CN104588880A - IC (integrated circuit) chip welding equipment - Google Patents

IC (integrated circuit) chip welding equipment Download PDF

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Publication number
CN104588880A
CN104588880A CN201510012166.XA CN201510012166A CN104588880A CN 104588880 A CN104588880 A CN 104588880A CN 201510012166 A CN201510012166 A CN 201510012166A CN 104588880 A CN104588880 A CN 104588880A
Authority
CN
China
Prior art keywords
screw thread
servomotor
center
mount pad
chip
Prior art date
Application number
CN201510012166.XA
Other languages
Chinese (zh)
Inventor
陈友兵
徐和平
宋越
Original Assignee
池州睿成微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 池州睿成微电子有限公司 filed Critical 池州睿成微电子有限公司
Priority to CN201510012166.XA priority Critical patent/CN104588880A/en
Publication of CN104588880A publication Critical patent/CN104588880A/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/78261Laser
    • H01L2224/78263Laser in the upper part of the bonding apparatus, e.g. in the capillary or wedge
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7865Means for transporting the components to be connected
    • H01L2224/78654Pneumatic conveyor

Abstract

The invention discloses IC (integrated circuit) chip welding equipment. The IC chip welding equipment comprises a rack and an IC chip, wherein the rack comprises a fixed base, a first servo motor, a first lead screw, a movable mounting base, a laser welding head, a pneumatic vacuum extractor, a movable base, a conveyor, a second servo motor and a second lead screw. Compared with the prior art, high-energy electron beams are emitted by the laser welding head, the first lead screw is driven by the first servo motor to drive the movable mounting base to move forwards and backwards, and the second lead screw is driven by the second servo motor to drive the movable mounting base to move leftwards and rightwards, so that IC chip welding is completed; the temperature of welding parts of the electron beam welding is consistent, so that the quality of the welded product is guaranteed.

Description

A kind of IC chip welding device

Technical field

The present invention relates to a kind of welding equipment, particularly relate to a kind of IC chip welding device.

Background technology

Along with the development of science and technology, electronic product is more and more advanced, volume is more and more less, and a large amount of uses being at all IC chip of electronic product development, current IC chip needs to be formed by welding with other circuit, and existing welding equipment is welded by flame, and the bad control of flame welding jointing temp, cause product rejection, in view of above-mentioned defect, be necessary to design a kind of IC chip welding device in fact.

Summary of the invention

Technical problem to be solved by this invention is: provide a kind of IC chip welding device, solve the problem of product rejection.

For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of IC chip welding device, comprise frame, comprise holder, first servomotor, the first screw mandrel, mobile mount pad, laser welding system, Pneumatic vacuum are inhaled, Mobile base, conveyer, the second servomotor, the second screw mandrel, IC chip, described fixed seating is in frame top center right-hand member, and the two screw thread is connected.The first described servomotor is positioned at holder right-hand member center, the two screw thread is connected, the first described screw mandrel is positioned at the first servomotor left end center, itself and holder are movably connected, be connected with the first servomotor screw thread, described mobile mount pad is positioned at holder top, and the two is movably connected, described laser welding system is positioned at place of mobile mount pad left end bottom centre, and the two screw thread is connected.Described Pneumatic vacuum attracts the position in mobile mount pad top center left end, and the two screw thread is connected.Described sliding seats is in framework soleplate center left, and the two is movably connected.Described conveyer is positioned at Mobile base center left, and it is connected with frame screw thread.The second described servomotor is positioned on the upside of center, the frame back side, and the two screw thread is connected, and the second described screw mandrel is positioned at the second center, servomotor front end, and itself and frame are movably connected, and is connected with the second servomotor screw thread.

Further, described Mobile base top center place is also provided with positioning module, and the two screw thread is connected.

Further, described conveyer top is also provided with storing frame, and the two screw thread is connected.

Further, described holder top is also provided with guide rail, and itself and mobile mount pad are movably connected, and are connected with holder screw thread.

Further, described place of mobile mount pad right-hand member bottom centre also establishes feed nut, and itself and screw mandrel are movably connected, and are connected with mobile mount pad screw thread.

Further, described Pneumatic vacuum is inhaled place of bottom centre and is also provided with vacuum cups, and the two screw thread is connected.

