CN104551442A - High-temperature solder of brazing ceramic, ceramic matrix composite and metal as well as preparation method and using method of high-temperature solder - Google Patents

High-temperature solder of brazing ceramic, ceramic matrix composite and metal as well as preparation method and using method of high-temperature solder Download PDF

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Publication number
CN104551442A
CN104551442A CN201510056118.0A CN201510056118A CN104551442A CN 104551442 A CN104551442 A CN 104551442A CN 201510056118 A CN201510056118 A CN 201510056118A CN 104551442 A CN104551442 A CN 104551442A
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China
Prior art keywords
ceramic
solder
metal
matric composite
ceramic matric
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CN201510056118.0A
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Inventor
张丽霞
郝通达
张若蘅
亓钧雷
冯吉才
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Harbin Institute of Technology
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Harbin Institute of Technology
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Priority to CN201510056118.0A priority Critical patent/CN104551442A/en
Publication of CN104551442A publication Critical patent/CN104551442A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/325—Ti as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles

Abstract

The invention discloses a high-temperature solder of a brazing ceramic, a ceramic matrix composite and a metal as well as a preparation method and a using method of the high-temperature solder, relates to a high-temperature solder as well as a preparation method and a using method thereof and aims at solving the problems of the traditional solder of poor high temperature mechanical property and large residual stress of a joint after the brazing ceramic/ceramic or ceramic/metal is welded. The high-temperature solder is prepared from the following components in percentage by weight: 70-80 percent of Ti and 20-30 percent of Co. The preparation method comprises the following steps: 1, weighing the components, and uniformly mixing to obtain a mixture; and 2, pressurizing mixed powder by 6-10t to obtain a foil, carrying out ultrasonic cleaning for 10 minutes, and drying for 1-2h at room temperature to obtain the high-temperature solder. According to the high-temperature solder as well as the preparation method and the using method thereof disclosed by the invention, the room-temperature shear strength of the joint is 40-230 MPa, and the high-temperature shear strength at the temperature of 800 DEG C achieves 40-60 percent of the room-temperature shear strength.

Description

High-temp solder of a kind of ceramic soldering and ceramic matric composite and metal and preparation method thereof and using method
Technical field
The present invention relates to a kind of high-temp solder and preparation method thereof and using method.
Background technology
Pottery and ceramic matric composite have the excellent performance such as high-melting-point, high strength, high rigidity, are with a wide range of applications in the field such as Aero-Space and the energy.Due to pottery and the fragility of ceramic matric composite and the restriction of technology of preparing, be difficult to obtain large scale, complex-shaped ceramic component, usually realize himself at aerospace field and could extensive use be obtained with metal material soldering.
By existing literature search, when using conventional Ag-Cu-Ti solder to connect pottery and ceramic matric composite and metal, postwelding joint can only use below 450 DEG C, cannot meet applied at elevated temperature requirement; Application number be 201310325160.9 and the Chinese patent of CN201310325159.6 invented a kind of Co-Ti-Nb solder using vacuum arc melting to prepare, this solder take atomic ratio as the Ti-Co composition of 1:1 is design basis, during soldering C/SiC and Nb, brazing seam structure is mainly the solid solution phase of TiCo compound and (Nb, Ti).Because TiCo compound need 1325 DEG C of generations, therefore the brazing temperature of this solder is 1300 DEG C-1340 DEG C, and this brazing temperature not only makes postwelding joint residual stress large, and so high brazing temperature is very large to the performance impact of metal to be welded.Therefore, develop a kind of brazing temperature lower than 1200 DEG C, postwelding joint has the solder of good mechanical behavior under high temperature simultaneously, significant for the application promoting pottery and ceramic matric composite.
Summary of the invention
The present invention will solve conventional solder ceramic soldering/pottery or the ceramic/metal problem that strength of joint is low and brazing temperature is high under the high temperature conditions, and provides high-temp solder of a kind of ceramic soldering and ceramic matric composite and metal and preparation method thereof and using method.
The high-temp solder of a kind of ceramic soldering of the present invention and ceramic matric composite and metal, is made up of the Ti of 70% ~ 80% and the Co of 20% ~ 30% by mass percentage.
