CN104569757A - CTI testing method and device - Google Patents
CTI testing method and device Download PDFInfo
- Publication number
- CN104569757A CN104569757A CN201410843060.XA CN201410843060A CN104569757A CN 104569757 A CN104569757 A CN 104569757A CN 201410843060 A CN201410843060 A CN 201410843060A CN 104569757 A CN104569757 A CN 104569757A
- Authority
- CN
- China
- Prior art keywords
- electrode
- cti
- conductive layer
- testing
- sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Relating To Insulation (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Abstract
The invention discloses a CTI testing method which comprises the following steps: 10, providing a testing electrode, a liquid dropping device and a tested sample, and partitioning the electrode from the tested sample by using a conductive material; 20, electrifying the electrode, and indirectly applying voltage to the tested sample through the conductive material. As the electrode is partitioned from the tested sample by using the conductive material, the electrode is far away from a testing point, the cleanness of the electrode is maintained, the abrasion on the electrode is alleviated, the accuracy of the CTI testing result can be ensured, a real CTI value of a circuit board in a practical circuit distance can be effectively simulated, and wire design and reference are facilitated.
Description
Technical field
The present invention relates to copper-clad plate technical field, particularly relate to a kind of CTI method of testing and device.
Background technology
Circuit board is formed primarily of insulating substrate and conductive layer, and circuit board after long-term use, due to the impact of the factors such as environment, can produce electric leakage corrosion and cause the insulativity of base material to be affected.During because of the industry inherence production board substrate, all need to test its relative discharge tracking index, whether the accelerated test of analogous pole mal-condition can form tracking to check insulating material, thus the ability that solid insulating material tracking-resistant plays trace can be distinguished at short notice, ensure the use safety of product under certain environmental conditions.
Relative discharge tracking index (being called for short CTI) refers to that tested material surface is able to take 50 electrolytic solution (such as, 0.1% aqueous ammonium chloride solution) and does not form the maximum voltage value of tracking, and unit is V.CTI method of testing generally adopts IEC60112 or GB/4207-2003 standard in the industry.As shown in Figure 1, this standard method requires that test sample is insulating substrate 100, namely needs to etch away surperficial Copper Foil, then utilizes the contact with platinum electrode 200, applies corresponding magnitude of voltage and test.Said method highly versatile, for current industry generally accepts.But, in actual test process, also there is many underlying factors, relate to people, machine, material, method, ring various aspects, such as, the cleanliness of electrical conductivity of water, aqueous ammonium chloride solution purity and concentration, drop height and size, platinum electrode and wearing and tearing, platinum electrode spacing accuracy etc., all have an impact to CTI test result.Wherein, the clean and maintenance of platinum electrode seems and is even more important, and is also one of factor the most easily affecting CTI test result; And along with the passing used, wearing and tearing are also can hardly be avoided, thus affect the stability of test result, moreover periodic replacement platinum electrode also certainly will cause the rising of testing cost.
In sum, the necessary CTI method of testing to prior art is improved, to improve test result accuracy and to reduce testing cost.
Summary of the invention
The object of the present invention is to provide a kind of CTI method of testing and device, to solve above-mentioned technical matters.
For reaching this object, the present invention by the following technical solutions:
On the one hand, a kind of CTI method of testing is provided, comprises the steps:
Step S10, provide test electrode, dropper and sample, described electrode and described sample are isolated by conductive material;
Step S20, make described electrifying electrodes, indirectly apply voltage to described sample through described conductive material.
Especially, in described step S10, described sample comprises insulation course and is arranged at the conductive layer at least two intervals of described surface of insulating layer, and described electrode is connected with described insulation course indirectly by described conductive layer.
Especially, described conductive layer adopts copper foil layer.
Especially, described conductive layer adopts the conductive pattern being arranged at described surface of insulating layer.
Especially, described conductive layer at least comprises two symmetrically arranged conductive patterns.
Especially, the thickness of described conductive layer is 12 μm ~ 210 μm.
