CN104492563A - Array-type PCB photosensitive film crushing device - Google Patents
Array-type PCB photosensitive film crushing device Download PDFInfo
- Publication number
- CN104492563A CN104492563A CN201410700259.7A CN201410700259A CN104492563A CN 104492563 A CN104492563 A CN 104492563A CN 201410700259 A CN201410700259 A CN 201410700259A CN 104492563 A CN104492563 A CN 104492563A
- Authority
- CN
- China
- Prior art keywords
- conical
- rotation seat
- raw material
- photosensitive film
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C18/00—Disintegrating by knives or other cutting or tearing members which chop material into fragments
- B02C18/06—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
- B02C18/08—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives within vertical containers
- B02C18/086—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives within vertical containers specially adapted for disintegrating plastics, e.g. cinematographic films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C18/00—Disintegrating by knives or other cutting or tearing members which chop material into fragments
- B02C18/06—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
- B02C18/16—Details
- B02C18/18—Knives; Mountings thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C23/00—Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in preceding groups or not specially adapted to apparatus covered by a single preceding group
- B02C23/18—Adding fluid, other than for crushing or disintegrating by fluid energy
- B02C23/20—Adding fluid, other than for crushing or disintegrating by fluid energy after crushing or disintegrating
- B02C23/22—Adding fluid, other than for crushing or disintegrating by fluid energy after crushing or disintegrating with recirculation of material to crushing or disintegrating zone
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- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Crushing And Pulverization Processes (AREA)
Abstract
The invention discloses an array-type PCB photosensitive film crushing device. The array-type PCB photosensitive film crushing device comprises a base barrel, a crushing mechanism and an air blast mechanism. The crushing mechanism comprises a conical rotation seat. A conical inclined plane of the conical rotation seat is provided with several annular smashing blades. The annular axis of the smashing blade and the axis of the rotation seat are the same. The air blast mechanism comprises a fan and an annular air duct. The annular air duct is arranged at the conical bottom of the base barrel corresponding to the rotation seat. The connection position of the annular air duct and the base barrel wall is provided with an annular air outlet. The annular air duct is connected to the fan by a connection pipe. The rotary-type conical crushing mechanism is used for crushing a photosensitive film raw material, when the photosensitive film raw material tumbles toward the conical bottom along the conical inclined plane, the raw material is cut and crushed by a cutter which is rotating at a high rate, and when the raw material falls on the conical ground, the raw material is blown by the fan to return to the conical top, then falls again and then is repeatedly cut and crushed. The array-type PCB photosensitive film crushing device has a simple structure.
Description
Technical field
The present invention relates to a kind of array PCB light-sensitive surface reducing mechanism, belong to a kind of light-sensitive surface material disintegrating mechanism.
Background technology
The change of the development of modern project technology and new material industry needs many raw materials in powder state and goods, pulverizer is the main powder manufacturing apparatus obtaining fine powder body, particularly nowadays Considering Environmental and resource reutilization, the finished product of a lot of industrial products can be recycled into raw material and use after use, the production cost of company can be improved, the waste material of light-sensitive surface after producing can be recycled, at present, the pulverizer used utilizes moving knife and stationary knife mutually to cut, realize moving knife and stationary knife cuts mutually, thus pulverizing light-sensitive surface, spacing between moving knife and stationary knife is 0.2mm, operating environment is all at normal temperatures, its shortcoming is:
1. pulverized particles is comparatively large, affects production efficiency and the quality of the utilization of raw material secondary;
2. equipment cooling poor performance, too high in crushing process shaft temperature, make light-sensitive surface easily sticky glutinous, the efficiency that impact is pulverized and time;
3. add the live load of cutting tool, thus add artificial maintenance frequency, shorten the service life of cutting tool, increase cost.
Summary of the invention
The technical problem to be solved in the present invention is: overcome the technical problem that in prior art, cutter crush efficiency is not high, provides a kind of array PCB light-sensitive surface reducing mechanism.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of array PCB light-sensitive surface reducing mechanism, comprises end bucket, disintegrating mechanism and Blast mechanism;
Described disintegrating mechanism comprises conical rotation seat, and the tapered slope of described rotation seat is provided with the Disintegrating knife of some annulars, the annular axis of described Disintegrating knife and the axis coaxle of rotation seat;
Described Blast mechanism comprises blower fan and air loop duct, described air loop duct is arranged on the taper basal surface position of the corresponding rotation seat of end bucket, described air loop duct end bucket wall link position is provided with an annular air outlet, described air loop duct is connected with blower fan by a tube connector.
As further innovation of the present invention, the blade of described Disintegrating knife is zigzag.
As further innovation of the present invention, bucket of the described end adopts elastic metallic to make.
The invention has the beneficial effects as follows:
1, the present invention carries out the pulverizing of light-sensitive surface raw material by a revolving taper disintegrating mechanism, raw material is while tumbling along conical inclined surface towards conical lower section, by the cutter cutting and grinding of High Rotation Speed, when raw material drops to taper ground, blown by blower fan, come back to conical top, again fall, repeatedly carry out the cutting and grinding of raw material, structure is simple, require low to cutter sharpness, manufacturing cost and maintenance cost can be effectively reduced.