The preparation method of the high-temp solder of a kind of ceramic soldering of the present invention and ceramic matric composite and metal, carries out according to following steps:
One, weigh: take Ti or TiH of 70 ~ 80% by mass percentage 2powder and 20 ~ 30% Co powder, mix, obtain batch mixing;
Two, to the batch mixing pressurization 6 ~ 10t of step one, paillon foil is obtained, then by paillon foil ultrasonic cleaning 10min, then drying at room temperature 1 ~ 2h, obtain high-temp solder.
The high-temp solder ceramic soldering of a kind of ceramic soldering of use of the present invention and ceramic matric composite and metal and the method for ceramic matric composite and metal, it carries out according to following steps:
One, the greasy dirt of pottery to be welded and ceramic matric composite and metal welding surface, oxide mechanical chipping method are cleared up;
Two, the solder compressing tablet of claim 1 is processed into the solder sheet equal with welded surface area, then after step one being cleared up, pottery and ceramic matric composite and metal are put into acetone, carry out ultrasonic cleaning 10min, again by after the material natural air drying after cleaning, assemble according to the form being followed successively by pottery and ceramic matric composite/solder sheet/metal from top to bottom, and be fixed at the pressure of pottery and ceramic matric composite surperficial applying 2MPa, the workpiece assembled is put into vacuum furnace;
Three, vacuumizing the vacuum drying oven of step 2, is 1 × 10 in vacuum -3during Pa, start with the heating rate of 15 DEG C/min to 500 DEG C, insulation 5min, then with the heating rate of 10 DEG C/min to after 1000 DEG C, again with the heating rate of 5 DEG C/min to 1060 ~ 1190 DEG C, insulation 5min, then cool to 400 DEG C with the speed of 10 DEG C/min, thereafter cool to room temperature with the furnace, namely complete the soldering of pottery and ceramic matric composite and metal.
Of the present inventionly comprise following beneficial effect:
Ti-Co solder of the present invention, eutectic liquid phase is formed by the reaction of Ti, Co binary eutectic in brazing process, therefore brazing temperature is 1060 ~ 1190 DEG C, far below the brazing temperature (1350 ~ 1450 DEG C) of other high temperature Ti base solder (Ti-Fe, Ti-Si).Particularly, this solder pottery and ceramic matric composite surface wettability good, postwelding brazing seam structure is mainly β Ti+Ti 2co eutectic product, not only ensure that joint has good high-temperature behavior at 800 DEG C, and the generation of β Ti solid solution alleviates postwelding joint residual stress greatly.
Utilize Ti-Co solder of the present invention at 1060 ~ 1190 DEG C, soldering Si under insulation 1 ~ 120min condition 3n 4, SiC, ZrO 2, the pottery such as C/SiC and ceramic matric composite and metal (Nb and Nb-based alloys, Invar alloy, TC4 and molybdenum and molybdenum alloy etc.), the joint room temperature shearing strength obtained is 40 ~ 230MPa, and 800 DEG C of high temperature shearing strengths reach 40% ~ 60% of room temperature shearing strength.This solder is not only applicable to the connection of pottery and ceramic matric composite and metal, is applicable to these potteries or ceramic matric composite self and connection each other simultaneously yet.
Accompanying drawing explanation
Fig. 1 is the high-temp solder electron microscopic picture of the soldering C/SiC composite that obtains of embodiment 1 and niobium.
Detailed description of the invention
Technical solution of the present invention is not limited to following cited detailed description of the invention, also comprises any combination between each detailed description of the invention.
Detailed description of the invention one: the high-temp solder of a kind of ceramic soldering of present embodiment and ceramic matric composite and metal, is made up of the Ti of 70% ~ 80% and the Co of 20% ~ 30% by mass percentage.
The solder of present embodiment forms eutectic liquid phase by the reaction of Ti, Co binary eutectic in brazing process, therefore brazing temperature is 1060 ~ 1190 DEG C, far below the brazing temperature (1350 ~ 1450 DEG C) of other high temperature Ti base solder (Ti-Fe, Ti-Si).Particularly, this solder pottery and ceramic matric composite surface wettability good, postwelding brazing seam structure is mainly β Ti+Ti 2co eutectic product, not only ensure that joint has good high-temperature behavior at 800 DEG C, and the generation of β Ti solid solution alleviates postwelding joint residual stress greatly.
