CN104579229B - Piezoelectric vibration piece and piezoelectric vibrator - Google Patents
Piezoelectric vibration piece and piezoelectric vibrator Download PDFInfo
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- CN104579229B CN104579229B CN201410589846.3A CN201410589846A CN104579229B CN 104579229 B CN104579229 B CN 104579229B CN 201410589846 A CN201410589846 A CN 201410589846A CN 104579229 B CN104579229 B CN 104579229B
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Abstract
The present invention provides the leakage of vibration of vibrating arm when can inhibit installation to the piezoelectric vibration piece of packaging part and has the piezoelectric vibrator of this piezoelectric vibration piece.One mode of the piezoelectric vibration piece of the present invention is characterized in that having：A pair of of vibrating arm is abreast configured in width direction；Supporting arm part is configured between a pair of of vibrating arm；Base portion connects a pair of of vibrating arm and supporting arm part；And department of assembly, it is set to supporting arm part, wherein in the length direction of the support arm, formed a groove between department of assembly and base portion.
Description
Technical field
The present invention relates to piezoelectric vibration piece and piezoelectric vibrators.
Background technology
In recent years, in portable telephones and portable information terminal devices, it is used as the moment using the piezoelectric vibrator of quartz etc.
Timing source, the derived reference signal etc. of source, control signal etc..Known various this piezoelectric vibrators, for example, as one of them,
There is the piezoelectric vibrator with such piezoelectric vibration piece, which has：From a pair of of vibrating arm of connection
The base portion of end, the supporting arm part extended between a pair of vibrating arm parts along direction same as the vibrating arm（For example, referring to special
Sharp document 1）.
Patent document 1：No. 4259842 bulletins of Japanese Patent No..
Invention content
Piezoelectric vibration piece as described above is set to the substrate base of packaging part via the department of assembly for being set to supporting arm part
On plate.Leaking to basal substrate from department of assembly contact with the base substrate accordingly, there exist the vibration of vibrating arm, this is asked
Topic.
One embodiment of the present invention is completed in view of the above problems, one of its goals is to：Offer can inhibit to install
When vibrating arm leakage of vibration to packaging part piezoelectric vibration piece and have the piezoelectric vibrator of this piezoelectric vibration piece.
One mode of the piezoelectric vibration piece of the present invention is characterized in that having：A pair of of vibrating arm, width direction simultaneously
The configuration of row ground；Supporting arm part is disposed between the pair of vibrating arm portions；Base portion connects the pair of vibrating arm and described
Supporting arm part；And department of assembly, it is set to the supporting arm part, wherein in the length direction of the support arm, described
It is formed a groove between department of assembly and the base portion.
It can also be the structure that the groove portion is formed throughout the entirety of the width direction of the supporting arm part.
Can also be that at least part of the groove portion is formed in the structure of the department of assembly.
It can also be the structure that the groove portion is formed near the root of the supporting arm part.
Can also be to be formed with the groove portion that there is roughly the same depth with the groove portion in the pair of vibrating arm
Structure.
Can also be the supporting arm part quality be the pair of vibrating arm among a vibrating arm
Structure more than quality.
One mode of the piezoelectric vibrator of the present invention is characterized in that having：Packaging part, the packaging part have substrate
Component and The lid component, the The lid component are overlapped with the basal component and are engaged and in the The lid component and the substrate structure
Gas-tight seal cavity is formed between part；And above-mentioned piezoelectric vibration piece, the piezoelectric vibration piece are assemblied in the basal component
In mounting surface, and accommodate in the cavity.
A mode according to the present invention provides the leakage of vibration of vibrating arm when can inhibit installation to the pressure of packaging part
Electric oscillation piece and the piezoelectric vibrator for having this piezoelectric vibration piece.
Description of the drawings
Fig. 1 is the exploded perspective view for the piezoelectric vibrator for showing the 1st embodiment.
Fig. 2 is the plan view for the piezoelectric vibration piece for showing the 1st embodiment.
Fig. 3 is the figure for the piezoelectric vibration piece for showing the 1st embodiment, is the III-III sectional views in Fig. 2.
Fig. 4 is the flow chart of the manufacturing method for the piezoelectric vibration piece for showing the 1st embodiment.
Fig. 5 is the definition graph of the effect for the piezoelectric vibration piece for illustrating the 1st embodiment.
Fig. 6 is the plan view for the piezoelectric vibration piece for showing the 2nd embodiment.
Fig. 7 is the plan view for the piezoelectric vibration piece for showing the 3rd embodiment.
Fig. 8 is the definition graph of the effect for the piezoelectric vibration piece for illustrating the 3rd embodiment.
Fig. 9 is the plan view for the piezoelectric vibration piece for showing the 4th embodiment.
Figure 10 is the figure of an example of the embodiment for showing oscillator.
Figure 11 is the figure of an example of the embodiment for showing electronic equipment.
Figure 12 is the figure of an example of the embodiment for showing radio controlled timepiece.
Specific implementation mode
Hereinafter, on one side with reference to figure, on one side piezoelectric vibration piece according to the embodiments of the present invention and piezoelectric vibration
Device illustrates.
In addition, the scope of the present invention embodiment not limited to the following, can appoint within the scope of the technical idea of the present invention
Meaning changes.In addition, in the following figures, for easy understanding each structure, makes sometimes in actual construction and each construction
The differences such as engineer's scale, quantity.
（1st embodiment）
[piezoelectric vibrator]
Fig. 1 is the exploded perspective view for the piezoelectric vibrator 1 for showing present embodiment.
As shown in Figure 1, the piezoelectric vibrator 1 of present embodiment is the so-called ceramic package that shape is substantially rectangular parallelepiped
The surface mounted vibrator of type.Piezoelectric vibrator 1 has：Packaging part 2 with gas-tight seal cavity C and receiving
In the piezoelectric vibration piece 50 of cavity C.
In addition, in the following description, setting XYZ axis, with reference to the XYZ coordinate system, and illustrate that the position of each component is closed
System.At this point, will be with piezoelectric vibration piece 50（Referring to Fig.1）The parallel direction of thickness direction be set as Z axis to will be with Z axis to vertical
And with piezoelectric vibrator 1（Referring to Fig.1）The parallel direction of length direction be set as X axis, will with Z axis to and X axis it is vertical simultaneously
The direction parallel with the width direction of piezoelectric vibrator 1 is set as Y-axis.
Packaging part 2 has：Package body（Basal component）3 and hush panel（The lid component）4.Package body 3 is tool
There is the component of recess portion 3a with the end.Hush panel 4 blocks the opening of the recess portion 3a of package body 3, and is connect with package body 3
It closes.Cavity C is comparable to the inner space of the inside of the recess portion 3a of package body 3, passes through package body 3 and hush panel 4
And it is separated with the outside of packaging part 2.
Package body 3 includes：1st basal substrate 10, the 2nd basal substrate 11 configured on the 1st basal substrate 10, with
And the sealing ring 12 configured on the 2nd basal substrate 11.
1st basal substrate 10 and the 2nd basal substrate 11 are to overlook（The faces XY view）When shape be respectively general rectangle
Tabular component.2nd basal substrate 11 is overlooked（The faces XY view）When appearance and size it is roughly the same with the 1st basal substrate 10.