Compared with prior art, first chip to be processed is placed in the storing frame in conveyer, first driven by servomotor moves mount pad, pneumatic middle suction is made to move to conveyer upper end center place, the Pneumatic vacuum heart moves downward, chip to be processed picks up by vacuum cups, and the first servomotor drives mobile mount pad back to move again, and Pneumatic vacuum is inhaled and is placed in positioning module by chip to be processed.Laser welding system sends high energy electron beam, mobile mount pad is driven to move left and right by the first driven by servomotor first screw mandrel, thus reach laser welding system and move left and right, second driven by servomotor second screw mandrel drives Mobile base to move forward and backward, thus complete chips welding processing, electron beam welding stable performance, ensures welding quality, avoids product rejection.

Accompanying drawing explanation

Fig. 1 is the front view of device

Fig. 2 is the left view of device

Frame 1 holder 2

First servomotor 3 first screw mandrel 4

Mobile mount pad 5 laser welding system 6

Pneumatic vacuum inhales 7 Mobile bases 8

Conveyer 9 second servomotor 10

Second screw mandrel 11 IC chip 12

Guide rail 201 feed nut 501

Vacuum cups 701 positioning module 801

Storing frame 901

Following detailed description of the invention will further illustrate in conjunction with above-mentioned accompanying drawing.

Detailed description of the invention

Hereinafter, set forth multiple specific detail, to provide the thorough understanding to the concept forming described embodiment basis.But to one skilled in the art, embodiment described obviously can be put into practice when not have in these specific detail some or all.In other cases, well-known treatment step is not specifically described.

As shown in Figure 1 and Figure 2, comprise frame 1, comprise holder 2, first servomotor 3, first screw mandrel 4, mobile mount pad 5, laser welding system 6, Pneumatic vacuum suction 7, Mobile base 8, conveyer 9, second servomotor 10, second screw mandrel 11, IC chip 12, described is fixing, 2 are positioned at frame 1 top center right-hand member, and the two screw thread is connected.The first described servomotor 3 is positioned at holder 2 right-hand member center, the two screw thread is connected, the first described screw mandrel 4 is positioned at the first servomotor 3 left end center, itself and holder 2 are movably connected, be connected with the first servomotor 3 screw thread, described mobile mount pad 5 is positioned at holder 2 top, the two is movably connected, described laser welding system 6 is positioned at place of mobile mount pad 5 left end bottom centre, the two screw thread is connected, described Pneumatic vacuum is inhaled 7 and is positioned at mobile mount pad 5 top center left end, the two screw thread is connected, described Mobile base 8 is positioned at frame 1 base plate center left, the two is movably connected, described conveyer 9 is positioned at Mobile base center left, it is connected with frame screw thread, the second described servomotor 10 is positioned on the upside of center, frame 1 back side, the two screw thread is connected, the second described screw mandrel 11 is positioned at the second center, servomotor 10 front end, itself and frame 1 are movably connected, be connected with the second servomotor 10 screw thread, described positioning seat 8 top center place is also provided with positioning module 801, the two screw thread is connected.Described conveyer 9 top is also provided with storing frame 901, the two screw thread is connected, described holder 2 top is also provided with guide rail 201, itself and mobile mount pad 5 are movably connected, be connected with holder 2 screw thread, described place of mobile mount pad 5 right-hand member bottom centre also establishes feed nut 501, itself and screw mandrel 4 are movably connected, be connected with mobile mount pad 5 screw thread, described Pneumatic vacuum is inhaled 7 places of bottom centre and is also provided with vacuum cups 701, the two screw thread is connected, its mid frame 1, holder 2, mobile mount pad 5, Mobile base 7 is support fixed mechanisms of component devices, feed nut 501 is connected with mobile mount pad 5, be movably connected with the first screw mandrel 4, drive screw mandrel 4 by the first servomotor 3, thus drive mobile mount pad 5 to move on guide rail 201, first IC chip 12 to be processed is placed in the storing frame 901 in conveyer 9, first servomotor 3 drives mobile mount pad 5, pneumatic middle suction 7 is made to move to conveyer 9 upper end center place, the Pneumatic vacuum heart is inhaled 7 and is moved downward, IC chip 12 to be processed picks up by vacuum cups 701, first servomotor 3 drives mobile installation 5 back to move again, Pneumatic vacuum is inhaled 7 and is placed in positioning module 801 by IC chip 12 to be processed.Laser welding system 6 sends high energy electron beam, the first screw mandrel 4 is driven to drive mobile mount pad 5 to move left and right by the first servomotor 3, thus reach laser welding system 6 and move left and right, second servomotor 10 drives the second screw mandrel 11 to move forward and backward to drive Mobile base 8, thus complete IC chip 12 welding processing, electron beam welding stable performance, ensures welding quality, avoids product rejection.