The solder of present embodiment at 1060 ~ 1190 DEG C, soldering Si under insulation 1 ~ 120min condition 3n 4, SiC, ZrO 2, the pottery such as C/SiC and ceramic matric composite and metal (Nb and Nb-based alloys, Invar alloy, TC4 and molybdenum and molybdenum alloy etc.), the joint room temperature shearing strength of acquisition is 40 ~ 230MPa, and 800 DEG C of high temperature shearing strengths reach 40% ~ 60%.Present embodiment solder is not only applicable to the connection of pottery and ceramic matric composite and metal, is applicable to these potteries or ceramic matric composite self and connection each other simultaneously yet.
Detailed description of the invention two: present embodiment and detailed description of the invention one unlike: described high-temp solder is made up of the Ti of 71% ~ 79% and the Co of 21% ~ 29% by mass percentage.Other is identical with detailed description of the invention one.
Detailed description of the invention three: present embodiment and detailed description of the invention one unlike: described high-temp solder is made up of the Ti of 72% ~ 78% and the Co of 22% ~ 28% by mass percentage.Other is identical with detailed description of the invention one.
Detailed description of the invention four: present embodiment and detailed description of the invention one unlike: described high-temp solder is made up of the Ti of 73% ~ 77% and the Co of 23% ~ 27% by mass percentage.Other is identical with detailed description of the invention one.
Detailed description of the invention five: present embodiment and detailed description of the invention one unlike: described high-temp solder is made up of the Ti of 73% ~ 76% and the Co of 24% ~ 27% by mass percentage.Other is identical with detailed description of the invention one.
Detailed description of the invention six: present embodiment and detailed description of the invention one unlike: described high-temp solder is made up of the Ti of 73% ~ 75% and the Co of 25% ~ 27% by mass percentage.Other is identical with detailed description of the invention one.
Detailed description of the invention seven: present embodiment and detailed description of the invention one unlike: described high-temp solder is made up of the Ti of 73% ~ 74% and the Co of 26% ~ 27% by mass percentage.Other is identical with detailed description of the invention one.
Detailed description of the invention eight: present embodiment and detailed description of the invention one unlike: described high-temp solder is made up of the Ti of 73.3% and the Co of 26.7% by mass percentage.Other is identical with detailed description of the invention one.
Detailed description of the invention nine: the purity that present embodiment and detailed description of the invention one are 99.0% ~ 99.9%, Co unlike the purity of: described Ti is 99.0% ~ 99.9%.Other is identical with detailed description of the invention one.
Detailed description of the invention ten: present embodiment and detailed description of the invention one unlike: described Ti and Co is 300 object metal dusts.Other is identical with detailed description of the invention one.
Detailed description of the invention 11: the preparation method of the high-temp solder of a kind of ceramic soldering of present embodiment and ceramic matric composite and metal, carry out according to following steps:
One, weigh: take Ti or TiH of 70 ~ 80% by mass percentage 2powder and 20 ~ 30% Co powder, mix, obtain batch mixing;
Two, to the batch mixing pressurization 6 ~ 10t of step one, paillon foil is obtained, then by paillon foil ultrasonic cleaning 10min, then drying at room temperature 1 ~ 2h, obtain high-temp solder.
The solder of present embodiment forms eutectic liquid phase by the reaction of Ti, Co binary eutectic in brazing process, therefore brazing temperature is 1060 ~ 1190 DEG C, far below the brazing temperature (1350 ~ 1450 DEG C) of other high temperature Ti base solder (Ti-Fe, Ti-Si).Particularly, this solder pottery and ceramic matric composite surface wettability good, postwelding brazing seam structure is mainly β Ti+Ti 2co eutectic product, not only ensure that joint has good high-temperature behavior at 800 DEG C, and the generation of β Ti solid solution alleviates postwelding joint residual stress greatly.
The solder of present embodiment at 1060 ~ 1190 DEG C, soldering Si under insulation 1 ~ 120min condition 3n 4, SiC, ZrO 2, the pottery such as C/SiC and ceramic matric composite and metal (Nb and Nb-based alloys, Invar alloy, TC4 and molybdenum and molybdenum alloy etc.), the joint room temperature shearing strength of acquisition is 40 ~ 230MPa, and 800 DEG C of high temperature shearing strengths reach 40% ~ 60%.Present embodiment solder is not only applicable to the connection of pottery and ceramic matric composite and metal, is applicable to these potteries or ceramic matric composite self and connection each other simultaneously yet.
Detailed description of the invention 12: present embodiment and detailed description of the invention 11 unlike: described Ti and Co is 300 object metal dusts.Other is identical with detailed description of the invention 11.
