CN104497683A - Inorganic dry powder heat-insulating putty - Google Patents
Inorganic dry powder heat-insulating putty Download PDFInfo
- Publication number
- CN104497683A CN104497683A CN201410854961.9A CN201410854961A CN104497683A CN 104497683 A CN104497683 A CN 104497683A CN 201410854961 A CN201410854961 A CN 201410854961A CN 104497683 A CN104497683 A CN 104497683A
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- Prior art keywords
- heat insulation
- inorganic powder
- putty
- agent
- insulation putty
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/34—Filling pastes
Abstract
The invention provides an inorganic dry powder heat-insulating putty in a dry powder state. The inorganic dry powder heat-insulating putty comprises the following components in parts by weight: 50-300 parts of inorganic cementing materials, 30-80 parts of dispersible adhesive powder, 50-400 parts of functional heat-insulating materials, 50-300 parts of fillers and 0-20 parts of auxiliary agents. The inorganic dry powder heat-insulating putty provided by the invention has the characteristics of low heat-conduction coefficient and can prevent the external heat from being conducted into a material even if atmospheric temperature is very high; besides, the inorganic dry powder heat-insulating putty provided by the invention has the advantages of good rubbing property, adhesivity, storage stability and the like, is convenient to transport and apply, especially can not generate harmful substances, namely VOC, benzene, formaldehyde, heavy metals and the like in an application process, is suitable for levelling the substrates of inner and outer walls of a building, and can be used for enhancing the heat insulation of an enclosure of the building and enhancing the superiority of integral energy-saving efficiency of the building.
Description
Technical field
The present invention relates to a kind of putty, particularly relate to a kind of heat insulation putty, be specially the heat insulation putty of a kind of inorganic powder.
Background technology
Putty is as the one of building and ornament materials, and mainly as the base material that a kind of wall-surface patching is levelling, be next step decoration of body of wall, such as brush paint wallpaper etc., lay a good foundation.Putty can be divided into inner wall putty and exterior wall putty two kinds, and wherein exterior wall putty needs opposing to expose to the weather, and therefore colloidality is strong, intensity large, environmental protection index is low; And relatively, the aggregative index of inner wall putty is higher, and there is the feature of health environment-friendly.So people sum up interior wall not external application, exterior wall not in pithy formula.
Although relative to other building and ornament materials, putty is a kind of material of coarse, low requirement, but in fact, the keying action that it plays is very important, no matter is batching or use, is all related to the final effect of other finishing material, therefore, prior art, while other finishing material of Improvement, is also improved putty, such as:
CN102911546A discloses a kind of putty, comprise a kind of putty composite resin material, its component is unsaturated polyester resin, Vinylite and 808 resins, in order to reduce evaporation rate and the shrinking percentage of putty, although in actual applications, its shrinking percentage reduces greatly, and its cost substantially prolongs the duration exactly, improve human cost, in fact unsatisfactory;
CN103525151A discloses a kind of environment-friendly type inner wall putty, component is talcum powder, water-ground limestone, calcium-base bentonite, Xylo-Mucine, Natvosol, building gypsum plaster, carboxymethyl cellulose, pre-gelatinized starch, Vltra tears and Sodium dodecylbenzene sulfonate, although the putty finally obtained belongs to Green Product, still containing objectionable impuritiess such as trace formaldehydes.
Summary of the invention
In order to solve prior art defect in actual use, while really reaching safety and environmental protection, increase other useful performance of putty, it is made in use to meet the demand of people as wide as possible, the invention provides the heat insulation putty of a kind of inorganic powder, have the advantages that thermal conductivity is little, even if outside heat also can be intercepted conduct to interior of articles when free air temperature is very high, in addition, also there is good grinability, cohesiveness, the advantages such as package stability, be convenient to transport and application, the most important thing is, VOC can not be produced in application process, benzene, the objectionable impuritiess such as formaldehyde heavy metal, the basic unit that simultaneously can be applicable to buildings inner-outer wall is levelling, and there is the thermal insulation improving buildings and go along with sb. to guard him, promote the advantage of the energy-saving efficiency of whole building.
Theme of the present invention is the heat insulation putty of a kind of inorganic powder, it is characterized in that, its component and weight proportion thereof comprise:
According to a preferred embodiment of the present invention, the heat insulation putty of described inorganic powder is dry powder.
In another preferred embodiment of the present invention, described inorganic coagulation material and re-dispersible glue powder form a kind of binding agent.
Described inorganic coagulation material comprise cement, lime, gypsum any one or a few.
