CN104579216B - Passive and wireless mode of resonance SAW temperature sensor packaging technology optimization method - Google Patents
Passive and wireless mode of resonance SAW temperature sensor packaging technology optimization method Download PDFInfo
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- CN104579216B CN104579216B CN201410811220.2A CN201410811220A CN104579216B CN 104579216 B CN104579216 B CN 104579216B CN 201410811220 A CN201410811220 A CN 201410811220A CN 104579216 B CN104579216 B CN 104579216B
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Abstract
The present invention provides a kind of passive and wireless mode of resonance SAW temperature sensor packaging technology optimization method, comprises the steps：Step one makes the monolithic piezoelectric substrate for having SAW resonator tube core there is provided front, applies sound absorption ink in monolithic piezoelectric substrate front, sound absorption ink covers the area of outermost 20%~45% on the left and right reflecting grating surface of each SAW resonator tube core；Step 2, carries out the solidification of sound absorption ink；Step 3, scribing：Each SAW resonator tube core cutting-up of monolithic piezoelectric substrate is separated using scribing machine；Step 4, burst：Each SAW resonator tube core of the monolithic piezoelectric substrate pulled is removed one by one and rearranged on clean filter paper, a spacing is separated by between each SAW resonator tube core, the filter paper for sequencing tube core is placed in culture dish and treats film；Step 5, film；Step 6, bonding；Step 7, sealing cap.The present invention can suppress the formation of SAW resonator secondary peak, so as to optimize the characteristic of passive and wireless mode of resonance SAW temperature sensor.
Description
Technical field
The present invention relates to a kind of device packaging method, especially a kind of passive and wireless mode of resonance SAW temperature sensor encapsulation
Technique optimization method.
Background technology
Early in 19th century, British scientist Rayleigh finds a kind of to propagate along ground surface in Study of Seismic wave process
Ripple, this ripple is surface acoustic wave（Surface Acoustic Wave abbreviations SAW）.
Surface acoustic wave does not all draw attention in a very long time after discovery.Until nineteen sixty-five R.M.White and
After F.W.Voltmer invention interdigital transducers, surface acoustic wave just causes the extensive concern of academia.Interdigital transducer is referred to
The metal pattern of finger cross-like is formed on piezoelectric substrate surface, it can realize the mutual conversion between acoustic-electric, such as Fig. 1 institutes
Show.The electric signal of external drive is changed into acoustic signals, i.e. surface acoustic wave by input interdigital transducer.Surface acoustic wave can be along pressure
The surface of electric substrate is propagated, and surface acoustic wave finally is converted into electric signal output by output interdigital transducer.
Surface acoustic wave sensor begins one's study in 1970s, but on passive wireless surface acoustic wave sensor research
Start from the late 1980s.Domestic correlative study is since later stage 1990s.Current passive and wireless sound table
Face ripple temperature sensor has two kinds of forms of delay line type and mode of resonance SAW temperature sensor.Delay line type passive and wireless SAW temperature
Degree sensor main will be encouraged using swept-frequency signal mode, using pumping signal with the delay in time of reception signal or phase
Measure of the change object temperature value；As long as mode of resonance passive and wireless SAW temperature sensor is encouraged using intermittent pulse, measurement swashs
The frequency change that signal is encouraged between the echo-signal that receives, then obtains the temperature of object under test by the change of frequency
Value.
Its core of passive and wireless mode of resonance SAW temperature sensor is exactly a SAW resonator in fact.
Existing SAW resonator method for packing is typically：In front, making has the monolithic piezoelectric substrate of SAW resonator tube core
Front first apply Protection glue；Then scribing, burst are carried out；Protection glue is removed again；Film is carried out, tube core is bonded on base；
Bonding, die electrodes and base electrode are connected by bonding wire；Sealing cap, by base cover plate and base base sealing welding.Press
Schematic diagram such as Fig. 2 after conventional encapsulating method encapsulation（For clarity of illustration, the structure of also non-sealing cap is shown in Fig. 2）Institute
Show.