Detailed description of the invention 13: present embodiment and detailed description of the invention 11 unlike the purity of: the Ti described in step one be 99.0% ~ 99.9% and the purity of Co be 99.0% ~ 99.9%.Other is identical with detailed description of the invention 11.
Detailed description of the invention 14: present embodiment and detailed description of the invention 11 unlike: described in step one take by mass percentage 73 ~ 77% Ti powder or TiH 2powder and 22% ~ 28% Co powder, mix, obtain batch mixing.Other is identical with detailed description of the invention 11.
Detailed description of the invention 15: present embodiment and detailed description of the invention 11 unlike: described in step one take by mass percentage 73 ~ 76% Ti powder or TiH 2powder and 23% ~ 27% Co powder, mix, obtain batch mixing.Other is identical with detailed description of the invention 11.
Detailed description of the invention 16: present embodiment and detailed description of the invention 11 unlike: described in step one take by mass percentage 73 ~ 75% Ti powder or TiH 2powder and 24% ~ 27% Co powder, mix, obtain batch mixing.Other is identical with detailed description of the invention 11.
Detailed description of the invention 17: present embodiment and detailed description of the invention 11 unlike: described in step one take by mass percentage 73 ~ 74% Ti powder or TiH 2powder and 25% ~ 27% Co powder, mix, obtain batch mixing.Other is identical with detailed description of the invention 11.
Detailed description of the invention 18: present embodiment and detailed description of the invention 11 unlike: described in step one take by mass percentage 73.3% Ti powder or TiH 2powder and 26.7% Co powder, mix, obtain batch mixing.Other is identical with detailed description of the invention 11.
Detailed description of the invention 19: present embodiment and detailed description of the invention 11 unlike: the supersonic frequency described in step 2 is 20KHz.Other is identical with detailed description of the invention 11.
Detailed description of the invention 20: present embodiment uses the high-temp solder ceramic soldering of a kind of ceramic soldering and ceramic matric composite and metal and the method for ceramic matric composite and metal, and it carries out according to following steps:
One, the greasy dirt of pottery to be welded and ceramic matric composite and metal welding surface, oxide mechanical chipping method are cleared up;
Two, the solder compressing tablet of claim 1 is processed into the solder sheet equal with welded surface area, then after step one being cleared up, pottery and ceramic matric composite and metal are put into acetone, carry out ultrasonic cleaning 10min, again by after the material natural air drying after cleaning, assemble according to the form being followed successively by pottery and ceramic matric composite/solder sheet/metal from top to bottom, and be fixed at the pressure of pottery and ceramic matric composite surperficial applying 2MPa, the workpiece assembled is put into vacuum furnace;
Three, vacuumizing the vacuum drying oven of step 2, is 1 × 10 in vacuum -3during Pa, start with the heating rate of 15 DEG C/min to 500 DEG C, insulation 5min, then with the heating rate of 10 DEG C/min to after 1000 DEG C, again with the heating rate of 5 DEG C/min to 1060 ~ 1190 DEG C, insulation 5min, then cool to 400 DEG C with the speed of 10 DEG C/min, thereafter cool to room temperature with the furnace, namely complete the soldering of pottery and ceramic matric composite and metal.
Supersonic frequency in present embodiment step 2 during ultrasonic cleaning is 20KHz.
Content of the present invention is not limited only to the content of the respective embodiments described above, and the combination of one of them or several detailed description of the invention equally also can realize the object of inventing.
Beneficial effect of the present invention is verified by following examples:
Embodiment one:
The preparation method of a kind of ceramic soldering of the present embodiment and ceramic matric composite and metallic high temperature solder carries out according to following steps: the TiH one, taking 73.3g 2the Co powder of powder, 26.7g; Two, by mixed-powder pressurization 6 ~ 10t, obtain paillon foil, ultrasonic cleaning 10min, drying at room temperature 1 ~ 2h, namely obtain the high-temp solder for pottery and ceramic matric composite and solder bonding metal.
The greasy dirt of C/SiC composite and niobium welding surface, oxide mechanical chipping method are cleaned out.Solder powder compressing tablet is processed into the small pieces equal with welded surface area, then C/SiC composite and niobium are put into acetone, carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, after the material natural air drying after cleaning, assemble according to the form from top to bottom for C/SiC composite/configuration high-temp solder compressing tablet/niobium, and be fixed at the pressure of C/SiC composite material surface applying 2MPa, the workpiece assembled is put into vacuum furnace, when vacuum is 1 × 10 -3during Pa, start with the heating rate of 10 DEG C/min to 1170 DEG C, insulation 10min, then cools to 400 DEG C with the speed of 10 DEG C/min, cools to room temperature with the furnace thereafter, namely complete the soldering of C/SiC and niobium.