1st basal substrate 10 and the 2nd basal substrate 11 are ceramic respectively.1st basal substrate 10 and the 2nd basal substrate
11 forming material can make for example using aluminium oxide as the hard-fired ware of principal component（HTCC：High Temperature
Co-Fired Ceramic）, can also be the low-temperature sintering ceramics such as glass ceramics（LTCC：Low Temperature Co-
Fired Ceramic）.
2nd basal substrate 11 is Chong Die with the 1st basal substrate 10, by with the 1st basal substrate 10 sintering etc. bys combined.That is,
2nd basal substrate 11 is integrated with the 1st basal substrate 10.In the 2nd basal substrate 11, towards with 10 phase of the 1st basal substrate
Anti- face, is equivalent to the bottom surface of the recess portion 3a of package body 3, and is the mounting surface 11a for assembling piezoelectric vibration piece 50.
Sealing ring 12 is to overlook（The faces XY view）When rectangle frame member, include the side of the recess portion 3a of package body 3
Wall.Sealing ring 12 is overlooked（The faces XY view）When an appearance and size circle smaller than the 2nd basal substrate 11.Sealing ring 12 by using
The sintering of the flux materials such as silver solder, solder material etc. adheres to and is bonded on mounting surface 11a.Sealing ring 12 can also by for
Deposition of the metallic bond layer formed on mounting surface 11a etc. and engaged with mounting surface 11a.The metallic bond layer can also use
Electrolytic plating method, electroless plating method, vapour deposition method, sputtering method at least one and formed.
Sealing ring 12 is electroconductive member, for example, including nickel-base alloy.The nickel-base alloy can also include Kovar alloy,
Elinvar（elinvar）, invar alloy（invar）, it is one kind or two or more in No. 42 alloys.The formation material of sealing ring 12
Material can also be selected from the material close with the 1st basal substrate 10 and 11 coefficient of thermal expansion of the 2nd basal substrate.For example, making
It is 6.8 × 10 with coefficient of thermal expansion-6/ DEG C forming material of the aluminium oxide as the 1st basal substrate 10 and the 2nd basal substrate 11
In the case of, it is 5.2 × 10 that the forming material of sealing ring 12, which can be coefficient of thermal expansion,-6/ DEG C Kovar alloy, can also be heat it is swollen
Swollen coefficient is 4.5~6.5 × 10-6/ DEG C No. 42 alloys.
Hush panel 4 overlaps on sealing ring 12, and the opening of plug for seal ring 12（The opening of recess portion 3a）.Above-mentioned cavity C
It is the space surrounded by the 2nd basal substrate 11, sealing ring 12 and hush panel 4.That is, piezoelectric vibration piece 50 is overlooked（The faces XY regard
Figure）When be contained in the inside of sealing ring 12.
Hush panel 4 is conductive board, and is engaged with sealing ring 12.Seam of the sealing ring 12 for example by making roller electrode contact
Welding, laser welding, ultrasonic bonding etc. are welded and are engaged with hush panel 4.The case where hush panel 4 and sealing ring 12 are welded
Under, in the lower surface of hush panel 4（The side surfaces-Z）With the upper surface of sealing ring 12（The side surfaces+Z）In one or both set
When being equipped with the bonding layer of nickel, gold etc., the reliability of the engagement by welding is improved, it is easy to ensure that the air-tightness of such as cavity C.
On the mounting surface 11a of the 2nd basal substrate 11 in the inside of sealing ring 12, it is provided with electrode pad 14 and electrode
Pad 15.Electrode pad 14 is a pair of terminal being electrically connected with piezoelectric vibration piece 50 with electrode pad 15.Electrode pad 14 and electricity
Pole pad 15 is, for example, bump electrode.
Although followed by detailed description, in piezoelectric vibration piece 50, be provided with substrate installation department of assembly 16 and
Department of assembly 17.Electrode pad 14 is electrically connected with the assembly electrode formed in the department of assembly of piezoelectric vibration piece 50 16, electrode pad 15
It is electrically connected with the assembly electrode formed in the department of assembly of piezoelectric vibration piece 50 17.
In the lower section side of the 1st basal substrate 10（The sides-Z）Surface, be provided with external electrode 18 and external electrode 19.
External electrode 18 and external electrode 19 are from device, such as installation piezoelectric vibrator 100 outside piezoelectric vibrator 1
Device receive the terminal of power supply.
In package body 3, it is provided with the 1st wiring of electrical connection electrode pad 14 and external electrode 18（It is not shown）, with
And the 2nd wiring of electrical connection electrode pad 15 and external electrode 19（It is not shown）.That is, to external electrode 18 apply current potential be through
By the 1st wiring and electrode pad 14, and apply to the assembly electrode formed in the department of assembly of piezoelectric vibration piece 50 16.In addition,
The current potential applied to external electrode 19 is via the 2nd wiring and electrode pad 15, and in the department of assembly of piezoelectric vibration piece 50 17
What the assembly electrode of formation applied.Piezoelectric vibration piece 50 is vibrated by the electric power supplied to each assembly electrode.
In addition, the 1st wiring includes：Such as in thickness direction（Z axis to）Penetrate through the 1st basal substrate 10 and with external electrode 18
Conducting the 1st through electrode, in thickness direction（Z axis to）The 2nd for penetrating through the 2nd basal substrate 11 and being connected with electrode pad 14 is passed through
Energization pole and setting between the 1st basal substrate 10 and the 2nd basal substrate and are electrically connected the 1st through electrode and the 2nd perforation electricity
The connecting wiring of pole.2nd wiring of electrical connection electrode pad 15 and external electrode 19 is same structure with the 1st wiring.1st cloth
Line and the structure of the 2nd wiring can suitably change.
[piezoelectric vibration piece]
Then, the piezoelectric vibration piece of present embodiment 50 is illustrated.
Fig. 2 and Fig. 3 is the figure for the piezoelectric vibration piece 50 for showing present embodiment.Fig. 2 is plan view（The faces XY figure）.Fig. 3 is
III-III sectional views in Fig. 2.
Piezoelectric vibration piece 50 is that have to act as electrode or wiring in the formation of the piezoelectricity body such as quartz, lithium tantalate, lithium niobate
The plate-shaped member of the spin offs such as conductive film pattern.The piezoelectric vibration piece 50 of present embodiment is so-called central arm type piezoelectricity
Vibrating reed.
As shown in Fig. 2, piezoelectric vibration piece 50 has：In width direction（Y-axis）A pair of of the vibrating arm abreast configured
20（Vibrating arm 23,24）, the supporting arm part 21, a pair of of vibrating arm 20 of connection and the branch that configure between a pair of of vibrating arm 20
The base portion 22 in brace portion 21, the department of assembly 16,17 for being set to supporting arm part 21.In the present embodiment, a pair of of vibrating arm 20,
Supporting arm part 21 and base portion 22 are integrally formed, and adjacent each portion is not with having interface continuous.In fig. 2, in order to show each portion
Range shows the cardinal extremity in each portion or front end with double dot dash line.
Base portion 22 connects supporting arm part 21 and vibrating arm 20（Vibrating arm 23,24）.
