CN104534554A - Adhesion structure, heater and adhesion process - Google Patents
Adhesion structure, heater and adhesion process Download PDFInfo
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- CN104534554A CN104534554A CN201410790430.8A CN201410790430A CN104534554A CN 104534554 A CN104534554 A CN 104534554A CN 201410790430 A CN201410790430 A CN 201410790430A CN 104534554 A CN104534554 A CN 104534554A
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Abstract
The invention provides an adhesion structure, a heater and an adhesion process. The adhesion structure comprises a first plate, a second plate, a quickly-drying adhesive layer and a high-temperature-resistant adhesive layer. The second plate is provided with a first groove and a second groove, the quickly-drying adhesive layer is located in the first groove and enables the second plate and the first plate to fixedly adhere to each other, and the high-temperature-resistant adhesive layer is located in the second groove and enables the second plate and the first plate to fixedly adhere to each other. According to the adhesion structure, the quickly-drying adhesive layer rapidly fixes the first plate and the second plate, can meet the requirement for fixing strength between the first plate and the second plate in a flowing production process and enables the first plate and the second plate which adhere to each other through the quickly-drying adhesive layer to enter the flowing production process, and the high-temperature-resistant adhesive layer cures naturally in the following production process, so that on the premise of not influencing the use performance of the product, the time consumption of an adhesion station is lowered, the production efficiency of the complete product is improved, and the production cost of the product is lowered.
Description
Technical field
The present invention relates to the sticking technology field of bonded structure, in particular to a kind of bonded structure, there is the warmer of this bonded structure and the technique for sticking of this bonded structure.
Background technology
As shown in Figure 1, the sheet metal 2' of existing warmer is provided with groove 3', pyroceram glue is injected in this groove 3', to be adhesively fixed to pyroceram plate 1' and sheet metal 2', but, in the production line of existing warmer, because the hardening time of pyroceram glue is very long, thus cause the increase consuming time of bonding station, this greatly reduces the production efficiency of product complete machine, and then cause the cost of product to increase; For solving this problem, usually pyroceram plate 1' and sheet metal 2' are carried out bonding in advance in prior art, although which improves the production line balance efficiency of product to a certain extent, but, bonding pyroceram plate 1' and sheet metal 2' needs to take very large placing space in the process of pyroceram adhesive curing in advance, thus cause which to have certain use limitation, be not easy to promote.
Summary of the invention
In order to solve the problems of the technologies described above one of at least, it is simple that one object of the present invention is to provide a kind of structure, and can improve the bonded structure of product production line production efficiency.
Another object of the present invention is to provide a kind of warmer with above-mentioned bonded structure.
Another object of the present invention is the technique for sticking providing a kind of above-mentioned bonded structure.
In view of this, first aspect present invention embodiment provides a kind of bonded structure, comprising: the first plate; Second plate, described second plate is provided with the first groove and the second groove; Rapid-curing cutback glue-line, described rapid-curing cutback glue-line is arranged between described first plate and described second plate, and described rapid-curing cutback glue-line is positioned at described first groove, and by described second plate and described first plate fixed bonding; With high temperature resistant glue-line, described high temperature resistant glue-line is arranged between described first plate and described second plate, and described high temperature resistant glue-line is positioned at described second groove, and by described second plate and described first plate fixed bonding.
Bonded structure provided by the invention, second plate is provided with the first groove and the second groove, and rapid-curing cutback glue-line is set in the first groove, in second groove, high temperature resistant glue-line is set, because the curing rate of rapid-curing cutback glue-line is fast, thus achieve fixing fast between the first plate and the second plate, and rapid-curing cutback glue-line has certain adhesive strength, the requirement to constant intensity between the first plate and the second plate in the descending production process of bonding station can be met, thus, the first plate after rapid-curing cutback glue-line is adhesively fixed and the second plate can be made to enter in descending production process, high temperature resistant glue-line then can spontaneous curing in the descending production process of the bonding station of product, so, this structure be arranged on the prerequisite not affecting product serviceability under, highly shortened the consuming time of bonding station, thus improve the production efficiency of product complete machine, and then reduce the production cost of product.
Specifically, in the production process of existing warmer, just descending production process can be carried out after the pyroceram glue need waiting until in bonded structure solidifies completely, this greatly reduces the production efficiency of product, and bonded structure provided by the invention, the first plate after rapid-curing cutback glue-line is adhesively fixed and the second plate can be made to enter in descending production process, high temperature resistant glue-line then can spontaneous curing in the descending production process of the bonding station of product, so, this structure be arranged on the prerequisite not affecting product serviceability under, highly shortened the consuming time of bonding station, thus improve the production efficiency of product, and then reduce the production cost of product.
In addition, the bonded structure in above-described embodiment provided by the invention can also have following additional technical feature:
According to one embodiment of present invention, the area of described first groove is less than or equal to the area of described second groove.
According to one embodiment of present invention, the diapire of described second groove and/or sidewall uneven.
According to one embodiment of present invention, the diapire of described first groove and/or sidewall uneven.
According to one embodiment of present invention, the base plate of described first groove is provided with multiple first spout hole; The base plate of described second groove is provided with multiple second spout hole.
According to one embodiment of present invention, the base plate of described first groove is provided with two described first spout holes; The base plate of described second groove is provided with two described second spout holes.
According to one embodiment of present invention, described first groove adopts Sheet Metal Forming Technology to make, and/or described second groove adopts Sheet Metal Forming Technology to make.
The embodiment of second aspect present invention provides a kind of warmer, comprises the bonded structure described in above-mentioned any one.
The bonded structure that the warmer that second aspect present invention embodiment provides provides by being provided with first aspect embodiment, second plate is provided with the first groove and the second groove, and rapid-curing cutback glue-line is set in the first groove, in second groove, high temperature resistant glue-line is set, the first plate after rapid-curing cutback glue-line is adhesively fixed and the second plate can be made to enter in descending production process, high temperature resistant glue-line then can spontaneous curing in the descending production process of the bonding station of product, so, this structure be arranged on the prerequisite not affecting product serviceability under, highly shortened the consuming time of bonding station, thus improve the production efficiency of product complete machine, and then reduce the production cost of product.
The embodiment of third aspect present invention provides a kind of technique for sticking, for the bonded structure described in above-mentioned any one, comprises the steps: injecting glue step, in the second groove, injects high-temperature plastic, in the first groove, inject quick-drying gelatin; Fixing step, is placed into the second plate on the first plate, applies pressure, and keep pressure to solidify to quick-drying gelatin to the second plate; Procedure of processing, carries out machining to the first plate and the second plate.
According to one embodiment of present invention, also comprise between described fixing step and described procedure of processing: cleaning, the quick-drying gelatin flowed out from the first spout hole is removed, the high-temperature plastic flowed out from the second spout hole is removed.
Technique for sticking provided by the invention, first high-temperature plastic is injected in the second groove, again quick-drying gelatin is injected in the first groove, because the curing rate of quick-drying gelatin is faster than high-temperature plastic, the setting of this injection order ensure that the adhesive effect of quick-drying gelatin to the second plate and the first plate, efficiently avoid quick-drying gelatin and solidifies in advance and cause the adhesive strength of quick-drying gelatin weakened; In addition, pressure is applied to the second plate, and keep pressure to solidify to quick-drying gelatin, for bonding finished product, efficiently reduce the gap between the first plate and the second plate, namely quick-drying gelatin makes to be in relative impaction state between the first plate and the second plate to the first plate and the tension of the second plate, thus, without the need to providing pressure to the second plate again in high-temperature plastic solidification process, only need to make high-temperature plastic spontaneous curing in the descending production process of bonding station, thus make the production of product convenient.
Additional aspect of the present invention and advantage become obvious by description part below, or are recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the perspective view of existing bonded structure;
Fig. 2 is the perspective view of bonded structure of the present invention;
Fig. 3 is the structural representation of the second plate described in Fig. 2;
Fig. 4 is the another kind of example structure schematic diagram of the second plate of the present invention;
Fig. 5 is the left TV structure schematic diagram of bonded structure shown in Fig. 4;
Fig. 6 is the schematic flow diagram according to technique for sticking one embodiment of the present invention;
Fig. 7 is the schematic flow diagram according to another embodiment of technique for sticking of the present invention.
