CN104476896A - 一种用于rfid标签倒封装的热压头装置 - Google Patents
一种用于rfid标签倒封装的热压头装置 Download PDFInfo
- Publication number
- CN104476896A CN104476896A CN201410578290.8A CN201410578290A CN104476896A CN 104476896 A CN104476896 A CN 104476896A CN 201410578290 A CN201410578290 A CN 201410578290A CN 104476896 A CN104476896 A CN 104476896A
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- hot
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- 238000007731 hot pressing Methods 0.000 title abstract description 12
- 238000005538 encapsulation Methods 0.000 title abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000010445 mica Substances 0.000 claims abstract description 8
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 8
- 230000008602 contraction Effects 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 16
- 241001656951 Protheca Species 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 208000010727 head pressing Diseases 0.000 abstract 1
- 238000010030 laminating Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 230000008676 import Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Induction Heating (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410578290.8A CN104476896B (zh) | 2014-10-24 | 2014-10-24 | 一种用于rfid标签倒封装的热压头装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410578290.8A CN104476896B (zh) | 2014-10-24 | 2014-10-24 | 一种用于rfid标签倒封装的热压头装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104476896A true CN104476896A (zh) | 2015-04-01 |
CN104476896B CN104476896B (zh) | 2016-06-29 |
Family
ID=52751563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410578290.8A Active CN104476896B (zh) | 2014-10-24 | 2014-10-24 | 一种用于rfid标签倒封装的热压头装置 |
Country Status (1)
Country | Link |
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CN (1) | CN104476896B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105742217A (zh) * | 2016-04-19 | 2016-07-06 | 刘宁 | 一种电子标签封装热压机构 |
CN112884112A (zh) * | 2021-03-19 | 2021-06-01 | 德龙信息技术(苏州)有限公司 | 一种用于rfid标签倒封装的热压结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201437284U (zh) * | 2009-07-14 | 2010-04-14 | 深圳才纳半导体设备有限公司 | 电子标签固化压力传导装置 |
CN101973011A (zh) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | 应用在电子标签倒扣封装设备上的固晶压头 |
CN202225442U (zh) * | 2011-09-19 | 2012-05-23 | 广东宝丽华服装有限公司 | Rfid标签热固化用热压头 |
CN102903648A (zh) * | 2012-08-28 | 2013-01-30 | 长春光华微电子设备工程中心有限公司 | 电子标签倒扣封装设备固晶压头 |
-
2014
- 2014-10-24 CN CN201410578290.8A patent/CN104476896B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201437284U (zh) * | 2009-07-14 | 2010-04-14 | 深圳才纳半导体设备有限公司 | 电子标签固化压力传导装置 |
CN101973011A (zh) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | 应用在电子标签倒扣封装设备上的固晶压头 |
CN202225442U (zh) * | 2011-09-19 | 2012-05-23 | 广东宝丽华服装有限公司 | Rfid标签热固化用热压头 |
CN102903648A (zh) * | 2012-08-28 | 2013-01-30 | 长春光华微电子设备工程中心有限公司 | 电子标签倒扣封装设备固晶压头 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105742217A (zh) * | 2016-04-19 | 2016-07-06 | 刘宁 | 一种电子标签封装热压机构 |
CN112884112A (zh) * | 2021-03-19 | 2021-06-01 | 德龙信息技术(苏州)有限公司 | 一种用于rfid标签倒封装的热压结构 |
Also Published As
Publication number | Publication date |
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CN104476896B (zh) | 2016-06-29 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 436070 Ezhou Economic Development Zone, Gedian Economic Development Zone, West Renmin Road, No. 6 Patentee after: Hubei huaweike intelligent Limited by Share Ltd Address before: 436070 Ezhou Economic Development Zone, Gedian Economic Development Zone, West Renmin Road, No. 6 Patentee before: HUBEI HUAWEIKE INTELLIGENT TECHNOLOGY CO., LTD. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Hot-pressing head device for inverted encapsulation of RFID label Effective date of registration: 20180213 Granted publication date: 20160629 Pledgee: Ezhou SME credit Company limited by guarantee Pledgor: Hubei huaweike intelligent Limited by Share Ltd Registration number: 2018420000005 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20181228 Granted publication date: 20160629 Pledgee: Ezhou SME credit Company limited by guarantee Pledgor: Hubei huaweike intelligent Limited by Share Ltd Registration number: 2018420000005 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Hot-pressing head device for inverted encapsulation of RFID label Effective date of registration: 20190107 Granted publication date: 20160629 Pledgee: Ezhou SME credit Company limited by guarantee Pledgor: Hubei huaweike intelligent Limited by Share Ltd Registration number: 2019420000001 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200615 Granted publication date: 20160629 Pledgee: Ezhou SME credit Company limited by guarantee Pledgor: HUBEI HUAWEIKE INTELLIGENT Corp.,Ltd. Registration number: 2019420000001 |