CN104582269B - Dual inline type electronic element packaging structure - Google Patents
Dual inline type electronic element packaging structure Download PDFInfo
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- CN104582269B CN104582269B CN201310519122.7A CN201310519122A CN104582269B CN 104582269 B CN104582269 B CN 104582269B CN 201310519122 A CN201310519122 A CN 201310519122A CN 104582269 B CN104582269 B CN 104582269B
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- hole
- welding unit
- connecting plate
- circuit board
- electronic component
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- 230000009977 dual effect Effects 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 238000003466 welding Methods 0.000 claims description 202
- 239000002184 metal Substances 0.000 claims description 67
- 229910052751 metal Inorganic materials 0.000 claims description 67
- 238000005253 cladding Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Abstract
A kind of dual inline type electronic element packaging structure, including a circuit board, the connecting plate being mounted on the circuit board and one first electronic component, the circuit board includes one first hole, the connecting plate includes connecting the first through hole set and the second through hole with first hole, first electronic component has the pin protruded out, and the pin of first electronic component runs through the first through hole and the second through hole of the connecting plate and is housed in the first hole of the circuit board.
Description
Technical field
The present invention relates to a kind of encapsulating structure of electronic component, more particularly to a kind of encapsulation of dual inline type electronic component
Structure.
Background technology
Traditional circuit board（PCB, Printed Circuit Board）Generally include multiple DIP (Dual In-line
Package) the electronic component of form, the electronic component passes through its multiple pin（pin）Circuit board is each passed through to open up in advance
Through hole, and be respectively welded on the pad of the circuit board, so as to be electrically connected with circuit board.
However, because the pin of the DIP electronic components passes through the through hole on the circuit board and exposes to the circuit
The other side surface of plate, so that the pin for causing the DIP electronic components exposed is easy to interfere with other elements, and then is damaged
The bad DIP electronic components.
The content of the invention
In view of this, it is necessary to which a kind of pin for avoiding dual inline type electronic component and other elements interference are provided
Encapsulating structure.
A kind of dual inline type electronic element packaging structure, including a circuit board, the company that is mounted on the circuit board
Fishplate bar and one first electronic component, the circuit board include one first hole, and the connecting plate includes and first hole
The first through hole set and the second through hole are connected, first electronic component has the pin protruded out, first electronic component
Pin through the connecting plate first through hole and the second through hole and be housed in the first hole of the circuit board.
In the dual inline type electronic element packaging structure of the present invention, the pin of the dual inline type electronic component runs through
First through hole and the second through hole on connecting plate, and its outer end is housed in the first hole of the circuit board, so that it is not
It can interfere and be destroyed with other electronic components.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the dual inline type electronic element packaging structure of first embodiment of the invention.
Fig. 2 is the decomposing schematic representation of the dual inline type electronic element packaging structure shown in Fig. 1.
Fig. 3 is the inversion enlarged drawing of the connecting plate shown in Fig. 2.
Fig. 4 is sectional view of the dual inline type electronic element packaging structure along IV-IV lines shown in Fig. 1.
Fig. 5 is the schematic perspective view of the dual inline type electronic element packaging structure of second embodiment of the invention.
Fig. 6 is the decomposing schematic representation of the dual inline type electronic element packaging structure shown in Fig. 5.
Fig. 7 is the inversion enlarged drawing of the connecting plate shown in Fig. 5.
Fig. 8 is sectional view of the dual inline type electronic element packaging structure along VIII-VIII lines shown in Fig. 5.
Fig. 9 is the decomposing schematic representation of the dual inline type electronic element packaging structure of third embodiment of the invention.
Figure 10 is the inversion enlarged drawing of the connecting plate shown in Fig. 9.