The SAW resonator of conventional encapsulating method encapsulation comes with some shortcomings.The propagation with acoustical signal is changed in acoustoelectric signal
During, some spurious signals will be produced, they are to influence the key factor of such resonator behavior.Spurious signal is mainly：
1）End face reflection ripple：SAW is propagated in substrate surface, when traveling to substrate end face, will be returned to interdigital change by end face reflection
On energy device, this ripple is end face reflection ripple.2）Interdigital transducer edge reflects：Interdigital transducer（IDT）Edge also can be to propagating
In SAW produce reflection.
Due to the presence of these spurious signals so that existing SAW resonator multiple spread out occurs in the distal end at main resonance peak
Raw peak (also referred to as secondary peak), as shown in circled in Fig. 3, due to the presence for thering are these to derive peak, existing passive wireless resonant type
SAW resonator in SAW temperature sensor often have in system test error code phenomenon appearance, influence sensor complete machine can
By property.
This problem never has suitable technique and can solve the problem that in a long time.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided a kind of passive and wireless mode of resonance SAW temperature
Sensor packaging technology optimization method is spent, suppresses above-mentioned spurious signal by smearing the method for sound absorption ink, suppresses SAW resonance
The formation of device secondary peak, so as to optimize the characteristic of passive and wireless mode of resonance SAW temperature sensor.The technical solution adopted by the present invention
It is：
A kind of passive and wireless mode of resonance SAW temperature sensor packaging technology optimization method, comprises the steps：
Step one makes the monolithic piezoelectric substrate for having SAW resonator tube core there is provided front, is applied in monolithic piezoelectric substrate front
Sound absorption ink, sound absorption ink covers the area of outermost 20%~45% on the left and right reflecting grating surface of each SAW resonator tube core；
The thickness of sound absorption ink is 0.1~0.6 millimeter；
Step 2, carries out the solidification of sound absorption ink；Temperature when sound absorption ink solidifies is 120 ± 5 DEG C, and hardening time is 2
Hour；
Step 3, scribing：Each SAW resonator tube core cutting-up of monolithic piezoelectric substrate is separated using scribing machine；
Step 4, burst：Each SAW resonator tube core of the monolithic piezoelectric substrate pulled is removed one by one and rearranged
On clean filter paper, a spacing is separated by between each SAW resonator tube core, the filter paper for sequencing tube core is placed in culture dish and treats film；
Step 5, film：By SAW resonator die front side upward, it is bonded on base；Then solidify；
Step 6, bonding：SAW resonator die electrodes and base electrode are connected by bonding wire；
Step 7, sealing cap：By base cover plate and base base sealing welding.
Further, in step one, the specific method using silk-screen printing applies sound absorption ink.
The advantage of the invention is that：Introduced in SAW resonator device encapsulation process and smear the technique of sound absorption ink to control
Acoustic wave diffraction processed produces time resonance peak, so as to improve the characteristic of passive and wireless mode of resonance SAW temperature sensor complete machine.Process implementing
Relatively simple convenience, the effect of acquisition is good.
Brief description of the drawings
Fig. 1 is existing SAW acoustic-electrics transition diagram.
Fig. 2 is existing SAW resonator encapsulating structure schematic diagram.
Fig. 3 is existing SAW resonator performance plot.
Fig. 4 is operational flowchart of the invention.
Fig. 5 is the printed steel plate schematic diagram in present invention process step.
Fig. 6 has the monolithic piezoelectric substrate schematic diagram of SAW resonator tube core to make.
Fig. 7 applies sound absorption ink schematic diagram for the left and right reflecting grating surface of the SAW resonator tube core of the present invention.
Fig. 8 is SAW resonator encapsulating structure schematic diagram of the invention（Before non-sealing cap）.
Fig. 9 is SAW resonator performance plot of the invention.