The purity of the Ti powder of the present embodiment is 99.9%, the purity of Co powder is 99.9%.
After tested, the joint room temperature shearing strength of C/SiC and niobium is up to 70MPa, and shearing strength when 800 DEG C reaches 29MPa.
The ceramic soldering obtain the present embodiment and ceramic matric composite and metallic high temperature solder carry out electron microscopic observation, result as shown in Figure 1, as shown in Figure 1 as can be seen from joint microstructure photo, active component Ti has very high activity in this solder system, effective interfacial reaction can be there is with C/SiC composite, form fine and close TiC conversion zone, thus effectively suppress the reaction of SiC matrix excessive dissolution; (Ti, Nb) solid solution can be formed with Nb side, alleviate residual stress, Weld pipe mill Ti 2the generation of Co compound makes joint have good mechanical behavior under high temperature.
Embodiment two:
The preparation method of a kind of ceramic soldering of the present embodiment and ceramic matric composite and metallic high temperature solder carries out according to following steps: one, take the Ti powder of 73.3g, the Co powder of 26.7g; Two, by mixed-powder pressurization 6 ~ 10t, obtain paillon foil, ultrasonic cleaning 10min, drying at room temperature 1 ~ 2h, namely obtain the high-temp solder for pottery and ceramic matric composite and solder bonding metal.
The greasy dirt of C/SiC composite and TC4 welding surface, oxide mechanical chipping method are cleaned out.Solder powder compressing tablet is processed into the small pieces equal with welded surface area, then C/SiC composite and TC4 are put into acetone, carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, after the material natural air drying after cleaning, assemble according to the form from top to bottom for C/SiC composite/configuration high-temp solder compressing tablet/TC4, and be fixed at the pressure of C/SiC composite material surface applying 2MPa, the workpiece assembled is put into vacuum furnace, when vacuum is 1 × 10 -3during Pa, start with the heating rate of 10 DEG C/min to 1170 DEG C, insulation 10min, then cools to 400 DEG C with the speed of 10 DEG C/min, cools to room temperature with the furnace thereafter, namely complete the soldering of C/SiC and TC4.
The purity of the Ti powder of the present embodiment is 99.9%, the purity of Co powder is 99.9%.
After tested, the joint room temperature shearing strength of C/SiC and TC4 is up to 34MPa, and shearing strength when 800 DEG C is 14MPa.
Embodiment three:
The preparation method of a kind of ceramic soldering of the present embodiment and ceramic matric composite and metallic high temperature solder carries out according to following steps: one, take the Ti powder of 73.3g, the Co powder of 26.7g; Two, by mixed-powder pressurization 6 ~ 10t, obtain paillon foil, ultrasonic cleaning 10min, drying at room temperature 1 ~ 2h, namely obtain the high-temp solder for pottery and ceramic matric composite and solder bonding metal.
The greasy dirt of C/SiC composite and Mo alloy welding surface, oxide mechanical chipping method are cleaned out.Solder powder compressing tablet is processed into the small pieces equal with welded surface area, then C/SiC composite and Mo alloy are put into acetone, carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, after the material natural air drying after cleaning, assemble according to the form from top to bottom for C/SiC composite/configuration high-temp solder compressing tablet/Mo alloy, and be fixed at the pressure of C/SiC composite material surface applying 2MPa, the workpiece assembled is put into vacuum furnace, when vacuum is 1 × 10 -3during Pa, start with the heating rate of 10 DEG C/min to 1170 DEG C, insulation 10min, then cools to 400 DEG C with the speed of 10 DEG C/min, cools to room temperature with the furnace thereafter, namely complete the soldering of C/SiC and Mo alloy.
The purity of the Ti powder of the present embodiment is 99.9%, the purity of Co powder is 99.9%.
After tested, the joint room temperature shearing strength of C/SiC and Mo alloy is up to 67MPa, and shearing strength when 800 DEG C reaches 30MPa.
Embodiment four:
The preparation method of a kind of ceramic soldering of the present embodiment and ceramic matric composite and metallic high temperature solder carries out according to following steps: one, take the Ti powder of 73.3g, the Co powder of 26.7g; Two, by mixed-powder pressurization 6 ~ 10t, obtain paillon foil, ultrasonic cleaning 10min, drying at room temperature 1 ~ 2h, namely obtain the high-temp solder for pottery and ceramic matric composite and solder bonding metal.
