CN104480503A - Pyrophosphate system brass-plated tin alloy plating liquid and electroplating process - Google Patents
Pyrophosphate system brass-plated tin alloy plating liquid and electroplating process Download PDFInfo
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- CN104480503A CN104480503A CN201410715313.5A CN201410715313A CN104480503A CN 104480503 A CN104480503 A CN 104480503A CN 201410715313 A CN201410715313 A CN 201410715313A CN 104480503 A CN104480503 A CN 104480503A
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- plating
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- pyrophosphate
- tin alloy
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a pyrophosphate system brass-plated tin alloy plating liquid and an electroplating process. The pyrophosphate system brass-plated tin alloy plating liquid is characterized by comprising the following components: 240-300g/L of pyrophosphate, 20-26g/L of a copper salt, 1.4-2.0g/L of a tin salt and 0.8-1.2mL/L of an additive. The plating liquid disclosed by the invention is high in stability, wide in working current density linear range, fine and compact in plated layer crystal and good in binding force.
Description
Technical field
The present invention relates to basic plating brass tin technical field, relate to a kind of pyrophosphate salt system brass plating tin alloy plating solution and electroplating technology more specifically.
Background technology
The traditional technology of electroplating copper tin alloy is hydride systems or adopts ventilation breather system.Electroplating copper tin alloy often adopts high cyanogen, low cyanogen and cyanide-free plating bath.Cyanide copper tin alloy technics comparing is ripe, and solution dispersibility is good, and Coating composition and color and luster easily control, but toxicity is large, seriously polluted.Along with China is to the requirement of cleaner production, the research without cyanogen gunmetal electroplating technology is more and more received to the concern of people.The most frequently used is replace poisonous prussiate by pyrophosphate salt-stannate system, and this bath stability is fine, and solution is weakly alkaline.But it also has certain shortcoming, as plating solution is easily aging, current density range is narrower, the problem such as oxidizable one-tenth tetravalent tin of Bivalent Tin in plating solution.From the seventies in last century so far, under the effort of at home and abroad electroplating industry worker, had been found that the gunmetal electroplating technology of multiple solution system.Wherein tetra-sodium system is simple because of its solution composition, easily to safeguard, coating performance is excellent etc. that advantage is widely applied in electroplating copper tin alloy technique.But compared with electroplating with prussiate, it is strong not that non-cyanide copper electroplating tin alloy plating solution still has solution system complexing, the shortcomings such as crystallization is careful not.Therefore, a lot of area for improvement is also had without the plating of cyanogen gunmetal.
Summary of the invention
The one composition that object of the present invention is exactly deficiency in order to solve prior art and provides is simple, and stability is high, and working current density linearity range is wide, and coating crystallization is closely careful, the pyrophosphate method of electro-plating brass tin alloy electric plating liquid that bonding force is good.
Another object of the present invention is to provide a kind of electroplating technology adopting pyrophosphate method of electro-plating brass tin alloy electric plating liquid.
The present invention adopts following technical solution to realize above-mentioned purpose: a kind of pyrophosphate method of electro-plating brass tin alloy electric plating liquid, it is characterized in that, its recipe ingredient comprises pyrophosphate salt 240g/L-300g/L, mantoquita 20-26g/L, pink salt 1.4-2.0g/L, additive 0.8-1.2mL/L.
Further illustrating as such scheme, the preferred alkaline zinc-plating additive of described additive.
The working temperature of described plating solution is 25-30 DEG C; Working ph values 8.5-9.0, use phosphoric acid, potassium hydroxide or sodium hydroxide regulate.
Adopt an electroplating technology for pyrophosphate method of electro-plating brass tin alloy electric plating liquid, it is characterized in that, its processing step is as follows:
A, take 240-300g/L pyrophosphate salt and divide equally in two beakers, add a small amount of distilled water, be stirred to agitator and dissolve completely; In two beakers, add mantoquita 20-26g/L and pink salt 1.4-2.0g/L solid respectively again, rapid stirring is until the solution of two beakers becomes clarification; Finally pour in 1L beaker by the mixing of the solution of two beakers, under agitation, with the slow neutralization solution of phosphoric acid solution, until pH reaches 8.5-9.0, placement grade in a moment plating solution uses pure water constant volume after becoming mazarine clarification;
B, pipette 0.8mL additive with transfer pipet and add in above-mentioned solution, stir a moment with agitator, stand-by.
C, to measure the obtained plating solution of step b with graduated cylinder in the groove of Hull, take phosphor-copper as anode, the latten(-tin) after sanding and polishing is negative electrode, electric current is 0.4-0.6A, aeration-agitation, plating 4-7min obtains bright golden yellow cu-sn alloy coating, and this plating solution cathode current density scope is 0.34-2.25A/cm
2.