Especially, the spacing between described conductive layer is 0.05mm ~ 5.0mm.
Especially, in described step S10, at least carry out surface protection process near the position of the projection of described dropper on described sample on described conductive layer, dissolve described conductive layer to prevent test solution.
Especially, in described step S10, make outside described electrode, to arrange the conductive material easily removed, realize the isolation between described electrode and described sample.
On the other hand, provide a kind of CTI proving installation, use described CTI method of testing.
Compared with prior art, beneficial effect of the present invention: the present invention is isolated between electrode and sample by conductive material, make electrode away from test point, can holding electrode cleanliness and reduce wearing and tearing, thus be conducive to the accuracy ensureing CTI test result, true CTI value under all right effectively analog line plate actual track spacing, is conducive to line design and reference.
Accompanying drawing explanation
According to drawings and embodiments the present invention is described in further detail below.
Fig. 1 is the schematic diagram of CTI method of testing of the prior art;
Fig. 2 is the process flow diagram of a kind of CTI method of testing provided according to one embodiment of the invention;
Fig. 3 is the process flow diagram of the CTI method of testing provided according to still another embodiment of the invention;
Fig. 4 is the test philosophy figure of the method for testing according to Fig. 3;
Fig. 5 is the process flow diagram of the CTI method of testing provided according to still another embodiment of the invention.
In figure:
100, insulating substrate; 200, platinum electrode;
1, electrode; 2, dropper; 3, sample; 31, insulation course; 32, conductive layer; 4, protective seam.
Embodiment
Technical scheme of the present invention is further illustrated by embodiment below in conjunction with accompanying drawing.
Fig. 2 is the process flow diagram of a kind of CTI method of testing provided according to one embodiment of the invention, and as shown in Figure 2, in the present embodiment, CTI method of testing comprises the steps:
Step S10, provide test electrode, dropper and sample, described electrode and described sample are isolated by conductive material;
Step S20, make described electrifying electrodes, indirectly apply voltage to described sample through described conductive material.
The present invention is isolated between electrode and sample by conductive material, makes electrode away from test point, can holding electrode cleanliness and reduce wearing and tearing, thus be conducive to the accuracy ensureing CTI test result.Certainly, one skilled in the art will appreciate that CTI method of testing not only comprises above-mentioned two steps, also include other steps, such as, dropping liquid step, other steps except two above-mentioned steps in the present invention are consistent with standard method of test, no longer elaborate herein.
In one embodiment of the invention, in described step S10, described sample comprises insulation course and is arranged at the conductive layer at least two intervals of described surface of insulating layer, and described electrode is connected with described insulation course indirectly by described conductive layer.By arranging the conductive layer at two intervals at surface of insulating layer, can make to isolate between insulation course and electrode on the one hand, make electrode away from the test point on insulation course, can holding electrode cleanliness and be not worn, thus eliminate the impact of result of electrode pair test; On the other hand, the CTI value between actual track can be simulated, thus the creepage trace performance of related circuit plate can be evaluated.
Preferably, described conductive layer adopts copper foil layer.Design like this, changes the way that existing standard method of test first must etch away all Copper Foils, remains part copper layers of foil, by originally needing the part copper layers of foil all etched away to recycle by test purpose, simulates the actual CTI value under different line pitch.Certainly in other embodiments of the invention, conductive layer can also have other forms, such as, can also adopt aluminium lamination.
Preferably, described conductive layer adopts the conductive pattern being arranged at described surface of insulating layer.The effect of guard electrode not only can be played by described design; On the other hand, effective CTI value of actual track can also be simulated, because much large-scale electric appliances plant also requires that used copper-clad plate also must possess excellent proof tracking, can be used for evaluating the creepage trace performance of copper-clad plate by this method.Preferred, described conductive layer at least comprises two symmetrically arranged conductive patterns.Preferably, the thickness of described conductive layer is 12 μm ~ 210 μm.Preferably, the spacing between described conductive layer is 0.05mm ~ 5.0mm.Preferred, the spacing between conductive layer is 0.5mm ~ 5.0mm.
