CN104519451B - micro-electro-mechanical system microphone chip package - Google Patents

micro-electro-mechanical system microphone chip package Download PDF

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Publication number
CN104519451B
CN104519451B CN201310755060.XA CN201310755060A CN104519451B CN 104519451 B CN104519451 B CN 104519451B CN 201310755060 A CN201310755060 A CN 201310755060A CN 104519451 B CN104519451 B CN 104519451B
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China
Prior art keywords
mems
microphone chip
condenser microphone
lid
chip
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CN104519451A (en
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潘玉堂
周世文
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Chipmos Technologies Inc
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Chipmos Technologies Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

The invention provides a micro electro mechanical system microphone chip packaging body which comprises a circuit carrier plate, a micro electro mechanical system microphone chip, a logic chip, a micro electro mechanical system cover body, at least one first welding wire and a packaging cover body. The micro-electro-mechanical system microphone chip, the logic chip and the packaging cover body are respectively arranged on the circuit carrier plate. The logic chip is electrically connected with the micro-electro-mechanical system microphone chip and the circuit carrier board. The cover body of the micro-electro-mechanical system is configured on the microphone chip of the micro-electro-mechanical system, and a second cavity is arranged between the cover body and the microphone chip of the micro-electro-mechanical system. The first bonding wire is electrically connected with the micro-electro-mechanical system microphone chip and the logic chip. A third cavity communicated with the second cavity is arranged between the packaging cover body and the circuit carrier plate so as to accommodate the micro-electro-mechanical system microphone chip and the logic chip.