As shown in Fig. 2, base portion 22 is along the direction intersected with the length direction of supporting arm part 21（Y-axis）Extend.Base portion 22
It overlooks（The faces XY view）When shape be rectangle.
On the right side of the diagram of base portion 22（The sides+X）In diagram on the upside of（The sides+Y）End be connected with vibrating arm 23.
On the right side of the diagram of base portion 22（The sides+X）In diagram on the downside of（The sides-Y）End be connected with vibrating arm 24.In the figure of base portion 22
Show right side（The sides+X）In central portion be connected with supporting arm part 21.
As shown in Fig. 2, a pair of of vibrating arm 20 includes vibrating arm 23 and vibrating arm 24.
Vibrating arm 23,24 is respectively in the side of length direction（The sides-X）End connect with base portion 22.Vibrating arm 23
With vibrating arm 24 with respect to the width direction of piezoelectric vibration piece 50（Y-axis）On center and in length direction（X-axis
To）Upper parallel line and line is symmetrically arranged.Since vibrating arm 23 is identical as the shape of vibrating arm 24 and size, so
In the following description, sometimes illustrated as representative, only about vibrating arm 23.
Vibrating arm 23 has：The strap 25 and width linearly extended with substantially uniform width（Y-axis is long
Degree）Than 25 broader hammer portion 26 of strap.Same, vibrating arm 24 has strap 29 and hammer portion 30.In addition,
This, there is the structure of hammer portion 30 to illustrate vibrating arm 23, but the implementation of the present invention is not limited to this, can also
It is the type without hammer portion.
The strap 25 of vibrating arm 23 is from base portion 22 along the length direction of piezoelectric vibrator 1（X axis）, with support
21 same side of arm（The sides+X）Linearly extend.That is, strap 25（Vibrating arm 23）Length direction and piezoelectric vibrator 1
Length direction（X axis）It is substantially parallel, also with the length direction of supporting arm part 21（X axis）It is substantially parallel.
It is formed with groove portion in strap 25（The groove portion of vibrating arm）27.The length direction of groove portion 27 and vibrating arm 23（X
It is axial）It extends roughly in parallel.As shown in figure 3, groove portion 27 is on the surface of piezoelectric vibration piece 50（The side surfaces+Z, another face）
50a and the back side（The side surfaces-Z, a face）50b is formed, the thickness direction of depth direction and piezoelectric vibration piece 50（Z axis to）
It is substantially parallel.It is same, it is formed with groove portion in the strap 29 of vibrating arm 24（2nd groove portion）28.
Hammer portion 26 is set to the side opposite with the side being connect with base portion 22 in strap 25（The sides+X）End.Equally
In this way, hammer portion 30 is set to the side opposite with the side of the connection of base portion 22 in strap 29（The sides+X）End.
As shown in figure 3, being formed with excitation electrode 32 and excitation electrode 33 on the surface of vibrating arm 23.
The surface of vibrating arm 23 in excitation electrode 32 and groove portion 27 and the vibrating arm 23 around groove portion 27
Surface is continuously formed.Excitation electrode 32 is via the extraction electrode for being set to base portion 22 and supporting arm part 21（It is not shown）, and it is rear
The assembly electrode electrical connection for being formed in department of assembly 16 stated.That is, excitation electrode 32 is electrically connected with external electrode 18 shown in FIG. 1.
Excitation electrode 33 is discontinuously formed with excitation electrode 32, is insulated with excitation electrode 32.Excitation electrode 33 is vibrating
The side intersected among arm 23, with the surface 50a of the surface 50a of piezoelectric vibration piece 50 and piezoelectric vibration piece 50（With Y-axis
Vertical face）And the back side 50b of piezoelectric vibration piece 50 is continuously formed.
Excitation electrode 33 is via the extraction electrode for being set to base portion 22 and supporting arm part 21（It is not shown）, with aftermentioned formation
Assembly electrode in department of assembly 17 is electrically connected.That is, excitation electrode 33 is electrically connected with external electrode 19 shown in FIG. 1.
Excitation electrode 32 and excitation electrode 33 receive power supply from external electrode 18 and external electrode 19, and shake to composition
The piezoelectrics in swing arm portion 23 apply electric field.When applying electric field to vibrating arm 23 from excitation electrode 32 and excitation electrode 33,
Close direction and separate direction, are vibrated using the connecting pin with base portion 22 as starting point with supporting arm part 21.
It is formed with excitation electrode 34 and excitation electrode 35 on the surface of vibrating arm 24.
Excitation electrode 34 is formed in the position corresponding with excitation electrode 33 in vibrating arm 23.Excitation electrode 34 is via setting
It is placed in the extraction electrode of base portion 22 and supporting arm part 21（It is not shown）, it is electrically connected with the aftermentioned assembly electrode for being formed in department of assembly 16
It connects.
Excitation electrode 35 is formed in the position corresponding with excitation electrode 32 in vibrating arm 23.Excitation electrode 35 is via setting
It is placed in the extraction electrode of base portion 22 and supporting arm part 21（It is not shown）, it is electrically connected with the aftermentioned assembly electrode for being formed in department of assembly 17
It connects.
Vibrating arm 24 is identical as vibrating arm 23, using the electric power supplied from external electrode 18 and external electrode 19, from
Excitation electrode 32 and excitation electrode 33 apply electric field to the piezoelectrics for constituting vibrating arm, in the direction close with supporting arm part 21
With separate direction, vibrated as starting point using the connecting pin with base portion 22.
The shape of supporting arm part 21 is to overlook（The faces XY view）When rectangle, the length of length direction and piezoelectric vibrator 1
Direction（X axis）It is substantially parallel.Supporting arm part 21 is from base portion 22 along the length direction of piezoelectric vibrator 1（X axis）, with shake
20 same side of swing arm portion（The sides+X）Linearly extend.In the present embodiment, the quality of supporting arm part 21 is a pair of of vibrating arm
It is more than the quality of the vibrating arm 23,24 among 20.In the present embodiment, due to vibrating arm 23 and vibrating arm 24
Shape and size are identical, so identical in quality.Therefore, the quality of supporting arm part 21 is the matter of vibrating arm 23, either one or two of 24
It is more than amount.
As shown in figure 3, in supporting arm part 21, it is formed with surface groove（Groove portion）40a and back groove（Groove portion）40b.This
Outside, here, on surface and this two sides of the back side there is the mode of groove portion to illustrate, but groove portion is present in surface and the back side
Either one or two of.
As shown in Fig. 2, surface groove 40a and back groove 40b, in the length direction of supporting arm part 21（X axis）Dress
With portion 16（Department of assembly 17）It is formed between base portion 22.In the present embodiment, surface groove 40a and back groove 40b are being propped up
22 side of base portion in brace portion 21（The sides-X）End near（Near root）It is formed.
Here, length directions of the surface groove 40a and back groove 40b in supporting arm part 21（X axis）Department of assembly 16
The length direction it is meant that about supporting arm part 21 in supporting arm part 21 is formed between base portion 22（X axis）, at least exist
Slot is formed between department of assembly 16 and base portion 22, and the slot is also allowed to extend to the length direction of supporting arm part 21（X axis）Assembly
Range other than between portion 16 and base portion 22.