Main element symbol description
| Dual inline type electronic element packaging structure | 100、100a、100b |
| Circuit board | 10、10a、10b |
| First welding unit | 11、11a、11b |
| Second welding unit | 12、12a、12b |
| 3rd welding unit | 14、14a、14b、24、24a、24b |
| First hole | 13、13a、13b |
| Second hole | 13a’、13b’ |
| Upper surface | 101、101a、101b、201、201a、201b |
| Lower surface | 102、102a、102b、202、202a、202b |
| First parallel walls | 131 |
| First circular arc wall | 132 |
| First through hole | 23、23a、23c |
| The first metal layer | 231、231a、231c |
| Second through hole | 24、24a、24c |
| Second metal layer | 241、241a、241c |
| Third through-hole | 23b、23d |
| 3rd metal level | 231b、231d |
| Fourth hole | 24b、24d |
| 4th metal level | 241b、241d |
| First weld part | 141a、241a、141b、241b |
| Second weld part | 142a、242a、142b、242b |
| 3rd weld part | 143a、243a |
| First deep-slotted chip breaker | 210、210a、210b |
| First metal cladding | 211、211a、211b |
| Second deep-slotted chip breaker | 220、220a、220b |
| Second metal cladding | 221、221a、221b |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
First embodiment
Refer to Fig. 1, the dual inline type electronic element packaging structure 100 of the present embodiment, including a circuit board 10, attachment
A connecting plate 20 on the circuit board 10 and be electrically connected with by the connecting plate 20 and the circuit board 10 one the
One electronic component 30.
Refer to Fig. 2, the circuit board 10 is a smooth plate body, it include a upper surface 101 and with the upper surface
The 101 concordant and relative lower surfaces 102 in interval.
The circuit board 10 include one first welding unit 11, be spaced and be arranged in parallel with the first welding unit 11 one the
Two welding units 12 and it is arranged between the welding unit 12 of the first welding unit 11 and second and through the circuit board
One first hole 13 of 10 thickness directions.First welding unit 11, the first hole 13 and the second welding unit 12 each other it
Between be arranged at intervals, and first welding unit 11, the first hole 13 and the second welding unit 12 be spaced it is in a row.
The welding unit of first welding unit 11 and second is respectively formed on the upper surface 101 of the circuit board 10.
The welding unit 12 of first welding unit 11 and second is a metal coating.First welding unit 11 and second is welded
Unit 12 is formed by the way of plating.In the present embodiment, the welding unit 12 of the first welding unit 11 and second is length
It is square.
First hole 13 is strip, and it includes relative and spaced 2 first parallel walls 131 and connected respectively
Connect 2 first circular arc walls 132 of the opposite end of 2 first parallel walls 131.
The welding unit 12 of first welding unit 11 and second is respectively formed at 2 first circles of first hole 13
The outside of arc wall 132.The direction of the Longitudinal extending of first welding unit, 11 and second welding unit 12 and first hole
The direction of 13 Longitudinal extendings is mutually perpendicular to.Preferably, the Longitudinal extending of 11 and second welding unit of the first welding unit 12
Length is more than the Breadth Maximum of first hole 13.
Please also refer to Fig. 3, the connecting plate 20 is the insulating board body of a rectangular-shape, it include a upper surface 201 and
And interval relative lower surface 202 parallel with the upper surface 201.The upper surface 201 of the connecting plate 20 is towards the electronics
Element 30, the lower surface 202 of the connecting plate 20 is towards the upper surface 101 of the circuit board 10.
The connecting plate 20 includes one first welding unit 21, second with the spaced and parallel setting of the first welding unit 21
Welding unit 22 and it is arranged between the welding unit 22 of the first welding unit 21 and second and through the thickness of connecting plate 20
The through hole 24 of first through hole 23 and second in direction.First welding unit 21, first through hole 23, the second through hole 24 and second
Welding unit 22 each other be arranged at intervals, and along the connecting plate 20 length direction be arranged in order it is in a row.
The welding unit 22 of first welding unit 21 and second is separately positioned on the lower surface 202 of the connecting plate 20,
And positioned at the opposite sides edge of the lower surface 202 of connecting plate 20.The welding unit 22 of first welding unit 21 and second
The first welding unit 11 and the second welding unit 12 respectively with the circuit board 10 is corresponding.In the present embodiment, the connecting plate
20 by the welding unit 22 of the first welding unit 21 and second respectively with the first welding unit 11 of the circuit board 10 and
Second welding unit 12 welds and is mounted on the upper surface 101 of the circuit board 10.
The welding unit 22 of first welding unit 21 and second is to be electroplated on the lower surface 202 of connecting plate 20
Metal coating, and its size and shape and the first welding unit 11 on the upper surface 101 of circuit board 10 and the second welding are single
Member 12 matches.
