CN104511675A - Vertical heat eutectic device - Google Patents
Vertical heat eutectic device Download PDFInfo
- Publication number
- CN104511675A CN104511675A CN201310461866.8A CN201310461866A CN104511675A CN 104511675 A CN104511675 A CN 104511675A CN 201310461866 A CN201310461866 A CN 201310461866A CN 104511675 A CN104511675 A CN 104511675A
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- CN
- China
- Prior art keywords
- eutectic
- area
- hot
- rectilinear
- preheating zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005496 eutectics Effects 0.000 title claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000007599 discharging Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Furnace Details (AREA)
Abstract
The invention relates to the field of light emitting diodes (LED), and discloses a vertical heat eutectic device. The vertical heat eutectic device comprises a heat source, an eutectic zone, a vertical preheating zone, and a conveying device; the heat source is a heating wire, a heating tube, an infrared source, an electromagnetic source or laser, and is placed in a high-temperature heat-conducting material; the conveying device is controlled by a motor and used for conveying materials to be processed; the eutectic zone is arranged above the heat source; the preheating zone is arranged above the eutectic zone; temperature zones are distributed vertically; and a vacuum function or a nitrogen function can be added into the preheating zone and the eutectic zone. By using the technical scheme, the vertical heat eutectic device has the advantages of simple production process, excellent quality and low cost.
Description
Technical field
The present invention relates to LED field, particularly the rectilinear hot eutectic device of one.
Background technology
Eutectic mode is one of mode of LED, has efficiency high, and cost is low, and the product thermal conductivity of encapsulation is good, and thermal resistance is little, steady performance, is a kind of trend of LED development.
At present, main eutectic equipment adopts solder reflow device.In Reflow Soldering, different warm area controls different temperature, and form a temperature curve gradually, LED eutectic then carries out under suitable temperature curve.Reflow Soldering has preheating zone usually, eutectic area and cooling zone.LED and pedestal thereof first by preheating zone, make it be heated evenly, guarantee obtain fast lifting in eutectic area temperature, reach the eutectic point of LED chip, Eutectic Layer is melted, and combines with pedestal.Then being transported to cooling zone makes temperature reduce, and completes eutectic.
Although Reflow Soldering eutectic can realize the object of eutectic, but the volume that solder reflow device itself is huge, needs to occupy a large amount of spaces, can reach with the Reflow Soldering appearance and size of conventional 7 warm areas long × wide × high=4.5 × 1 × 1.4 meters, huge space, when also can cause inflated with nitrogen, demand is large, and loss is large, also cannot realize vacuum function, and material range ability in Reflow Soldering is long, operation smoothness is limited, easily causes the LED chip on pedestal to shake, phenomenon out of position.
Summary of the invention
In view of the above problems, the object of the present invention is to provide a kind of rectilinear hot eutectic device, adopt the technical program to improve the quality of products, reduce the LED cost of equipment cost and entirety.
In order to realize foregoing invention object, complete skill scheme of the present invention is:
A kind of rectilinear hot eutectic device, this rectilinear hot eutectic device comprises: thermal source, described thermal source is heating wire, heat-generating pipe, infrared radiation source, electromagnet source or laser, be built in the hot plate of resistant to elevated temperatures Heat Conduction Material making or be positioned over below hot plate, form the overall thermal source of this device, for preheating zone and eutectic area provide heat; Conveyer, described conveyer adopts motor control; Eutectic area, described eutectic area be built in thermal source hot plate upper surface or above; Preheating zone, described preheating zone to distribute one or more temperature provinces at eutectic area upper vertical.
As a kind of preferred embodiment, described thermal source is heating wire, heat-generating pipe, infrared radiation source, electromagnet source or laser, is placed in below hot plate that thickness is 0.1mm-50mm or in hot plate.
As a kind of preferred embodiment, described hot plate adopts thermostable heat-conductive material to make, minimum heatproof 240 DEG C.
As a kind of preferred embodiment, described eutectic area is 0.0001-50mm region above described hot plate upper surface or described hot plate.
As a kind of preferred embodiment, described preheating zone is more than 0.0001mm region above eutectic area, has one or more preheated zones.
As a kind of preferred embodiment, described thermal source, eutectic area, preheating zone surrounding, top and bottom have heat-barrier material to seal.
As a kind of preferred embodiment, described heat-barrier material has feeding mouth and discharging opening, described feeding mouth and discharging opening have the thermal insulation board that can run, and are used to open or close charging aperture and discharging opening.
As a kind of preferred embodiment, the other conveyer that adopts in described eutectic area and preheating zone carries and hauling operation material.
As a kind of preferred embodiment, described conveyer can carry out speed adjustment as required, can realize by the static speed of service to 100mm/s.
As a kind of preferred embodiment, described eutectic area and preheating zone adopt vacuum function or inflated with nitrogen function, can improve eutectic product quality.