The present invention is not limited to above-mentioned concrete embodiment, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion made, all drop within protection scope of the present invention.

Claims (6)

1. an IC chip welding device, comprise frame, it is characterized in that comprising holder, first servomotor, the first screw mandrel, mobile mount pad, laser welding system, Pneumatic vacuum are inhaled, Mobile base, conveyer, the second servomotor, the second screw mandrel, IC chip, described fixed seating is in frame top center right-hand member, and the two screw thread is connected.The first described servomotor is positioned at holder right-hand member center, the two screw thread is connected, the first described screw mandrel is positioned at the first servomotor left end center, itself and holder are movably connected, be connected with the first servomotor screw thread, described mobile mount pad is positioned at holder top, and the two is movably connected, described laser welding system is positioned at place of mobile mount pad left end bottom centre, and the two screw thread is connected.Described Pneumatic vacuum attracts the position in mobile mount pad top center left end, and the two screw thread is connected.Described sliding seats is in framework soleplate center left, and the two is movably connected.Described conveyer is positioned at Mobile base center left, and it is connected with frame screw thread.The second described servomotor is positioned on the upside of center, the frame back side, and the two screw thread is connected, and the second described screw mandrel is positioned at the second center, servomotor front end, and itself and frame are movably connected, and is connected with the second servomotor screw thread.
2. a kind of IC chip welding device as claimed in claim 1, is characterized in that described Mobile base top center place is also provided with positioning module, and the two screw thread is connected.
3. a kind of IC chip welding device as claimed in claim 2, is characterized in that described conveyer top is also provided with storing frame, and the two screw thread is connected.
4. a kind of IC chip welding device as claimed in claim 3, it is characterized in that described holder top is also provided with guide rail, itself and mobile mount pad are movably connected, and are connected with holder screw thread.
5. a kind of IC chip welding device as claimed in claim 4, it is characterized in that described place of mobile mount pad right-hand member bottom centre also establishes feed nut, itself and screw mandrel are movably connected, and are connected with mobile mount pad screw thread.
6. a kind of IC chip welding device as claimed in claim 5, it is characterized in that described Pneumatic vacuum is inhaled place of bottom centre and is also provided with vacuum cups, the two screw thread is connected.
CN201510012166.XA 2015-01-09 2015-01-09 IC (integrated circuit) chip welding equipment CN104588880A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510012166.XA CN104588880A (en) 2015-01-09 2015-01-09 IC (integrated circuit) chip welding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510012166.XA CN104588880A (en) 2015-01-09 2015-01-09 IC (integrated circuit) chip welding equipment

Publications (1)

Publication Number Publication Date
CN104588880A true CN104588880A (en) 2015-05-06

Family

ID=53115119

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510012166.XA CN104588880A (en) 2015-01-09 2015-01-09 IC (integrated circuit) chip welding equipment

Country Status (1)

Country Link
CN (1) CN104588880A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202411601U (en) * 2011-12-20 2012-09-05 奥特力合自动化技术(北京)有限公司 Spot welding and carrying device of integral chip
CN202780148U (en) * 2012-08-22 2013-03-13 弘益泰克自动化设备(惠州)有限公司 Welding machine using two soldering irons for welding
CN202861569U (en) * 2012-04-18 2013-04-10 深圳市恒毅兴实业有限公司 Circuit board welding-based welding system
CN203566033U (en) * 2013-10-21 2014-04-30 武汉市楚源光电有限公司 Automatic laser tin soldering machine
CN104084697A (en) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 Laser cutting equipment for stainless steel chip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202411601U (en) * 2011-12-20 2012-09-05 奥特力合自动化技术(北京)有限公司 Spot welding and carrying device of integral chip
CN202861569U (en) * 2012-04-18 2013-04-10 深圳市恒毅兴实业有限公司 Circuit board welding-based welding system
CN202780148U (en) * 2012-08-22 2013-03-13 弘益泰克自动化设备(惠州)有限公司 Welding machine using two soldering irons for welding
CN203566033U (en) * 2013-10-21 2014-04-30 武汉市楚源光电有限公司 Automatic laser tin soldering machine
CN104084697A (en) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 Laser cutting equipment for stainless steel chip

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Application publication date: 20150506