The first through hole 23 is correspondingly arranged with the second through hole 24 with the first hole 13 on the circuit board 10.This implementation
In example, the through hole 24 of first through hole 23 and second is cylindrical hole.
The first metal layer 231 for covering its periphery inwall is coated with the inwall of the first through hole 23.First gold medal
Category layer 231 from the periphery inwall of the first through hole 23 extend out to respectively on the upper surface 201 of the connecting plate 20 and under
Surface 202.Wherein, the first metal layer 231 on the lower surface 202 of the connecting plate 20 with first welding unit 21
It is electrically connected.
Similarly, the second metal layer 241 for covering its inwall periphery is coated with the inwall of second through hole 24.It is described
Second metal layer 241 extends out to the upper surface 201 of the connecting plate 20 from the inwall periphery of second through hole 24 respectively
And on lower surface 202.Wherein, lower surface 202 and the connecting plate 20 of the second metal layer 241 in the connecting plate 20
Second welding unit 22 is electrically connected with.
Each edge of the connecting plate 20 further comprises running through connecting plate 20, first along the thickness direction of connecting plate 20
First deep-slotted chip breaker 210 of the welding unit 22 of welding unit 21 and second, so that the connecting plate 20 is not easy to and its corner
Other neighbouring electronic components are interfered.
The first metal cladding 211 for covering its inner surface is formed in first deep-slotted chip breaker 210.Wherein, it is described to be located at
2 first metal claddings 211 of the side of the first welding unit 21 of connecting plate 20 are formed with first welding unit 21 respectively
It is electrically connected with；2 first metal claddings 211 positioned at the side of 20 second welding unit of connecting plate 22 are respectively with described
Two welding units 22 are electrically connected.
Refer to Fig. 4, when the connecting plate 20 the first welding unit 21 and the second welding unit 22 respectively with circuit board
When 10 the first welding unit 11 and the second welding unit 12 correspondence are welded, some solder can be with first deep-slotted chip breaker 210
The first interior metal cladding 211 is climbed upwards from the lower surface 202 of connecting plate 20 towards the direction of upper surface 201, and is finally housed
In first deep-slotted chip breaker 210.In this way, the connecting plate 20 and solder（It is not shown）Contact area increase so that
The connecting plate 20 be more firmly welded in on the circuit board 10.
When connecting plate 20 in the present embodiment is assembled with the circuit board 10, the on the lower surface 202 of connecting plate 20
One welding unit 21 and the second welding unit 22 respectively with the first welding unit 11 on the upper surface 101 of circuit board 10 and
Two welding units 12 correspondence is welded.Thickness direction of the through hole 24 of first through hole 23 and second of the connecting plate 20 in connecting plate 20
It is upper to be connected respectively with the first hole 13 of circuit board 10, and the through hole 24 of the first through hole 23 and second is respectively positioned on first hole
In the region in hole 13.The first pin 31 and second pin 32 of the electronic component 30 distinguish corresponding inserted in the connecting plate 20
The through hole 24 of first through hole 23 and second in, and extend through the through hole 24 of first through hole 23 and second.Now, the electronics
First pin 31 of element 30 and the outer end of second pin 32 are each passed through the through hole 24 of first through hole 23 and second and difference
It is housed in inside the first hole 13 of the circuit board 10.
In the present embodiment, by the first pin 31 of the electronic component 30 and the outer end of second pin 32 are housed in institute
State in the first hole 13 of circuit board 10, so that first pin 31 and second pin 32 will not occur with other elements
Interference, and then avoid the first pin 31 and the easily damaged or short-circuit defect of second pin 32 of electronic component 30.
In addition, in the present embodiment, one the 3rd welding unit 14 is also included on the upper surface 101 of the circuit board 10, it is described
Connecting plate 20 is towards forming the 3rd welding unit 24 on the lower surface 202 of circuit board 10, and the lower surface 202 of the connecting plate 20
3rd welding unit 24 is correspondingly arranged with the 3rd welding unit 14 on the circuit board 10.
3rd welding unit 14 of the circuit board 10 be located at the welding unit 12 of the first welding unit 11 and second it
Between, and the side of the first parallel walls 131 positioned at first hole 13.In the present embodiment, the 3rd welding unit 14 is
Rectangle, and the direction of its Longitudinal extending and the direction of the Longitudinal extending of 11 and second welding unit of the first welding unit 12 are vertical
Directly.