The embodiment of the present invention have employed rectilinear warm area, can save a large amount of spaces; The consumption to electricity, gas etc. can be reduced simultaneously; And vertical warm area mode, product range ability can be shortened, effectively can improve the vibrations to product in running; The invention provides vacuum function and inflated with nitrogen function, the quality of product can be improved.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the cross-sectional view of a kind of rectilinear hot eutectic device provided by the invention;
Fig. 2 is the cross-sectional view of the rectilinear hot eutectic device of the another kind with nitrogen function provided by the invention;
Fig. 3 is the cross-sectional view of the rectilinear hot eutectic device of the another kind with vacuum function provided by the invention;
Fig. 4 is the ceramic substrate top view of one of work materials provided by the invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment
As shown in Figure 1, the present embodiment provides a kind of rectilinear hot eutectic device, comprise hot plate 101, eutectic area 102, preheating zone 103, conveyer 104, heat-insulating and sealing plate 105, charging aperture 106, discharging opening 107, thermal baffle 108, LED base 109, motor controller 110, temperature controller 111, supporting seat 112, LED chip 113, thermal source 114.Wherein, supporting seat 112 supports hot plate 01, conveyer 04, heat-insulating and sealing plate 105 and thermal baffle 108, and supporting seat 112 has heat-barrier material to separate with between thermal source 114 and hot plate 101, and motor controller 110 and temperature controller 111 are positioned in supporting seat 112; The LED base 109 being mounted with LED chip 113 according to pre-provisioning request under the carrying of conveyer 04 by feeding mouth 106, enter preheating zone 103, and progressively down run, arrive eutectic area 102, and complete after LED chip 113 is combined with LED base 109, run, until LED base 109 runs to outside discharging opening 107 completely toward discharging opening 107; Thermal baffle 108 moves down when charging or discharging, makes charging aperture 106 or discharging opening 107 can be normally unimpeded, and when non-charging or discharging on move and close charging aperture 106 or discharging opening 107.
Can be, but not limited to, hot plate 101 adopts the flat copper plate of length × wide × height=200mm × 200mm × 20mm, is arranged on supporting seat 112.
Can be, but not limited to, 8 heating wires 114 are placed in hot plate 101.
Can be, but not limited to, eutectic area 102 is hot plate 101 upper surface.
Can be, but not limited to, preheating zone 103 is 1mm-30mm region above hot plate 101.
Concrete, 5 regions, respectively 1mm, 5mm, 10mm, 20mm, 30mm position above hot plate 101 are preset in preheating zone, will stop 1-5 minute, to ensure that LED base 109 can obtain abundant preheating, be heated evenly everywhere time namely pedestal runs to above position.When eutectic area on setting hot plate is 310 ± 3 DEG C, then the temperature of each preheating warm area is from lower to upper: 280 ± 10 DEG C, 240 ± 15 DEG C, 200 ± 15 DEG C, 150 ± 15 DEG C, 80 ± 20 DEG C.
Can be, but not limited to, conveyer 104 near heat-insulating and sealing plate 105, and is supported, for the control of rising to LED base 109 charging, discharging, rising, decline and thermal baffle 108 or declining by steel column (sign).
Can be, but not limited to, heat-insulating and sealing plate 105 adopts the steel plate of built-in heat insulation asbestos, and thickness is 5mm, forms the cube of long × wide × height=300mm × 300mm × 400mm with supporting seat 112.
Can be, but not limited to, the length × wide=60mm × 5mm of charging aperture 106 and discharging opening 107.
Can be, but not limited to, thermal baffle 108 is controlled by conveyer, moves down when charging or discharging, otherwise closes charging aperture 106 and discharging opening 107 always.
Can be, but not limited to, LED base 09 is the ceramic substrate of length × wide × height=100mm × 55mm × 0.65mm, ceramic substrate has the position of presetting the placement LED chip reserved.
Can be, but not limited to, motor controller 110 controls conveyer 04, and then controls the operation conditions of thermal baffle 108 and LED base 109.
Can be, but not limited to, temperature controller 111 controls the temperature of hot plate 101, to obtain suitable temperature according to LED chip eutectic point, temperature controller 111, with 6 thermocouples (sign), is distributed in positions different on hot plate 101.
Can be, but not limited to, supporting seat 112 is the cube of length × wide × height=300mm × 300mm × 300mm.
Can be, but not limited to, the Eutectic Layer of LED chip 113 is the gold-tin alloy of Au:Sn=80:20, and fusing point is 282 DEG C.
As shown in Figure 2, can be, but not limited to, the face that hot plate 101 surrounding is connected with supporting seat 112 arranges nitrogen access aperture 201, and connected together by tracheae 202 and outside source nitrogen 203.When LED base 109 is completely by feeding mouth 106, thermal baffle 108 is closed, and now source nitrogen 203 is connected, and makes preheating zone 103 and eutectic area 102 be full of nitrogen completely.
As shown in Figure 3, can be, but not limited to, 4 holes 301 on the face that hot plate 101 surrounding is connected with supporting seat 112, and linked together by tracheae 302 and external vacuum generator 303.Arrive hot plate 101 upper surface in LED base 109, and when contacting completely with upper surface, start vacuum generator 303, make eutectic area 102 and preheating zone 103 close to vacuum state.
