CN104501114B

CN104501114B - Heat dissipation structure of LED lamp

Info

Publication number: CN104501114B
Application number: CN201410800347.4A
Authority: CN
Inventors: 曾茂进; 曹亮亮; 李甫文
Original assignee: Leedarson Lighting Co Ltd
Current assignee: Leedarson Lighting Co Ltd
Priority date: 2014-12-19
Filing date: 2014-12-19
Publication date: 2022-12-23
Anticipated expiration: 2034-12-19
Also published as: CN104501114A

Abstract

A heat dissipation structure of an LED lamp is used for dissipating heat emitted by an LED light source to the outside, and comprises a heat transfer plate, a heat dissipation bag and a heat conduction medium, wherein the LED light source is in thermal connection with the heat transfer plate, the heat dissipation bag is in thermal connection with the heat transfer plate, the heat conduction medium is arranged in the heat dissipation bag, and when the LED light source works, at least partial phase change occurs when the heat conduction medium is heated. The heat conducting medium is changed into gas after absorbing heat emitted by the LED light source, so that the heat dissipation bag body is enlarged, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Description

Heat dissipation structure of LED lamp

Technical Field

The invention relates to a heat dissipation structure, in particular to a heat dissipation structure of an LED lamp.

Background

The LED lamp is more popular due to the advantages of energy conservation, environmental protection and the like, and has the advantages of high luminous efficiency, electricity saving and long service life. Because the temperature of the LED light source can gradually rise when the LED light source emits light, if the heat generated by the LED light source cannot be dissipated in time in the continuous working process, the light source component is damaged to influence the service life of the lighting device.

The current technology is to use metal or plastic heat sinks for heat dissipation. For example, a Chinese patent with the publication date of 2013, 5 and 8 months and the patent number of 201220601005.6 discloses an industrial and mining lamp. The LED mining lamp comprises a power supply box, a connecting piece, a radiating piece, a connecting plate, a reflecting cover, an aluminum substrate and a lampshade for protecting the aluminum substrate, wherein the connecting piece is positioned in the middle and connects the power supply box with the radiating piece, the connecting plate is positioned between the radiating piece and the reflecting cover, the aluminum substrate and the lampshade for protecting the aluminum substrate are positioned inside the reflecting cover, the radiating piece, the reflecting cover, the aluminum substrate and the lampshade are all fixed on the connecting plate, a driving power supply is arranged inside the power supply box, and a plurality of LED lamps are pasted on the aluminum substrate.

However, although metal heat sinks have good thermal conductivity, they are dense, heavy, and costly to manufacture and material: although the plastic heat sink is easy to manufacture, the plastic heat sink has the problems of low thermal conductivity, easy cracking, unstable performance and the like. The existing LED mining lamp is high in power, and in order to achieve the purpose of good heat dissipation, an alloy aluminum material is usually adopted, so that the whole lamp is large in size, heavy in weight, inconvenient to carry, high in hanging requirement, and high in material cost and manufacturing cost.

Disclosure of Invention

In view of this, it is necessary to provide a heat dissipation structure of an LED lamp with good heat dissipation effect, light weight and low manufacturing cost.

A heat dissipation structure of an LED lamp is used for dissipating heat emitted by an LED light source to the outside, and comprises a heat transfer plate, a heat dissipation bag and a heat conduction medium, wherein the LED light source is in thermal connection with the heat transfer plate, the heat dissipation bag is in thermal connection with the heat transfer plate, the heat conduction medium is arranged in the heat dissipation bag, and when the LED light source works, at least partial phase change occurs when the heat conduction medium is heated.

Compared with the prior art, the heat dissipation structure of the LED lamp is provided with the heat dissipation bag, the heat transfer plate and the heat conduction medium arranged in the heat dissipation bag. The heat dissipation bag is thermally connected with the heat transfer plate, and when the LED light source works, the heat conducting medium is heated to at least partially change phase. The heat conducting medium is changed into gas after absorbing heat emitted by the LED light source, so that the heat dissipation bag body is enlarged, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Drawings

FIG. 1 is an exploded perspective view of an LED lamp heat dissipation structure of the present invention in an operating state;

FIG. 2 is a perspective view of the heat sink structure of the LED lamp shown in FIG. 1 assembled in a non-operational state;

FIG. 3 is a perspective view of the heat dissipation structure of the LED lamp shown in FIG. 1 after assembly in an operating state;

fig. 4 is a schematic cross-sectional view of the heat dissipation structure of the LED lamp shown in fig. 1 after assembly in an operating state.

Description of reference numerals:

10LED lamp heat radiation structure 20LED light source 30 reflector

11 heat dissipation bag 12 heat transfer plate 13 heat transfer medium

14 connecting pipe 15 and lead 16 substrate

111 opening 112, inner layer 113, and outer layer

Detailed Description

The invention is described in further detail below with reference to the drawings and the detailed description.

Referring to fig. 1 to 4, the LED mining lamp 100 includes an LED lamp heat dissipation structure 10, an LED light source 20, and a reflector 30. The LED lamp heat dissipation structure 10 is used for dissipating heat emitted from the LED light source 20 to the outside, and the reflector 30 is used for reflecting light emitted from the LED light source 20.

The heat dissipation structure 10 of the LED lamp includes a heat dissipation bag 11, a heat transfer plate 12, a heat conducting medium 13, a connection tube 14, a wire 15, and a substrate 16. The LED light source 20 is thermally connected to the heat transfer plate 12, the heat dissipating bag 11 is thermally connected to the heat transfer plate 12, and the heat conducting medium 13 is disposed in the heat dissipating bag 11. The connecting tube 14 is a hollow structure, one end of the connecting tube 14 is connected to the heat transfer plate 12, the other end of the connecting tube 14 passes through the heat dissipating bag 11 and extends out of the heat dissipating bag 11, the wire 15 is disposed inside the connecting tube 14, and one end of the wire 15 is electrically connected to the LED light source on the heat transfer plate. The LED light source 20 is disposed on the substrate 16, the substrate 16 is thermally connected to the heat transfer plate 12, and the substrate 16 is further disposed with driving electronic components. The reflector 30 is arranged on the heat transfer plate 12 around the LED light sources 20.

The heat dissipating bag 11 is made of elastic material or flexible material, the bottom of the heat dissipating bag 11 is provided with an opening 111, the heat dissipating bag 11 is connected with the heat transfer plate 12 through the opening 111, and the heat transfer medium 13 is contained between the heat dissipating bag 11 and the heat transfer plate 12. Preferably, the heat dissipating bag 11 includes an inner layer 112 and an outer layer 113 thermally connected to the inner layer 112, the inner layer 112 is a metal layer, the outer layer 113 is made of an elastic material or a flexible material, and the inner layer 112 isolates the heat conducting medium 13 from other parts of the heat dissipating bag 11. The inner layer 112 is made of aluminum foil or tin foil, and the material of the outer layer 113 can be selected from plastic, paper or cloth. The inner wall of the heat dissipating bag 11 is provided with a capillary reflow structure (not shown).

The heat conducting medium 13 is a liquid, the heat dissipating bag 11 is a closed structure, and before the LED light source 20 operates, at least a portion of the inside of the heat dissipating bag 11 is evacuated to form a negative pressure. When the LED light source 20 is in operation, the heat conducting medium 13 is heated to at least partially change phase.

When the heat dissipation bag 11 works, heat emitted by the LED light source 20 is transmitted to the heat conducting medium 13 through the heat conducting plate 12, the heat conducting medium 13 absorbs the heat and starts to rise in temperature, when the heat conducting medium 13 reaches a certain temperature, a part or all of the heat conducting medium 13 is transformed into gas, and the volume of the heat dissipation bag 11 is gradually increased as the heat conducting medium 13 transformed into gas is gradually increased. A part of heat generated by the LED light source is phase-changed and absorbed by the heat conducting medium 13, another part of heat is consumed by the heat dissipating bag 11 due to the volume increase and the heat conducting medium 13 of the gas consuming a lot of energy, and finally the rest of heat is dissipated to the external space through the surface of the heat dissipating bag 11.