3rd welding unit 24 of the connecting plate 20 be located at the welding unit 22 of the first welding unit 21 and second it
Between, and a lateral edges of the lower surface 202 positioned at the connecting plate 20.In the present embodiment, the 3rd welding unit 24 is length
It is square, and its Longitudinal extending direction perpendicular to the side of the Longitudinal extending of 21 and second welding unit of the first welding unit 22
To.
The connecting plate 20 is further formed through connecting plate 20 and the on the side side wall of the 3rd welding unit 24
Second deep-slotted chip breaker 220 of three welding units 24.The second metal for covering its whole inner surface is set in second deep-slotted chip breaker 220
Coating 221, and second metal cladding 221 is electrically connected with the 3rd welding unit 24.It is described in the present embodiment
The number of second deep-slotted chip breaker 220 is two, and the two is arranged at intervals.
In the present embodiment, the 3rd welding unit 14 of the 3rd welding unit 24 and the circuit board 10 of the connecting plate 20
Correspondence welding, increases the bonding area of connecting plate 20 and circuit board 10, and then enhances the steadiness of the two connection.Certainly,
When the 3rd welding unit 14 of the 3rd welding unit 24 and the circuit board 10 of the connecting plate 20 is welded, some solder meeting
Climbed along the second metal cladding 221 of the inner surface of the second deep-slotted chip breaker 220 from lower surface 202 towards the direction of upper surface 201
Climb, and finally condense and be housed in second deep-slotted chip breaker 220, so that between the connecting plate 20 and circuit board 10
Bonding area further increases.
Second embodiment
Refer to dual inline type electronic element packaging structure 100a in Fig. 5, the present embodiment include a circuit board 10a,
The connecting plate 20a being arranged on circuit board 10a and the first electricity being electrically connected with by the connecting plate 20a and circuit board 10a
Subcomponent 30a and one second electronic component 30a '.
Fig. 6 is referred to, the circuit board 10a includes surface 101a disposed thereon one first welding unit 11a, the second weldering
Order member 12a and between the first welding unit 11a and the second welding unit 12a and spaced first hole
13a and the second hole 13a '.Wherein, the first hole 13a and the second hole 13a ' runs through the upper surface of the circuit board 10a
101a and lower surface 102a.
Between the first welding unit 11a, the first hole 13a, the second hole 13a ' and the second welding unit 12a
It is arranged at intervals, and is arranged in order in a row.
Refer to Fig. 7, one first welding unit 21a that the connecting plate 20a includes being located on its lower surface 202a, with the
The spaced second welding unit 22a of one welding unit 21a and be arranged on the first welding unit 21a and second welding
First through hole 23a, the second through hole 24a, third through-hole 23b and fourth hole 24b between unit 22a.
It is spaced and sets between the first through hole 23a, the second through hole 24a, third through-hole 23b and fourth hole 24b
Put, and it is in a row along the longitudinal arrangement of the connecting plate 20a.
The the first welding unit 21a and the second welding unit 22a of the connecting plate 20a corresponds to the circuit board 10a respectively
The first welding unit 11a and the second welding unit 12a.24a points of the first through hole 23a of the connecting plate 20a and the second through hole
Not Dui Ying the circuit board 10a the first hole 13a, the connecting plate 20a third through-hole 23b and fourth hole 24b difference
The correspondence circuit board 10a the second hole 13a '.
The first metal layer 231a for covering its periphery inwall is coated with the inwall of the first through hole 23a.Described first
Metal level 231a from the first through hole 23a periphery inwall extend out to the upper surface 201a of the connecting plate 20a respectively
Upper and lower surface 202a.Wherein, the first metal layer 231a on the lower surface 202a of the connecting plate 20a with described first
Welding unit 21a is electrically connected.
The second metal layer 241a for covering its inwall periphery is coated with the inwall of the second through hole 24a.Described second
Metal level 241a from the second through hole 24a inwall periphery extend out to the upper surface 201a of the connecting plate 20a respectively
And on lower surface 202a.Wherein, the second metal layer 241a further extends simultaneously in the lower surface 202a of the connecting plate 20a
It is electrically connected with the second welding unit 22a of the connecting plate 20a.
