CN104557084A - Platinum delivery device for electronic glass manufacturing, as well as preparation method and filling material of platinum delivery device - Google Patents
Platinum delivery device for electronic glass manufacturing, as well as preparation method and filling material of platinum delivery device Download PDFInfo
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- CN104557084A CN104557084A CN201410835280.8A CN201410835280A CN104557084A CN 104557084 A CN104557084 A CN 104557084A CN 201410835280 A CN201410835280 A CN 201410835280A CN 104557084 A CN104557084 A CN 104557084A
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- platinum
- foerderanlage
- packing material
- delivery device
- filling material
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Abstract
The invention relates to a platinum delivery device for electronic glass manufacturing, as well as a preparation method and a filling material of the platinum delivery device. The filling material comprises the following substances in percentage by weight: 50 to 80 percent of ZrO2, 3 to 15 percent of Al2O3, 10 to 30 percent of SiO2 and less than 10 percent of water glass. The filling material is added into a gap between the platinum delivery device and a heat-preservation material, and because the filling material is in a loose state at 1,100 DEG C or less, and is free of sintering, the expansion of platinum is facilitated, and the service life of the platinum delivery device is prolonged; the sintering of the filling material is started from 1100 EDG C, and the filling material can be completely sintered at 1,600 DEG C,, so that volatilization loss after the oxidation corrosion of a platinum material is reduced; in addition, sintering uniformity is ensured, so that temperature distribution in the platinum delivery device is uniform, the quality of glass is effectively improved, and the application range is wide.
Description
Technical field
The present invention relates to electronic glass and manufacture field, particularly relate to a kind of electronic glass manufacture platinum e Foerderanlage and preparation method and packing material thereof.
Background technology
During electronic glass manufactures, in the process that platinum e Foerderanlage heats up, platinum can expand and intensity reduces, if directly contacted with lagging material, can cause damage to platinum e Foerderanlage.So should have certain gap between platinum e Foerderanlage and lagging material, expand to it and play the effect of buffer protection, avoiding device contacts with the direct of lagging material simultaneously.
In the manufacturing processed of glass, the moisture content in melten glass at high temperature decomposes, the hydrogen ion (H in the hydroxyl of generation
+) excessive by platinum medium, and leave over oxonium ion (O in glass
2-) enrichment freely combining, a certain amount of air blister defect can be formed in glass; Meanwhile, at high temperature, the surface of platinum can form very thin oxidation film layer, and work as raised temperature, decomposition reaction appears in platinum oxide, and the volatilization loss of platinum shows with the lifting of air pressure and the relation of temperature: as oxygen partial pressure (Po
2) and PtO
2decomposition pressure (P
ptO2) equal time, oxidizing reaction is in equilibrium state, and its changes in weight is not obvious; When temperature continues to raise, Po
2>P
ptO2time, then reaction will continue to resultant (PtO
2) direction carries out, the oxidation film layer of platinum is thickening, reaction overbalance, and its instantaneous weight will increase to some extent; Work as Po
2<P
ptO2time, then reaction will be carried out round about, at this moment occur decomposition reaction, or gasification volatilization makes the rate of weight loss of platinum accelerate, and thus aggravate the voloxidation loss of platinum.Have data to show, glass is in melting process, and decomposition a large amount of moisture content are out again through thermolysis, and the concentration of hydrogen and oxygen is increased, and platinum and oxygen generate PtO
2dissolve in glass or decompose, making the corrosion aggravation of platinum and volatilization loss.The volatilization loss of this platinum is directly harm platinum installation weight percentage ratio and the many platinum material intensity at position, the reason of stability of local volatile quantity in usually using.In addition, be located on lagging material around glass manufacturing apparatus, thermal insulation material because the platinum after volatilization is attached to, therefore make the parts as platinum purification and recover object increase.And the loss that the platinum material due to high price is vaporized being difficult to cause in the space of reclaiming is also very large.
Therefore, need to fill a kind of material in the space of platinum material and lagging material, both to the expanded shock absorption of platinum, platinum material intensity can be reinforced, the volatilization of platinum material can be reduced again, improve glass quality.
Because platinum expands comparatively fast below 1100 DEG C, so the packing material described in wishing is loose state below 1100 DEG C, do not sinter, with the expansion of blocking-proof platinum, the use temperature of platinum e Foerderanlage is more than 1600 DEG C, fully sintered when this just requires that packing material is more than 1600 DEG C, plays the effect supporting fixing platinum e Foerderanlage, complete coated platinum material is outside simultaneously, slows down voloxidation.