Description

MEMS condenser microphone chip packing-body
Technical field
The present invention is related to a kind of packaging body, and in particular to a kind of MEMS condenser microphone chip packing-body.
Background technology
With the development of science and technology various sensing device furthers have been commonly applied in electronic product.For example, sensing dress Put can be sense the pressure sensor (Pressure Sensor) of pressure, accelerometer (Accelerometer) or To sense the sound transducer of sound wave (Acoustic Sensor).By taking sound transducer as an example, because market is to sound quality Requirement increasingly increase, therefore in general sound transducer can arrange the preferable MEMS condenser microphone of signal quality.
In general, MEMS condenser microphone is generally disposed among portable electronic devices, such as mobile phone（mobile phone）, personal digital assistant（PDA）Or tablet personal computer（tablet PC）Deng.However, in portable electronic devices towards small-sized Under the development trend of change, it is known that MEMS condenser microphone generally there is encapsulation volume it is excessive the problem of, and then improve Degree of difficulty of the portable electronic devices in design or assembling.On the other hand, in encapsulation process, such as vacuum slot can be utilized MEMS microphone chip is adsorbed etc. equipment, MEMS microphone chip is arranged on support plate, therefore, MEMS wheat Vibrating membrane on gram wind chip is vulnerable to the absorption affinity traction of the equipment such as vacuum slot or pressed and damaged；In addition, foreign substance pollution Or personnel's false touch may also destroy vibrating membrane, and then cause making yield bad.
The content of the invention
The present invention provides a kind of MEMS condenser microphone chip packing-body, and it meets the trend of packaging body miniaturization, and Yield is made with preferable.
MEMS condenser microphone chip packing-body proposed by the present invention includes line carrier plate, MEMS condenser microphone core Piece, logic chip, MEMS lid, at least one first bonding wire and encapsulation lid.MEMS condenser microphone chip is matched somebody with somebody It is placed on line carrier plate, wherein MEMS condenser microphone chip has vibrating membrane, and has between vibrating membrane and line carrier plate First chamber.Logic chip is configured on line carrier plate, and logic chip carries with MEMS condenser microphone chip and circuit Plate is electrically connected with.MEMS lid is configured on MEMS condenser microphone chip, and at least covers vibrating membrane, wherein micro- There is second chamber between Mechatronic Systems lid and MEMS condenser microphone chip.First bonding wire is electrically connected with MEMS Microphone chip and logic chip.Encapsulation lid is configured on line carrier plate, wherein having between encapsulation lid and line carrier plate 3rd chamber is to accommodate MEMS condenser microphone chip and logic chip, and second chamber is connected with the 3rd chamber.
In one embodiment of this invention, above-mentioned MEMS lid includes plate body and multiple projections.Projection position Between plate body and MEMS condenser microphone chip, and multiple passages are formed between projection and plate body, pass through second chamber Passage is connected with the 3rd chamber.
In one embodiment of this invention, at least side of above-mentioned MEMS lid is stepped down with an at least routing Area, routing resigning area are formed at an at least side for plate body.
In one embodiment of this invention, above-mentioned at least one first bonding wire is electrically connected by an at least routing resigning area Connect MEMS condenser microphone chip.
In one embodiment of this invention, the plate body of above-mentioned MEMS lid and projection are formed in one.
In one embodiment of this invention, the plate body of above-mentioned MEMS lid and projection are the knot being formed separately Structure.
In one embodiment of this invention, above-mentioned logic chip is stacked and placed on above MEMS condenser microphone chip On MEMS lid.
In one embodiment of this invention, above-mentioned logic chip and MEMS condenser microphone chip are side by side in circuit On support plate.
In one embodiment of this invention, above-mentioned encapsulation lid has sound inlet, and sound inlet is connected with the 3rd chamber It is logical.
In one embodiment of this invention, above-mentioned encapsulation lid has sound inlet, and sound inlet is connected with first chamber It is logical.
Based on above-mentioned, of the invention MEMS condenser microphone chip packing-body by MEMS condenser microphone chip Upper configuration MEMS lid, can effectively avoid vibrating membrane in assembling process on MEMS condenser microphone chip by Such as the absorption affinity of the equipment such as vacuum slot traction or press and damaged；MEMS lid is also possible to prevent foreign substance pollution Or damage vibrating membrane or vibrating membrane is destroyed because of false touch, so as to lift the yield on making.On the other hand, it is of the invention micro electronmechanical System lid is because having passage so that sound wave can enter second chamber by passage and be transferred to vibrating membrane.Therefore, it is of the invention The setting of MEMS lid can not only protect MEMS condenser microphone chip, also not interfere with MEMS condenser microphone The running of chip.In addition, MEMS lid can separately have routing resigning area, bonding wire can be engaged in micro- by routing resigning area On Mechatronic Systems microphone chip, the progress without influenceing packaging technology.Furthermore logic chip can be directly joined micro electronmechanical Stacked structure is formed above MEMS lid on system microphone chip, can effectively reduce MEMS condenser microphone The size of chip packing-body, and meet now sci-tech product towards the trend of miniaturization.
For features described above of the invention and advantage can be become apparent, special embodiment below, and accompanying drawing appended by cooperation It is described in detail below.
Brief description of the drawings
Figure 1A is the cut-away view of the MEMS condenser microphone chip packing-body of first embodiment of the invention.
Figure 1B is the schematic perspective view of Figure 1A MEMS lid.
Fig. 1 C are the schematic perspective views of the MEMS lid of another embodiments of Figure 1A.
Fig. 2A is the cut-away view of the MEMS condenser microphone chip packing-body of second embodiment of the invention.
Fig. 2 B are the schematic perspective views of Fig. 2A MEMS lid.
Fig. 2 C are the schematic perspective views of the MEMS lid of another embodiments of Fig. 2A.
Fig. 2 D are the schematic perspective views of the MEMS lid of Fig. 2A another embodiment.
Fig. 3 is the cut-away view of the MEMS condenser microphone chip packing-body of third embodiment of the invention.
Fig. 4 is the cut-away view of the MEMS condenser microphone chip packing-body of fourth embodiment of the invention.
Fig. 5 is the cut-away view of the MEMS condenser microphone chip packing-body of fifth embodiment of the invention.
【Description of reference numerals】
100A~100E：MEMS condenser microphone chip packing-body
110：Line carrier plate
110a：Sound inlet
112：Connection pad
120：MEMS condenser microphone chip
120a、130a：Adhesion coating
121 vibrating membranes
122：First chamber
130：Logic chip
140、140a、240、240a、240b：MEMS lid
141：Second chamber
142、242：Plate body
143、243：Projection
144、244：Passage
245、246：Routing resigning area
150：Encapsulate lid
151：3rd chamber