Described re-dispersible glue powder is obtained after super-dry by polymer emulsion, wherein, described polymkeric substance comprise in homopolymer, copolymer, terpolymer any one or a few, wherein, described homopolymer, copolymer, terpolymer are obtained by any one or a few generation polymerization comprised in alkene, diolefine, vinylformic acid, acroleic acid resin, methacrylic acid, methacrylic ester, tertiary carbonic ester, vinyl fatty ester.
The lagging material that described functional lagging material thermal conductivity is low, comprise in hollow ceramic microspheres, glass hollow microballon, plastic hollow microballon, fly ash float, vermiculite any one or a few.
Described filler comprise in silicon oxide, silicate, carbonate, carbide, vitriol, sulfide, nitride, metal oxide, metal hydroxides, metal any one or a few.
Described auxiliary agent comprise dispersion agent, wetting agent, defoamer, air entrapment agent, water reducer, thixotroping rheological agent, thickening material, the agent of the suppression accumulation of salt in the surface soil, cracking resistance agent any one or a few.
Wherein, described dispersion agent comprises any one or a few in fatty acid, aliphatic amide type, ester class, paraffin class, metal soap, low-molecular-weight wax class.
Wherein, described defoamer comprises any one or a few in silicon ether Copolymer, organo-siloxane, polyethers and phosphoric acid ester.
Wherein, described thickening material comprise in cellulose family, polyacrylate(s), wilkinite, association type polyurethanes any one or a few, be more preferably, the homopolymer of methylcellulose gum, carboxyl alkyl cellulose, hydroxy alkyl cellulose, (methyl) vinylformic acid or its ester or salt or multipolymer.
The heat insulation putty of inorganic powder of the present invention, owing to have employed technique scheme, has the following advantages and beneficial effect:
1, the heat insulation putty of inorganic powder that finally obtains of the present invention, has the advantages that thermal conductivity is little, conducts even if also can intercept outside heat when free air temperature is very high to interior of articles;
2, the heat insulation putty of inorganic powder of the present invention has the advantages such as good grinability, cohesiveness, package stability, is convenient to transport and application;
3, the most important thing is, the heat insulation putty of inorganic powder of the present invention can not produce the objectionable impuritiess such as VOC, benzene, formaldehyde heavy metal in application process, the basic unit that simultaneously can be applicable to buildings inner-outer wall is levelling, and there is the thermal insulation improving buildings and go along with sb. to guard him, promote the advantage of the energy-saving efficiency of whole building.
Embodiment
The invention provides the heat insulation putty of a kind of inorganic powder, it is characterized in that, its component and weight proportion thereof comprise:
According to a preferred embodiment of the present invention, the heat insulation putty of described inorganic powder is dry powder.
Described inorganic coagulation material and re-dispersible glue powder form a kind of binding agent.
Described inorganic coagulation material comprise cement, lime, gypsum any one or a few.
Described re-dispersible glue powder is obtained after super-dry by polymer emulsion, wherein, described polymkeric substance comprise in homopolymer, copolymer, terpolymer any one or a few, wherein, described homopolymer, copolymer, terpolymer are obtained by any one or a few generation polymerization comprised in alkene, diolefine, vinylformic acid, acroleic acid resin, methacrylic acid, methacrylic ester, tertiary carbonic ester, vinyl fatty ester.
Described functional lagging material is the lagging material that thermal conductivity is low, comprises any one or a few in hollow ceramic microspheres, glass hollow microballon, plastic hollow microballon, fly ash float, vermiculite.
Described filler comprise in silicon oxide, silicate, carbonate, carbide, vitriol, sulfide, nitride, metal oxide, metal hydroxides, metal any one or a few.
Described auxiliary agent comprise dispersion agent, wetting agent, defoamer, air entrapment agent, water reducer, thixotroping rheological agent, thickening material, the agent of the suppression accumulation of salt in the surface soil, cracking resistance agent any one or a few.
Wherein, described dispersion agent comprises any one or a few in fatty acid, aliphatic amide type, ester class, paraffin class, metal soap, low-molecular-weight wax class.Wherein, described defoamer comprises any one or a few in silicon ether Copolymer, organo-siloxane, polyethers and phosphoric acid ester.Wherein, described thickening material comprise in cellulose family, polyacrylate(s), wilkinite, association type polyurethanes any one or a few, be more preferably, the homopolymer of methylcellulose gum, carboxyl alkyl cellulose, hydroxy alkyl cellulose, (methyl) vinylformic acid or its ester or salt or multipolymer.
For the technical scheme of the heat insulation putty of inorganic powder of the present invention, existing by following examples it be further explained and illustrate.