That is, length directions of the surface groove 40a and back groove 40b in supporting arm part 21（X axis）Department of assembly 16 with
It is formed between base portion 22 and also includes, for example, length directions of the surface groove 40a and back groove 40b from supporting arm part 21（X-axis
To）In ratio department of assembly 16,17 closer to 22 side of base portion（The sides-X）It is formed than department of assembly 16,17 closer to front end side（+ X
Side）Such situation.
Surface groove 40a is formed in the surface 50a of piezoelectric vibration piece 50.Back groove 40b is formed in piezoelectric vibration piece 50
Back side 50b.In the present embodiment, surface groove 40a and back groove 40b are overlooked（The faces XY view）When be rectangle, and
Superposed it is arranged.The vertical view of surface groove 40a and back groove 40b（The faces XY view）When size be not particularly limited.
As shown in figure 3, in the present embodiment, the depth T2 of surface groove 40a and back groove 40b, and in shaker arm
The depth T1 for the groove portion 27,28 that portion 20 is formed is identical.
Here, in the present specification " identical ", may not be it is accurate identical, for example, including depth T1's and depth T2
Than the range of the ratio for 0.9 or more, 1.1 or less degree.It is also the same such about other various sizes.
For example, the thickness of piezoelectric vibration piece 50 be 90 μm or more, 150 μm of degree below in the case of, as surface
The depth of groove portion 40a and back groove 40b are 30 μm or more, 72 μm of degree below.
As shown in Fig. 2, department of assembly 16,17 is length of the back side sides 50b in supporting arm part 21 along supporting arm part 21
Direction（X axis）And abreast it is arranged.Department of assembly 16 is arranged more to lean on 22 side of base portion than department of assembly 17（The sides-X）.
It is formed with assembly electrode in department of assembly 16（It is not shown）.It is and shown in FIG. 1 in the assembly electrode that department of assembly 16 is formed
Electrode pad 14 is electrically connected.For example, being contacted with electrode pad 14 by department of assembly 16 is via conductive adhesive, it is formed in dress
Assembly electrode with portion 16 is connected with electrode pad 14.
It is same, it is formed with assembly electrode in department of assembly 17（It is not shown）.It is identical as department of assembly 16, it is formed in department of assembly
17 assembly electrode is electrically connected with electrode pad 15.
In addition, department of assembly 16 can not also be in direct contact electrode pad 14 via conductive adhesive.In addition, department of assembly
16 are electrically connected with electrode pad 14, can also use the connection method other than bump electrode.
[manufacturing method of piezoelectric vibration piece]
Then, the manufacturing method of the piezoelectric vibration piece of present embodiment 50 is illustrated.
Fig. 4 is the flow chart for the manufacturing method for showing piezoelectric vibration piece 50.
As shown in figure 4, preparing the wafer that polishing terminates, is accurately finish-machined to given thickness first（S1）.Then, into
Row shape forming process（S2）, wherein etch by photolithography the wafer and form multiple piezoelectric vibration pieces 50 in the wafer
Outer shape.For the process, it is specifically described.
First, it is respectively formed etching protective film on two surfaces of wafer（S2a）.As the etching protective film, for example, being formed
Several μm of chromium（Cr）.Then, photoetching technique composition photoresist film is utilized on etching protective film.At this point, being patterned into Fig. 2 institutes
It is showing, surround have supporting arm part 21, base portion 22, a pair of of vibrating arm 23,24 piezoelectric vibration piece 50 around shape.And
And it is etched processing by mask of the photoresist film, not masked etching protective film is selectively removed.Moreover,
Photoresist film is removed after etching and processing.
The outer shape along piezoelectric vibration piece 50, i.e. supporting arm part 21, base portion 22 and a pair of of vibrating arm are formed as a result,
23, the etching protective film that 24 outer shape is patterned（S2b）.At this point, the quantity of the piezoelectric vibration piece 50 manufactured
Composition.
Then, using the etching protective film of institute's composition as mask, two surfaces of difference etching and processing wafer（S2c）.It selects as a result,
The region for not being etched protective film masking is removed to selecting property, the outer shape of appearance piezoelectric vibration piece 50 is capable of.
In the above manner, shape forming process（S2）Terminate, forms multiple outer shapes with piezoelectric vibration piece 50
Piezoelectric board.
Then, groove formation process is carried out（S3）, wherein shape on the interarea of a pair of of vibrating arm 23,24 shown in Fig. 2
At groove portion 27,28, and surface groove 40a and back groove 40b is formed on the interarea of supporting arm part 21.Specifically, with
It is identical when shape formation above-mentioned, photoresist film is formed on the patterned etching protection film.Moreover, passing through photoetching skill
Art, the composition photoresist film in a manner of diging up groove portion 27,28, the region of surface groove 40a and back groove 40b.Moreover,
It is etched processing as mask using the photoresist film of institute's composition, etching protective film is selectively removed.Then, pass through removing
Photoresist film can dig up groove portion 27,28, in the state of the region of surface groove 40a and back groove 40b
The further composition of etching protective film of composition.
Then, using the etching protective film of the composition again as mask, after etching and processing wafer, the etching as mask is removed
Protective film.Thereby, it is possible to form a groove 27,28 on the interarea of a pair of of vibrating arm 23,24, and in the master of supporting arm part 21
Surface groove 40a and back groove 40b is formed on face.
In addition, multiple piezoelectric boards become the state via linking part and wafer connection, until the cut-out then carried out
Process.
Then, electrode forming process is carried out（S4）, wherein by carrying out the exposure by mask, in multiple piezoelectric boards
Patterning electrode film on outer surface is respectively formed excitation electrode 32,33,34,35, assembly electrode and extraction electrode.For the process
It is described in detail.
In electrode forming process, first, electrode film is formed by being deposited, sputtering etc. in the outer surface of piezoelectric board（S4a）.
As the electrode film of formation, for example, the lit-par-lit structure of chromium above-mentioned and gold can be set as.
Then, carry out being formed the photoresist film formation process of photoresist film on electrode film（S4b）.This is photic
Resist is the compound based on the resin to ultraviolet light with luminous sensitivity, uses eurymeric light in the present embodiment
Cause resist.
By the process, photoresist film is formed on electrode film.
Then, it is exposed process（S4c）, wherein pass through excitation electrode 32,33,34,35, assembly electrode and extraction electricity
The photomask of region openings other than the forming region of pole exposes ultraviolet light to photoresist film.By the process, to pass through
Photoresist film and by film covering to leave the part of electrode film in advance in a manner of, composition photoresist film.
As conditions of exposure, for example, light exposure can be set as 900Jm/cm with cumulative amount2。
After exposure, by developer solution remove should not part by so that photoresist film is cured by heating process etc.
（S4d）.Moreover, passing through metal etch（S4e）, form the photoresist film based on shape corresponding to the electrode forming part
Photoresist pattern.In this way, by removing the photoresist film（S4f）, form excitation electrode 32,33,34,35, assembly electricity
Pole and extraction electrode, and terminate electrode forming process（S4）.
Finally, cut off operation is carried out（S5）, wherein the linking part of cut-out connection wafer and multiple piezoelectric boards is cut from wafer
Cut the multiple piezoelectric boards of separation and panelization.Thereby, it is possible to from 1 piece of wafer, once manufacture multiple central arm type piezoelectric vibration pieces 50.
