CN104486903B - A kind of high current firm flexible printed board - Google Patents

A kind of high current firm flexible printed board Download PDF

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Publication number
CN104486903B
CN104486903B CN201410756677.8A CN201410756677A CN104486903B CN 104486903 B CN104486903 B CN 104486903B CN 201410756677 A CN201410756677 A CN 201410756677A CN 104486903 B CN104486903 B CN 104486903B
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China
Prior art keywords
flexible
region
copper
rigid
foil layer
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CN201410756677.8A
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Chinese (zh)
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CN104486903A (en
Inventor
刘建斌
杨秀涛
张中前
马亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Institute of Electronic System Engineering
Guizhou Space Appliance Co Ltd
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Guizhou Space Appliance Co Ltd
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Priority to CN201410756677.8A priority Critical patent/CN104486903B/en
Publication of CN104486903A publication Critical patent/CN104486903A/en
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Publication of CN104486903B publication Critical patent/CN104486903B/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention provides a kind of high current firm flexible printed board, including flexible layers and rigid layer, the rigid layer is bonded in the both ends for the flexible printed board upper and lower sides being made of flexible layers, forms two rigid regions, and the part between two rigid region is flexible region；The copper foil layer of the inside of the flexible region, flexible region and rigid region calmodulin binding domain CaM is copper mesh, and the copper foil layer of the rigid region is real copper A.The copper foil layer of the inside of flexible region of the present invention, flexible region and rigid region calmodulin binding domain CaM is copper mesh, and common process acquisition can be used, it is easy to process, and can increase the flexibility of flexible region using copper mesh；The copper foil layer of rigid region is real copper A, and the copper foil layer at flexible region edge is real copper B；Flexible region edge reality copper B can increase the tear resistance of flex region, increase the reliability of product.

Description

A kind of high current firm flexible printed board
Technical field
The present invention relates to flexible printed board technical fields, and in particular to a kind of high current firm flexible printed board.
Background technology
Flexible printed board have the characteristics that it is light-weight, flexible, occupy little space, be easy for installation, reliability it is high, extensively Applied to smart electronics product, military project and space industry, medical instruments field.
Printed conductor overcurrent capability and printed conductor width, printed conductor cross section and temperature liter etc. have direct relation, electricity Printed conductor needed for stream is bigger is wider.For super-high-current, the printed wiring layer generally use large area of printed board applies the side of copper Formula, but directly apply real copper in flexible region large area, then flexible region bending performance can be caused to be deteriorated, repeatedly bending part after bending There is the trace of deformation in position.
The method of traditional super-high-current is combined to complete with conducting wire for firm flexible printed board, the printed wiring layer of flexible region For too little current, the printed wiring layer and wire interconnection of rigid region are used for super-high-current.This mode shortcoming is to increase Product installation space, conducting wire both ends are subject to external force to pull the risk for coming off, being broken.
The content of the invention
In order to solve the above technical problems, the present invention provides a kind of high current firm flexible printed board, the rigid-flexible printings of the high current Plate can with super-high-current, installation space is small, good bending property and reliability are high.
The present invention is achieved by the following technical programs.
A kind of high current firm flexible printed board provided by the invention, including flexible layers and rigid layer, the rigid layer is bonded in By the both ends for the flexible printed board upper and lower sides that flexible layers are formed, two rigid regions are formed, the portion between two rigid region It is divided into flexible region；The copper foil layer of the inside of the flexible region, flexible region and rigid region calmodulin binding domain CaM is copper mesh, described The copper foil layer of rigid region is real copper A.
The copper foil layer at the flexible region edge is real copper B.
The copper foil layer of the flexible layers is same source or not homologous.
The copper foil layer of the flexible layers is one or more layers.
Copper foil layer on the flexible region and rigid region is same layer or different layers.
At least provided with two vias on the copper foil layer of the flexible layers.
The reality copper A is apart from printed board edge >=0.3mm.
The reality copper B is apart from printed board edge >=0.3mm.
Width >=0.5mm of the reality copper B.
Line footpath >=10mil of the copper mesh.
The beneficial effects of the present invention are：The copper foil of the inside of flexible region, flexible region and rigid region calmodulin binding domain CaM Layer is copper mesh, and common process acquisition can be used, it is easy to process, and can increase the flexibility of flexible region using copper mesh；Just Property region copper foil layer be real copper A, the copper foil layer at flexible region edge is real copper B；Flexible region edge reality copper B can increase flexibility The tear resistance in area increases the reliability of product.
Description of the drawings
Fig. 1 is the structure diagram of the present invention；
Fig. 2 is that copper foil layer is the structure diagram of the flexible layers in same source in Fig. 1；
Fig. 3 is the structure diagram that copper foil layer is not homologous flexible layers in Fig. 1；
In figure：1- rigid regions, 2- flexible regions, 21- rigid layers, 22- flexible layers, 221- reality copper A, 222- vias, 223- reality copper B, 224- copper mesh.
Specific embodiment
Be described further below technical scheme, but claimed scope be not limited to it is described.
Such as a kind of Fig. 1~high current firm flexible printed board shown in Fig. 2, including flexible layers 22 and rigid layer 21, the rigidity Layer 21 is bonded in the both ends for the flexible printed board upper and lower sides being made of flexible layers 22, forms two rigid regions 1, two rigidity Part between region 1 is flexible region 2；1 calmodulin binding domain CaM of inside, flexible region 2 and rigid region of the flexible region 2 Copper foil layer is copper mesh 224, and the copper foil layer of the rigid region 1 is real copper A221；The copper foil layer at 2 edge of flexible region is real Copper B223.
The copper foil layer of the flexible layers 22 is same source or not homologous.Possess two sources as shown in Figure 3, i.e., real copper A221 quilts The flexible layers of two parts of 221a and 221b are divided into, interval >=0.3mm between 221a and 221b.
The copper foil layer of the flexible layers 22 is one or more layers.Copper foil layer on the flexible region 2 and rigid region 1 is Same layer or different layers.At least provided with two vias 222 on the copper foil layer of the flexible layers 22.
The reality copper A221 apart from printed board edge >=0.3mm, the reality copper B223 apart from printed board edge >=0.3mm, Width >=the 0.5mm, line footpath >=10mil of the copper mesh 224 of the reality copper B223.
Routine can be used for copper mesh 224 in the copper foil layer of the inside of flexible region, flexible region and rigid region calmodulin binding domain CaM Technique obtains, it is easy to process, and can increase the flexibility of flexible region 2, flexible region edge reality copper B223 using copper mesh The tear resistance of flex region can be increased, increase the reliability of product.
The present invention not only solves the method for traditional super-high-current and is combined to complete with conducting wire for firm flexible printed board, Yi Jichuan System large area applies the drawbacks of copper strips comes, and increases the flexibility of the rigid-flexible land of product, improves the reliability of product.