Embodiment 1
The heat insulation putty of a kind of inorganic powder, its component and weight proportion thereof comprise:
Wherein, the heat insulation putty of described inorganic powder is dry powder;
Described inorganic coagulation material and re-dispersible glue powder form a kind of binding agent;
Described inorganic coagulation material is the mixture of cement, lime and gypsum;
Described re-dispersible glue powder is occurred to be polymerized the homopolymer obtained by acroleic acid resin, then obtain after super-dry;
Described functional lagging material is the mixture comprising hollow ceramic microspheres, glass hollow microballon, plastic hollow microballon, fly ash float, vermiculite;
Described filler is the mixture comprising silicon oxide, silicate, carbonate, carbide, vitriol, sulfide, nitride, metal oxide, metal hydroxides, metal;
Described auxiliary agent comprises dispersion agent, wetting agent, defoamer, air entrapment agent, water reducer, thixotroping rheological agent, thickening material, the agent of the suppression accumulation of salt in the surface soil, cracking resistance agent.
Embodiment 2
The heat insulation putty of a kind of inorganic powder, its component and weight proportion thereof comprise:
Wherein, the heat insulation putty of described inorganic powder is dry powder;
Described inorganic coagulation material and re-dispersible glue powder form a kind of binding agent;
Described inorganic coagulation material is the mixture of cement and gypsum;
Described re-dispersible glue powder is occurred to be polymerized the homopolymer obtained by vinyl fatty ester, then obtain after super-dry;
Described functional lagging material is the mixture comprising hollow ceramic microspheres, fly ash float, vermiculite;
Described filler is the mixture comprising metal oxide, metal hydroxides, metal;
Described auxiliary agent comprises dispersion agent, defoamer, water reducer, thixotroping rheological agent, thickening material, the agent of the suppression accumulation of salt in the surface soil, cracking resistance agent.
Embodiment 3
The heat insulation putty of a kind of inorganic powder, its component and weight proportion thereof comprise:
Wherein, the heat insulation putty of described inorganic powder is dry powder;
Described inorganic coagulation material and re-dispersible glue powder form a kind of binding agent;
Described inorganic coagulation material is the mixture of lime and gypsum;
Described re-dispersible glue powder is the mixture that copolymer and the terpolymer obtained is occurred to be polymerized by vinylformic acid, then obtain after super-dry;
Described functional lagging material is the mixture comprising hollow ceramic microspheres, glass hollow microballon, plastic hollow microballon;
Described filler is the mixture comprising silicon oxide, silicate, metal;
Described auxiliary agent comprises dispersion agent, wetting agent, air entrapment agent, thixotroping rheological agent, thickening material, cracking resistance agent.
The present invention is by JC/T 157-2009 " putty for exterior use " main technical requirements (adding thermal conductivity), and wherein, the detected result of embodiment 1-3 is as follows:
Be described in detail specific embodiments of the invention above, but it is just as example, the present invention is not restricted to specific embodiment described above.To those skilled in the art, any equivalent modifications that the present invention is carried out and substituting also all among category of the present invention.Therefore, equalization conversion done without departing from the spirit and scope of the invention and amendment, all should contain within the scope of the invention.
Claims (10)
1. the heat insulation putty of inorganic powder, is characterized in that, its component and weight proportion thereof comprise:
2. the heat insulation putty of inorganic powder according to claim 1, it is characterized in that, the heat insulation putty of described inorganic powder is dry powder.
3. the heat insulation putty of inorganic powder according to claim 1, it is characterized in that, described inorganic coagulation material and re-dispersible glue powder form a kind of binding agent.
4. the heat insulation putty of inorganic powder according to claim 1, is characterized in that, described inorganic coagulation material comprise cement, lime, gypsum any one or a few.
5. the heat insulation putty of inorganic powder according to claim 1, is characterized in that, described re-dispersible glue powder is obtained after super-dry by polymer emulsion.
6. the heat insulation putty of inorganic powder according to claim 5, is characterized in that, described polymkeric substance comprise in homopolymer, copolymer, terpolymer any one or a few.
7. the heat insulation putty of inorganic powder according to claim 6, it is characterized in that, described homopolymer, copolymer, terpolymer are obtained by any one or a few generation polymerization comprised in alkene, diolefine, vinylformic acid, acroleic acid resin, methacrylic acid, methacrylic ester, tertiary carbonic ester, vinyl fatty ester.
8. the heat insulation putty of inorganic powder according to claim 1, it is characterized in that, the lagging material that described functional lagging material thermal conductivity is low, comprise in hollow ceramic microspheres, glass hollow microballon, plastic hollow microballon, fly ash float, vermiculite any one or a few.
9. the heat insulation putty of inorganic powder according to claim 1, it is characterized in that, described filler comprise in silicon oxide, silicate, carbonate, carbide, vitriol, sulfide, nitride, metal oxide, metal hydroxides, metal any one or a few.