Therefore described rectilinear hot eutectic device provides easy, quick, stable eutectic mode, save the use amount of a large amount of spaces and electricity, gas, greatly reduce cost, and production efficiency high product quality is good.
Above-described embodiment, does not form the restriction to this technical scheme protection domain.The amendment done within any spirit at above-mentioned embodiment and principle, equivalently to replace and improvement etc., within the protection domain that all should be included in this technical scheme.
Claims (10)
1. a rectilinear hot eutectic device, it is characterized in that: comprise described thermal source, eutectic area and preheating zone, described eutectic area is above thermal source; Described preheating zone, above eutectic area, becomes rectilinear distribution with eutectic area.
2. rectilinear hot eutectic device as claimed in claim 1 a kind of, it is characterized in that, described thermal source is heating wire, heat-generating pipe, infrared radiation source, electromagnet source or laser, be built in by minimum can the hot plate made of the material of resistance to 240 degree of high temperature.
3. a kind of rectilinear hot eutectic device as claimed in claim 1, is characterized in that, described thermal source, eutectic area and preheating zone surrounding, top and bottom adopt heat-barrier material sealing.
4. rectilinear hot eutectic device as claimed in claim 1 a kind of, is characterized in that, described eutectic area is 0.0001mm-50mm region above the hot plate upper surface made of high-temperature material to hot plate.
5. a kind of rectilinear hot eutectic device as claimed in claim 1, it is characterized in that, described preheating zone is more than 0.0001mm region above eutectic area, has 1-200 warm area.
6. a kind of rectilinear hot eutectic device as claimed in claim 1, is characterized in that, the other conveyer that adopts in described eutectic area and preheating zone carries and hauling operation material.
7. a kind of rectilinear hot eutectic device as claimed in claim 1, it is characterized in that, described eutectic area and preheating zone have vacuum function.
8. a kind of rectilinear hot eutectic device as claimed in claim 1, it is characterized in that, described eutectic area and preheating zone have inflated with nitrogen function.
9. a kind of rectilinear hot eutectic device as claimed in claim 3, is characterized in that described heat-barrier material having charging aperture and discharging opening, and has corresponding movable heat-insulating and sealing plate described charging aperture and discharging opening to be closed.
10. a kind of rectilinear hot eutectic device as claimed in claim 6, it is characterized in that, described conveyer can carry out speed adjustment as required, can realize by the static speed of service to 100mm/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310461866.8A CN104511675A (en) | 2013-09-30 | 2013-09-30 | Vertical heat eutectic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310461866.8A CN104511675A (en) | 2013-09-30 | 2013-09-30 | Vertical heat eutectic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104511675A true CN104511675A (en) | 2015-04-15 |
Family
ID=52787867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310461866.8A Pending CN104511675A (en) | 2013-09-30 | 2013-09-30 | Vertical heat eutectic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104511675A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114535742A (en) * | 2020-11-11 | 2022-05-27 | 马丁·施韦克哈特 | Method for operating a vacuum system and vacuum system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002144076A (en) * | 2000-11-06 | 2002-05-21 | Koyo Thermo System Kk | Reflow furnace and its treating method |
| CN200959336Y (en) * | 2006-10-09 | 2007-10-10 | 深圳市量子光电子有限公司 | LED shared operating platform |
| CN101144988A (en) * | 2006-09-13 | 2008-03-19 | 沈阳芯源先进半导体技术有限公司 | Temperature gradient controllable wafer front-drying method and its hot plate type front drying device |
| CN201143585Y (en) * | 2007-09-03 | 2008-11-05 | 中国电子科技集团公司第二研究所 | Vacuum/controllable atmosphere eutectic furnace |
| CN102522348A (en) * | 2012-01-05 | 2012-06-27 | 上海共晶电子科技有限公司 | Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip |
| CN203509273U (en) * | 2013-09-30 | 2014-04-02 | 雷训金 | Vertical type hot eutectic device |
-
2013
- 2013-09-30 CN CN201310461866.8A patent/CN104511675A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002144076A (en) * | 2000-11-06 | 2002-05-21 | Koyo Thermo System Kk | Reflow furnace and its treating method |
| CN101144988A (en) * | 2006-09-13 | 2008-03-19 | 沈阳芯源先进半导体技术有限公司 | Temperature gradient controllable wafer front-drying method and its hot plate type front drying device |
| CN200959336Y (en) * | 2006-10-09 | 2007-10-10 | 深圳市量子光电子有限公司 | LED shared operating platform |
| CN201143585Y (en) * | 2007-09-03 | 2008-11-05 | 中国电子科技集团公司第二研究所 | Vacuum/controllable atmosphere eutectic furnace |
| CN102522348A (en) * | 2012-01-05 | 2012-06-27 | 上海共晶电子科技有限公司 | Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip |
| CN203509273U (en) * | 2013-09-30 | 2014-04-02 | 雷训金 | Vertical type hot eutectic device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114535742A (en) * | 2020-11-11 | 2022-05-27 | 马丁·施韦克哈特 | Method for operating a vacuum system and vacuum system |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150415 |
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