2, jagged crushing knife can improve specific breakage rate to raw material and crushing effect, uses general electric saw sander just can polish, and makes polishing also simpler and easy.
3, the end of the present invention bucket adopts elastomeric material, can rebound on disintegrating mechanism by being beaten by blade the raw material flown, and improves the speed pulverized.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is lateral sectional view of the present invention.
Detailed description of the invention
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present invention are described in a schematic way, and therefore it only shows the formation relevant with the present invention.
As shown in Figure 1, a kind of array PCB light-sensitive surface reducing mechanism, comprises end bucket 1, disintegrating mechanism and Blast mechanism;
Described disintegrating mechanism comprises conical rotation seat, and the tapered slope of described rotation seat is provided with the Disintegrating knife 3 of some annulars, the annular axis of described Disintegrating knife 3 and the axis coaxle of rotation seat;
Described Blast mechanism comprises blower fan and air loop duct 5, described air loop duct 5 is arranged on the taper basal surface position of the corresponding rotation seat of end bucket 1, described air loop duct 5 end bucket 1 wall link position is provided with an annular air outlet, described air loop duct 5 is connected with blower fan by a tube connector;
The blade of described Disintegrating knife 3 is zigzag; Bucket of the described end 1 adopts elastic metallic to make;
During use, the turning cylinder 4 of the bottom of rotation seat and motor is coaxially fixed, the pulverizing of light-sensitive surface raw material is carried out by a revolving taper disintegrating mechanism, raw material is while tumbling along conical inclined surface towards conical lower section, by the cutter cutting and grinding of High Rotation Speed, when raw material drops to taper ground, blown by blower fan, come back to conical top, again fall, repeatedly carry out the cutting and grinding of raw material, structure is simple, require low to cutter sharpness, manufacturing cost and maintenance cost can be effectively reduced;
Jagged crushing knife can improve specific breakage rate to raw material and crushing effect, uses general electric saw sander just can polish, and makes polishing also simpler and easy; End bucket 1 adopts elastomeric material, during pulverizing, can rebound on disintegrating mechanism by being beaten by blade the raw material flown, and improves the speed pulverized.
With above-mentioned according to desirable embodiment of the present invention for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this invention technological thought, can carry out various change and amendment completely.The technical scope of this invention is not limited to the content on description, must determine its technical scope according to right.
Claims (3)
1. an array PCB light-sensitive surface reducing mechanism, is characterized in that: comprise end bucket, disintegrating mechanism and Blast mechanism;
Described disintegrating mechanism comprises conical rotation seat, and the tapered slope of described rotation seat is provided with the Disintegrating knife of some annulars, the annular axis of described Disintegrating knife and the axis coaxle of rotation seat;
Described Blast mechanism comprises blower fan and air loop duct, described air loop duct is arranged on the taper basal surface position of the corresponding rotation seat of end bucket, described air loop duct end bucket wall link position is provided with an annular air outlet, described air loop duct is connected with blower fan by a tube connector.
2. a kind of array PCB light-sensitive surface reducing mechanism as claimed in claim 1, is characterized in that: the blade of described Disintegrating knife is zigzag.
3. a kind of array PCB light-sensitive surface reducing mechanism as claimed in claim 1, is characterized in that: bucket of the described end adopts elastic metallic to make.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410700259.7A CN104492563A (en) | 2014-11-28 | 2014-11-28 | Array-type PCB photosensitive film crushing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410700259.7A CN104492563A (en) | 2014-11-28 | 2014-11-28 | Array-type PCB photosensitive film crushing device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104492563A true CN104492563A (en) | 2015-04-08 |
Family
ID=52934065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410700259.7A Pending CN104492563A (en) | 2014-11-28 | 2014-11-28 | Array-type PCB photosensitive film crushing device |
Country Status (1)
Country | Link |
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CN (1) | CN104492563A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106393499A (en) * | 2016-09-23 | 2017-02-15 | 东莞市联洲知识产权运营管理有限公司 | Safety film feeding device with smashing structure |
CN106426657A (en) * | 2016-09-23 | 2017-02-22 | 东莞市联洲知识产权运营管理有限公司 | Feeding device on protection film pasting production device |
CN107029843A (en) * | 2017-06-02 | 2017-08-11 | 林华 | Gardens impurity reducing mechanism |
-
2014
- 2014-11-28 CN CN201410700259.7A patent/CN104492563A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106393499A (en) * | 2016-09-23 | 2017-02-15 | 东莞市联洲知识产权运营管理有限公司 | Safety film feeding device with smashing structure |
CN106426657A (en) * | 2016-09-23 | 2017-02-22 | 东莞市联洲知识产权运营管理有限公司 | Feeding device on protection film pasting production device |
CN106393499B (en) * | 2016-09-23 | 2018-08-24 | 蒋加顺 | A kind of band crushes the safety diaphragm feeding equipment of structure |
CN107029843A (en) * | 2017-06-02 | 2017-08-11 | 林华 | Gardens impurity reducing mechanism |
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C06 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150408 |
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WD01 | Invention patent application deemed withdrawn after publication |