Embodiment
With reference to specific drawings and examples, the invention will be further described.
Passive and wireless mode of resonance SAW temperature sensor packaging technology optimization method proposed by the invention, as shown in figure 4,
Comprise the steps：
Step one makes the monolithic piezoelectric substrate for having SAW resonator tube core there is provided front, is applied in monolithic piezoelectric substrate front
Sound absorption ink, sound absorption ink covers the area of outermost 20%~45% on the left and right reflecting grating surface of each SAW resonator tube core；
The thickness of sound absorption ink is 0.1~0.6 millimeter；
This step one is carried out using screen process press.Specifically include：
Step 1-1, calibrates printed steel plate；Using microscope, pass through microscope inner cross frame adjustment printing steel version register guide
Note is parallel with microscope cross；Steel version is printed as shown in figure 5, middle for criss-cross printing steel version alignment mark.
Step 1-2, calibrates monolithic piezoelectric substrate, printed steel plate is lifted, monolithic piezoelectric substrate is loaded onto on wafer-supporting platform, whole
Block piezoelectric substrate is typically disk, and piezoelectric substrate alignment mark 4 is parallel with microscope cross；
Fig. 6 is that front makes the monolithic piezoelectric substrate schematic diagram for having SAW resonator tube core, and multiple SAW resonance are included above
Device tube core, each SAW resonator tube core is anti-including middle interdigital transducer 1 and the left reflecting grating 2 of interdigital transducer both sides and the right side
Penetrate grid 3；Monolithic piezoelectric substrate is provided with a criss-cross piezoelectric substrate alignment mark 4.
Step 1-3, fine setting contraposition, printed steel plate is put down, and steel version alignment mark and piezoelectricity are printed by micro- sem observation
Whether substrate paraposition mark 4 overlaps, and is not completely superposed such as and is allowed to overlap by finely tuning printing steel version.
Step 1-4, frictioning uniformly scrapes sound absorption ink to the other end with scraper plate from printed steel plate one end；Printed steel plate
It is upper to have made printed pattern in advance, therefore after this step terminates, it is possible to sound absorption ink is covered into each SAW resonator tube core
The surface leftmost side of left reflecting grating 2 20%~45% area, as shown in mark 5 in Fig. 7, and the rightmost side of right reflecting grating 3 20%
~45% area, as shown in the mark 6 in Fig. 7.The thickness that sound absorption ink is controlled during silk-screen printing is 0.1~0.6 millimeter.
Step 1-5, unloading piece keeps flat the monolithic piezoelectric substrate for coating sound absorption ink in biography horse.
The pine board elastic surface absorber that above-mentioned sound absorption ink can be produced using Minhang District, Shanghai Shen Jiang cleaning preparation factories.
Step 2, carries out the solidification of sound absorption ink；
The biography piece that will be equipped with coating the monolithic piezoelectric substrate of sound absorption ink is placed in 120 ± 5 DEG C of baking ovens 2 hours.
Step 3, scribing：Each SAW resonator tube core cutting-up of monolithic piezoelectric substrate is separated using scribing machine；
In this step, a link film, commonly referred to as indigo plant are pasted in the monolithic piezoelectric substrate back for the sound absorption ink that is cured first
Film, each SAW resonator tube core is at random when preventing scribing；Then it is monolithic piezoelectric substrate is face-up, with scribing machine by each
SAW resonator tube core cutting-up is separated.
Step 4, burst：Tube core two ends are clamped with tweezers SAW resonator, by each SAW of the monolithic piezoelectric substrate pulled
Resonator tube core is removed one by one to be rearranged on clean filter paper, and the spacing of a tube core is separated by between each SAW resonator tube core,
The filter paper for sequencing tube core is placed in culture dish and treats film；
Step 5, film：By SAW resonator die front side upward, it is bonded on base；Then solidify；
In this step, appropriate bonding die glue is dripped in the region of centre 1/3 of base with adhesive dripping machine, then with tweezers to clamp SAW humorous
Tube core is bonded on base by the device tube core two ends that shake by defined direction, is then put it into 140 ± 5 DEG C of baking oven 8 hours.