Claims (5)

1. a kind of high current firm flexible printed board, including flexible layers (22) and rigid layer (21), the rigid layer (21) be bonded in by The both ends for the flexible printed board upper and lower sides that flexible layers (22) are formed form two rigid regions (1), two rigid region (1) Between part be flexible region (2), it is characterised in that：Inside, flexible region (2) and the rigid region of the flexible region (2) The copper foil layer of domain (1) calmodulin binding domain CaM is copper mesh (224), and the copper foil layer of the rigid region (1) is reality copper A (221)；The flexibility The copper foil layer at region (2) edge is reality copper B (223)；
The copper foil layer of the flexible layers (22) is same source or not homologous；
The copper foil layer of the flexible layers (22) is one or more layers；
Copper foil layer on the flexible region (2) and rigid region (1) is same layer or different layers；
At least provided with two vias (222) on the copper foil layer of the flexible layers (22).
2. high current firm flexible printed board as described in claim 1, it is characterised in that：Reality copper A (221) the distance printing edges of boards Edge >=0.3mm.
3. high current firm flexible printed board as described in claim 1, it is characterised in that：Reality copper B (223) the distance printing edges of boards Edge >=0.3mm.
4. high current firm flexible printed board as described in claim 1, it is characterised in that：The width of the reality copper B (223) >= 0.5mm。
5. high current firm flexible printed board as described in claim 1, it is characterised in that：The line footpath of the copper mesh (224) >= 10mil。
CN201410756677.8A 2014-12-10 2014-12-10 A kind of high current firm flexible printed board Active CN104486903B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410756677.8A CN104486903B (en) 2014-12-10 2014-12-10 A kind of high current firm flexible printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410756677.8A CN104486903B (en) 2014-12-10 2014-12-10 A kind of high current firm flexible printed board

Publications (2)

Publication Number Publication Date
CN104486903A CN104486903A (en) 2015-04-01
CN104486903B true CN104486903B (en) 2018-06-05

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105682340B (en) * 2016-02-25 2018-11-27 广东欧珀移动通信有限公司 The mobile terminal of Rigid Flex and the application Rigid Flex
CN209572202U (en) * 2018-10-31 2019-11-01 奥特斯(中国)有限公司 Component load-bearing part semi-flexible

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101894626A (en) * 2009-05-19 2010-11-24 苑顺法 Hollow cable
CN103648240A (en) * 2013-12-19 2014-03-19 博敏电子股份有限公司 Method for manufacturing symmetrical rigid-flexible printed circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03283484A (en) * 1990-03-30 1991-12-13 Furukawa Electric Co Ltd:The Large current circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101894626A (en) * 2009-05-19 2010-11-24 苑顺法 Hollow cable
CN103648240A (en) * 2013-12-19 2014-03-19 博敏电子股份有限公司 Method for manufacturing symmetrical rigid-flexible printed circuit board

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Effective date of registration: 20190115

Address after: 550009 Guiyang Economic and Technological Development Zone, Guizhou Province

Co-patentee after: Beijing Electronic Engineering General Research Institute

Patentee after: Guizhou Space Electric Appliance Co., Ltd.

Address before: 550009 Guiyang Economic and Technological Development Zone, Guizhou Province

Patentee before: Guizhou Space Electric Appliance Co., Ltd.