In one embodiment of the invention, in described step S10, at least carry out surface protection process near the position of the projection of described dropper on described sample on described conductive layer, dissolve described conductive layer to prevent test solution.Preferably, outside described conductive layer 32, be coated with protective seam 4, dissolve described conductive layer to prevent test solution.Such as, adopt the mode of gold-plated/immersion Ni/Au to be covered by described conductive layer, do not dissolve described conductive layer with relay testing solution.And for example, adopt the mode of spray tin to be covered by described conductive layer, do not dissolved to protect described conductive layer.Certainly, the set-up mode of protective seam is not limited to the above-mentioned example exemplified, as long as can meet protection conductive layer be not all applicable to the present invention by the mode of dissolving.
In one embodiment of the invention, in described step S10, make outside described electrode, to arrange the conductive material easily removed, realize the isolation between described electrode and described sample.By arranging the conductive material easily removed; the cleanliness of guard electrode and not frayed can be realized on the one hand; on the other hand; can not satisfy the demand at conductive material; or when test result may be affected; this conductive material of removal that can be fast and convenient, and the conductive material more renewed, to ensure the accuracy of test result.
Preferably, described conductive material can adopt conductive casings, is sheathed on outside described electrode.Certainly in other embodiments of the invention, the conductive material of above-mentioned easy removal also can have other versions, such as, one guard shield is set, guard shield can move with described electrode and mobile, described guard shield at least has the isolation part for isolating described electrode and described sample, isolation part described in described electrode contact, and described isolation part is at least conduct electricity with the part of described electrode contact.
Fig. 3 is the process flow diagram of the CTI method of testing provided according to one embodiment of the invention.Fig. 4 is the test philosophy figure of the method for testing according to Fig. 3.As shown in Figure 3,4, in the present embodiment, CTI method of testing comprises: step S10 ', provide test electrode 1, dropper 2 and sample 3, wherein, described sample 3 comprises insulation course 31 and is arranged at the conductive layer 32 at least two intervals on described insulation course 31 surface, and described electrode 1 is connected with described insulation course 31 indirectly by described conductive layer 32; Step S20 ', described electrode 1 is energized, indirectly applies voltage to the insulation course 31 of described sample 3 through described conductive layer 32.
Fig. 5 is the process flow diagram of the CTI method of testing provided according to another embodiment of the present invention.As shown in Figure 5, in the present embodiment, CTI method of testing comprises: step S10 ", test electrode, dropper and sample are provided, wherein, the conductive material that described electrode outer wrapping is easily removed; Step S20 ", make described electrifying electrodes, indirectly apply voltage to described sample through described conductive material.
Embodiments of the invention additionally provide a kind of CTI proving installation, in order to implement CTI method of testing of the present invention.This proving installation at least comprises test electrode, and dropper, described electrode comprises two, carries out applying voltage respectively as both positive and negative polarity to sample, and described dropper can drip test solution according to standard method of test to the appointed area of sample.The electrode of the present embodiment adopts platinum electrode, and test solution adopts aqueous ammonium chloride solution.
The first embodiment of the present invention: sample is provided; this sample adopts the insulating substrate of S2600 model; and two intervals, insulating substrate surface arrange the copper clad patterns of 35um; two copper clad patterns symmetrically structure; distance is 4mm between the two; copper clad patterns adopts the mode of immersion Ni/Au to protect, and other are all tested according to IEC60112 standard method, and obtaining CTI result is 600V.
First comparative example: adopt the insulating substrate of same model with the first embodiment, and test according to IEC60112 standard method, obtaining CTI result is 600V.
As can be seen from the above results, recording CTI result and classic method by method of the present invention, to record CTI result consistent, illustrates that method of the present invention can be used for alternative traditional method of testing.