At this point, the manufacturing process of piezoelectric vibration piece 50 terminates, piezoelectric vibration piece 50 shown in Fig. 2 is obtained.
According to the piezoelectric vibration piece 50 of present embodiment, the length direction of the supporting arm part 21 in supporting arm part 21（X-axis
To）Department of assembly 16 and base portion 22 between formed surface groove 40a and back groove 40b.Therefore, via base portion 22, from vibration
The vibration that arm 23,24 is conducted to supporting arm part 21 decays at the position for forming surface groove 40a and back groove 40b.Cause
This, shakes in the vibration decaying conducted to the position for being provided with department of assembly 16 and department of assembly 17 by piezoelectricity according to present embodiment
When the installation of movable plate 50 is to packaging part 2, the vibration of vibrating arm 20 can be inhibited from the department of assembly 16 contacted with the 2nd basal substrate 11
And department of assembly 17 leaks to packaging part 2.Further, since as described above at least one shape on the surface of supporting arm part 21 and the back side
At groove portion, even thus, for example in the case where surface groove 40a is only arranged, same effect can be also obtained.
In addition, the piezoelectric vibrator 1 according to present embodiment, due to installing above-mentioned piezoelectric vibration piece 50, so can press down
The leakage of vibration of piezoelectric vibration piece 50 processed obtains piezoelectric vibrator excellent in reliability to packaging part 2.
In addition, the piezoelectric vibration piece 50 according to present embodiment can inhibit to vibrate when vibrating arm 23,24 is vibrated
Arm 23,24 is contacted with supporting arm part 21.Hereinafter, being described in detail.
Fig. 5 is the sectional view of the effect for the piezoelectric vibration piece 50 for illustrating present embodiment.
In the central arm type piezoelectric vibration piece as in the present embodiment, it is configured with support arm between a pair of vibrating arm parts
Portion, so when the vibrating arm vibrates, there is the worries that vibrating arm can be contacted with supporting arm part.
In contrast, according to present embodiment, due to forming surface groove 40a and back groove 40b in supporting arm part 21,
So flexural rigidity is lower at the position for being formed with surface groove 40a and back groove 40b.Therefore, as shown in figure 5, with shape
It is fulcrum at the position for the supporting arm part 21 for having surface groove 40a and back groove 40b, piezoelectric vibration piece 50 is easily bent change
Shape.More specifically, relative to supporting arm part 21, base portion 22 is in the direction close to the 2nd basal substrate 11（-Z direction）It tilts,
Accompanying this, relative to supporting arm part 21, the front end of vibrating arm 20 is along from the direction that the 2nd basal substrate 11 leaves（+ Z
Direction）It tilts.As a result, relative to the slope of the vibrating arm 20 of the mounting surface 11a of the 2nd basal substrate 11 and supporting arm part 21
Slope becomes different conditions.That is, in lateral plan（The faces ZX view）When, the thickness direction of vibrating arm 20 and supporting arm part 21（Z
It is axial）Position become the state that is mutually shifted.Therefore, vibrating arm 20 is in the width direction（Y-axis）When vibration, it can inhibit
Vibrating arm 20 and supporting arm part 21 contact.In addition, being formed in slot at least one of surface, back side of supporting arm part 21
Root nearby in the case of, the flexural deformation degree of piezoelectric vibration piece 50 can further increase.It shakes that is, can further increase
The displacement relative to supporting arm part 21 in swing arm portion 20.
In addition, the depth T2 of the piezoelectric vibration piece 50 according to present embodiment, surface groove 40a and back groove 40b with
It is roughly the same in the depth T1 for the groove portion 27,28 that vibrating arm 23,24 is formed.The case where forming each groove portion by etching
Under, the depth for each groove portion to be formed can be determined according to etching period.Therefore, in the case where each groove portion is formed by etching,
The etching required time for being used to form groove portion 27,28 and the etching institute for being used to form surface groove 40a and back groove 40b
The time needed is roughly the same.Therefore, according to present embodiment, the same process can be used（S3, with reference to Fig. 4）It is formed simultaneously slot
Portion 27,28 and surface groove 40a and back groove 40b, it is very easy.
In addition, in the present embodiment, the quality of supporting arm part 21 is a shaker arm among a pair of of vibrating arm 20
It is more than the quality in portion 23,24.By keeping the quality of supporting arm part 21 larger, it can more efficiently reduce and be produced in vibrating arm 20
Raw vibration is propagated to supporting arm part 21.
In addition, following structure can also be adopted in the present embodiment.
In the above-described embodiment, in the surface 50a of piezoelectric vibration piece 50 and back side 50b both sides, it is formed with each groove portion（Table
Face groove portion 40a, back groove 40b）, but not limited to this.In the present embodiment, for example, it can be only in surface 50a and
The structure of groove portion is formed with either one or two of among the 50b of the back side.
In addition, in the present embodiment, the depth T2 that can also be surface groove 40a and back groove 40b is to distinguish not
Same structure.
In addition, in the present embodiment, the plan view shape of surface groove 40a and back groove 40b are rectangle, but are not limited to
This.The plan view shape of surface groove 40a and back groove 40b can be round, can also be other shapes.
In addition, in the present embodiment, surface groove 40a and back groove 40b are formed as side（The faces ZX）It is not opening, but
It is without being limited thereto.In the present embodiment, for example, surface groove 40a and back groove 40b can also be formed as in piezoelectric vibrator
1 width direction（Y-axis）On an end or both sides end split shed.
In addition, in the present embodiment, as the piezoelectric vibrator 1 for using piezoelectric vibration piece 50, for ceramic package class
The surface mounted vibrator of type illustrates, but also piezoelectric vibration piece 50 can be suitable for base made of glass material
The piezoelectric vibrator for the glass package type that substrate and cover substrate are engaged by anodic bonding.
（2nd embodiment）
Relative to the piezoelectric vibration piece 50 of the 1st embodiment, the piezoelectric vibration piece of the 2nd embodiment spreads branch in each groove portion
The width direction in brace portion is whole and forms this respect difference.
In addition, in the following description, for the same structure as the above embodiment, sometimes through additional same label
Deng and omit the description.
Fig. 6 is the plan view for the piezoelectric vibration piece 150 for showing present embodiment.
As shown in fig. 6, the piezoelectric vibration piece 150 of present embodiment has：A pair of of vibrating arm 20, supporting arm part 121, base
Portion 22 and department of assembly 116,117.
In supporting arm part 121, it is formed with surface groove 140a and back groove 140b.Surface groove 140a is formed in piezoelectricity
The surface 150a of vibrating reed 150.Back groove 140b is formed in the back side 150b of piezoelectric vibration piece 150.
Surface groove 140a and back groove 140b spreads the width direction of supporting arm part 121 respectively（Y-axis）Entirety
And it is formed.That is, in the width direction of piezoelectric vibrator 1（Y-axis）Both ends in, surface groove 140a and back groove 140b
It is open to the side of piezoelectric vibration piece 50（The faces ZX）.Surface groove 140a and back groove 140b are to overlook（The faces XY view）When it is mutual
The mode being mutually integrally overlapped is formed.
According to present embodiment, since surface groove 140a and back groove 140b spreads the width of supporting arm part 121 respectively
Spend direction（Y-axis）Entirety and formed, so relative to surface groove formed in the 1st embodiment supporting arm part 121
The flexural rigidity smaller at the position of 140a and back groove 140b.As a result, according to present embodiment, by piezoelectric vibration piece 150
When being set on the 2nd basal substrate 11, piezoelectric vibration piece 150 is more prone to flexural deformation, is better able to inhibit vibrating arm 20
It is contacted with supporting arm part 121.
（3rd embodiment）
Relative to the piezoelectric vibration piece 50 of the 1st embodiment, the shape of the back groove of the piezoelectric vibration piece of the 3rd embodiment
At position difference.
In addition, in the following description, for the same structure as the above embodiment, sometimes through additional same label
Deng and omit the description.
Fig. 7 is the plan view for the piezoelectric vibration piece 250 for showing present embodiment.
As shown in fig. 7, the piezoelectric vibration piece 250 of present embodiment has a pair of of vibrating arm 20, supporting arm part 221, base
Portion 22 and department of assembly 216,217.
In supporting arm part 221, surface groove 240a and back groove 240b is formed.Surface groove 240a and back groove
The vertical view of 240b（The faces XY view）When shape be rectangle.
Surface groove 240a is formed in the surface 250a of piezoelectric vibration piece 250.Formation surface groove in supporting arm part 221
The position of 240a is same as the surface groove 40a of the 1st embodiment.
Back groove 240b is formed in the back side 250b of piezoelectric vibration piece 250.A part of back groove 240b is formed in
Department of assembly 216.In other words, a part of back groove 240b and a part for department of assembly 216 are overlooked（The faces XY view）Shi Chong
It is folded.
That is, at least part of back groove 240b can also be formed in department of assembly 216.It is adjoint therewith, it is formed in
The assembly electrode of department of assembly 216 is that the bottom surface of overleaf groove portion 240b is formed.
According to present embodiment, since a part of back groove 240b is formed in a part for department of assembly 216, so
When piezoelectric vibration piece 250 being set on the mounting surface 11a of the 2nd basal substrate 11, adhesive strength can be improved.Hereinafter, to thin
Section illustrates.
Fig. 8 is shown the mounting surface 11a of the installation of piezoelectric vibration piece 250 of present embodiment to the 2nd basal substrate 11
The sectional view of state.
As shown in figure 8, for example, in the present embodiment, electrode pad 14,15 and department of assembly 216,217 are via electric conductivity
Bonding agent 60 and be bonded.Here, since the part in department of assembly 216 is formed with back groove 240b, so electric conductivity is bonded
Agent 60 enters in back groove 240b.It, can be by conductive adhesive 60 and supporting arm part 221 as a result, according to present embodiment
The area of contact increases the amount of the inner wall of back groove 240b, can make the bonding of piezoelectric vibration piece 250 and the 2nd basal substrate 11
More securely.
（4th embodiment）
The piezoelectric vibration piece of 4th embodiment is different in surface groove and each multiple this respects of formation of back groove difference.
In addition, in the following description, for the same structure as the above embodiment, sometimes through additional same label
Deng and omit the description.
Fig. 9 is the plan view for the piezoelectric vibration piece 350 for showing present embodiment.
As shown in figure 9, the piezoelectric vibration piece 350 of present embodiment has a pair of of vibrating arm 20, supporting arm part 321, base
Portion 22 and department of assembly 316,317.
In supporting arm part 321 respectively along the length direction of supporting arm part 321（X axis）Abreast form surface groove
340a, 341a, 342a and back groove 340b, 341b, 342b.
Each surface groove is formed in the surface 350a of piezoelectric vibration piece 350.Each back groove is formed in piezoelectric vibration piece 350
Back side 350b.It overlooks（The faces XY view）When each surface groove and each back groove superposed formed respectively.
In the present embodiment, surface groove 340a and each formation 3 of back groove 340b difference.Surface groove 340a and
Length directions of the back groove 340b in supporting arm part 321（X axis）Department of assembly 316 and base portion 22 between formed.Reverse groove
Among portion 340b, it is formed in and leaves most sides from base portion 22（The sides+X）A part of back groove 340b be in department of assembly
What 316 part was formed.
Length directions of the surface groove 341a and back groove 341b in supporting arm part 321（X axis）Department of assembly 316 with
It is formed between department of assembly 317.A part of back groove 341b is formed in a part for department of assembly 317.
Surface groove 342a and back groove 342b than department of assembly 317 closer to the front end side of supporting arm part 321（+ X
Side）It is formed.A part of back groove 342b is that the part in department of assembly 317 is formed.
According to present embodiment, in the length direction of supporting arm part 321（X axis）Department of assembly 316 and base portion 22 between,
Multiple surface groove 340a and back groove 340b are formed with, so the vibration conducted to department of assembly 316 that can more decay.
In addition, according to present embodiment, in the length direction of supporting arm part 321（X axis）Department of assembly 316 and department of assembly
Between 317, surface groove 341a and back groove 341b is formed, so can make to utilize multiple surface groove 340a and reverse groove
The vibration of portion 340b decaying further decays, and is better able to the vibration conducted to department of assembly 317 that decays.
In addition, according to present embodiment, by forming multiple surface grooves and back groove, support can be easily reduced
The quality of arm 321 is easy to keep piezoelectric vibration piece 350 light-weight.
In addition, according to present embodiment, a part of the part in department of assembly 316 in back groove 340b is formed, the back of the body
A part of the part of face groove portion 341b and back groove 342b in department of assembly 317 is formed, so making 350 He of piezoelectric vibration piece
The adhesive strength of 2nd basal substrate 11 is more secured.
In addition, in the present embodiment, the length direction of multiple surface grooves and back groove along supporting arm part 321（X-axis
To）It is abreast formed, but not limited to this.In the present embodiment, for example, multiple surface grooves and back groove can also edges
The width direction of supporting arm part 321（Y-axis）Abreast formed.
In addition, in the above-described first to fourth embodiments of the piezoelectric vibrating piece, about surface groove
And each 1 is arranged respectively for back groove or each 5 examples illustrate, but not limited to this.In the piezoelectric vibration piece of the present invention
A mode in, surface groove and back groove can also be respectively set each 2 or more 4 hereinafter, can also be arranged each 6
More than.
In addition, in one mode of the piezoelectric vibrating piece of the present invention, for surface groove and back groove, can also make
The quantity of formation, form and dimension, forming position when overlooking etc. are respectively different.
（Has the embodiment of the equipment of piezoelectric vibrator）
[oscillator]
Then, it is illustrated for having the oscillator of the present embodiment of piezoelectric vibrator 1.
Figure 10 is the figure for the oscillator 1000 for showing present embodiment.
Oscillator 1000 has：Substrate 1010, integrated circuit 1020, electronic unit 1030 and piezoelectric vibrator 1.
Electronic unit 1030 is, for example, capacitor etc., is installed on substrate 1010.Integrated circuit 1020 is used for oscillator, installation
In substrate 1010.