152：Sound inlet
160：First bonding wire
170：Second bonding wire
Embodiment
Figure 1A is the MEMS of first embodiment of the invention（Microelectromechanical System, MEMS）The cut-away view of microphone chip packaging body.Figure 1A is refer to, in the present embodiment, MEMS condenser microphone chip envelope Filling body 100A includes line carrier plate 110, MEMS condenser microphone chip 120, logic chip 130, MEMS lid 140 And encapsulation lid 150.MEMS condenser microphone chip 120 is configured on line carrier plate 110, MEMS condenser microphone core Piece 120 has vibrating membrane 121, and has first chamber 122 between vibrating membrane 121 and line carrier plate 110.Logic chip 130 is matched somebody with somebody It is placed on line carrier plate 110, and logic chip 130 electrically connects with MEMS condenser microphone chip 120 and line carrier plate 110 Connect.MEMS lid 140 is configured on MEMS condenser microphone chip 120 and at least covers vibrating membrane 121, wherein micro- There is second chamber 141 between Mechatronic Systems lid 140 and MEMS condenser microphone chip 120.Encapsulation lid 150 is configured at On line carrier plate 110, wherein having the 3rd chamber 151 to accommodate MEMS between encapsulation lid 150 and line carrier plate 110 Microphone chip 120 and logic chip 130, and second chamber 141 is connected with the 3rd chamber 151.
Please continue to refer to Figure 1A, in the present embodiment, MEMS condenser microphone chip 120 and logic chip 130 are side by side In on line carrier plate 110, wherein MEMS condenser microphone chip 120 and logic chip 130 respectively by adhesion coating 120a, 130a is fitted on line carrier plate 110.MEMS condenser microphone chip packing-body 100A further includes the first bonding wire 160 and Two bonding wires 170.First bonding wire 160 engages by routing（wire bonding）Technology is electrically connected with MEMS condenser microphone core Piece 120 and logic chip 130.Second bonding wire 170 is also electrically connected with logic chip 130 to line carrier plate by wire bonding technologies Connection pad 112 on 110.In the present embodiment, the planar dimension of MEMS lid 140 is slightly larger than the area of vibrating membrane 121 To cover vibrating membrane 121, that is to say, that orthographic projection of the vibrating membrane 121 on line carrier plate 110 is to be located at MEMS lid Within 140 orthographic projection on line carrier plate 110.Therefore, MEMS lid 140 have no effect on the first bonding wire 160 with it is micro- The engagement of Mechatronic Systems microphone chip 120.
Multiple field base of the line carrier plate 110 e.g. made by FR-4 substrates pressing technology or ceramic substrate pressing technology Plate.MEMS condenser microphone chip 120 is, for example, to combine CMOS（Complementary Metal- Oxide Semiconductor,CMOS）With MEMS（microelectromechanical system）Technique and make Make the microphone chip completed（microphone chip）Or silicon microphone（silicon microphone）, wherein micro electronmechanical The vibrating membrane 121 of system microphone chip 120 is, for example, directly to be lost with microelectromechanical processes in MEMS condenser microphone chip 120 Carve and complete.In addition, logic chip 130 is, for example, ASIC（Application-specific integrated circuit,ASIC）, it has compared with universal integrated circuit, and volume is smaller, weight is lighter, power consumption is lower, reliability improves, The advantages that performance improves, confidentiality strengthens, cost reduces.MEMS lid 140 and encapsulation lid 150 are, for example, by gold The mask that the material such as category or ceramics is formed, wherein encapsulation lid 150 is, for example, to be engaged in line carrier plate 110 by glue-line On.In addition, the material of the first bonding wire 160 and the second bonding wire 170 can be selected from gold, copper, silver, palladium, aluminium, its alloy or its is any Combination.
Figure 1B is the schematic perspective view of Figure 1A MEMS lid.Figure 1B is refer to, it is in the present embodiment, micro electronmechanical System lid 140 includes plate body 142 and multiple projections 143, and projection 143 is located at four corners of plate body 142 with Supporting plate 142, and multiple passages 144 are formed between plate body 142, when MEMS lid 140 is configured at MEMS Mike When on wind chip 120, projection 143 engages MEMS condenser microphone chip 120, and second chamber 141 passes through passage 144 and the Three chambers 151 are connected.In the present embodiment, structure that plate body 142 and projection 143 are formed in one, so the present invention not with This is limited.
Fig. 1 C are the schematic perspective views of the MEMS lid of another embodiments of Figure 1A.Fig. 1 C are refer to, Fig. 1 C's is micro- The difference of Mechatronic Systems lid 140a and Figure 1B MEMS lid 140 be in：MEMS lid 140a plate Body 142 and projection 143 are the structure being formed separately, and projection 143 can be by phase same material or unlike material institute structure with plate body 142 Into.On the other hand, projection 143 is, for example, structure or its any combinations such as square columns, cylinder or Elliptic Cylinder.Further For, the projection 143 positioned at four corners of plate body 142 can be identical size or various sizes of cylinder, and the present invention is herein It is not any limitation as.
Please continue to refer to Figure 1A, in the present embodiment, encapsulation lid 150 has a sound inlet 152, and sound inlet 152 and the Three chambers 151 connect.That is, extraneous sound wave can enter MEMS condenser microphone chip package by sound inlet 152 In body 100A, and enter second chamber 141 by passage 144 and be transferred to vibrating membrane 121, MEMS condenser microphone chip 120 receive vibration parameters caused by vibrating membranes 121, and after computing, amplify the sound from specific direction intensity and The intensity of the sound from other directions is reduced, to reduce phase noise, and the noise beyond source of sound is reduced and passes to those who answer Ear so that those who answer obtains clear and correct audio.
Due to being configured with MEMS lid 140 on the MEMS condenser microphone chip 120 of the present invention, in encapsulation work In skill, such as the equipment such as vacuum slot can directly contact MEMS lid 140 and inhale MEMS condenser microphone chip 120 It is attached to carry out viscous crystalline substance（Die Bond）Step, to avoid vibrating membrane 121 from being led by the absorption affinity of the equipment such as vacuum slot Draw or press and damaged；MEMS lid 140 is also possible to prevent foreign substance pollution or damage vibrating membrane 121 or broken because of false touch Bad vibrating membrane 121, yield is made so as to effectively lift it.
On the other hand, MEMS lid 140 of the invention is because with passage 144 so that sound wave can be by passage 144 Vibrating membrane 121 is transferred into second chamber 141.Therefore, the setting of MEMS lid 140 of the invention can not only be protected MEMS condenser microphone chip 120 is protected, does not also interfere with the running of packaging technology and MEMS condenser microphone chip 120.
Fig. 2A is the cut-away view of the MEMS condenser microphone chip packing-body of second embodiment of the invention.It refer to figure 2A, in the present embodiment, Fig. 2A MEMS condenser microphone chip packing-body 100B MEMS lid 240 and Figure 1A MEMS lid 140 difference be in：The planar dimension of MEMS lid 240 generally with MEMS The surface area of microphone chip 120 is close, that is to say, that orthographic projection of the MEMS lid 240 on line carrier plate 110 is big Orthographic projection in cause with MEMS condenser microphone chip 120 on line carrier plate 110 overlaps.Therefore, MEMS lid Body 240 not only covers vibrating membrane 121, also covers the routing area on MEMS condenser microphone chip 120.