The greasy dirt of C/SiC composite and Invar alloy welding surface, oxide mechanical chipping method are cleaned out.Solder powder compressing tablet is processed into the small pieces equal with welded surface area, then C/SiC composite and Invar alloy are put into acetone, carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, after the material natural air drying after cleaning, assemble according to the form from top to bottom for C/SiC composite/configuration high-temp solder compressing tablet/Invar alloy, and be fixed at the pressure of C/SiC composite material surface applying 2MPa, the workpiece assembled is put into vacuum furnace, when vacuum is 1 × 10 -3during Pa, start with the heating rate of 10 DEG C/min to 1170 DEG C, insulation 10min, then cools to 400 DEG C with the speed of 10 DEG C/min, cools to room temperature with the furnace thereafter, namely complete the soldering of C/SiC and Invar alloy.
The purity of the Ti powder of the present embodiment is 99.9%, the purity of Co powder is 99.9%.
After tested, the joint room temperature shearing strength of C/SiC and Invar alloy is up to 84MPa, and shearing strength when 800 DEG C reaches 45MPa.
Embodiment five:
The preparation method of a kind of ceramic soldering of the present embodiment and ceramic matric composite and metallic high temperature solder carries out according to following steps: one, take the Ti powder of 73.3g, the Co powder of 26.7g; Two, by mixed-powder pressurization 6 ~ 10t, obtain paillon foil, ultrasonic cleaning 10min, drying at room temperature 1 ~ 2h, namely obtain the high-temp solder for pottery and ceramic matric composite and solder bonding metal.
The greasy dirt of SiC and Invar alloy welding surface, oxide mechanical chipping method are cleaned out.Solder powder compressing tablet is processed into the small pieces equal with welded surface area, then SiC and Invar alloy is put into acetone, carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, after the material natural air drying after cleaning, assemble according to the form configuring high-temp solder compressing tablet/Invar alloy for SiC/ from top to bottom, and be fixed at the pressure of surface of SiC applying 2MPa, the workpiece assembled is put into vacuum furnace, when vacuum is 1 × 10 -3during Pa, start with the heating rate of 10 DEG C/min to 1170 DEG C, insulation 10min, then cools to 400 DEG C with the speed of 10 DEG C/min, cools to room temperature with the furnace thereafter, namely complete the soldering of SiC and Invar alloy.
The purity of the Ti powder of the present embodiment is 99.9%, the purity of Co powder is 99.9%.
After tested, the joint room temperature shearing strength of SiC and Invar alloy is up to 50MPa, and shearing strength when 800 DEG C reaches 27MPa.
Embodiment six:
The preparation method of a kind of ceramic soldering of the present embodiment and ceramic matric composite and metallic high temperature solder carries out according to following steps: one, take the Ti powder of 73.3g, the Co powder of 26.7g; Two, by mixed-powder pressurization 6 ~ 10t, obtain paillon foil, ultrasonic cleaning 10min, drying at room temperature 1 ~ 2h, namely obtain the high-temp solder for pottery and ceramic matric composite and solder bonding metal.
By ZrO 2greasy dirt, the oxide mechanical chipping method of pottery and Mo alloy welding surface are cleaned out.Solder powder compressing tablet is processed into the small pieces equal with welded surface area, then by ZrO 2acetone put into by pottery and Mo alloy, carries out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, after the material natural air drying after cleaning, according to being ZrO from top to bottom 2the form of pottery/configuration high-temp solder compressing tablet/Mo alloy is assembled, and at ZrO 2the pressure that ceramic surface applies 2MPa is fixed, and the workpiece assembled is put into vacuum furnace, when vacuum is 1 × 10 -3during Pa, start with the heating rate of 10 DEG C/min to 1170 DEG C, insulation 10min, then cools to 400 DEG C with the speed of 10 DEG C/min, cools to room temperature with the furnace thereafter, namely complete ZrO 2the soldering of pottery and Mo alloy.
The purity of the Ti powder of the present embodiment is 99.9%, the purity of Co powder is 99.9%.
After tested, ZrO 2pottery is up to 210MPa with the joint room temperature shearing strength of Mo alloy, and shearing strength when 800 DEG C reaches 120MPa.