Described processing step c replaces with following steps: measure the obtained plating solution of step b in square groove with graduated cylinder, take phosphor-copper as anode, latten(-tin) after sanding and polishing is negative electrode, electric current is 0.4-0.6A, aeration-agitation, plating 35-45min obtain bright golden yellow cu-sn alloy coating, the latten(-tin) after plating being terminated, with water rinse put into passivating solution passivation in a moment clean dry up.
The beneficial effect that the present invention adopts above-mentioned technical solution to reach is:
1, the specially designed formula that the present invention adopts prepares pyrophosphate salt system bronze (copper-tin alloy) electroplating plating solution, and can obtain bright golden yellow cu-sn alloy coating, this coating crystallization is closely careful, and thickness of coating can reach 8-10 μm.
2, gained solution of the present invention is not containing prussiate, product environmental protection; Raw materials usedly be easy to get, cost is low.
3, plating solution working current density linearity range provided by the invention is wide, and coating morphology is good.
4, plating solution provided by the invention is applied widely, and binding force of cladding material is good, and corrosion resistance nature is strong.
Accompanying drawing explanation
Fig. 1 is the electron scanning micrograph of embodiment 1 gained test piece coating;
Fig. 2 is the energy spectrogram of Fig. 1 corresponding zone;
Fig. 3 is that the present invention electroplates the metallurgical microscopic obtaining gunmetal.
Embodiment
The present invention is a kind of pyrophosphate salt system brass-plating tin alloy plating solution, and its component comprises pyrophosphate salt 240g/L-300g/L, mantoquita 20-26g/L, pink salt 1.4-2.0g/L, additive 0.8-1.2mL/L; The present invention, by preferred a kind of alkaline zinc plating additive, obtains current density linearity range wide, and bonding force is good, the golden yellow coating of the light that corrosion resistance nature is strong.
Plating solution of the present invention, its working temperature is 25-30 DEG C; Working ph values 8.5-9.0, use phosphoric acid, potassium hydroxide or sodium hydroxide regulate.
Embodiment 1
The present embodiment uses plating solution of the present invention to electroplate latten(-tin), and its operating process is as follows:
1,260g/L K is taken
4p
2o
73H
2o divides equally in two beakers, adds a small amount of distilled water, by magnetic stirrer to dissolving completely; Cu is added respectively again in two beakers
2p
2o
73H
2o and Sn
2p
2o
7solid, rapid stirring is until the solution of two beakers becomes clarification; Finally pour in 1L beaker by the mixing of the solution of two beakers, under agitation, with the slow neutralization solution of phosphoric acid solution, until pH reaches 8.5-9.0, placement grade in a moment plating solution uses pure water constant volume after becoming mazarine clarification;
2, pipetting 0.8mL additive with 1mL transfer pipet adds in above-mentioned solution, with magnetic stirrer a moment, stand-by;
3, measuring plating solution to volume obtained in step 2 with 250mL graduated cylinder is in the groove of 267mL Hull, take phosphor-copper as anode, latten(-tin) after sanding and polishing is negative electrode, electric current is 0.5A, aeration-agitation, plating 5min obtains bright golden yellow cu-sn alloy coating, and this plating solution cathode current density scope is 0.34-2.25A/cm
2.
Embodiment 2
The difference of the present embodiment and embodiment 1 is, step 3 replaces with: measuring plating solution in 2 with 250mL graduated cylinder, in 500mL square groove, take phosphor-copper as anode, latten(-tin) after sanding and polishing is negative electrode, electric current is 0.5A, aeration-agitation, and plating 40min obtains bright golden yellow cu-sn alloy coating.Test piece after plating is terminated, with water rinse put into passivating solution passivation in a moment clean dry up.Use its surface topography of JSM-6510 sem observation, and test its constituent content with the energy spectrometer of subsidiary INCA X-ACT.Electron scanning micrograph is shown in Fig. 1, and its multiple is 1000 times.In energy spectrometer test, test zone is shown in Fig. 2, and the sample that energy spectrometer analysis obtains elementary composition (weight) is: Cu 87.77%, Sn 12.23%.Fig. 3 is the microstructure figure of 200 times.