Fig. 2 B are the schematic perspective views of Fig. 2A MEMS lid.Fig. 2 B are refer to, due to MEMS lid 240 not only cover vibrating membrane 121, also cover the routing area on MEMS condenser microphone chip 120, therefore compared to Figure 1B's For MEMS lid 140, the two opposite sides of the plate body 242 of MEMS lid 240 have routing resigning area 245, So that the first bonding wire 160 can be engaged on MEMS condenser microphone chip 120 by routing resigning area 245.In the present embodiment In, routing resigning area 245 is to form rectangular recess respectively at the two opposite sides of plate body 242 so that the plane of plate body 242 is presented I words or H fonts.However, in other embodiment, quantity and the shape in routing resigning area 245 can adjust according to design requirement, can Routing resigning area 245 only is formed in the side of plate body 242, or routing resigning area is all formed in three sides of plate body 242 or four sides 245, and can be multiple in the routing resigning area 245 of 242 single side of plate body.
Fig. 2 C are the schematic perspective views of the MEMS lid of another embodiments of Fig. 2A.It refer to Fig. 2 C, micro-electro-mechanical systems System lid 240a and Fig. 1 C MEMS lid 140a difference be in：MEMS lid 240a plate body 242 Single side there is routing resigning area 245 so that the first bonding wire 160 can be engaged in MEMS by routing resigning area 245 On microphone chip 120.
Fig. 2 D are the schematic perspective views of the MEMS lid of Fig. 2A another embodiment.Fig. 2 D are refer to, Fig. 2 D's is micro- Mechatronic Systems lid 240b and Fig. 2 C MEMS lid 240a difference be in：MEMS lid 240b's beats Line resigning area 246 is, for example, the resigning hole of multiple single sides for being formed at plate body 242, and U shape profile is generally presented in it.However, In other possible embodiments, routing resigning area 246 also can be the resigning hole of other appropriate external form profiles, and the present invention is herein simultaneously It is not any limitation as.
In short, MEMS lid 240,240a, 240b can be also configured at MEMS condenser microphone by the present invention On chip 120, wherein projection 243 between plate body 242 and MEMS condenser microphone chip 120, and with plate body 242 it Between form multiple passages 244（As shown in Fig. 2 B to Fig. 2 D）So that sound wave can enter second chamber 141 by passage 244 and pass It is handed to vibrating membrane 121, and then effect same as the previously described embodiments.
Fig. 3 is the cut-away view of the MEMS condenser microphone chip packing-body of third embodiment of the invention.It refer to Fig. 3, Fig. 3 MEMS condenser microphone chip packing-body 100C and Figure 1A MEMS condenser microphone chip packing-body 100A are not Exist together and be：MEMS condenser microphone chip packing-body 100C line carrier plate 110 has sound inlet 110a, and sound inlet 110a is connected with first chamber 122, and wherein sound inlet 110a is, for example, to be formed by technologies such as laser drill or machine drillings In line carrier plate 110.In other words, sound inlet of the invention, which does not limit, is formed on encapsulation lid 150（As shown in Figure 1A）, its In in the case where sound inlet 110a is formed on line carrier plate 110 and is connected with first chamber 122, extraneous sound wave can be borrowed First chamber 122 is entered by sound inlet 110a and is transferred to vibrating membrane 121, and allows those who answer to obtain clear and correct audio. In short, under so configured, the technical effect for being same as above-described embodiment can be also obtained.
Fig. 4 is the cut-away view of the MEMS condenser microphone chip packing-body of fourth embodiment of the invention.It refer to Fig. 4, Fig. 4 MEMS condenser microphone chip packing-body 100D and Figure 1A MEMS condenser microphone chip packing-body 100A are not Exist together and be：MEMS condenser microphone chip packing-body 100D logic chip 130 is stacked and placed on MEMS condenser microphone core On the MEMS lid 140 of the top of piece 120, that is to say, that MEMS lid 140 is located at MEMS condenser microphone Between chip 120 and logic chip 130.Specifically, logic chip 130 is engaged in MEMS lid by adhesion coating 130a On body 140, then by the first bonding wire 160 and the second bonding wire 170 be respectively and electrically connected to MEMS condenser microphone chip 120 and Connection pad 112 on line carrier plate 110.In short, the mode of foregoing stack arrangement, can not only obtain and be same as above-described embodiment Technology attacks effect, is more conducive to reduce the size of MEMS condenser microphone chip packing-body.
Fig. 5 is the cut-away view of the MEMS condenser microphone chip packing-body of fifth embodiment of the invention.It refer to Fig. 5, Fig. 5 MEMS condenser microphone chip packing-body 100E and Fig. 4 MEMS condenser microphone chip packing-body 100D are not Exist together and be：MEMS condenser microphone chip packing-body 100E line carrier plate 110 has sound inlet 110a, and sound inlet 110a is connected with first chamber 122.In other words, sound inlet of the invention, which does not limit, is formed on encapsulation lid 150（Such as figure Shown in 4）, wherein in the case where sound inlet 110a is formed on line carrier plate 110 and is connected with first chamber 122, it is extraneous Sound wave can enter first chamber 122 by sound inlet 110a and be transferred to vibrating membrane 121, and allow those who answer to obtain clearly and just True audio.In short, under so configured, the technical effect for being same as above-described embodiment can be also obtained.
In summary, MEMS condenser microphone chip packing-body of the present invention is by MEMS condenser microphone chip MEMS lid is configured, vibrating membrane when can effectively avoid assembling on MEMS condenser microphone chip is by such as vacuum The absorption affinity traction of the equipment such as suction nozzle presses and damaged；MEMS lid is also possible to prevent foreign substance pollution or damage vibration Film destroys vibrating membrane because of false touch, so as to lift the yield on making.On the other hand, MEMS lid of the invention because With passage so that sound wave can enter second chamber by passage and be transferred to vibrating membrane.Therefore, MEMS of the invention The setting of lid can not only protect MEMS condenser microphone chip, also not interfere with the fortune of MEMS condenser microphone chip Make.In addition, MEMS lid can separately have routing resigning area, bonding wire can be engaged in MEMS by routing resigning area On microphone chip, the progress without influenceing packaging technology.Furthermore logic chip can be directly joined to MEMS Mike Stacked structure is formed above MEMS lid on wind chip, can effectively reduce MEMS condenser microphone chip package The size of body, and meet now sci-tech product towards the trend of miniaturization.
Although the present invention is disclosed above with embodiment, so it is not limited to the present invention, any art Middle tool usually intellectual, without departing from the spirit and scope of the present invention, when a little change and retouching can be made, thus it is of the invention Protection domain when being defined depending on those as defined in claim.