The second embodiment of the present invention: sample is provided; this sample adopts the insulating substrate of S1600 model; and two intervals, insulating substrate surface arrange the copper clad patterns of 35um; two copper clad patterns symmetrically structure; distance is 4mm, 3mm, 2mm and 1mm between the two; copper clad patterns adopts gold-plated mode to protect, and other all divide four groups to test according to IEC60112 standard method, obtain CTI result as shown in the table:
| Spacing | 1mm | 2mm | 3mm | 4mm |
| CTI | 175 | 375 | 425 | 600 |
Test findings display CTI decreases along with the minimizing of spacing; Employing the above results is charted, and derives the effective CTI value of test material under All other routes spacing.As can be seen here, method of the present invention also effectively can simulate the CTI value between actual track, provides favourable support for producing, using.
In description of the invention, it is to be appreciated that term " first ", " second ", only for being distinguished in description, not special implication.
It is to be understood that; above-mentioned embodiment is only preferred embodiment of the present invention and institute's application technology principle; in technical scope disclosed in this invention, the change that any those skilled in the art of being familiar with easily expect or replacement, all should be encompassed in protection scope of the present invention.
Claims (10)
1. a CTI method of testing, is characterized in that, comprises the steps:
Step S10, provide test electrode, dropper and sample, described electrode and described sample are isolated by conductive material;
Step S20, make described electrifying electrodes, indirectly apply voltage to described sample through described conductive material.
2. a kind of CTI method of testing according to claim 1, it is characterized in that, in described step S10, described sample comprises insulation course and is arranged at the conductive layer at least two intervals of described surface of insulating layer, and described electrode is connected with described insulation course indirectly by described conductive layer.
3. a kind of CTI method of testing according to claim 2, is characterized in that, described conductive layer adopts copper foil layer.
4. a kind of CTI method of testing according to claim 2, is characterized in that, described conductive layer adopts the conductive pattern being arranged at described surface of insulating layer.
5. a kind of CTI method of testing according to claim 4, is characterized in that, described conductive layer at least comprises two symmetrically arranged conductive patterns.
6. a kind of CTI method of testing according to claim 5, is characterized in that, the thickness of described conductive layer is 12 μm ~ 210 μm.
7. a kind of CTI method of testing according to claim 5, is characterized in that, the spacing between described conductive layer is 0.05mm ~ 5.0mm.
8. a kind of CTI method of testing according to any one of claim 2 to 7; it is characterized in that; in described step S10; at least carry out surface protection process near the position of the projection of described dropper on described sample on described conductive layer, dissolve described conductive layer to prevent test solution.
9. a kind of CTI method of testing according to claim 1, is characterized in that, in described step S10, makes to arrange the conductive material easily removed outside described electrode, realizes the isolation between described electrode and described sample.
10. a CTI proving installation, is characterized in that, uses the CTI method of testing as described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410843060.XA CN104569757B (en) | 2014-12-30 | 2014-12-30 | A kind of CTI test method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410843060.XA CN104569757B (en) | 2014-12-30 | 2014-12-30 | A kind of CTI test method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104569757A true CN104569757A (en) | 2015-04-29 |
| CN104569757B CN104569757B (en) | 2019-09-20 |
Family