Integrated circuit 1020 and each of piezoelectric vibrator 1 and electronic unit 1030, it is electric via the wiring that diagram is omitted
Connection.Piezoelectric vibrator 1 is for example installed near integrated circuit 1020 in substrate 1010.Piezoelectric vibrator 1 is referring to Fig.1 etc.
And the piezoelectric vibrator of the embodiment of above description, it works as oscillator.At least part of oscillator 1000 can also
It is moulded by resin (not shown) appropriate.
About oscillator 1000, when being supplied electric power to piezoelectric vibrator 1, the piezoelectric vibration piece of piezoelectric vibrator 1 vibrates.
The vibration of piezoelectric vibration piece is converted to electric signal by piezoelectric property possessed by piezoelectric vibration piece.The electric signal shakes from piezoelectricity
Dynamic device 1 is exported to integrated circuit 1020.Integrated circuit 1020 by from electric signal that piezoelectric vibrator 1 exports execute it is various from
It manages and generates frequency signal.
Oscillator 1000 is determining for the action timing of the various devices such as single-function oscillator for clocks, control computer
When control device, can be applied to the device etc. that moment or calendar etc. are provided.Integrated circuit 1020 is according to 1000 institute of oscillator
It is required that function and constitute, can also include so-called RTC（Real-time clock）Module.
According to present embodiment, due to having piezoelectric vibrator 1, thus it is same as described above, obtain excellent in reliability shake
Swing device 1000.
[electronic equipment]
Then, as a mode of the electronic equipment for the present embodiment for having piezoelectric vibrator 1, about mobile information
Equipment illustrates.
The portable information device is mode as wrist-watch, especially more small-sized and light-weight than general portable phone, but energy
Carry out communication same as a portable phone.The portable information device is in the part for being equivalent to character disc configured with liquid crystal display etc.
Display unit can show time information etc. in display unit.In addition, the portable information device is provided with raises one's voice in the inner part of the strap
The input and output portions such as device, microphone can be conversed etc. using input and output portion.
Figure 11 is the figure of an example of the portable information device 1100 for showing present embodiment.
Portable information device 1100 shown in Figure 11 has：Timing unit 1110, display unit 1120, communication unit 1130, control
Portion 1140, power supply unit 1150, voltage detection department 1160, power truncation 1170.
Each portion of 1140 overall control portable information device 1100 of control unit.For example, the control of control unit 1140 utilizes timing
Measurement at the time of portion 1110, using display unit 1120 information display, utilize communication unit 1130 and external communication etc..
Control unit 1140 includes：Such as be previously written the ROM of program, read the program that the ROM is written, execute various places according to the program
The CPU of the reason and RAM of workspace as the CPU.
Timing unit 1110 has integrated circuit and piezoelectric vibrator 1.The integrated circuit includes oscillating circuit, register electricity
Road, counter circuit and interface circuit.Piezoelectric vibrator 1 is the piezoelectric vibrator involved by the embodiment of above description.
Piezoelectric vibrator 1 receives power supply and piezoelectric vibration piece vibrates, and by the vibration be converted to possessed by piezoelectric vibration piece
The corresponding electric signal of piezoelectric property.It will be inputted from the electric signal that piezoelectric vibrator 1 exports to the oscillating circuit of integrated circuit.
In the integrated circuit of timing unit 1110, the output of oscillating circuit is binarized and by register circuit and counting
Device circuit count.The count results are supplied via interface circuit to control unit 1140.Control unit 1140 is by being based on from integrated
The count results of circuit and execute various operations etc., to operation moment, date etc., based on its operation result, make display unit
The various information such as 1120 display moment, date, calendar.
Communication unit 1130 carries out the communication with outside, i.e., to the transmission of external data and connecing from external data
It receives.Communication unit 1130 includes radio section 1200, sound processing section 1210, switching part 1220, enlarging section 1230, voice input output
Portion 1240, telephone number input 1250, call tone generation section 1260 and call control memory 1270.
Radio section 1200 via antenna 1280 and with the various data such as the encoded voice data of base station exchange.Acoustic processing
The data inputted from radio section 1200 are decoded and are exported to enlarging section 1230 by portion 1210.In addition, sound processing section 1210 will be from
The data encoding of the input of enlarging section 1230 is simultaneously exported to radio section 1200.Enlarging section 1230 carries out and 1210 harmony of sound processing section
Signal handing-over between sound input and output portion 1240, and the signal joined is amplified to predetermined level appropriate.Sound is defeated
Enter output section 1240 and includes loud speaker and microphone etc., sound corresponding with the signal from enlarging section 1230 is defeated to outside
Go out, and receives the input of sound from outside.
In addition, switching part 1220 using with the corresponding instruction from control unit 1140 such as exhalation from base station, in the future
Electric sound generating unit 1260 is connect with enlarging section 1230.Call tone generation section 1260 is come from using corresponding with the exhalation from base station
The instruction of control unit 1140 exports the data of ringtone to switching part 1220.That is, control unit 1140 is according to exhaling from base station
Go out, by the data to 1230 output incoming sound of enlarging section, utilizes 1240 output incoming sound of sound input and output section.
The calling of the storage communication of call control memory 1270/carry out program involved by electric control.In addition, telephone number
Input unit 1250 has such as 0 to 9 number button and other buttons, by pressing these number buttons etc., for conversing
The input of the telephone number of object etc..
Power supply unit 1150 for example comprising lithium rechargeable battery, is supplied electric power to each portion of portable information device 1100.Electricity
Press the voltage of each portion supply of the detection of test section 1160 from power supply unit 1150 to portable information device 1100.Voltage detection department 1160
When the detected voltage is lower than a predetermined value, notify that voltage is the situation of set value or less to control unit 1140.
The set value is as in order to make the required voltage of 1130 operating stably of communication unit and preset value, for example, 3V are left
It is right.The control unit 1140 for receiving the notice that voltage declines from voltage detection department 1160 is prevented or restricted from comprising radio section 1200, sound
At least part of action in multiple function parts of sound processing unit 1210, switching part 1220 and call tone generation section 1260.
In this case, compared to a functional part with relatively low power consumption among multiple functional parts, control unit 1140 is prevented or restricted from multiple first
The action of the larger function part of relative power consumption in function part.Control unit 1140 makes to show the decline due to supplying electric power and function is stopped
Only or limited information, it is shown in display unit 1120.The display can include character, can also sign of inclusion, for example, it is also possible to
With to the phone icon that is shown in display unit 1120 it is additional " ×（Fork）" label mode.Among multiple functions, power supply is cut
Disconnected portion 1170 selectively stops declining and the supply of the electric power of the function part of function stop to due to voltage.
According to present embodiment, due to having piezoelectric vibrator 1, so same as described above, obtain it is excellent in reliability just
Take information equipment 1100.
[radio controlled timepiece]
Then, the radio controlled timepiece for having the present embodiment of piezoelectric vibrator 1 is illustrated.
At the time of radio controlled timepiece has the function of making being adapted to obtain from standard wave at the time of display.Standard wave passes through
The modulated signal of information at the time of being referred to as timing code will be included, AM modulation is applied to the carrier wave of set frequency.Such as in Japan
The dispatching station of the country, dispatching station and Saga county from Fukushima county sends standard wave.The standard sent from the dispatching station in Fukushima county
The carrier frequency of electric wave is 40kHz, and the carrier frequency of the standard wave sent from the dispatching station in Saga county is 60kHz.