Wherein, the Reference numeral in Fig. 1 and the corresponding relation between component names are:
1' pyroceram plate, 2' sheet metal, 3' groove;
Corresponding relation in Fig. 2 to Fig. 5 between Reference numeral and component names is:
1 first plate, 2 second plates, 21 first grooves, 211 first spout holes, 22 second grooves, 221 second spout holes;
Dotted line shown in figure is the invisible outline line of the first plate and the second plate.
Detailed description of the invention
In order to more clearly understand above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail.It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understand the present invention; but; the present invention can also adopt other to be different from other modes described here and implement, and therefore, protection scope of the present invention is not by the restriction of following public specific embodiment.
Referring to Fig. 2 to Fig. 5, described according to some embodiments of the invention bonded structure is described.
As shown in Figures 2 to 5, the bonded structure that first aspect present invention embodiment provides, comprising: the first plate 1, second plate 2, rapid-curing cutback glue-line (not shown) and high temperature resistant glue-line (not shown).
Particularly, the second plate 2 is provided with the first groove 21 and the second groove 22; Rapid-curing cutback glue-line is arranged between the first plate 1 and the second plate 2, and rapid-curing cutback glue-line is positioned at the first groove 21, and by the second plate 2 and the first plate 1 fixed bonding; High temperature resistant glue-line is arranged between the first plate 1 and the second plate 2, and high temperature resistant glue-line is positioned at the second groove 22, and by the second plate 2 and the first plate 1 fixed bonding.
Bonded structure provided by the invention, second plate 2 is provided with the first groove 21 and the second groove 22, and rapid-curing cutback glue-line is set in the first groove 21, in second groove 22, high temperature resistant glue-line is set, because the curing rate of rapid-curing cutback glue-line is fast, thus achieve fixing fast between the first plate 1 and the second plate 2, and rapid-curing cutback glue-line has certain adhesive strength, the requirement to constant intensity between the first plate 1 and the second plate 2 in the descending production process of bonding station can be met, thus, the first plate 1 after rapid-curing cutback glue-line is adhesively fixed and the second plate 2 can be made to enter in descending production process, high temperature resistant glue-line then can spontaneous curing in the descending production process of the bonding station of product, so, this structure be arranged on the prerequisite not affecting product serviceability under, highly shortened the consuming time of bonding station, thus improve the production efficiency of product complete machine, and then reduce the production cost of product.
Descending operation described in the present invention is other production processes in the production line of product after bonding station.
In one embodiment of the invention, preferably, the area of the first groove 21 is less than or equal to the area of the second groove 22.
In this embodiment, second groove 22 is for holding high-temperature plastic, and the adhesive strength of high-temperature plastic increases along with the increase of the bond area of high-temperature plastic, in this programme, the adhesive strength of high-temperature plastic and the serviceability of product closely bound up, for ensureing in product quality further, the size arranging the second groove 22 area should require to adapt with the working strength of product, and the first groove 21 is mainly used in holding quick-drying gelatin, and the adhesive strength of quick-drying gelatin increases along with the increase of the bond area of quick-drying gelatin, in this programme, the adhesive strength arranging quick-drying gelatin only needs to meet the requirement of strength of product in descending production process, so, the area arranging the first groove 21 is less than or equal to the area of the second groove 22, under the prerequisite of processability ensureing product, reduce further the consumption of quick-drying gelatin, thus reduce the production cost of product.
Certainly, require different along with in the descending operation of bonding process to adhesive strength between the first plate 1 from the second plate 2, suitably can regulate the size of the area of the first groove 21.
In one particular embodiment of the present invention, preferably, the diapire of the first groove 21 and/or sidewall uneven.
In this embodiment, the diapire and/or the sidewall that arrange the first groove 21 are uneven, this structure be arranged on the prerequisite of the area not expanding the first groove 21 under, add the contact area between the second plate 2 and rapid-curing cutback glue-line, thus further increase the adhesive strength between rapid-curing cutback glue-line and the second plate 2.