ID=53086288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410843060.XA Active CN104569757B (en) | 2014-12-30 | 2014-12-30 | A kind of CTI test method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104569757B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110703053A (en) * | 2019-10-23 | 2020-01-17 | 广东优科检测技术服务有限公司 | Dropping device and leakage tracking testing machine adopting same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5552573A (en) * | 1993-12-08 | 1996-09-03 | The Furukawa Electric Co., Ltd. | Resistance welding process for aluminum and aluminum alloy materials |
| CN1665636A (en) * | 2002-07-03 | 2005-09-07 | 弗罗纽斯国际有限公司 | Electrode protection device, spot-welding tool and resistance welding method |
| CN102173131A (en) * | 2010-12-30 | 2011-09-07 | 上海南亚覆铜箔板有限公司 | Copper foil-coated plate with high electricity leakage tracking index and preparation method thereof |
| CN203385825U (en) * | 2013-07-18 | 2014-01-08 | 广东生益科技股份有限公司 | Dropping device and leakage-resistance trace tester with dropping device |
-
2014
- 2014-12-30 CN CN201410843060.XA patent/CN104569757B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5552573A (en) * | 1993-12-08 | 1996-09-03 | The Furukawa Electric Co., Ltd. | Resistance welding process for aluminum and aluminum alloy materials |
| CN1665636A (en) * | 2002-07-03 | 2005-09-07 | 弗罗纽斯国际有限公司 | Electrode protection device, spot-welding tool and resistance welding method |
| CN102173131A (en) * | 2010-12-30 | 2011-09-07 | 上海南亚覆铜箔板有限公司 | Copper foil-coated plate with high electricity leakage tracking index and preparation method thereof |
| CN203385825U (en) * | 2013-07-18 | 2014-01-08 | 广东生益科技股份有限公司 | Dropping device and leakage-resistance trace tester with dropping device |
Non-Patent Citations (4)
| Title |
|---|
| 佚名: "关于漏电起痕试验和耐漏电起痕指数的确定", 《百度文库HTTP://WENKU.BAIDU.COM/VIEW/CA9E858083D049649B665891.HTML》 * |
| 冯雷等: "照明电器中漏电起痕指数测定方法的解读", 《光源与照明》 * |
| 德意志联邦共和国标注化研究所等: "VDE-绝缘材料抗漏电强度电气试验规程", 《西德工业标准DIN53480》 * |
| 陆俭国 等: "《中国电气工程大典 第11卷 配电工程》", 28 February 2009, 北京：中国电力出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110703053A (en) * | 2019-10-23 | 2020-01-17 | 广东优科检测技术服务有限公司 | Dropping device and leakage tracking testing machine adopting same |
| CN110703053B (en) * | 2019-10-23 | 2022-02-18 | 广东优科检测技术服务有限公司 | Dropping device and leakage tracking testing machine adopting same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104569757B (en) | 2019-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY146651A (en) | Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as dielectric substrate | |
| TW200614889A (en) | Method and apparatus for manufacturing probing printed circuit board test access point structures | |
| CN204142158U (en) | A kind of microswitch inspection frock | |
| CN104569757A (en) | CTI testing method and device | |
| CN204631176U (en) | A kind of battery short circuit test machine | |
| CN102324702A (en) | Corona voltage-sharing device and multi-gap series gas spark switch adopting same | |
| CN203385825U (en) | Dropping device and leakage-resistance trace tester with dropping device | |
| CN204649907U (en) | The creeping discharge model equipment of degree of combining closely between electrode and medium can be changed | |
| CN204203285U (en) | Insulating bar experimental provision | |
| CN204314367U (en) | A kind of high-tension switch cabinet insulating part Leakage Current measures sensing device | |
| CN103748269B (en) | Copper plating bath | |
| CN203596231U (en) | Surface mounting type piezoresistor | |
| BR112014016016A2 (en) | process for determining a piston position in a piston pressure accumulator by measuring resistance as well as appropriately formed piston pressure accumulator | |
| CN203798843U (en) | Probe disc having hollow portion structure | |
| CN202957018U (en) | Screen body aging wire-leading wiring structure | |
| CN204255987U (en) | A kind of dials of PCB electric property test jig | |
| CN202595321U (en) | Electrode | |
| CN203850505U (en) | Rapid-assembled electrode apparatus | |
| CN205562745U (en) | Micropin test fixture | |
| CN203881670U (en) | Copper clad plate peeling strength testing die | |
| CN203894275U (en) | Insulated operating lever voltage withstanding test stand | |
| CN202533914U (en) | Capacitive touch screen and electrode protective layer thereof | |
| CN202649242U (en) | Superfine probe testing fixture | |
| CN203218468U (en) | Compound graphite grounding electrode | |
| CN204335142U (en) | A kind of novel pcb equipment being convenient to detect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |