CN104505452A - Reflow soldering LED (Light Emitting Diode) lamp filament - Google Patents
Reflow soldering LED (Light Emitting Diode) lamp filament Download PDFInfo
- Publication number
- CN104505452A CN104505452A CN201410647648.8A CN201410647648A CN104505452A CN 104505452 A CN104505452 A CN 104505452A CN 201410647648 A CN201410647648 A CN 201410647648A CN 104505452 A CN104505452 A CN 104505452A
- Authority
- CN
- China
- Prior art keywords
- substrate
- reflow soldering
- sheet metal
- metal sheets
- led silk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Abstract
The invention relates to a reflow soldering LED (Light Emitting Diode) lamp filament which solves the problem of product scrapping due to low quality caused by poor bonding effect of a substrate and metal sheets of a lamp filament in the prior art. The lamp filament comprises a substrate, wherein an LED chip is arranged on the surface of the substrate; the two ends of the substrate are connected with metal sheets; coatings are arranged on the faces of the two ends of the substrate which are connected with the metal sheets; soldering paste is arranged between the metal sheets and the coatings; and the metal sheets are connected with the substrate by reflow soldering. The lamp filament has the advantages that the coatings are arranged on the substrate and the soldering paste substitutes the traditional fixing glue, so that bonding is firmer; and the metal sheets are connected with the substrate by reflow soldering, so that the sapphire coatings are tightly bonded with the metal sheets, the defects of insufficient bonding force and uneven connecting part of the substrate and the metal sheets are improved, and the problem of product scrapping due to separation and split of the substrate and the metal sheets in the prior art employing spot soldering is solved.
Description
Technical field
The present invention relates to a kind of LED technology field, especially relate to a kind of firm, that yields is high, heat radiation light-out effect is good Reflow Soldering formula LED silk that bonds.
Background technology
The LED silk of current use is as the LED silk of sapphire substrate, and it generally uses fixing glue to be fixed on sheet metal by sapphire substrate, usually can run into following problem.
1. current use fixing glue is fixed in sapphire design, and by board, operator impact is comparatively large, and the consistency of some glue amount is not fine, there are differences with time point glue outward appearance.
If 2. use fixing glue to fix sapphire substrate, usual way uses board on metal pins, put appropriate fixing glue, then belongs to support with a sleeve clamp bonus and flatten, and uses the instruments such as tweezers just being put into fixture spacing hole by sapphire, and it is fixed gently to press solidly.Take out support and enter baking.But because different employee's operation technique is different, even same employee, also can produce difference in use dynamics, this can produce a very large impact product fixed mass.In this case, partially, fixing glue is extruded to side to sapphire dress, in protruding condition, easily flows to metal pins back pollution support.
3. owing to fixing in sapphire design in use fixing glue, extrude sapphire substrate gently glue is evenly distributed, but in actual production process, because the support placing sapphire substrate is softer, i.e. stressed just distortion, therefore take in the process of support, transfer support at operator, all there is deformation of timbering, support and sapphire joining place is caused to occur gap, changing appears in glue outward appearance, can not cover contact area completely, in middle many glue, the phenomenon that periphery is glue-free, affects product quality.
4. use fixing glue to fix sapphire, there is bonding firm not, spot welding easily occurs that sapphire and sheet metal depart from, and the phenomenons such as split, make product rejection.
These situations equally also occur on ceramic substrate, glass substrate, PCB substrate, transparent resin substrate.
Also existing filament and filament support are all be connected by spot welding in addition, filament easily occurs that in pinpoint welding procedure sealing-off, rosin joint etc. are abnormal, have a strong impact on production yield and the useful life of light source, equipment, material etc. simultaneously needed for spot-welding technology also to a certain degree improve light source production cost.
Summary of the invention
The present invention mainly solve the substrate of filament in prior art and sheet metal bond effect bad, affect product quality, cause the problem of product rejection, provide a kind of Reflow Soldering formula LED silk that a kind of bond effect is good.
Another goal of the invention of the present invention solves filament to adopt spot welding to be connected with filament support, easily produces the problem of sealing-off, rosin joint, provide and a kind ofly connect fastening Reflow Soldering formula LED silk.
Above-mentioned technical problem of the present invention is mainly solved by following technical proposals: a kind of Reflow Soldering formula LED silk, comprise substrate, be provided with LED chip on the surface of the substrate, substrate two ends are connected with sheet metal, the face that described substrate two ends are connected with sheet metal is provided with one deck coating, between sheet metal and coating, soldering paste is set, and by Reflow Soldering, sheet metal is connected with substrate.The present invention arranges certain thickness coating on substrate, soldering paste is used to replace traditional fixing glue, make bonding more firm, and by Reflow Soldering, sheet metal is connected with substrate, coating and sheet metal are combined closely, improves substrate and sheet metal cohesive force inadequate, junction out-of-flatness, and avoid because spot welding makes that substrate and sheet metal depart from, split, cause the problem of product rejection.
As a kind of preferred version, the thickness of described coating is 0.1 micron-3 microns.
As a kind of preferred version, described sheet metal is provided with alligatoring district near the surface of position place of rear end, and alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.Sheet metal rear end, for divide with substrate connecting portion, the part be connected is carried out roughening treatment and is formed alligatoring district, add the binding ability of sheet metal and substrate with substrate, guarantees that connection is more certain.
As a kind of preferred version, described sheet metal also has bar hole.Arrange the stress that bar hole causes in an assembling process in order to discharge filament, bar hole discharges stress by deformation, thus serves protective effect, prevents metal electrode and substrate from coming off.
As a kind of preferred version, described sheet metal front end bends and forms the connecting plate of flat, and connecting plate is provided with connecting hole, and filament is connected with filament support, and the front end of filament support is provided with joint pin, and connecting plate is enclosed within joint pin by connecting hole.Be connected with light bulb filament support by filament in this programme and have employed embedded assembling mode, on the termination of filament support, correspondence is provided with joint pin, and the connecting plate on sheet metal is nested with on joint pin by connecting hole.This avoid light source and occur the bad problems such as filament sealing-off, rosin joint in traditional electrode welding process, save the cost such as equipment, material needed for welding technology simultaneously, improve product yield, reduce cost.
As a kind of preferred version, described substrate is sapphire substrate, ceramic substrate, glass substrate, PCB substrate or transparent resin substrate.
As a kind of preferred version, described soldering paste is lead-free solder paste or has lead welding cream.
As a kind of preferred version, described coating comprises silver, nickel, copper, gold or tin coating.
Therefore, advantage of the present invention is: substrate arranges coating, unleaded SAC soldering paste is used to replace traditional fixing glue, make bonding more firm, and by Reflow Soldering, sheet metal is connected with substrate, sapphire silver coating and sheet metal are combined closely, improve substrate and sheet metal cohesive force is inadequate, junction out-of-flatness, and avoid because spot welding makes that substrate and sheet metal depart from, split, cause the problem of product rejection.Filament sheet metal Front-end Design becomes damascene structures, filament is connected more fastening with filament support, avoid light source and occur the bad problems such as filament sealing-off, rosin joint in traditional electrode welding process, save the cost such as equipment, material needed for welding technology simultaneously, improve product yield, reduce cost.
Accompanying drawing explanation
Accompanying drawing 1 is a kind of structural representation of substrate in the present invention;
Accompanying drawing 2 is a kind of structural representations that in the present invention, substrate is connected with sheet metal;
Accompanying drawing 3 is a kind of structural representations of sheet metal in the present invention;
A kind of structural representation of accompanying drawing 4 to be the sheet metal front ends of filament in the present invention be damascene structures;
Accompanying drawing 5 is a kind of structural representations that in the present invention, filament is connected with filament support.
1-substrate 2-sheet metal 3-bar hole 4-coating 5-soldering paste 6-alligatoring district 7-connecting plate 8-connecting hole 9-filament support 10-joint pin.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, technical scheme of the present invention is described in further detail.
Embodiment:
A kind of Reflow Soldering formula of the present embodiment LED silk, as depicted in figs. 1 and 2, comprise substrate 1, substrate is sapphire substrate, ceramic substrate, glass substrate, PCB substrate or transparent resin substrate, here sapphire substrate is adopted to be example, be provided with LED chip on the surface of the substrate, substrate two ends are connected with sheet metal 2, the face that substrate two ends are connected with sheet metal is provided with one deck coating 4, coating is silver, nickel, copper, gold or tin coating, the thickness of coating is 1 micron, arranges soldering paste 5, and be connected with substrate by sheet metal by Reflow Soldering between sheet metal and coating.Soldering paste is for having lead welding cream or lead-free solder paste.
As shown in Figure 3, sheet metal 2 is provided with alligatoring district 6 near the surface of position place of rear end, and alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.Sheet metal also has bar hole 3.
Be connected more firm in order to make sheet metal with the filament support of bulb, prevent the problem of rosin joint or sealing-off, as shown in Figure 3, sheet metal is designed to damascene structures, sheet metal front end bends and forms the connecting plate 7 of flat, and connecting plate is provided with connecting hole 8.Filament support 9 front end in bulb is provided with joint pin 10, and as shown in Figure 5, when filament is connected with filament support, the connecting plate of sheet metal is enclosed within joint pin by connecting hole.
Specific embodiment described herein is only to the explanation for example of the present invention's spirit.Those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present invention or surmount the scope that appended claims defines.
Although more employ the terms such as substrate, sheet metal, bar hole, coating, soldering paste herein, do not get rid of the possibility using other term.These terms are used to be only used to describe and explain essence of the present invention more easily; The restriction that they are construed to any one additional is all contrary with spirit of the present invention.
Claims (8)
1. a Reflow Soldering formula LED silk, comprise substrate, be provided with LED chip on the surface of the substrate, substrate two ends are connected with sheet metal, it is characterized in that: the face that described substrate two ends are connected with sheet metal is provided with one deck coating (4), between sheet metal and silver coating, soldering paste is set, and by Reflow Soldering, sheet metal is connected with substrate.
2. a kind of Reflow Soldering formula LED silk according to claim 1, is characterized in that the thickness of described coating (4) is 0.1 micron-3 microns.
3. a kind of Reflow Soldering formula LED silk according to claim 1 and 2, it is characterized in that described sheet metal (2) is provided with alligatoring district (6) near the surface of position place of rear end, alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.
4. a kind of Reflow Soldering formula LED silk according to claim 1 and 2, is characterized in that described sheet metal (2) also has bar hole (3).
5. a kind of Reflow Soldering formula LED silk according to claim 1 and 2, it is characterized in that described sheet metal (2) front end bends and forms the connecting plate (7) of flat, connecting plate is provided with connecting hole (8), filament is connected with filament support, be provided with joint pin (10) in the front end of filament support, connecting plate is enclosed within joint pin by connecting hole.
6. a kind of Reflow Soldering formula LED silk according to claim 1 and 2, is characterized in that described substrate is sapphire substrate, ceramic substrate, glass substrate, PCB substrate or transparent resin substrate.
7. a kind of Reflow Soldering formula LED silk according to claim 1 and 2, is characterized in that described soldering paste is lead-free solder paste or has lead welding cream.
8. a kind of Reflow Soldering formula LED silk according to claim 1 and 2, is characterized in that described coating comprises silver, nickel, copper, gold or tin coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410647648.8A CN104505452A (en) | 2014-11-14 | 2014-11-14 | Reflow soldering LED (Light Emitting Diode) lamp filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410647648.8A CN104505452A (en) | 2014-11-14 | 2014-11-14 | Reflow soldering LED (Light Emitting Diode) lamp filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104505452A true CN104505452A (en) | 2015-04-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410647648.8A Pending CN104505452A (en) | 2014-11-14 | 2014-11-14 | Reflow soldering LED (Light Emitting Diode) lamp filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104505452A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020036464A1 (en) * | 2000-09-26 | 2002-03-28 | Kabushiki Kaisha Toshiba | Led lamp, led lamp assembly and fixing method of an led lamp |
| CN201017904Y (en) * | 2007-02-13 | 2008-02-06 | 咸瑞科技股份有限公司 | Led |
| CN101262035A (en) * | 2007-03-09 | 2008-09-10 | 亿光电子工业股份有限公司 | LED structure and its assembly method |
| CN102751426A (en) * | 2010-01-20 | 2012-10-24 | 旭丽电子(广州)有限公司 | Packaging structure and light-emitting diode packaging structure |
| CN103337583A (en) * | 2013-06-26 | 2013-10-02 | 深圳雷曼光电科技股份有限公司 | LED inverted structure and inversion process |
| WO2014020470A1 (en) * | 2012-07-30 | 2014-02-06 | Koninklijke Philips N.V. | Strengthened led package and method therefor |
| CN203503699U (en) * | 2013-10-14 | 2014-03-26 | 长兴科迪光电有限公司 | SMD-based LED packaging structure |
| CN103943616A (en) * | 2013-01-22 | 2014-07-23 | 浙江中宙照明科技有限公司 | LED light emitting device |
| CN104124325A (en) * | 2014-08-07 | 2014-10-29 | 深圳市九洲光电科技有限公司 | Light reflection substrate, LED die set and manufacturing method thereof |
-
2014
- 2014-11-14 CN CN201410647648.8A patent/CN104505452A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020036464A1 (en) * | 2000-09-26 | 2002-03-28 | Kabushiki Kaisha Toshiba | Led lamp, led lamp assembly and fixing method of an led lamp |
| CN201017904Y (en) * | 2007-02-13 | 2008-02-06 | 咸瑞科技股份有限公司 | Led |
| CN101262035A (en) * | 2007-03-09 | 2008-09-10 | 亿光电子工业股份有限公司 | LED structure and its assembly method |
| CN102751426A (en) * | 2010-01-20 | 2012-10-24 | 旭丽电子(广州)有限公司 | Packaging structure and light-emitting diode packaging structure |
| WO2014020470A1 (en) * | 2012-07-30 | 2014-02-06 | Koninklijke Philips N.V. | Strengthened led package and method therefor |
| CN103943616A (en) * | 2013-01-22 | 2014-07-23 | 浙江中宙照明科技有限公司 | LED light emitting device |
| CN103337583A (en) * | 2013-06-26 | 2013-10-02 | 深圳雷曼光电科技股份有限公司 | LED inverted structure and inversion process |
| CN203503699U (en) * | 2013-10-14 | 2014-03-26 | 长兴科迪光电有限公司 | SMD-based LED packaging structure |
| CN104124325A (en) * | 2014-08-07 | 2014-10-29 | 深圳市九洲光电科技有限公司 | Light reflection substrate, LED die set and manufacturing method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150408 |