Claims (9)

  1. A kind of 1. MEMS condenser microphone chip packing-body, it is characterised in that including：
    Line carrier plate；
    MEMS condenser microphone chip, it is configured on the line carrier plate, wherein the MEMS condenser microphone chip has and shaken Dynamic film, and there is first chamber between the vibrating membrane and the line carrier plate；
    Logic chip, it is configured on the line carrier plate, and the logic chip and the MEMS condenser microphone chip and the line Road-load plate is electrically connected with；
    MEMS lid, it is configured on the MEMS condenser microphone chip, and at least covers the vibrating membrane, wherein this is micro- There is second chamber, the MEMS lid includes plate body between Mechatronic Systems lid and the MEMS condenser microphone chip And multiple projections, the plurality of projection are located between the plate body and the MEMS condenser microphone chip, and the plurality of projection with Multiple passages are formed between the plate body；
    At least one first bonding wire, it is electrically connected with the MEMS condenser microphone chip and the logic chip；And
    Encapsulate lid, be configured on the line carrier plate, wherein between the encapsulation lid and the line carrier plate have the 3rd chamber with The MEMS condenser microphone chip and the logic chip are accommodated, and the second chamber passes through the plurality of passage and the 3rd chamber Room is connected.
  2. 2. MEMS condenser microphone chip packing-body as claimed in claim 1, it is characterised in that the MEMS lid At least side there is an at least routing resigning area, an at least routing resigning area is formed at an at least side for the plate body.
  3. 3. MEMS condenser microphone chip packing-body as claimed in claim 2, it is characterised in that at least one first bonding wire By this, at least a routing resigning area is electrically connected with the MEMS condenser microphone chip.
  4. 4. MEMS condenser microphone chip packing-body as claimed in claim 1, it is characterised in that the MEMS lid The plate body and the plurality of projection be formed in one.
  5. 5. MEMS condenser microphone chip packing-body as claimed in claim 1, it is characterised in that the MEMS lid The plate body and the plurality of projection be the structure being formed separately.
  6. 6. MEMS condenser microphone chip packing-body as claimed in claim 1, it is characterised in that the logic chip is stacked and placed on On the MEMS lid above the MEMS condenser microphone chip.
  7. 7. MEMS condenser microphone chip packing-body as claimed in claim 1, it is characterised in that the logic chip is micro- with this Mechatronic Systems microphone chip is side by side on the line carrier plate.
  8. 8. MEMS condenser microphone chip packing-body as claimed in claim 1, it is characterised in that the encapsulation lid have into Sound hole, and the sound inlet is connected with the 3rd chamber.
  9. 9. MEMS condenser microphone chip packing-body as claimed in claim 1, it is characterised in that the line carrier plate have into Sound hole, and the sound inlet is connected with the first chamber.
CN201310755060.XA 2013-09-30 2013-12-30 micro-electro-mechanical system microphone chip package Active CN104519451B (en)