Similarly, the 3rd metal for covering its inner surface is formed in the third through-hole 23b and fourth hole 24b respectively
Layer 231b and the 4th metal level 241b, the 3rd metal level 231b and the 4th metal level 241b respectively from third through-hole 23b and
Fourth hole 24b extends to connecting plate 20a upper surface 201a and lower surface 202a from inside to outside.
In the present embodiment, the second metal layer 241a and the 3rd metal level 231b is under the connecting plate 20a
It is electrically connected with each other on the 202a of surface.
The first weldering that each edge of the connecting plate 20a is formed on the connecting plate 20a and connecting plate 20a respectively
Order member 21a and the second welding unit 22a multiple first deep-slotted chip breaker 210a, it is each to reduce the connecting plate 20a and its corner
The electronic component at place is interfered,
The the first metal cladding 211a for covering its inner surface is formed in the first deep-slotted chip breaker 210a.Wherein, described
First metal cladding 211a of one welding unit 21a sides is welded on connecting plate 20a lower surface 202a with described first
Order member 21a is electrically connected；First metal cladding 211a of the second welding unit 22a sides is in connecting plate 20a
Lower surface 202a on be electrically connected with the second welding unit 22a.
In order to further enhance the firm connection between the connecting plate 20a and the circuit board 10a, the circuit board
Formed and formed on the 3rd welding unit 14a, the connecting plate 20a and the 3rd welding unit on the circuit board 10a on 10a
The 3rd corresponding 14a welding unit 24a.
The 3rd 14a pairs of welding unit on the 3rd welding unit 24a and circuit board 10a on the connecting plate 20a
It should weld, with the bonding area between increasing circuit plate 10a and connecting plate 20a, so as to strengthen the connecting plate 20a and the electricity
Steadiness between the plate 10a of road.
The 3rd welding unit 14a on the circuit board 10a include one first weld part 141a, the second weld part 142a with
And the 3rd weld part 143a.Between the first weld part 141a, the second weld part 142a and the 3rd weld part 143a
It is arranged at intervals.
The first weld part 141a and the second weld part 142a are arranged on the welding of the first welding unit 11a and second
Between unit 12a, and the side of the first hole 13a and the second hole 13a ' positioned at the circuit board 10a.3rd welding
Portion 143a is located between the first welding unit 11a and the second welding unit 12a, and positioned at the first of the circuit board 10a
Hole 13a and the second hole 13a ' other side.The first welding unit 11a, the second welding unit 12a and the 3rd welding
Unit 14a encloses the periphery located at the first hole 13a and the second hole 13a ' jointly.
In the present embodiment, the company between the first weld part 141a, the second weld part 142a and the 3rd weld part 143a
Line one isosceles triangle of formation.
The 3rd welding unit 24a on the connecting plate 20a include one first weld part 241a, the second weld part 242a with
And the 3rd weld part 243a.The first weld part 241a, the second weld part 242a and the 3rd weld part 243 and the circuit
The first weld part 141a, the second weld part 142a and the 3rd weld part 143a on plate 10a, which are corresponded, to be set.
The first weld part 241a and the second weld part 242a is located at the welding of the first welding unit 21a and second
Between unit 22a, and a lateral edges of the lower surface 202a positioned at the connecting portion 20a.The 3rd weld part 243a is located at
Between the first welding unit 21a and the second welding unit 22a, and positioned at the connecting plate 20a lower surfaces 202a in addition
One lateral edges.The first welding unit 21a, the second welding unit 22a and the 3rd welding unit 24a enclose located at described jointly
First through hole 23a, the second through hole 24a, third through-hole 23b and third through-hole 24b periphery.
In the present embodiment, the first weld part 241a, the second weld part 242a and the 3rd weld part of the connecting plate 20a
Line one isosceles triangle of formation between 243a.
Certainly, in order to further enhance the firm connection between the connecting plate 20a and the circuit board 10a, the company
Formed respectively on fishplate bar 20a side wall and run through the connecting plate 20a, the first weld part 241a, the second weld part 242a and the 3rd
Weld part 243a the second deep-slotted chip breaker 220a.The second deep-slotted chip breaker 220a's is internally formed the second metal for covering its inner surface
Coating 221a.The second deep-slotted chip breaker 220a is welded with the first weld part 241a, the second weld part 242a and the 3rd respectively
Socket part 243a is electrically connected on connecting plate 20a lower surface 202a.
