking the selected graphite raw material in a sodium hydroxide solution with concentration of 200 g / L for 30min, and washing with water to a neutral state; boiling the graphite in nitric acid solution with concentration of 20% for 20 min, then washing with water to neutral state, and drying at a temperature of 80 DEG C; preparing a plating solution from blue copperas, distilled water and sulfuric acid in the ratio of 1:100:2, then adding graphite, controlling the current density at 9A / dm<2> for 60-80 min, and indirectly mixing in the electroplating process, wherein the weight of the graphite and the plating solution is 1:150; after plating, washing to a neutral state, conducting passivation treatment by using 0.5% benzotriazole at the temperature of 50 DEG C for 7 min, and drying at 90 DEG C. The method has the advantages of simpleness, short plating time and low cost.
Description
Technical field
The invention belongs to Graphite processing technical field, be specifically related to a kind of Graphite Powder 99 copper coating technique.
Background technology
Copper, graphite composite material are the brush that is widely used of a class and electrical contact material, the electroconductibility that it mainly utilizes copper excellent and thermal conductivity, and the anti-attrition of graphite and lubrication.At present, the preparation method of graphite mainly adopts electroless copper method and powder metallurgic method, and electroless copper law technology is comparatively ripe, but graphite pre-treating technology is complicated, and waste liquid is difficult, and preparation cost is high; The problems such as powder metallurgic method exists batch mixing inequality, and copper, graphite interface bonding strength are low.
Summary of the invention
In order to overcome the above-mentioned technical problem that prior art field exists, the object of the invention is to, provide a kind of Graphite Powder 99 copper coating technique, method is simple, and cost is low.
Graphite Powder 99 copper coating technique provided by the invention, comprise the following steps: (1) chooses carbon content 99%, granularity is that the natural flake graphite of 200 is as starting material, be the sodium hydroxide solution immersion 30min of 200g/L by the graphite raw material concentration chosen, be then washed to neutrality; (2) graphite is put into concentration be 20% salpeter solution boil 20min, be then washed to neutrality, and dry under the temperature condition of 80 DEG C; (3) adopt cupric sulfate pentahydrate, distilled water, sulfuric acid to make electroplate liquid according to the proportioning of 1:100:2, then add graphite, control current density is 9A/dm
2, the time is 60-80min, and indirectly stir in the process of plating, the weight ratio of described graphite and electroplate liquid is 1:150; (4), after plating terminates, be washed to neutrality, carry out Passivation Treatment with the benzotriazole of 0.5% afterwards, treatment temp is 50 DEG C, and the time is 7min, dries afterwards under the temperature condition of 90 DEG C.
Graphite Powder 99 copper coating technique provided by the invention, its beneficial effect is, after plating terminates, is washed to neutrality, carries out Passivation Treatment afterwards, effective anti-oxidation with the benzotriazole of 0.5%, and method is simple, and electroplating time is short, and cost is low.
Embodiment
Below in conjunction with an embodiment, Graphite Powder 99 copper coating technique provided by the invention is described in detail.
Embodiment
The Graphite Powder 99 copper coating technique of the present embodiment, comprise the following steps: (1) chooses carbon content 99%, granularity is that the natural flake graphite of 200 is as starting material, be the sodium hydroxide solution immersion 30min of 200g/L by the graphite raw material concentration chosen, be then washed to neutrality; (2) graphite is put into concentration be 20% salpeter solution boil 20min, be then washed to neutrality, and dry under the temperature condition of 80 DEG C; (3) adopt cupric sulfate pentahydrate, distilled water, sulfuric acid to make electroplate liquid according to the proportioning of 1:100:2, then add graphite, control current density is 9A/dm
2, the time is 80min, and indirectly stir in the process of plating, the weight ratio of described graphite and electroplate liquid is 1:150; (4), after plating terminates, be washed to neutrality, carry out Passivation Treatment with the benzotriazole of 0.5% afterwards, treatment temp is 50 DEG C, and the time is 7min, dries afterwards under the temperature condition of 90 DEG C.
Claims (1)
1. a Graphite Powder 99 copper coating technique, it is characterized in that: comprise the following steps: (1) chooses carbon content 99%, granularity is that the natural flake graphite of 200 is as starting material, be the sodium hydroxide solution immersion 30min of 200g/L by the graphite raw material concentration chosen, be then washed to neutrality; (2) graphite is put into concentration be 20% salpeter solution boil 20min, be then washed to neutrality, and dry under the temperature condition of 80 DEG C; (3) adopt cupric sulfate pentahydrate, distilled water, sulfuric acid to make electroplate liquid according to the proportioning of 1:100:2, then add graphite, control current density is 9A/dm
2, the time is 60-80min, and indirectly stir in the process of plating, the weight ratio of described graphite and electroplate liquid is 1:150; (4), after plating terminates, be washed to neutrality, carry out Passivation Treatment with the benzotriazole of 0.5% afterwards, treatment temp is 50 DEG C, and the time is 7min, dries afterwards under the temperature condition of 90 DEG C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310525298.3A CN104593838A (en) | 2013-10-31 | 2013-10-31 | Copper plating technology on graphite powder surface |
Applications Claiming Priority (1)
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CN201310525298.3A CN104593838A (en) | 2013-10-31 | 2013-10-31 | Copper plating technology on graphite powder surface |
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CN104593838A true CN104593838A (en) | 2015-05-06 |
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CN201310525298.3A Pending CN104593838A (en) | 2013-10-31 | 2013-10-31 | Copper plating technology on graphite powder surface |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107858713A (en) * | 2017-11-02 | 2018-03-30 | 中国科学院山西煤炭化学研究所 | A kind of apparatus and method for preparing expanded graphite electro-coppering |
CN108598451A (en) * | 2017-12-12 | 2018-09-28 | 湖北工业大学 | Sodium-ion battery red phosphorus cathode pole piece and preparation method thereof |
CN113622007A (en) * | 2021-09-08 | 2021-11-09 | 苏州市安派精密电子有限公司 | Preparation method of high-flexibility graphite or graphene heat dissipation component |
-
2013
- 2013-10-31 CN CN201310525298.3A patent/CN104593838A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107858713A (en) * | 2017-11-02 | 2018-03-30 | 中国科学院山西煤炭化学研究所 | A kind of apparatus and method for preparing expanded graphite electro-coppering |
CN107858713B (en) * | 2017-11-02 | 2019-11-05 | 中国科学院山西煤炭化学研究所 | A kind of device and method preparing expanded graphite electro-coppering |
CN108598451A (en) * | 2017-12-12 | 2018-09-28 | 湖北工业大学 | Sodium-ion battery red phosphorus cathode pole piece and preparation method thereof |
CN108598451B (en) * | 2017-12-12 | 2020-11-06 | 湖北工业大学 | Sodium ion battery red phosphorus negative pole piece and preparation method thereof |
CN113622007A (en) * | 2021-09-08 | 2021-11-09 | 苏州市安派精密电子有限公司 | Preparation method of high-flexibility graphite or graphene heat dissipation component |
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Application publication date: 20150506 |