Embodiment seven:
The preparation method of a kind of ceramic soldering of the present embodiment and ceramic matric composite and metallic high temperature solder carries out according to following steps: one, take the Ti powder of 73.3g, the Co powder of 26.7g; Two, by mixed-powder pressurization 6 ~ 10t, obtain paillon foil, ultrasonic cleaning 10min, drying at room temperature 1 ~ 2h, namely obtain the high-temp solder for pottery and ceramic matric composite and solder bonding metal.
By ZrO 2greasy dirt, the oxide mechanical chipping method of pottery and TC4 welding surface are cleaned out.Solder powder compressing tablet is processed into the small pieces equal with welded surface area, then by ZrO 2pottery and TC4 put into acetone, carry out ultrasonic wave (supersonic frequency is 20KHz) and clean 10min, after the material natural air drying after cleaning, according to being ZrO from top to bottom 2the form of pottery/configuration high-temp solder compressing tablet/TC4 is assembled, and at ZrO 2the pressure that ceramic surface applies 2MPa is fixed, and the workpiece assembled is put into vacuum furnace, when vacuum is 1 × 10 -3during Pa, start with the heating rate of 10 DEG C/min to 1170 DEG C, insulation 10min, then cools to 400 DEG C with the speed of 10 DEG C/min, cools to room temperature with the furnace thereafter, namely complete ZrO 2the soldering of pottery and TC4.
The purity of the Ti powder of the present embodiment is 99.9%, the purity of Co powder is 99.9%.
After tested, ZrO 2pottery is up to 230MPa with the joint room temperature shearing strength of TC4 alloy, and shearing strength when 800 DEG C reaches 128MPa.

Claims (10)

1. a high-temp solder for ceramic soldering and ceramic matric composite and metal, is characterized in that described high-temp solder is made up of the Ti of 70% ~ 80% and the Co of 20% ~ 30% by mass percentage.
2. the high-temp solder of a kind of ceramic soldering according to claim 1 and ceramic matric composite and metal, is characterized in that the purity of described Ti be the purity of 99.0% ~ 99.9%, Co is 99.0% ~ 99.9%.
3. the high-temp solder of a kind of ceramic soldering according to claim 1 and ceramic matric composite and metal, is characterized in that described high-temp solder is made up of the Ti of 70% ~ 78% and the Co of 22% ~ 28% by mass percentage.
4. the high-temp solder of a kind of ceramic soldering according to claim 3 and ceramic matric composite and metal, is characterized in that described high-temp solder is made up of the Ti of 70% ~ 75% and the Co of 24% ~ 28% by mass percentage.
5. the high-temp solder of a kind of ceramic soldering according to claim 4 and ceramic matric composite and metal, is characterized in that described high-temp solder is made up of the Ti of 73.3% and the Co of 26.7% by mass percentage.
6. the high-temp solder of a kind of ceramic soldering according to claim 1 and ceramic matric composite and metal, is characterized in that described Ti and Co is 300 object metal dusts.
7. prepare the method for the high-temp solder of a kind of ceramic soldering according to claim 1 and ceramic matric composite and metal, it is characterized in that it carries out according to following steps:
One, weigh: take Ti or the TiH2 powder of 70 ~ 80% and the Co powder of 20 ~ 30% by mass percentage, mix, obtain batch mixing;
Two, to the batch mixing pressurization 6 ~ 10t of step one, paillon foil is obtained, then by paillon foil ultrasonic cleaning 10min, then drying at room temperature 1 ~ 2h, obtain high-temp solder.
8. the preparation method of the high-temp solder of a kind of ceramic soldering according to claim 7 and ceramic matric composite and metal, it is characterized in that the purity of the Ti described in step one be 99.0% ~ 99.9% and the purity of Co be 99.0% ~ 99.9%.
9. the preparation method of the high-temp solder of a kind of ceramic soldering according to claim 7 and ceramic matric composite and metal, it is characterized in that described in step one take by mass percentage 73.3% Ti powder or TiH 2powder and 26.7% Co powder, mix, obtain batch mixing.