Applications Claiming Priority (2)

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TW102135404 2013-09-30
TW102135404A TWI532387B (en) 2013-09-30 2013-09-30 Package of microelectromechanical system microphone chip

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CN104519451B true CN104519451B (en) 2018-02-06

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022685A (en) * 2007-03-23 2007-08-22 胡维 Condenser miniature silicon microphone and preparative method
CN101150886A (en) * 2006-09-21 2008-03-26 财团法人工业技术研究院 Encapsulation structure and its encapsulation method for computer electric microphone
CN201182009Y (en) * 2006-05-09 2009-01-14 宝星电子株式会社 Silicon capacitor microphone with appended back tone chamber and sound hole in PCB
CN202931550U (en) * 2012-11-07 2013-05-08 山东共达电声股份有限公司 MEMS microphone

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101096544B1 (en) * 2009-11-18 2011-12-20 주식회사 비에스이 Mems microphone package and packaging method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201182009Y (en) * 2006-05-09 2009-01-14 宝星电子株式会社 Silicon capacitor microphone with appended back tone chamber and sound hole in PCB
CN101150886A (en) * 2006-09-21 2008-03-26 财团法人工业技术研究院 Encapsulation structure and its encapsulation method for computer electric microphone
CN101022685A (en) * 2007-03-23 2007-08-22 胡维 Condenser miniature silicon microphone and preparative method
CN202931550U (en) * 2012-11-07 2013-05-08 山东共达电声股份有限公司 MEMS microphone

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TWI532387B (en) 2016-05-01
CN104519451A (en) 2015-04-15

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