CN104528632A - Device and method for processing microstructure by utilizing track movement of triangular-pyramid microprobe - Google Patents
Device and method for processing microstructure by utilizing track movement of triangular-pyramid microprobe Download PDFInfo
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- CN104528632A CN104528632A CN201410813219.3A CN201410813219A CN104528632A CN 104528632 A CN104528632 A CN 104528632A CN 201410813219 A CN201410813219 A CN 201410813219A CN 104528632 A CN104528632 A CN 104528632A
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Abstract
The invention discloses a device and a method for processing a microstructure by utilizing the track movement of a triangular-pyramid microprobe. The device comprises a support, a z-direction coarse-movement positioning platform, a three-dimensional piezoelectric displacement platform, the triangular-pyramid microprobe, an optical microscope, a two-dimensional leveling platform and a two-dimensional working platform, wherein the two-dimensional working platform is fixed on the support; the two-dimensional leveling platform is fixed on the two-dimensional working platform; the triangular-pyramid microprobe is positioned above the two-dimensional leveling platform and is rigidly connected with the three-dimensional piezoelectric displacement platform; the three-dimensional piezoelectric displacement platform is connected with the z-direction coarse-movement positioning platform; the optical microscope is fixed on the support and is used for observing the distance between the triangular-pyramid microprobe and a metal sample. The device and the method disclosed by the invention have the advantages that geometrical and asymmetric triangular-pyramid microprobe is adopted to carry out circumferential revolution track movement, so that the front angle of a cutter in each rotary cutting is changed continuously, the determined feeding direction is controlled for processing, and the microstructure with small burrs can be obtained by processing the surface of the metal sample.
Description
Technical field
The invention belongs to micro nano structure manufacture field, relate to a kind of device and method based on AFM probe identical delineation direction machinery processed complex nanostructured.
Background technology
Microminaturization technology has promoted the research in micro-nano field to a great extent, and is widely used in a lot of industrial circle, as information technology, medical treatment, biochemistry and automobile etc.For meeting the dimensional requirement needed for small parts and micro-structure, corresponding micro-nano Processing Technology Development is rapid.At present, micro-nano process technology mainly comprises: Investigation of Mechanical Micro-cutting Technology, micro spark process technology and etching processing techniques.Wherein to have system of processing flexibility high because of it for Investigation of Mechanical Micro-cutting Technology, advantages such as rapidoprint scope is wide and by scholars' extensively research.
In Investigation of Mechanical Micro-cutting Technology, micro-Milling Process is applicable to machining 3 D micro-structural the most, but reduces gradually along with the size of processing structure, and micro-milling can only be met the demands by the size reducing cutter.At present, there is scholar can process micro-milling cutter of diameter 50 microns by wheel grinding, adopt FIB can process micro-milling cutter of minimum 20 micron diameters.Due to the revolution processing that milling is cutter, therefore the diameter of cutter reduces to make as reaching enough cutting linear velocities, and the rotating speed of main shaft just needs very high, and this dynamic characteristic to main shaft requires very high, adds the cost of experimental facilities.And the reduction of micro-milling cutter diameter size reduces the intensity of cutter, the probability of tool failure in process is increased.
AFM (AFM) relies on the active force of needle point and sample room to carry out work, is used for detecting, and can be used for when power is large processing when power is little.Due to the probe of AFM very little (about tens nanometers of needle point arc radius), the power of applying is also very little, therefore can process less structure.Control the operating force between tip-sample by the degree of crook controlling micro-cantilever, accurate three-dimensional structure can be obtained in surface of the work processing.But because it relies on power controlled working, the degree of depth of processing structure can not be determined; And being subject to the restriction of probe cantilevers degree of crook, the active force excursion that can apply neither be very large.
At present, in the technological means of the method processing micro structure adopting machinery to remove, the size of micro-structural can be processed at several microns to 100 microns, even there is no a kind of comparatively ripe process technology.Reduce the processing dimension of micro-milling, or the processing dimension increased based on AFM processing all can introduce new technical barrier, and add the cost of experimental facilities.Therefore, a kind of new processing method is needed badly and is put forward to fill up this processing vacancy.In addition, when utilizing micro-Milling Process to have the good metal exemplar of ductility, often produce burr at the edge of processing structure, this directly affects machining accuracy and the surface quality of workpiece, and deburring process not only complexity can reduce working (machining) efficiency.Therefore, the research for the generation of minimizing burr in process is very significant.