10. use a kind of ceramic soldering described in claim 1 and the high-temp solder ceramic soldering of ceramic matric composite and metal and the method for ceramic matric composite and metal, it is characterized in that it carries out according to following steps:
One, the greasy dirt of pottery to be welded and ceramic matric composite and metal welding surface, oxide mechanical chipping method are cleared up;
Two, the solder compressing tablet of claim 1 is processed into the solder sheet equal with welded surface area, then after step one being cleared up, pottery and ceramic matric composite and metal are put into acetone, carry out ultrasonic cleaning 10min, again by after the material natural air drying after cleaning, assemble according to the form being followed successively by pottery and ceramic matric composite/solder sheet/metal from top to bottom, and be fixed at the pressure of pottery and ceramic matric composite surperficial applying 2MPa, the workpiece assembled is put into vacuum furnace;
Three, vacuumizing the vacuum drying oven of step 2, is 1 × 10 in vacuum -3during Pa, start with the heating rate of 15 DEG C/min to 500 DEG C, insulation 5min, then with the heating rate of 10 DEG C/min to after 1000 DEG C, again with the heating rate of 5 DEG C/min to 1060 ~ 1190 DEG C, insulation 5min, then cool to 400 DEG C with the speed of 10 DEG C/min, thereafter cool to room temperature with the furnace, namely complete the soldering of pottery and ceramic matric composite and metal.
CN201510056118.0A 2015-02-03 2015-02-03 High-temperature solder of brazing ceramic, ceramic matrix composite and metal as well as preparation method and using method of high-temperature solder Pending CN104551442A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106112309A (en) * 2016-07-27 2016-11-16 江苏科技大学 A kind of brazing material for SiC ceramic soldering and use the technique that this material carries out soldering
CN110407600A (en) * 2019-07-29 2019-11-05 浙江工业大学 A method of SiC ceramic is connected using Au base high-temp solder
CN113385851A (en) * 2021-05-28 2021-09-14 中国科学院上海硅酸盐研究所苏州研究院 High-temperature-resistant corrosion-resistant solder for silicon carbide ceramic connection and preparation method and application thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6586118B2 (en) * 2001-05-30 2003-07-01 General Electric Company Bonded niobium silicide and molybdenum silicide composite articles using semi-solid brazes
CN101890591A (en) * 2010-07-06 2010-11-24 哈尔滨工业大学 Nickel-based high temperature solder and preparation method thereof
CN102198569A (en) * 2011-04-19 2011-09-28 哈尔滨工业大学 High-temperature solder for brazing TiAl-based alloy and preparation method thereof
CN102689109A (en) * 2012-06-21 2012-09-26 哈尔滨工业大学 High-entropy brazing filler metal for brazing non-oxide ceramics and non-oxide ceramic composite material and preparation method of brazing filler metal
CN103341700A (en) * 2013-07-30 2013-10-09 哈尔滨工业大学 Co-Ti-Nb-based high-temperature brazing filler metal

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6586118B2 (en) * 2001-05-30 2003-07-01 General Electric Company Bonded niobium silicide and molybdenum silicide composite articles using semi-solid brazes
CN101890591A (en) * 2010-07-06 2010-11-24 哈尔滨工业大学 Nickel-based high temperature solder and preparation method thereof
CN102198569A (en) * 2011-04-19 2011-09-28 哈尔滨工业大学 High-temperature solder for brazing TiAl-based alloy and preparation method thereof
CN102689109A (en) * 2012-06-21 2012-09-26 哈尔滨工业大学 High-entropy brazing filler metal for brazing non-oxide ceramics and non-oxide ceramic composite material and preparation method of brazing filler metal
CN103341700A (en) * 2013-07-30 2013-10-09 哈尔滨工业大学 Co-Ti-Nb-based high-temperature brazing filler metal

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
虞觉奇等: "《二元合金状态图集》", 31 October 1987, 上海科学技术出版社 *
陆善平等: "Co–Ti, Ti-Zr-Cu高温钎料在Si3N4陶瓷上润湿性与界面连接", 《材料研究学报》 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106112309A (en) * 2016-07-27 2016-11-16 江苏科技大学 A kind of brazing material for SiC ceramic soldering and use the technique that this material carries out soldering
CN106112309B (en) * 2016-07-27 2018-02-23 江苏科技大学 A kind of brazing material for SiC ceramic soldering and the technique using material progress soldering
CN110407600A (en) * 2019-07-29 2019-11-05 浙江工业大学 A method of SiC ceramic is connected using Au base high-temp solder
CN113385851A (en) * 2021-05-28 2021-09-14 中国科学院上海硅酸盐研究所苏州研究院 High-temperature-resistant corrosion-resistant solder for silicon carbide ceramic connection and preparation method and application thereof

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