During electronic glass manufactures, the course of conveying of glass should be avoided occurring non-uniform temperature phenomenon, affects the quality of glass.The stopping composition in the past adopted is aluminum oxide powder solution or alumina hollow ball solution, and they easily occur Sunk-fund effect, presents top after sintering and loosens, and the situation of bottom densification affects the homogeneity of platinum e Foerderanlage temperature distribution.If do not added water in these two kinds of stopping composition, only adopt alumina powder or alumina hollow ball, there will be again the too low situation that maybe cannot sinter of sintering temperature.
Therefore, need the packing material of a kind of sintering temperature between 1100 DEG C ~ 1600 DEG C to protect and support platinum e Foerderanlage, extend the life-span of platinum e Foerderanlage with this, reduce platinum volatilization simultaneously, improve the quality of glass.
Summary of the invention
The object of the invention is to overcome prior art defect, provide a kind of and effectively support platinum e Foerderanlage, reduce platinum oxidation volatilization, improve the electronic glass manufacture platinum e Foerderanlage of glass quality and preparation method and packing material thereof simultaneously.
The technical scheme of packing material of the present invention is:
By mass percentage, following material is comprised:
ZrO
2：50～80％；
Al
2O
3：3～15％；
SiO
2：10～30％；
Water glass < 10%.
Described ZrO
2for diameter is less than the hollow ball of 1mm.
Described Al
2o
3and SiO
2for the particle that granularity is less than 100 μm.
The technical scheme of e Foerderanlage of the present invention is:
Comprise the lagging material for supporting and being incubated that platinum e Foerderanlage and platinum e Foerderanlage are arranged outward, leave gap between described platinum e Foerderanlage and lagging material, being filled with in described gap can at the packing material of 1100 ~ 1600 DEG C of sintering.
Described gap is 5 ~ 50mm.
The technical scheme of e Foerderanlage preparation method of the present invention is:
First add packing material in the gap between platinum e Foerderanlage and lagging material, then packing material is sintered at 1100 ~ 1600 DEG C.
The sintering time of described packing material is 2 ~ 4h.
Described packing material sinters after 100 ~ 140 DEG C of drying 3 ~ 5h.
The present invention relative to existing technologies, has following useful technique effect:
Packing material of the present invention comprises ZrO
2, Al
2o
3, SiO
2and water glass, wherein ZrO
2main Function be improve the sintering temperature of packing material, can start and and Al at 1100 ~ 1600 DEG C
2o
3and other material is fully sintered together, and ZrO
2thermal conductivity lower, better heat insulation effect can be played; The water glass added can as bonding agent, be beneficial in the gap and hole making packing material penetrate into platinum equipment quickly when filling, blocking capillary porosity duct, stop the generation because of the Bubbles in Glass caused by hydrogen infiltration, and the volatilization loss reduced after platinum material oxidation corrosion, ultimate compression strength and the tensile strength of platinum material can also be strengthened simultaneously.
Further, ZrO in the present invention
2hollow ball form make packing material have better mobility, be beneficial to Even Sintering.
E Foerderanlage in the present invention is filled with ZrO
2based on packing material, it is loose state below 1100 DEG C, do not sinter, be beneficial to the expansion of platinum, start at 1100 ~ 1600 DEG C and sinter, proportion α>=1.15 after sintering and before sintering, apparent porosity β≤15, illustrate fully sintered, and the sintering strength sintered after 3 hours is equal to or greater than 10MPa at 1600 DEG C, platinum e Foerderanlage can be supported by available protecting, extend the platinum e Foerderanlage life-span; Sintering evenly, makes uniformity of temperature profile in platinum e Foerderanlage simultaneously, effectively improves the quality of glass; Moisture content in melten glass at high temperature decomposes, the hydrogen ion (H in the hydroxyl of generation
+) cannot be excessive by platinum medium, so there is no oxonium ion (O
2-) enrichment freely combining, effectively reduce the micro-bubble in glass, raising glass quality, the volatilization loss after the oxidation corrosion of minimizing platinum material; Packing material in the present invention effectively can avoid the volatilization loss of platinum, and through test, platinum volatile quantity can reach zero.Apparatus of the present invention are applied widely, as the making of display base plate glass, touch screen base plate glass and touch-screen cover-plate glass etc.