In one particular embodiment of the present invention, preferably, the diapire of the second groove 22 and/or sidewall uneven.
In this embodiment, the diapire and/or the sidewall that arrange the second groove 22 are uneven, this structure be arranged on the prerequisite of the area not expanding the second groove 22 under, add the contact area between the second plate 2 and high temperature resistant glue-line, thus further increase the adhesive strength between the second plate 2 and high temperature resistant glue-line.
In one embodiment of the invention, preferably, as shown in Figures 2 to 4, the base plate of the first groove 21 is provided with multiple first spout hole 211; The base plate of the second groove 22 is provided with multiple second spout hole 221.
In this embodiment, the base plate of the first groove 21 and the second groove 22 arranges multiple first spout hole 211 and multiple second spout hole 221 respectively, make in the solidification process of quick-drying gelatin and high-temperature plastic, when applying pressure to the second plate 2, unnecessary quick-drying gelatin and high-temperature plastic can overflow from the first spout hole 211 and the second spout hole 221 respectively, thus avoid unnecessary quick-drying gelatin and high-temperature plastic to solidify rear support between the first plate 1 and the second plate 2, cause occurring comparatively wide arc gap between the first plate 1 and the second plate 2.
In one embodiment of the invention, preferably, as shown in Figures 2 to 4, the base plate of the first groove 21 is provided with two the first spout holes 211; The base plate of the second groove 22 is provided with two the second spout holes 221.
In this embodiment, the base plate of the first groove 21 is provided with two the first spout holes 211; The base plate of the second groove 22 is provided with two the second spout holes 221, under guarantee first spout hole 211 and the second spout hole 221 can meet the prerequisite of overflow requirement, further reduce the manufacturing procedure of the second plate 2, thus, correspondingly improve Product processing efficiency.
Certainly, because quick-drying gelatin has certain shrinkage, and the shrinkage factor of different quick-drying gelatin is different, as shown in Figures 2 and 3, when adopting the large quick-drying gelatin of shrinkage factor, the base plate that can not be used in the first groove 21 arranges the first spout hole 211.
In one embodiment of the invention, preferably, the first groove 21 adopts Sheet Metal Forming Technology to make, and/or the second groove 22 adopts Sheet Metal Forming Technology to make.
In this embodiment, second plate 2 is metallic plate, and the thinner thickness of the second plate 2, be convenient to punch forming, because stamping forming processing technology is simple, quick, the first groove 21 is made to adopt Sheet Metal Forming Technology to make, and/or, second groove 22 adopts Sheet Metal Forming Technology to make, then further increase the working (machining) efficiency of product.
The warmer (not shown) that the embodiment of second aspect present invention provides, comprises the bonded structure described in above-mentioned any one.
The bonded structure that the warmer that second aspect present invention embodiment provides provides by being provided with first aspect embodiment, second plate 2 is provided with the first groove 21 and the second groove 22, and rapid-curing cutback glue-line is set in the first groove 21, in second groove 22, high temperature resistant glue-line is set, the first plate 1 after rapid-curing cutback glue-line is adhesively fixed and the second plate 2 can be made to enter in descending production process, high temperature resistant glue-line then can spontaneous curing in the descending production process of the bonding station of product, so, this structure be arranged on the prerequisite not affecting product serviceability under, highly shortened the consuming time of bonding station, thus improve the production efficiency of product complete machine, and then reduce the production cost of product.
As shown in Figure 6, the embodiment of third aspect present invention provides a kind of technique for sticking, for the bonded structure described in above-mentioned any one, comprises the steps:
Step 101, injects high-temperature plastic in the second groove, in the first groove, inject quick-drying gelatin;
Step 102, is placed into the second plate on the first plate, applies pressure, and keep pressure to solidify to quick-drying gelatin to the second plate;
Step 104, carries out machining to the first plate and the second plate.