It can be appreciated that when the first electronic component 30a and the second electronic component 30a ' passes through described first, third through-hole respectively
After 23a, 23b and second, fourth hole 24a, 24b are soldered on the circuit board 10, the first electronic component 30a and second
It is connected in series between electronic component 30a '.
Moreover, referring to Fig. 8, the first pin 31a and second pin 32a of the first electronic component 30a are each passed through
The first through hole 23a of the connecting plate 20a and the second through hole 24a, and its outer end is housed in the first hole of the circuit board 10a
Inside 13a；The the first pin 31a ' and second pin 32a ' of the second electronic component 30a ' is each passed through the connecting plate 20a
Third through-hole 23b and fourth hole 24b, and its outer end be housed in the circuit board 10a the second hole 13a ' it is internal so that
So that the first electronic component 30a and the second electronic component 30a ' pin will not interfere with other elements.
3rd embodiment
Refer to dual inline type electronic element packaging structure 100b in Fig. 9, the present embodiment include a circuit board 10b,
The connecting plate 20b that is mounted on the circuit board 10b and it is electrically connected with by the connecting plate 20b and circuit board 10b
The first electronic component 30b and the second electronic component 30b '.
The circuit board 10b includes one first welding unit 11b on surface 101b disposed thereon, one and first welding
Unit 11b intervals and the second parallel welding unit 12b and it is arranged on the first welding unit 11b and the second welding unit
Between 12b and through the circuit board 10b upper surfaces 101b and lower surface 102b the first hole 13b and the second hole 13b '.
Between the first welding unit 11b, the second welding unit 12b, the first hole 13b and the second hole 13b '
It is arranged at intervals.
The first hole 13b and the second hole 13b ' are disposed side by side on the welding of the first welding unit 11b and second
Longitudinally prolong perpendicular to the first welding unit 11b and the second welding unit 12b between the unit 12b and direction of its Longitudinal extending
The direction stretched.
Refer to Figure 10, the connecting plate 20b include one first welding unit 21b, with the first welding unit 21b intervals and
The second parallel welding unit 22b and be arranged between the first welding unit 21b and the second welding unit 22b one
One through hole 23c, one second through hole 24c, a third through-hole 23d and fourth hole 24d.
The first through hole 23c and the second through hole 24c intervals are relative, third through-hole 23d and fourth hole the 24d interval
Relatively, and the third through-hole 23d and fourth hole 24d are set side by side with the first through hole 23c and fourth hole 24c respectively
Put.
On the inwall of the first through hole 23c cover the first metal layer 231c, and the first metal layer 231c respectively from
The inwall of the first through hole 23c extends out to the upper surface 201b and lower surface 202b of the connecting plate 20b.Described first
Metal level 231c and the first welding unit 21b is electrically connected with.
The inwall overlying cap-shaped of the second through hole 24c is divided into second metal layer 241c, and the second metal layer 241c
The upper surface 201b and lower surface 202b of the connecting plate 20b are not extended out to from the inwall of the second through hole 24c.It is described
Second metal layer 241c and the second welding unit 22b is electrically connected with.
Similarly, the 3rd metal level 231d and is formed on the inwall of the third through-hole 23d and fourth hole 24d respectively
Four metal level 241d, and the 3rd metal level 231d and the 4th metal level 241d respectively with first welding unit
21b and the second welding unit 22b is electrically connected with.In this way, then the first metal layer 231c and the 3rd metal level 231d with it is described
First welding unit 21b is electrically connected with, the second metal layer 241c and the 4th metal level 241d and second welding unit
22 are electrically connected with.
It can be appreciated that when the first electronic component 30b and the second electronic component 30b ' passes through the first through hole respectively
23c, 24c are electrically connected with after the circuit board 10b, for simultaneously between the first electronic component 30b and the second electronic component 30b '
Connection connection.
Two pins for being additionally, since the first electronic component 30b extend through the first through hole 23c, the second through hole
24c, and its outer end is housed in the first hole 13b, the second electronic component 30b ' two pins extend through described
Third through-hole 23d, fourth hole 24d, and its outer end is housed in the second hole 13b ' respectively, so that the first electronics
Element 30b and the second electronic component 30b ' pin will not interfere with other electronic components.