In the preparation method of e Foerderanlage of the present invention, the packing material adopted sinters at 1100 ~ 1600 DEG C, the sintering temperature of packing material is more than the rapid expansion temperature of platinum, and it is fully sintered before glass production, meet the change of temperature when electronic glass manufactures, both are coupling mutually, and synergy is good.
Further, the packing material in the present invention to reburn knot through super-dry, effectively reduces the moisture content in packing material.
Accompanying drawing explanation
Fig. 1 is the sectional view of platinum e Foerderanlage of the present invention.
Wherein: 101-platinum e Foerderanlage; 102-lagging material; 103-packing material.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further details.
See Fig. 1, the present invention includes platinum e Foerderanlage 101, platinum e Foerderanlage 101 periphery arranges lagging material 102, and lagging material 102 carries out supporting and being incubated; Leave the gap of 5 ~ 50mm between platinum e Foerderanlage 101 and lagging material 102, add with ZrO in this gap
2based on packing material 103, wherein packing material 103 is first at 100 ~ 140 DEG C of drying 3 ~ 5h, removes moisture content; Then add in gap at 1100 ~ 1600 DEG C of sintering 2 ~ 4h.
By mass percentage, packing material comprises ZrO
2: 50 ~ 80%, Al
2o
3: 3 ~ 15%, SiO
2: 10 ~ 30%, water glass: < 10%, wherein water glass degree Beaume is 9.9 ~ 45 ° of B é, is liquid state, is beneficial to flowing, in the gap making packing material can penetrate into platinum equipment and hole, blocking capillary porosity duct.
Wherein ZrO
2introduce with the form of hollow ball, hollow ball diameter is less than 1mm; Al
2o
3with SiO
2introduce with the form of particle, grain graininess is less than 100 μm.
The highlyest in packing material allow the Fe comprising 50ppm (ppm, 1,000,000/)
2o
3impurity.
In the present invention by the packing material of different ratio by mould make diameter 10 ~ 20mm, length 20 ~ 50mm cylindric, at 100 ~ 140 DEG C of drying 3 ~ 5h, then put into High Temperature Furnaces Heating Apparatus, 1100 DEG C with 1600 DEG C at fire 2 ~ 4 hours.Proportion and apparent porosity detection (GB/T2997-2000) are carried out to the material after firing, table one is defined as follows to sintering degree.
Table one sinters the definition of degree
| Project | Proportion α before proportion/sintering after sintering | Apparent porosity β % |
| Loose | α＝1 | β≥30 |
| Slight sintering | 1＜α≤1.05 | 20≤β<30 |
| Moderate sinters | 1.05<α<1.15 | 15<β<20 |
| Fully sintered | α≥1.15 | β≤15 |
Embodiment and comparative example
PtRh10 alloy plate (size: 250mm is selected in the present invention
2× 1.0mm) as test film, carry out the volatilization loss test of platinum.
Packing material different embodiments of the invention prepared is coated on PtRh10 alloy plate; after the two sides of PtRh10 alloy plate is all filled coated materials; at 100 ~ 140 DEG C of drying 3 ~ 5h; then High Temperature Furnaces Heating Apparatus is put into; at 1100 ~ 1600 DEG C, fire 2 ~ 4h, make the protective layer of PtRh10 alloy plate.
Under the present invention's test is exposed to extraneous air; at 1600 DEG C, the PtRh10 alloy plate test film firing matcoveredn is heated 84 hours; measure the changes in weight after heating; weight reduced value and platinum volatile quantity; in grams; as shown in Table 2, table two also illustrates the test-results (comparative example one) of the test film of uncoated packing material to its result in the lump.Its mild or moderate represents slight sintering, and moderate represents that moderate sinters, and perfect representation is fully sintered.
Table two embodiment of the present invention and comparative example test-results synopsis
Continued two:
As can be seen from Table II, packing material in the present invention, fire 2 ~ 4h at 1100 ~ 1600 DEG C after, sintering state all reach slight sintering and more than, wherein reach moderate 1100 DEG C of sintering state major parts, 1200 DEG C time, major part reaches fully sintered, and at 1600 DEG C, the sintering strength sintered after 3 hours is equal to or is greater than 10MPa, and all fully sintered; Contrast from the platinum volatile quantity of nine embodiments of the present invention and comparative example one, the PtRh10 alloy plate test film of comparative example one does not apply packing material of the present invention, it is after 1600 DEG C/84h heats, platinum volatile quantity reaches 0.4g, and the test film platinum volatile quantity being coated with packing material of the present invention effectively reduces, and when fully sintered, platinum volatile quantity is zero.So the packing material in the present invention effectively can reduce the voloxidation of platinum; available protecting platinum e Foerderanlage also extends the platinum e Foerderanlage life-span; by adding the obtained platinum e Foerderanlage of packing material; applied range; can be used for the manufacture of multiple electronic glass substrate; as display base plate glass, touch screen base plate glass and touch-screen cover-plate glass etc., and the micro-bubble in glass can be reduced, improve glass quality.