Step 6, bonding：SAW resonator die electrodes 7 and base electrode 8 are connected by bonding wire 9；
This step is as shown in figure 8, bonding wire 9 can use Si-Al wire, with ultrasonic bonding machine by SAW resonator die electrodes 7
Connected with base electrode 8 by bonding wire 9.
Step 7, sealing cap：Base cover plate is positioned on base, by parallel seam sealing machine by base cover plate and base base
Sealing welding.
The present invention peculiar step one and step 2, the method by smearing sound absorption ink can suppress in background technology
The spurious signal mentioned, so as to suppress the formation of SAW resonator secondary peak, substantially increases the reliability of temperature sensor complete machine.
The SAW resonator characteristic encapsulated using optimize technique is as shown in figure 9, SAW resonator secondary peak is preferably suppressed, as schemed
Shown in circled in 9.
Claims (2)
1. a kind of passive and wireless mode of resonance SAW temperature sensor packaging technology optimization method, it is characterised in that：Including following steps
Suddenly：
Step one makes the monolithic piezoelectric substrate for having SAW resonator tube core there is provided front, and sound absorption is applied in monolithic piezoelectric substrate front
Ink, sound absorption ink covers the area of outermost 20%~45% on the left and right reflecting grating surface of each SAW resonator tube core；Sound absorption
The thickness of ink is 0.1~0.6 millimeter；
Step 2, carries out the solidification of sound absorption ink；
Step 3, scribing：Each SAW resonator tube core cutting-up of monolithic piezoelectric substrate is separated using scribing machine；
Step 4, burst：Each SAW resonator tube core of the monolithic piezoelectric substrate pulled is removed one by one and rearranged clean
Filter paper on, a spacing is separated by between each SAW resonator tube core, the filter paper for sequencing tube core is placed in culture dish and treats film；
Step 5, film：By SAW resonator die front side upward, it is bonded on base；Then solidify；
Step 6, bonding：SAW resonator die electrodes and base electrode are connected by bonding wire；
Step 7, sealing cap：By base cover plate and base base sealing welding；
In step one, the specific method using silk-screen printing applies sound absorption ink；
Temperature when sound absorption ink solidifies is 120 ± 5 DEG C, and hardening time is 2 hours；
In step 4, the spacing of a tube core is separated by between each SAW resonator tube core.
2. passive and wireless mode of resonance SAW temperature sensor packaging technology optimization method as claimed in claim 1, its feature exists
In：
In step 6, bonding wire uses Si-Al wire.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006211182A (en) * | 2005-01-27 | 2006-08-10 | Seiko Epson Corp | Surface acoustic wave device and its manufacturing method |
| CN103117728A (en) * | 2013-03-07 | 2013-05-22 | 浙江工商大学 | Acoustic surface wave resonator |
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| TWI330461B (en) * | 2006-01-12 | 2010-09-11 | Ind Tech Res Inst | Surface acoustic wave bio-chip |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006211182A (en) * | 2005-01-27 | 2006-08-10 | Seiko Epson Corp | Surface acoustic wave device and its manufacturing method |
| CN103117728A (en) * | 2013-03-07 | 2013-05-22 | 浙江工商大学 | Acoustic surface wave resonator |
Non-Patent Citations (2)
| Title |
|---|
| 低损耗、高Q值声表面波谐振器和低相位噪声SAW振荡器;周卫;《中国优秀硕士学位论文全文数据库信息科技辑》;20061215;第2006年卷(第12期);正文第39-55页 * |
| 双频输入耦合结构集成声路——可编程声表面波滤波器结构研究;陈英;《中国优秀硕士学位论文全文数据库信息科技辑》;20021215;第2002年卷(第2期);正文第54页 * |
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