In summary, the heat dissipating structure 10 of the LED lamp includes a heat dissipating bag 11, a heat transferring plate 12, and a heat conducting medium 13 disposed in the heat dissipating bag 11. The heat dissipating bag 11 is thermally connected to the heat transfer plate 12, and when the LED light source 20 is operated, the heat conducting medium 13 is heated to at least partially change phase. Because the heat conducting medium 13 is changed into gas after absorbing the heat emitted by the LED light source 20, the volume of the heat dissipating bag 11 is increased, the heat dissipating area is increased, and the heat dissipating efficiency is improved, and compared with a metal or plastic heat dissipating member, the heat dissipating bag 11 has low manufacturing cost and light weight, so that the heat dissipating structure 10 of the LED lamp has the advantages of good heat dissipating effect, light weight, and low manufacturing cost. The capillary reflux structure is arranged on the inner wall of the heat dissipation bag 11, so that gas can be fully and quickly refluxed to the bottom of the bag-shaped heat dissipation bag 11 after being condensed, the heat dissipation speed is improved, and the LED lamp heat dissipation structure 10 has the advantage of high heat dissipation efficiency. Because the heat dissipating bag 11 comprises the inner layer 112 and the outer layer 113 thermally connected to the inner layer 112, the inner layer 112 is a metal layer, the outer layer 113 is made of an elastic material or a flexible material, and the heat conducting medium 13 is isolated from other parts of the heat dissipating bag 11 by the inner layer 112, the heat conducting medium 13 is prevented from damaging the heat dissipating bag 11, and the service life of the heat dissipating structure 10 of the LED lamp is prolonged.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a LED lamp heat radiation structure for give off the heat that LED light source sent to the external world, includes the heat transfer plate, LED light source and this heat transfer plate thermal connection, its characterized in that: the LED light source is characterized by further comprising a heat dissipation bag, the heat dissipation bag is in thermal connection with the heat transfer plate, a heat conduction medium is arranged in the heat dissipation bag, when the LED light source works, at least partial phase change occurs when the heat conduction medium is heated, an opening is formed in the bottom of the heat dissipation bag, the heat dissipation bag is connected with the heat transfer plate through the opening, the heat conduction medium is contained between the heat dissipation bag and the heat transfer plate, the heat dissipation bag comprises an inner layer and an outer layer in thermal connection with the inner layer, the inner layer is a metal layer, the outer layer is made of elastic materials or flexible materials, and the inner layer isolates the heat conduction medium from other parts of the heat dissipation bag.

2. The heat dissipation structure of an LED lamp of claim 1, wherein: the heat conducting medium is liquid, the heat dissipation bag is of a closed structure, and before the LED light source works, at least part of the interior of the heat dissipation bag is vacuumized to form negative pressure.

3. The heat dissipation structure of an LED lamp of claim 2, wherein: the inner wall of the heat dissipation bag is provided with a capillary reflux structure.

4. The heat dissipation structure of an LED lamp of claim 2, wherein: the inner layer is made of aluminum foil or tin foil, and the material of the outer layer can be selected from plastic, paper or cloth.

5. The heat dissipation structure of an LED lamp of claim 1, wherein: the LED lamp also comprises a connecting pipe, wherein the connecting pipe is of a hollow structure, one end of the connecting pipe is connected with the heat transfer plate, the other end of the connecting pipe penetrates through the heat dissipation bag and extends out of the heat dissipation bag, a wire is arranged inside the connecting pipe, and one end of the wire is electrically connected with the LED light source on the heat transfer plate.

6. The heat dissipation structure of an LED lamp of claim 1, wherein: the LED light source is arranged on the substrate, the substrate is in thermal connection with the heat transfer plate, and a driving electronic element is further arranged on the substrate.