Technique for sticking provided by the invention, first high-temperature plastic is injected in the second groove, again quick-drying gelatin is injected in the first groove, because the curing rate of quick-drying gelatin is faster than high-temperature plastic, the setting of this injection order ensure that the adhesive effect of quick-drying gelatin to the second plate and the first plate, efficiently avoid quick-drying gelatin and solidifies in advance and cause its adhesive strength weakened; In addition, pressure is applied to the second plate, and keep pressure to solidify to quick-drying gelatin, for bonding finished product, efficiently reduce the gap between the first plate and the second plate, namely quick-drying gelatin makes to be in relative impaction state between the first plate and the second plate to the first plate and the tension of the second plate, thus, without the need to providing pressure to the second plate again in high-temperature plastic solidification process, only need to make high-temperature plastic spontaneous curing in the descending production process of bonding station, thus make the production of product convenient.
In one embodiment of the invention, as shown in Figure 7, also comprise between step 102 and step 104:
Step 103, removes the quick-drying gelatin flowed out from the first spout hole, is removed the high-temperature plastic flowed out from the second spout hole.
Wherein, step 101 is injecting glue step, and step 102 is fixing step, and step 103 is cleaning, and step 104 is procedure of processing.
In this embodiment, for avoid flowing out from the second spout hole, uncured high-temperature plastic pollutes process equipment descending production process, the process equipment life-span is caused to reduce, thus between step 102 and step 104 setting steps 103, remove with the high-temperature plastic that the second spout hole is flowed out, then effectively ensure that production spatter property, also correspondingly extend the life-span of descending production equipment simultaneously.
In sum, bonded structure provided by the invention, second plate 2 is provided with the first groove 21 and the second groove 22, and rapid-curing cutback glue-line is set in the first groove 21, in second groove 22, high temperature resistant glue-line is set, because the curing rate of rapid-curing cutback glue-line is fast, thus achieve fixing fast between the first plate 1 and the second plate 2, and rapid-curing cutback glue-line has certain adhesive strength, the constant intensity requirement to the first plate 1 and the second plate 2 in the descending production process of bonding station can be met, thus, the first plate 1 after rapid-curing cutback glue-line is adhesively fixed and the second plate 2 can be made to enter in descending production process, high temperature resistant glue-line then can spontaneous curing in the descending production process of the bonding station of product, so, this structure be arranged on the prerequisite not affecting product serviceability under, highly shortened the consuming time of bonding station, thus improve the production efficiency of product complete machine, and then reduce the production cost of product.
Specifically, in the production process of existing warmer, just descending production process can be carried out after the pyroceram glue need waiting until in bonded structure solidifies completely, this greatly reduces the production efficiency of product, and bonded structure provided by the invention, the first plate 1 after rapid-curing cutback glue-line is adhesively fixed and the second plate 2 can be made to enter in descending production process, high temperature resistant glue-line then can spontaneous curing in the descending production process of the bonding station of product, so, this structure be arranged on the prerequisite not affecting product serviceability under, highly shortened the consuming time of bonding station, thus improve the production efficiency of product complete machine, and then reduce the production cost of product.
In the present invention, term " first ", " second " object only for describing, and instruction or hint relative importance can not be interpreted as; Term " multiple " then refers to two or more, unless otherwise clear and definite restriction.The term such as term " installation ", " being connected ", " connection ", " fixing " all should be interpreted broadly, and such as, " connection " can be fixedly connected with, and also can be removably connect, or connects integratedly; " being connected " can be directly be connected, and also indirectly can be connected by intermediary.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the description of this description, specific features, structure, material or feature that the description of term " embodiment ", " some embodiments ", " specific embodiment " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a bonded structure, is characterized in that, comprising:
First plate;
Second plate, described second plate is provided with the first groove and the second groove;
Rapid-curing cutback glue-line, described rapid-curing cutback glue-line is arranged between described first plate and described second plate, and described rapid-curing cutback glue-line is positioned at described first groove, and by described second plate and described first plate fixed bonding; With
High temperature resistant glue-line, described high temperature resistant glue-line is arranged between described first plate and described second plate, and described high temperature resistant glue-line is positioned at described second groove, and by described second plate and described first plate fixed bonding.
2. bonded structure according to claim 1, is characterized in that,
The area of described first groove is less than or equal to the area of described second groove.