Summary of the invention
The object of this invention is to provide a kind of device and method utilizing triangular pyramid microprobe orbiting motion processing micro structure, realize processing change in size on the surface at ten microns to the micro-structural in 100 micrometer ranges at metal sample, and the edge of micro-structural has less burr to generate.
For achieving the above object, the present invention takes following technical scheme:
A kind of device utilizing triangular pyramid microprobe orbiting motion processing micro structure, comprise bearing, z is to coarse motion positioning table, three-dimensional piezoelectric displacement platform, triangular pyramid microprobe, light microscope, two dimension leveling platform, two-dimentional work bench, wherein: two-dimentional work bench is fixed on bearing, two dimension leveling platform is fixed on two-dimentional work bench, triangular pyramid microprobe to be positioned at above two-dimentional leveling platform and to be rigidly connected with three-dimensional piezoelectric displacement platform, three-dimensional piezoelectric displacement platform is connected to coarse motion positioning table with z, light microscope is fixed on bearing, for observing the distance between triangular pyramid microprobe and metal sample.
Utilize a method for said apparatus processing micro structure, comprise the steps:
Step one, three-dimensional piezoelectric displacement platform drive the rotary motion of triangular pyramid probe:
Choose the driving element of three-dimensional piezoelectric displacement platform as processing, triangular pyramid probe is rigidly attached on three-dimensional piezoelectric displacement platform by adaptor, composition tool motion module.The sinusoidal excitation signal of two-way out-phase is applied by the trunnion axis (x-axis and y-axis) to three-dimensional piezoelectric displacement platform, each trunnion axis is made to do reciprocally simple harmonic motion, and the resultant motion of two axles makes three-dimensional piezoelectric displacement platform do circumference revolution in horizontal plane, thus drive triangular pyramid probe motion.Step signal is applied by the vertical axes (z-axis) to three-dimensional piezoelectric displacement platform, three-dimensional piezoelectric displacement platform in the vertical direction can be made to stretch back and forth, this not only can drive triangular pyramid probe to approach metal sample surface, can also change the working depth of the micro-structural of processing.The radius of a circle of triangular pyramid probe is the frequency 10-20Hz of 5-10 μm, rotation.
The contact on step 2, triangular pyramid probe and metal sample surface:
Z is adopted slightly to approach to coarse motion displacement platform carry its tools motion module to metal sample surface, by the distance between observation by light microscope triangular pyramid probe and metal sample, when distance when between triangular pyramid probe-metal sample reaches in the numerical value telescopic extensions of three-dimensional piezoelectric displacement platform, the z-axis of using three-dimensional piezoelectric displacement platform instead is extended and is driven that triangular pyramid probe is micro-approaches metal sample surface, thus completes the contact of triangular pyramid probe and metal sample.
Step 3, triangular pyramid probe are towards the determination with two-dimentional work bench direction of feed:
Geometry due to triangular pyramid probe is asymmetrical, and this just makes at it in certain process a bit rotated, and along different directions of feed, the track of motion is different, thus the removing method causing material different, affect the result of processing.Therefore, need before processing to triangular pyramid probe relative to the two-dimentional work bench direction of motion towards determining.Impress metal sample with triangular pyramid probe, leave leg-of-mutton impression on metal sample surface, two-dimentional work bench moves certain distance subsequently, impresses in the same way on metal sample surface.Observe the impression of two positions under an optical microscope, determine triangular pyramid probe relative to the two-dimentional work bench direction of motion towards.
The leveling on step 4, metal sample surface:
Owing to being rigidity processing, consistent for ensureing the depth of microstructure of processing, therefore need the inclination eliminating metal sample surface.By the stroke of record triangular pyramid probe three-dimensional piezoelectric displacement platform after diverse location and metal sample surface contact, detect the obliquity on metal sample surface.Adopt two-dimentional leveling platform along adjustment metal sample surface, horizontal two-dimension direction, make when diverse location triangular pyramid probe-metal sample contact, the stroke of three-dimensional piezoelectric displacement platform is consistent, thus ensure that the level on metal sample surface.
Step 5, cooperation two-dimentional work bench feed motion processing micro structure:
After triangular pyramid probe contacts with metal sample rotatably, allow three-dimensional piezoelectric displacement platform stretch to reach predetermined working depth downwards, now control two-dimentional work bench and drive metal sample motion to start processing micro structure.When two-dimentional work bench moves along a direction, what process is MCA, and microchannel wide is the radius of turn of probe.When triangular pyramid probe towards after determining with direction of rotation, because the non-symmetrical geometries two-dimentional work bench of triangular pyramid is along the feeding respectively of x+, x-, y+, y-four direction, four kinds of differently contoured microchannels can be obtained.During two-dimentional work bench Union Movement, can planar structure be processed, meanwhile, increase triangular pyramid probe z to displacement can process the micro-structural obtained with change in depth.
Tool of the present invention has the following advantages:
1, the micro-structural of change in size scope in several microns to micron up to a hundred can be processed, adopt Bit andits control processing event working depth controlled.
2, by adopting the asymmetrical triangular pyramid probe of geometry to carry out circumference revolution orbiting motion, the anterior angle of cutter in rotary cutting each time can be made constantly to change, the direction of feed controlling to determine is processed, and can obtain the less micro-structural of burr in metal sample Surface Machining.
Accompanying drawing explanation
Fig. 1 is the structural representation carrying out the device of machining based on the motion of microprobe circular path of the present invention;
Fig. 2 is the circular path of triangular pyramid needle point of the present invention processing and the schematic diagram by four kinds of different directions feedings;
The schematic diagram of table feed track when Fig. 3 is machining 3 D micro-structural of the present invention;
In figure: 1-z is to coarse motion positioning table, 2-three-dimensional piezoelectric displacement platform, 3-triangular pyramid microprobe, 4-light microscope, 5-metal sample, 6-two dimension leveling platform, 7-two-dimentional work bench, the a certain bar limit of 8-triangle impression, the track (i.e. machining locus) that 9-triangular pyramid needle point outermost profile covers, the movement locus of 10-needle point tip.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme of the present invention is further described; but be not limited thereto; everyly technical solution of the present invention modified or equivalent to replace, and not departing from the spirit and scope of technical solution of the present invention, all should be encompassed in protection scope of the present invention.
As shown in Figure 1, processing unit (plant) based on microprobe orbiting motion provided by the invention comprises bearing, z is to coarse motion positioning table 1, three-dimensional piezoelectric displacement platform 2, triangular pyramid microprobe 3, light microscope 4, two dimension leveling platform 6, two-dimentional work bench 7, wherein: two-dimentional work bench 7 is made up of to travelling carriage at right angle setting to travelling carriage and y x, x is fixed on bearing to travelling carriage, two dimension leveling platform 6 is fixed on y on travelling carriage, triangular pyramid microprobe 3 to be positioned at above two-dimentional leveling platform 6 and to be rigidly connected with three-dimensional piezoelectric displacement platform 2, three-dimensional piezoelectric displacement platform 2 is connected to coarse motion positioning table 1 with z, light microscope 4 is fixed on bearing, for observing the distance between triangular pyramid microprobe 3 and metal sample 5.
Utilize above-mentioned processing unit (plant) to carry out the method for micro-structural processing, concrete steps are as follows:
Step one, needle point approach sample surfaces:
Choose triangular pyramid needle point to be used for making the probe impressed, the angle, face of needle point is 35o, and the radius of edge of three seamed edges is less than 40nm.Triangular pyramid microprobe 3 and three-dimensional piezoelectric displacement platform 2 are rigidly connected, and are connected to coarse motion positioning table 1 with z together, three-dimensional piezoelectric displacement platform 2 three direction closed loop strokes are 100 μm, and resolution ratio is 7nm, and repetitive positioning accuracy is 30nm.Control z drives three-dimensional piezoelectric displacement platform 2 to move down to approach metal sample 5 surface to coarse motion positioning table 1, z to the stroke 100mm of coarse motion positioning table 1, repetitive positioning accuracy 5 μm.The distance between triangular pyramid microprobe 3 and metal sample 5 is observed by light microscope 4, after distance is between the two in the movement travel of three-dimensional piezoelectric displacement platform 2, z is stopped to move down to coarse motion positioning table 1, use three-dimensional piezoelectric displacement platform 2 instead progressively to move down with the displacement of 100nm, two-dimentional work bench 7 moves along a direction simultaneously, when being seen that by light microscope 4 triangular pyramid microprobe 3 has cut to occur on metal sample 5 surface, show that triangular pyramid microprobe 3 contacts with metal sample 5 surface, and record the downward displacement of now three-dimensional piezoelectric displacement platform 2.
The inclination of step 2, elimination surface of the work:
By computer export digital command signal, and convert data signal to analog signal by D/A transition card, to drive three-dimensional piezoelectric displacement platform 2 after analog signal amplification.Determine the input voltage of analog signal and the corresponding relation of three-dimensional piezoelectric displacement platform 2 displacement subsequently: the displacement that 1v is corresponding 10 μm.First to the z-axis input step signal of three-dimensional piezoelectric displacement platform 2, make triangular pyramid microprobe 3 approach metal sample 5, until triangular pyramid microprobe 3 contacting metal sample 5 is surperficial, now write down the downward displacement of three-dimensional piezoelectric displacement platform 2.Lift triangular pyramid microprobe 3, the x+ controlled in two-dimentional work bench 7 drives metal sample 5 to move to next position to travelling carriage, continues triangular pyramid microprobe 3 is approached and contacting metal sample 5 surface, and writes down the displacement of current three-dimensional piezoelectric displacement platform 2.Contrast the displacement at two position three-dimensional piezoelectric displacement platforms 2, judge metal sample 5 surface in x+ and x-direction which side high which side is low, regulate afterwards the x of two-dimentional leveling platform 6 to, until when upwards each position, triangular pyramid microprobe 3 and metal sample 5 surface contacts x three-dimensional piezoelectric displacement platform 2 displacement consistent, because this eliminating the inclination of metal sample 5 surface in x-axis, in this leveling process, y keeps motionless to travelling carriage.The inclination of the adjustment y-axis that uses the same method, ensure that the displacement of the three-dimensional piezoelectric displacement platform 2 when upwards triangular pyramid microprobe 3 contacts with each position, metal sample 5 surface y is consistent, so just be eliminated x to y to gradient, make the height of each point on two-dimensional level face on metal sample 5 surface consistent.
Step 3, adjustment triangular pyramid tip position:
After the surperficial leveling of metal sample 5, be pressed into surface at metal sample 5 surperficial a certain position triangular pyramid microprobe 3 and leave impression.Control three-dimensional piezoelectric displacement platform 2 lifts triangular pyramid microprobe 3 and is separated with metal sample 5 surface, and the x controlled in two-dimentional work bench 7 drives metal sample 5 to move to next position to travelling carriage, continues to make triangular pyramid microprobe 3 on metal sample 5 surface and impresses.The metal sample 5 triangle impression line of centres of two triangular pyramid microprobes 3 and the angle of triangle edges is on the surface observed by light microscope 4, adjust the x that triangular pyramid microprobe 3 position makes itself and two-dimentional work bench 7 afterwards, y ensures as shown in Figure 2 to position, that is: a certain bar limit 8 of triangle impression is parallel to the moving direction of travelling carriage with x, vertical to the moving direction of travelling carriage with y, thus complete the adjustment of tip position.
The processing of step 4, microchannel:
Before tip-sample does not contact, two-way sinusoidal signal is inputted to three-dimensional piezoelectric displacement platform 2, amplitude and the frequency of two paths of signals are 1v and 10Hz, but phase 90o, and such three-dimensional piezoelectric displacement platform 2 can drive triangular pyramid microprobe 3 to do circumference revolution as shown in Figure 2.Controlling three-dimensional piezoelectric displacement platform 2 drives triangular pyramid microprobe 3 to approach metal sample 5 surface downwards, and after triangular pyramid microprobe 3 with metal sample 5 surface contact, three-dimensional piezoelectric displacement platform 2 continues to stretch downwards the working depth of 1-2 μm.Control two-dimentional work bench 7 subsequently along x+ direction with the motion of the speed of 5 μm/s, so just process 10 μm wide, 1-2 μm dark microchannel, length can be determined by the displacement of two-dimentional work bench 7.Same method can process the microchannel that two-dimentional work bench 7 obtains along the feeding of x-, y+, y-direction.Can find, due to the geometry of triangular pyramid microprobe 3, make the machining locus difference obtained along these four kinds of direction feedings, thus the change of the undeformed chip thickness of needle point in each circle rotates is different, in rotation the angle α of triangular pyramid microprobe 3 rake face and metal sample green surface and the change of anterior angle also variant, the profile therefore processing the microchannel obtained is not identical.When employing add man-hour along the feeding of x+ direction as shown in Figure 2, when triangular pyramid microprobe 3 is cut and is cut out and the angle of metal sample green surface be positive rake angle, therefore cutting deformation is little, and the plastic deformation of metal material is little.So the burr that processing obtains the generation of two side, microchannel is little, microchannel is polishing more.
The processing of step 5, three-dimensional microstructures:
As shown in Figure 3, for machining 3 D micro-structural, Processing Strategies is that first microchannel processes thus forms a pit face one by one.Along (when long arrow is processing every bar microchannel, x is to the movement locus of travelling carriage, the length of its length representative processing microchannel) shown in the long arrow of Mei Tiao microchannel, x+ direction table feed twice Fig. 3; Along shown in the short arrow of y+ direction workbench microfeed Fig. 3, (short arrow is that every bar microchannel machines the movement locus of rear y to travelling carriage subsequently, its length representative amount of feeding of movement), the amount of feeding is less than the width of microchannel, and the size in pit face is by the length of long arrow and the length of all short arrows and decision.After a pit face machines, this machined surface basis increases working depth, reprocess a new pit in the next degree of depth, reduce the size of pit simultaneously, will ledge structure be processed like this.By that analogy, the pit that processing dimension reduces gradually under different depth, just can process the three-dimensional structure obtaining having different depth step.Owing to adopting the mode processing step structure along x+ feeding processing microchannel described in step 5, this will make the edge more polishing of step.
Claims (8)
1. one kind utilizes the device of triangular pyramid microprobe orbiting motion processing micro structure, it is characterized in that described device is by bearing, z is to coarse motion positioning table, three-dimensional piezoelectric displacement platform, triangular pyramid microprobe, light microscope, two dimension leveling platform and two-dimentional work bench are formed, wherein: two-dimentional work bench is fixed on bearing, two dimension leveling platform is fixed on two-dimentional work bench, triangular pyramid microprobe to be positioned at above two-dimentional leveling platform and to be rigidly connected with three-dimensional piezoelectric displacement platform, three-dimensional piezoelectric displacement platform is connected to coarse motion positioning table with z, light microscope is fixed on bearing, for observing the distance between triangular pyramid microprobe and metal sample.
2. the device utilizing triangular pyramid microprobe orbiting motion processing micro structure according to claim 1, it is characterized in that described two-dimentional work bench is made up of to travelling carriage at right angle setting to travelling carriage and y x, x is fixed on bearing to travelling carriage, and two-dimentional leveling platform is fixed on y on travelling carriage.
3. the device utilizing triangular pyramid microprobe orbiting motion processing micro structure according to claim 1, is characterized in that described triangular pyramid probe is rigidly attached on three-dimensional piezoelectric displacement platform by adaptor.
4. the device utilizing triangular pyramid microprobe orbiting motion processing micro structure according to claim 1, it is characterized in that the angle, face of described triangular pyramid probe is 35o, the radius of edge of three seamed edges is less than 40nm.