Embodiment 3
The present embodiment uses plating solution of the present invention to electroplate latten(-tin), and its operating process is as follows:
1,250g/L K is taken
4p
2o
73H
2o divides equally in two beakers, adds a small amount of distilled water, by magnetic stirrer to dissolving completely; Cu is added respectively again in two beakers
2p
2o
73H
2o and Sn
2p
2o
7solid, rapid stirring is until the solution of two beakers becomes clarification; Finally pour in 1L beaker by the mixing of the solution of two beakers, under agitation, with the slow neutralization solution of phosphoric acid solution, until pH reaches 8.5-9.0, placement grade in a moment plating solution uses pure water constant volume after becoming mazarine clarification;
2, pipetting 0.8mL additive with 1mL transfer pipet adds in above-mentioned solution, with magnetic stirrer a moment, stand-by;
3, measuring plating solution to volume obtained in step 2 with 250mL graduated cylinder is in the groove of 267mL Hull, take phosphor-copper as anode, latten(-tin) after sanding and polishing is negative electrode, electric current is 0.5A, aeration-agitation, plating 7min obtains bright golden yellow cu-sn alloy coating, and this plating solution cathode current density scope is 0.34-2.25A/cm
2.
Above-described is only the preferred embodiment of the present invention, it should be pointed out that for the person of ordinary skill of the art, and without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (5)
1. a pyrophosphate method of electro-plating brass tin alloy electric plating liquid, is characterized in that, its recipe ingredient comprises pyrophosphate salt 240g/L-300g/L, mantoquita 20-26g/L, pink salt 1.4-2.0g/L, additive 0.8-1.2mL/L.
2. a kind of pyrophosphate method of electro-plating brass tin alloy electric plating liquid according to claim 1, is characterized in that, the preferred alkaline zinc-plating additive of described additive.
3. a kind of pyrophosphate method of electro-plating brass tin alloy electric plating liquid according to claim 1, it is characterized in that, the working temperature of described plating solution is 25-30 DEG C; Working ph values 8.5-9.0, use phosphoric acid, potassium hydroxide or sodium hydroxide regulate.
4. adopt an electroplating technology for the pyrophosphate method of electro-plating brass tin alloy electric plating liquid as described in claim 1-3 any one, it is characterized in that, its processing step is as follows:
A, take 240-300g/L pyrophosphate salt and divide equally in two beakers, add a small amount of distilled water, be stirred to agitator and dissolve completely; In two beakers, add mantoquita 20-26g/L and pink salt 1.4-2.0g/L solid respectively again, rapid stirring is until the solution of two beakers becomes clarification; Finally pour in 1L beaker by the mixing of the solution of two beakers, under agitation, with the slow neutralization solution of phosphoric acid solution, until pH reaches 8.5-9.0, placement grade in a moment plating solution uses pure water constant volume after becoming mazarine clarification;
B, pipette 0.8mL additive with transfer pipet and add in above-mentioned solution, stir a moment with agitator, stand-by.
C, to measure the obtained plating solution of step b with graduated cylinder in the groove of Hull, take phosphor-copper as anode, the latten(-tin) after sanding and polishing is negative electrode, electric current is 0.4-0.6A, aeration-agitation, plating 4-7min obtains bright golden yellow cu-sn alloy coating, and this plating solution cathode current density scope is 0.34-2.25A/cm
2.
5. the electroplating technology of pyrophosphate method of electro-plating brass tin alloy electric plating liquid according to claim 4, it is characterized in that, described processing step c replaces with following steps: measure the obtained plating solution of step b in square groove with graduated cylinder, be anode with phosphor-copper, the latten(-tin) after sanding and polishing is negative electrode, and electric current is 0.4-0.6A, aeration-agitation, plating 35-45min obtain bright golden yellow cu-sn alloy coating, the latten(-tin) after plating being terminated, with water rinse put into passivating solution passivation in a moment clean dry up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715313.5A CN104480503A (en) | 2014-11-28 | 2014-11-28 | Pyrophosphate system brass-plated tin alloy plating liquid and electroplating process |
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| CN201410715313.5A CN104480503A (en) | 2014-11-28 | 2014-11-28 | Pyrophosphate system brass-plated tin alloy plating liquid and electroplating process |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668359A (en) * | 2012-09-06 | 2014-03-26 | 上海造币有限公司 | Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof |
-
2014
- 2014-11-28 CN CN201410715313.5A patent/CN104480503A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668359A (en) * | 2012-09-06 | 2014-03-26 | 上海造币有限公司 | Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof |
Non-Patent Citations (3)
| Title |
|---|
| 张琪: "焦磷酸盐溶液体系低锡铜—锡合金电键工艺", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 * |
| 张琪等: "添加剂对无氰电镀铜–锡合金(低锡)镀层性能的影响", 《电镀与涂饰》 * |
| 赵洋等: "添加剂对无氰电镀白铜锡工艺的影响", 《电镀与涂饰》 * |
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