3. bonded structure according to claim 2, is characterized in that,
Diapire and/or the sidewall of described second groove are uneven.
4. bonded structure according to claim 3, is characterized in that,
Diapire and/or the sidewall of described first groove are uneven.
5. bonded structure according to claim 4, is characterized in that,
The base plate of described first groove is provided with multiple first spout hole; The base plate of described second groove is provided with multiple second spout hole.
6. bonded structure according to claim 5, is characterized in that,
The base plate of described first groove is provided with two described first spout holes; The base plate of described second groove is provided with two described second spout holes.
7. bonded structure according to claim 5, is characterized in that,
Described first groove adopts Sheet Metal Forming Technology to make, and/or described second groove adopts Sheet Metal Forming Technology to make.
8. a warmer, is characterized in that, includes the bonded structure according to any one of claim 1 to 7.
9. a technique for sticking, for the bonded structure according to any one of claim 1 to 7, is characterized in that, comprises the steps:
Injecting glue step, injects high-temperature plastic in the second groove, in the first groove, inject quick-drying gelatin;
Fixing step, is placed into the second plate on the first plate, applies pressure, and keep pressure to solidify to quick-drying gelatin to the second plate;
Procedure of processing, carries out machining to the first plate and the second plate.
10. technique for sticking according to claim 9, is characterized in that,
Also comprise between described fixing step and described procedure of processing:
Cleaning, removes the quick-drying gelatin flowed out from the first spout hole, is removed the high-temperature plastic flowed out from the second spout hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410790430.8A CN104534554B (en) | 2014-12-17 | 2014-12-17 | Bonded structure, heater and technique for sticking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410790430.8A CN104534554B (en) | 2014-12-17 | 2014-12-17 | Bonded structure, heater and technique for sticking |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104534554A true CN104534554A (en) | 2015-04-22 |
| CN104534554B CN104534554B (en) | 2018-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410790430.8A Active CN104534554B (en) | 2014-12-17 | 2014-12-17 | Bonded structure, heater and technique for sticking |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110420807A (en) * | 2019-08-06 | 2019-11-08 | 深圳市中孚能电气设备有限公司 | A kind of equipment and glue-pouring device |
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| CN2113434U (en) * | 1991-08-16 | 1992-08-19 | 工贸合营山东省招远电池总厂 | Electric heating warmer |
| CN201407706Y (en) * | 2009-05-19 | 2010-02-17 | 九阳股份有限公司 | Induction cooker with waterproof structure |
| CN202118992U (en) * | 2011-06-07 | 2012-01-18 | 广东科龙配件有限公司 | Electric heater with anti-fog glass panel |
| CN102520502A (en) * | 2011-12-12 | 2012-06-27 | 中国科学院电工研究所 | Bonding process for reflecting mirror unit of solar condenser |
| CN102538033A (en) * | 2010-12-23 | 2012-07-04 | 珠海格力电器股份有限公司 | Household appliance and bonding method thereof |
| CN202915448U (en) * | 2012-11-07 | 2013-05-01 | 林光成 | Warmer |
| CN203501238U (en) * | 2013-09-29 | 2014-03-26 | 九阳股份有限公司 | Panel induction cooker |
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| CN2113434U (en) * | 1991-08-16 | 1992-08-19 | 工贸合营山东省招远电池总厂 | Electric heating warmer |
| CN201407706Y (en) * | 2009-05-19 | 2010-02-17 | 九阳股份有限公司 | Induction cooker with waterproof structure |
| CN102538033A (en) * | 2010-12-23 | 2012-07-04 | 珠海格力电器股份有限公司 | Household appliance and bonding method thereof |
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| CN102520502A (en) * | 2011-12-12 | 2012-06-27 | 中国科学院电工研究所 | Bonding process for reflecting mirror unit of solar condenser |
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| CN110420807A (en) * | 2019-08-06 | 2019-11-08 | 深圳市中孚能电气设备有限公司 | A kind of equipment and glue-pouring device |
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| Publication number | Publication date |
|---|---|
| CN104534554B (en) | 2018-04-24 |
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