10. the heat insulation putty of inorganic powder according to claim 1, is characterized in that, described auxiliary agent comprise dispersion agent, wetting agent, defoamer, air entrapment agent, water reducer, thixotroping rheological agent, thickening material, the agent of the suppression accumulation of salt in the surface soil, cracking resistance agent any one or a few.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410854961.9A CN104497683A (en) | 2014-12-31 | 2014-12-31 | Inorganic dry powder heat-insulating putty |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410854961.9A CN104497683A (en) | 2014-12-31 | 2014-12-31 | Inorganic dry powder heat-insulating putty |
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| CN104497683A true CN104497683A (en) | 2015-04-08 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106009864A (en) * | 2016-05-21 | 2016-10-12 | 浙江大学自贡创新中心 | Use method of stain-resistant inorganic dry power heat isolation paint |
| CN106009865A (en) * | 2016-05-21 | 2016-10-12 | 浙江大学自贡创新中心 | Stain-resistant inorganic dry power heat isolation paint |
| CN106752243A (en) * | 2016-12-20 | 2017-05-31 | 河南同伟建材有限公司 | A kind of putty for exterior use cream and preparation method thereof |
| CN106978080A (en) * | 2017-03-08 | 2017-07-25 | 河北美荷涂料有限公司 | The floor paint and preparation method of a kind of novel environment friendly dry powder shape |
| CN107236347A (en) * | 2017-05-09 | 2017-10-10 | 深圳市奇信建设集团股份有限公司 | Heat-insulated putty and preparation method thereof |
| CN108410245A (en) * | 2018-03-23 | 2018-08-17 | 常德市万福达环保节能建材有限公司 | A kind of heat insulating inner wall putty and preparation method |
| CN109593395A (en) * | 2019-01-09 | 2019-04-09 | 衢州超群钙业有限公司 | A kind of high strength/fire proof flame retardant type powder of lacquer putty for use on and its manufacture craft |
| CN109987910A (en) * | 2017-12-29 | 2019-07-09 | 西安增材制造国家研究院有限公司 | Stereolithography apparatus die surface handles material and its preparation and processing method |
| CN110452571A (en) * | 2019-09-12 | 2019-11-15 | 深圳市奇信集团股份有限公司 | A kind of putty and preparation method thereof |
| CN113667343A (en) * | 2021-08-03 | 2021-11-19 | 中冶武汉冶金建筑研究院有限公司 | External wall heat-insulating waterproof putty and preparation method thereof |
| CN114437581A (en) * | 2020-11-03 | 2022-05-06 | 湖南梨树园涂料有限公司 | Exterior wall putty for quick repairing or proofing |
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Patent Citations (2)
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Non-Patent Citations (1)
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106009864A (en) * | 2016-05-21 | 2016-10-12 | 浙江大学自贡创新中心 | Use method of stain-resistant inorganic dry power heat isolation paint |
| CN106009865A (en) * | 2016-05-21 | 2016-10-12 | 浙江大学自贡创新中心 | Stain-resistant inorganic dry power heat isolation paint |
| CN106752243A (en) * | 2016-12-20 | 2017-05-31 | 河南同伟建材有限公司 | A kind of putty for exterior use cream and preparation method thereof |
| CN106978080A (en) * | 2017-03-08 | 2017-07-25 | 河北美荷涂料有限公司 | The floor paint and preparation method of a kind of novel environment friendly dry powder shape |
| CN107236347A (en) * | 2017-05-09 | 2017-10-10 | 深圳市奇信建设集团股份有限公司 | Heat-insulated putty and preparation method thereof |
| CN109987910A (en) * | 2017-12-29 | 2019-07-09 | 西安增材制造国家研究院有限公司 | Stereolithography apparatus die surface handles material and its preparation and processing method |
| CN108410245A (en) * | 2018-03-23 | 2018-08-17 | 常德市万福达环保节能建材有限公司 | A kind of heat insulating inner wall putty and preparation method |
| CN109593395A (en) * | 2019-01-09 | 2019-04-09 | 衢州超群钙业有限公司 | A kind of high strength/fire proof flame retardant type powder of lacquer putty for use on and its manufacture craft |
| CN110452571A (en) * | 2019-09-12 | 2019-11-15 | 深圳市奇信集团股份有限公司 | A kind of putty and preparation method thereof |
| CN110452571B (en) * | 2019-09-12 | 2022-01-28 | 深圳市奇信集团股份有限公司 | Putty and preparation method thereof |
| CN114437581A (en) * | 2020-11-03 | 2022-05-06 | 湖南梨树园涂料有限公司 | Exterior wall putty for quick repairing or proofing |
| CN113667343A (en) * | 2021-08-03 | 2021-11-19 | 中冶武汉冶金建筑研究院有限公司 | External wall heat-insulating waterproof putty and preparation method thereof |
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