Claims (8)
1. an electronic glass manufacture packing material for platinum e Foerderanlage, is characterized in that: by mass percentage, comprises following material:
ZrO
2：50～80％；
Al
2O
3：3～15％；
SiO
2：10～30％；
Water glass < 10%.
2. the packing material of a kind of electronic glass manufacture platinum e Foerderanlage according to claim 1, is characterized in that: described ZrO
2for diameter is less than the hollow ball of 1mm.
3. the packing material of a kind of electronic glass manufacture platinum e Foerderanlage according to claim 1, is characterized in that: described Al
2o
3and SiO
2for the particle that granularity is less than 100 μm.
4. one kind is filled with the electronic glass manufacture platinum e Foerderanlage of packing material described in claim 1, it is characterized in that: comprise the lagging material (102) for supporting and being incubated that platinum e Foerderanlage (101) and platinum e Foerderanlage (101) are arranged outward, leave gap between described platinum e Foerderanlage (101) and lagging material (102), being filled with in described gap can at the packing material (103) of 1100 ~ 1600 DEG C of sintering.
5. a kind of electronic glass manufacture platinum e Foerderanlage according to claim 4, is characterized in that: described gap is 5 ~ 50mm.
6. one kind is filled with the preparation method of the electronic glass manufacture platinum e Foerderanlage of packing material described in claim 1, it is characterized in that: in the gap first between platinum e Foerderanlage (101) and lagging material (102), add packing material (103), then packing material (103) is sintered at 1100 ~ 1600 DEG C.
7. the preparation method of a kind of electronic glass manufacture platinum e Foerderanlage according to claim 6, is characterized in that: the sintering time of described packing material (103) is 2 ~ 4h.
8. the preparation method of a kind of electronic glass manufacture platinum e Foerderanlage according to claim 6 or 7, is characterized in that: described packing material (103) sinters after 100 ~ 140 DEG C of drying 3 ~ 5h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410835280.8A CN104557084B (en) | 2014-12-27 | 2014-12-27 | A kind of electronic glass manufacture platinum conveyer device and preparation method and packing material thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410835280.8A CN104557084B (en) | 2014-12-27 | 2014-12-27 | A kind of electronic glass manufacture platinum conveyer device and preparation method and packing material thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104557084A true CN104557084A (en) | 2015-04-29 |
| CN104557084B CN104557084B (en) | 2016-08-17 |
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ID=53074271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410835280.8A Active CN104557084B (en) | 2014-12-27 | 2014-12-27 | A kind of electronic glass manufacture platinum conveyer device and preparation method and packing material thereof |
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| Country | Link |
|---|---|
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2167833C1 (en) * | 1999-11-09 | 2001-05-27 | Обнинское научно-производственное предприятие "Технология" | Glass mass drop cutting scissors |
| CN203007108U (en) * | 2012-12-04 | 2013-06-19 | 陕西彩虹电子玻璃有限公司 | Platinum channel |
| CN203360255U (en) * | 2013-06-06 | 2013-12-25 | 彩虹（张家港）平板显示有限公司 | Novel Platinum channel adopting corrosion-resistant refractory bricks for production of glass substrates |
-
2014
- 2014-12-27 CN CN201410835280.8A patent/CN104557084B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2167833C1 (en) * | 1999-11-09 | 2001-05-27 | Обнинское научно-производственное предприятие "Технология" | Glass mass drop cutting scissors |
| CN203007108U (en) * | 2012-12-04 | 2013-06-19 | 陕西彩虹电子玻璃有限公司 | Platinum channel |
| CN203360255U (en) * | 2013-06-06 | 2013-12-25 | 彩虹（张家港）平板显示有限公司 | Novel Platinum channel adopting corrosion-resistant refractory bricks for production of glass substrates |
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| Publication number | Publication date |
|---|---|
| CN104557084B (en) | 2016-08-17 |
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