CN104551433A - Lead-free metal-spraying welding material - Google Patents
Lead-free metal-spraying welding material Download PDFInfo
- Publication number
- CN104551433A CN104551433A CN201310503030.XA CN201310503030A CN104551433A CN 104551433 A CN104551433 A CN 104551433A CN 201310503030 A CN201310503030 A CN 201310503030A CN 104551433 A CN104551433 A CN 104551433A
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- CN
- China
- Prior art keywords
- lead
- welding material
- neodymium
- cerium
- rare earth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
Abstract
The invention relates to welding material, particularly to lead-free metal-spraying welding material composed of 30% of tin, 0.2% of neodymium, 1% of stibium, 0.1% of copper, 0.005% of cerium, 2% of aluminum, 0.01% of misch metal and the balance of zinc and inevitable impurity. The misch metal is cerium light rare earth and neodymium light rare earth. The lead-free metal-spraying welding material is high in cost performance.
Description
Technical field
The present invention relates to a kind of welding material, specifically a kind of lead-free golden-plating welding material.
Background technology
The metallized film container end face metal spraying material (abbreviation gold spraying material) be widely used, traditional gold spraying material is generally lead-containing alloy material, as Sn35PbSbZn, Sn30PbSbZn, Sn28PbSbZn, the lead base quaternarys such as Sn38PbSbZnBi or lead base five yuan of gold spraying materials, this gold spraying material contains more lead, and lead content is at 57%-65%, but it is plumbous poisonous, when waste electronic electrical equipment landfill disposal, the Pb in solder meets acid rain or underground water, forms Pb
2+, be dissolved in underground water, enter the water supply chain of people thus enter in human body, causing lead poisoning, and its material combination of the no-lead gold spraying material occurred at present can not overcome material performance inherently defect, performance is superior not, in the global tide that electronic devices and components are unleaded, substantially be eliminated at present, quite a large amount of producers is had to use zinc silk, Zn-Al alloy wire and tin zinc series alloy silk etc. replace lead base five yuan of gold spraying materials, because tin zinc series alloy has and the same good end face adhesive force of lead base five yuan of gold spraying materials and superior welding performance, its fusing point also than zinc silk and allumen low, therefore, tin zinc series alloy becomes the metal spraying material of capacitor manufacturer first-selection, but in order to ensure the good contact of gilding layer and film metal evaporation layer, often first to spray the pure zinc bottom of one deck, spray tin-zinc containing alloy surface layer again, can reduce costs, the requirement of capacitor performance can be met again, and this adds increased operation, make complex technical process, but as no-lead gold spraying material, at fusing point, price, the aspects such as performance can't meet the requirement of vast Capacitor manufactures.
Summary of the invention
The object of this invention is to provide the lead-free golden-plating welding material that a kind of cost performance is high.
Technical scheme of the present invention is a kind of lead-free golden-plating welding material, it is characterized in that, described each component precentagewise composition: tin 30-60%, neodymium 0.2-0.25%, antimony 1-2.5%, copper 0.1-0.4%, cerium 0.005-0.1%, aluminium 2-10%, norium 0.01-2%, all the other impurity being zinc and not avoiding.
Say further, described norium is cerium lightweight rare earth and neodymium lightweight rare earth.
Advantage of the present invention has that oxidation resistance is strong, wetability good, mechanical and physical performance is excellent, the advantage that electric conductivity, solderability are good.
Detailed description of the invention
The present invention is further described with the following Examples,
Embodiment 1, a kind of lead-free golden-plating welding material, described each component precentagewise composition: tin 30%, neodymium 0.2%, antimony 1%, copper 0.1%, cerium 0.005%, aluminium 2%, norium 0.01%, all the other impurity being zinc and not avoiding.Described norium is cerium lightweight rare earth and neodymium lightweight rare earth.
Embodiment 2, a kind of lead-free golden-plating welding material, described each component precentagewise composition: tin 45%, neodymium 0.22%, antimony 2%, copper 0.25%, cerium 0.01%, aluminium 6%, norium 0.8%, all the other impurity being zinc and not avoiding.Described norium is cerium lightweight rare earth and neodymium lightweight rare earth.
Embodiment 3, a kind of lead-free golden-plating welding material, described each component precentagewise composition: tin 60%, neodymium 0.25%, antimony 2.5%, copper 0.4%, cerium 0.1%, aluminium 10%, norium 2%, all the other impurity being zinc and not avoiding.Described norium is cerium lightweight rare earth and neodymium lightweight rare earth.
Should be understood that this embodiment is only not used in for illustration of the present invention to limit the scope of the invention.In addition, should be understood that those skilled in the art can make various changes or modifications the present invention, and these equivalent form of values fall within the protection domain that the application's appended claims limits equally after having read the content that the present invention lectures.
Claims (2)
1. a lead-free golden-plating welding material, is characterized in that, described each component precentagewise composition: tin 30-60%, neodymium 0.2-0.25%, antimony 1-2.5%, copper 0.1-0.4%, cerium 0.005-0.1%, aluminium 2-10%, norium 0.01-2%, all the other impurity being zinc and not avoiding.
2. a kind of nothing according to claim 1 is along metal spraying welding material, and it is characterized in that, described norium is cerium lightweight rare earth and neodymium lightweight rare earth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310503030.XA CN104551433A (en) | 2013-10-23 | 2013-10-23 | Lead-free metal-spraying welding material |
Applications Claiming Priority (1)
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CN201310503030.XA CN104551433A (en) | 2013-10-23 | 2013-10-23 | Lead-free metal-spraying welding material |
Publications (1)
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CN104551433A true CN104551433A (en) | 2015-04-29 |
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CN201310503030.XA Pending CN104551433A (en) | 2013-10-23 | 2013-10-23 | Lead-free metal-spraying welding material |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111571059A (en) * | 2020-05-29 | 2020-08-25 | 南昌大学 | Cerium-modified high-temperature zinc-tin-based alloy solder and preparation method and application thereof |
-
2013
- 2013-10-23 CN CN201310503030.XA patent/CN104551433A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111571059A (en) * | 2020-05-29 | 2020-08-25 | 南昌大学 | Cerium-modified high-temperature zinc-tin-based alloy solder and preparation method and application thereof |
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Legal Events
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PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150429 |