5. utilize a method for the device processing micro structure utilizing triangular pyramid microprobe orbiting motion processing micro structure described in the arbitrary claim of claim 1-4, it is characterized in that described method step is as follows:
Step one, three-dimensional piezoelectric displacement platform drive the rotary motion of triangular pyramid probe:
Choose the driving element of three-dimensional piezoelectric displacement platform as processing, triangular pyramid probe is connected on three-dimensional piezoelectric displacement platform, composition tool motion module; By applying the sinusoidal excitation signal of two-way out-phase to the trunnion axis of three-dimensional piezoelectric displacement platform, each trunnion axis is made to do reciprocally simple harmonic motion, and the resultant motion of two axles makes three-dimensional piezoelectric displacement platform do circumference revolution in horizontal plane, thus drive triangular pyramid probe motion; By applying step signal to the vertical axes of three-dimensional piezoelectric displacement platform, three-dimensional piezoelectric displacement platform in the vertical direction is stretched back and forth;
The contact on step 2, triangular pyramid probe and metal sample surface:
Z is adopted slightly to approach to coarse motion displacement platform carry its tools motion module to metal sample surface, by the distance between observation by light microscope triangular pyramid probe and metal sample, when distance when between triangular pyramid probe-metal sample reaches in the numerical value telescopic extensions of three-dimensional piezoelectric displacement platform, the z-axis of using three-dimensional piezoelectric displacement platform instead is extended and is driven that triangular pyramid probe is micro-approaches metal sample surface, thus completes the contact of triangular pyramid probe and metal sample;
Step 3, triangular pyramid probe are towards the determination with two-dimentional work bench direction of feed:
Impress metal sample with triangular pyramid probe, leave leg-of-mutton impression on metal sample surface, two-dimentional work bench moves certain distance subsequently, impresses in the same way on metal sample surface; Observe the impression of two positions under an optical microscope, determine triangular pyramid probe relative to the two-dimentional work bench direction of motion towards;
The leveling on step 4, metal sample surface:
Adopt two-dimentional leveling platform along adjustment metal sample surface, horizontal two-dimension direction, make when diverse location triangular pyramid probe-metal sample contact, the stroke of three-dimensional piezoelectric displacement platform is consistent, thus ensures the level of metal sample surfaces;
Step 5, cooperation two-dimentional work bench feed motion processing micro structure:
After triangular pyramid probe contacts with metal sample rotatably, allow three-dimensional piezoelectric displacement platform stretch to reach predetermined working depth downwards, now control two-dimentional work bench and drive metal sample motion to start processing micro structure.
6. the method utilizing the device processing micro structure of triangular pyramid microprobe orbiting motion processing micro structure according to claim 5, is characterized in that the radius of a circle of described triangular pyramid probe is the frequency 10-20Hz of 5-10 μm, rotation.
7. the method utilizing the device processing micro structure of triangular pyramid microprobe orbiting motion processing micro structure according to claim 5, it is characterized in that described three-dimensional piezoelectric displacement platform three direction closed loop strokes are 100 μm, resolution ratio is 7nm, and repetitive positioning accuracy is 30nm.
8. the method utilizing the device processing micro structure of triangular pyramid microprobe orbiting motion processing micro structure according to claim 5, is characterized in that the stroke 100mm of described z to coarse motion positioning table 1, repetitive positioning accuracy 5 μm.
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| CN111732073A (en) * | 2020-06-18 | 2020-10-02 | 东北林业大学 | Device and method for machining micro-nano composite structure based on needle point track motion |
| CN111732073B (en) * | 2020-06-18 | 2024-05-14 | 东北林业大学 | Device and method for machining micro-nano composite structure based on needle point track movement |
| CN112345320A (en) * | 2020-10-20 | 2021-02-09 | 江南大学 | Method for micro-controlling two-dimensional material based on semi-automatic probe station |
| CN115535960A (en) * | 2022-09-05 | 2022-12-30 | 南方科技大学 | Device and method for processing two-dimensional material nanostructure array |
| CN115535960B (en) * | 2022-09-05 | 2023-11-10 | 南方科技大学 | Device and method for processing two-dimensional material nanostructure array |
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