Certainly, the connecting plate 20b each edge formation the first deep-slotted chip breaker 210b with reduce the connecting plate 20b with
Other electronic components are interfered.The first metal cladding for covering its inner surface can be further formed in the first deep-slotted chip breaker 210b
211b。
In order to further enhance the stable connection between the connecting plate 20b and the circuit board 10b, the circuit board
Formed on 10b on the 3rd welding unit 14b, the connecting plate 20b and be formed at the 3rd welding unit 14b the corresponding the 3rd
Welding unit 24b.
The 3rd welding unit 14b on the circuit board 10b include one first weld part 141b and with first weld part
The second relative weld part 142b of 141b intervals.The first weld part 141b and the second weld part 142b is located at the described first weldering
Between order member 11b and the second welding unit 12b, and enclose with the first welding unit 11b and the second welding unit 12b and set institute
State the first hole 13b and the second hole 13b ' in the inner.
The 3rd welding unit 24b on the connecting plate 20b include one first weld part 241b and with first weld part
The second relative weld part 242b of 241b intervals.
It is single that the first weld part 214b and the second weld part 242b is located at the welding of the first welding unit 21b and second
Between first 22b, and positioned at the both sides of the edge of the connecting plate 20b lower surfaces 202b.The first welding unit 241b and second
Welding unit 242b and the first welding unit 21b and the second welding unit 22b enclose jointly sets the first through hole 23c, the
Two through hole 24c, third through-hole 23d and fourth hole 24d are in the inner.
Similar to the second deep-slotted chip breaker 220,220a in the first embodiment and second embodiment, in the present embodiment, institute
State connecting plate 20b and further form the second deep-slotted chip breaker 220b for running through the 3rd welding unit 24b, and second deep-slotted chip breaker
The the second metal cladding 221b for covering its inner surface and being electrically connected with the 3rd welding unit 24b is formed in 220b.
It is understood that for the person of ordinary skill of the art, can be done with technique according to the invention design
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (10)
1. a kind of dual inline type electronic element packaging structure, including a circuit board, the connection that is mounted on the circuit board
Plate and one first electronic component, it is characterised in that：The circuit board include one first hole, the connecting plate include with it is described
First through hole and the second through hole that the connection of first hole is set, first electronic component have the pin protruded out, described first
First through hole and second through hole and first hole that is housed in the circuit board of the pin of electronic component through the connecting plate
In.
2. dual inline type electronic element packaging structure as claimed in claim 1, it is characterised in that：The circuit board includes one
First welding unit and with spaced second welding unit of its first welding unit, the circuit board the first hole position
The first welding unit and the second welding unit interval between its first welding unit and the second welding unit and with circuit board
Set, the connecting plate includes the first of welding corresponding with the first welding unit and the second welding unit of the circuit board respectively
Welding unit and the second welding unit, the first through hole of the connecting plate and the second through hole are located at its first welding unit and second
Between welding unit.
3. dual inline type electronic element packaging structure as claimed in claim 2, it is characterised in that：One the first metal layer is covered
The inwall of the first through hole and the upper and lower surface that the connecting plate is extended respectively to along its inwall, first metal
First welding unit of layer and connecting plate is electrically connected with, and a second metal layer covers second through-hole wall and divided along its inwall
Do not extend to the upper and lower surface of the connecting plate, the second welding unit of the second metal layer and connecting plate electrically connects
Connect.
4. dual inline type electronic element packaging structure as claimed in claim 3, it is characterised in that：The first of the connecting plate
Welding unit and the second welding unit are located at the opposite sides edge of its lower surface respectively.
5. dual inline type electronic element packaging structure as claimed in claim 4, it is characterised in that：Each side of the connecting plate
Angle has the first deep-slotted chip breaker through the upper and lower surface of connecting plate and its first welding unit and the second welding unit.
6. dual inline type electronic element packaging structure as claimed in claim 5, it is characterised in that：In first deep-slotted chip breaker
The first metal cladding for covering its inner surface is formed, and positioned at the first metal cladding of the first welding unit of connecting plate side
It is electrically connected with the first welding unit of connecting plate, the first metal cladding and company positioned at the second welding unit of connecting plate side
Second welding unit of fishplate bar is electrically connected with.