Figure 12 is the figure for the radio controlled timepiece 1300 for showing present embodiment.The radio controlled timepiece 1300 has：Antenna 1310 is put
Big device 1320, filter section 1330, detection rectification circuit 1340, waveform shaping circuit 1350, CPU 1360 and RTC 1370.
Antenna 1310 receives standard wave.Amplifier 1320 amplify the signal of standard wave that antenna 1310 is received and to
Filter section 1330 exports.Filter section 1330 will filter from the signal of amplifier 1320, tuning and to detection rectification circuit
1340 outputs.Detection rectification circuit 1340 will demodulate and to waveform shaping circuit 1350 from the signal demodulator of filter section 1330
Output.The signal of the always self-recification rectification circuit 1340 of waveform shaping circuit 1350 obtains timing code, by the timing code to CPU
1360 supplies.CPU 1360 obtains the information related to time such as current year, accumulative day, week, moment from timing code.RTC
1370 be so-called real-time clock, keeps the information such as current year, month, day, hour, min, second.CPU 1360 makes to obtain from timing code
The information that is kept in RTC 1370 of message reflection related to time.The information that RTC 1370 is kept is suitably read simultaneously
Display for the moment.
Filter section 1330 includes the piezoelectric vibrator with the comparable resonant frequency of frequency of the signal of filtering.In filter
In portion 1330, piezoelectric vibrator works as resonator.Make in Japan for example, the radio controlled timepiece 1300 of Fig. 9 is assumed to be
With the piezoelectric vibrator that filter section 1330 includes the piezoelectric vibrator 1a that resonant frequency is 40kHz and resonant frequency is 60kHz
1b.Moreover, it is assumed that for the radio controlled timepiece 1300 that region outside Japan uses, according to corresponding with used region
The carrier frequency of standard wave and the resonant frequency for setting the piezoelectric vibrator of filter section 1330.
In the present embodiment, the piezoelectric vibrator 1a and piezoelectric vibrator 1b of filter section 1330 are respectively and above state
The 1 same piezoelectric vibrator of piezoelectric vibrator of bright embodiment.
According to present embodiment, due to having piezoelectric vibrator 1a, the 1b that there is same structure with piezoelectric vibrator 1,
So it is same as described above, obtain radio controlled timepiece 1300 excellent in reliability.
In addition, in the above description, as the example of oscillator, electronic equipment and radio controlled timepiece, shows to have and be equipped with
The example of the piezoelectric vibrator 1 of the piezoelectric vibration piece 50 of 1st embodiment, but not limited to this.As oscillator, electronic equipment
And the embodiment of radio controlled timepiece, such as can also be to have that piezoelectricity shown in the 2nd embodiment to the 4th embodiment is installed
The structure of the piezoelectric vibrator of vibrating reed.
[label declaration]
1,1a, 1b piezoelectric vibrator；2 packaging parts；3 package bodies（Basal component）；4 hush panels（The lid component）；
11a mounting surfaces；16,17,116,117,216,217,316,317 department of assembly；20,23,24 vibrating arm；21、121、221、
321 supporting arm parts；22 base portions；27,28 groove portion（2nd groove portion）；40a, 140a, 240a, 340a, 341a surface groove（Slot
Portion）；40b, 140b, 240b, 340b, 341b back groove（Groove portion）；50,150,250,350 piezoelectric vibration piece；50a、
The surface 150a, 250a, 350a（Another face）；The back side 50b, 150b, 250b, 350b（One face）；C cavitys.
Claims (6)
1. a kind of piezoelectric vibration piece, which is characterized in that have：
A pair of of vibrating arm is abreast configured in width direction；
Supporting arm part is disposed between the pair of vibrating arm portions；
Base portion connects the pair of vibrating arm and the supporting arm part；And
Department of assembly is set to the supporting arm part,
In the length direction of the support arm, it forms a groove between the fitting part and the base part,
At least part of the groove portion is formed in the department of assembly.
2. piezoelectric vibration piece as described in claim 1, wherein the groove portion spreads the whole of the width direction of the supporting arm part
Body and formed.
3. piezoelectric vibration piece as claimed in claim 1 or 2, wherein the root that the groove portion is formed in the supporting arm part is attached
Closely.
4. piezoelectric vibration piece as claimed in claim 1 or 2, wherein be formed with and the groove portion in the pair of vibrating arm
Groove portion with roughly the same depth.
5. piezoelectric vibration piece as claimed in claim 1 or 2, wherein the quality of the supporting arm part is the pair of shaker arm
It is more than the quality of a vibrating arm among portion.
6. a kind of piezoelectric vibrator, which is characterized in that have：
Packaging part, there is the packaging part basal component and The lid component, the The lid component to overlap and engage with the basal component,
And gas-tight seal cavity is formed between the cover member and the base member；And
Piezoelectric vibration piece as claimed in claim 1 or 2, the mounting surface that the piezoelectric vibration piece is assembled in the base member,
And it accommodates in the cavity.
Applications Claiming Priority (2)
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|---|---|---|---|
| JP2013-224719 | 2013-10-29 | ||
| JP2013224719A JP6216213B2 (en) | 2013-10-29 | 2013-10-29 | Piezoelectric vibrating piece and piezoelectric vibrator |
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| CN104579229A CN104579229A (en) | 2015-04-29 |
| CN104579229B true CN104579229B (en) | 2018-09-18 |
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Citations (1)
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|---|---|---|---|---|
| CN1881792A (en) * | 2005-06-09 | 2006-12-20 | Eta瑞士钟表制造股份有限公司 | Small-sized piezoelectric resonator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010119128A (en) * | 2003-08-19 | 2010-05-27 | Seiko Epson Corp | Tuning-fork type piezoelectric vibrator piece |
| JP3951058B2 (en) * | 2003-08-19 | 2007-08-01 | セイコーエプソン株式会社 | Tuning fork type piezoelectric vibrating piece |
| DE602005005647T2 (en) * | 2005-06-09 | 2009-04-16 | Eta Sa Manufacture Horlogère Suisse | Piezoelectric resonator with small dimensions |
| JP2012039226A (en) * | 2010-08-04 | 2012-02-23 | Nippon Dempa Kogyo Co Ltd | Tuning fork type piezoelectric vibrating piece and piezoelectric device |
| JP2012147348A (en) * | 2011-01-14 | 2012-08-02 | Seiko Epson Corp | Vibration piece, vibrator, oscillator and electronic apparatus |
| JP2013187853A (en) * | 2012-03-09 | 2013-09-19 | Seiko Instruments Inc | Piezoelectric vibration piece, piezoelectric vibrator, oscillator, electronic apparatus, and atomic clock |
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|---|---|---|---|---|
| CN1881792A (en) * | 2005-06-09 | 2006-12-20 | Eta瑞士钟表制造股份有限公司 | Small-sized piezoelectric resonator |
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| JP2015088866A (en) | 2015-05-07 |
| CN104579229A (en) | 2015-04-29 |
| JP6216213B2 (en) | 2017-10-18 |
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