7. dual inline type electronic element packaging structure as claimed in claim 2, it is characterised in that：The circuit board is further
Including one positioned at one the 3rd welding unit between the welding unit of circuit board first and the second welding unit, the connecting plate enters one
Step include one positioned between the welding unit of connecting plate first and the second welding unit and with the 3rd welding unit of the circuit board
3rd welding unit of correspondence welding.
8. dual inline type electronic element packaging structure as claimed in claim 3 further comprises one second electronic component, institute
State circuit board further comprise one be located between the welding unit of circuit board first and the second welding unit and with the first hole interval
The second hole set, the connecting plate further comprises the third through-hole and fourth hole for running through lower surface thereon, described
The pin of second electronic component extends through the third through-hole and fourth hole and its outer end is housed in second hole respectively
In hole.
9. dual inline type electronic element packaging structure as claimed in claim 8, it is characterised in that：The first through hole,
Two through holes, third through-hole and fourth hole are intervally installed, and the described 3rd and the inner surface of fourth hole be covered each by
Three, the 4th metal levels, inner surface of the three, the 4th metal level along the 3rd and fourth hole extends to the upper table of connecting plate
Face and lower surface, wherein, the second metal layer is electrically connected with so that the first electronic component and second with the 3rd metal level
Electronic component is connected.
10. dual inline type electronic element packaging structure as claimed in claim 8, it is characterised in that：The first through hole,
Two through holes, third through-hole and fourth hole are intervally installed, and the described 3rd and the inner surface of fourth hole be covered each by
Three, the 4th metal levels, inner surface of the three, the 4th metal level along the 3rd and fourth hole extends to the upper table of connecting plate
Face and lower surface, wherein, the first welding unit of the 3rd metal level and the connecting plate is electrically connected with, the 4th metal
Layer is electrically connected with to cause first electronic component and the second electronic component in parallel with the second welding unit of the connecting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310519122.7A CN104582269B (en) | 2013-10-29 | 2013-10-29 | Dual inline type electronic element packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310519122.7A CN104582269B (en) | 2013-10-29 | 2013-10-29 | Dual inline type electronic element packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104582269A CN104582269A (en) | 2015-04-29 |
| CN104582269B true CN104582269B (en) | 2017-08-08 |
Family
ID=53097162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310519122.7A Expired - Fee Related CN104582269B (en) | 2013-10-29 | 2013-10-29 | Dual inline type electronic element packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104582269B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561619A (en) * | 2018-12-29 | 2019-04-02 | 昂纳信息技术（深圳）有限公司 | A kind of electronic component combination unit and preparation method thereof |
| CN111354697B (en) * | 2020-04-21 | 2020-10-23 | 深圳市信展通电子有限公司 | Semiconductor integrated circuit device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6798228B2 (en) * | 2003-01-10 | 2004-09-28 | Qualitau, Inc. | Test socket for packaged semiconductor devices |
| CN2859845Y (en) * | 2005-10-14 | 2007-01-17 | 北京工业大学 | Safety stand for DIP programmable chip programme debugging |
| JP4973907B2 (en) * | 2005-11-15 | 2012-07-11 | 日本圧着端子製造株式会社 | Dip connector |
| CN101111126A (en) * | 2006-07-18 | 2008-01-23 | 明基电通信息技术有限公司 | Circuit board |
| CN201523486U (en) * | 2009-09-14 | 2010-07-07 | 英业达股份有限公司 | Carrier plate |
| CN202172148U (en) * | 2011-07-13 | 2012-03-21 | 镇江惠通元二接插件有限公司 | Printed circuit board direct insertion type connector socket |
-
2013
- 2013-10-29 CN CN201310519122.7A patent/CN104582269B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN104582269A (en) | 2015-04-29 |
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Effective date of registration: 20180224 Address after: 201613 Shanghai city south of Songjiang Export Processing Zone Road No. 1925 Patentee after: Ambit Microsystems (Shanghai) Ltd. Address before: 201613 Shanghai City, Songjiang District Songjiang Export Processing Zone South Road No. 1925 Co-patentee before: HON HAI PRECISION INDUSTRY Co.,Ltd. Patentee before: Ambit Microsystems (Shanghai) Ltd. |
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Granted publication date: 20170808 |