CN104475731A - Reinforced copper/diamond composite heat dissipating material and preparation method thereof - Google Patents
Reinforced copper/diamond composite heat dissipating material and preparation method thereof Download PDFInfo
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- CN104475731A CN104475731A CN201410781364.8A CN201410781364A CN104475731A CN 104475731 A CN104475731 A CN 104475731A CN 201410781364 A CN201410781364 A CN 201410781364A CN 104475731 A CN104475731 A CN 104475731A
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Abstract
The invention provides a reinforced copper/diamond composite heat dissipating material and a preparation method thereof. The reinforced copper/diamond composite heat dissipating material is prepared from copper powder, diamond microcrystal, carbon nano tubes and chromium powder through a vacuum hot press molding process. The heat dissipating material has excellent heat-conducting property, is suitable for electronic devices with a high heat dissipating requirement, and is particularly suitable for the fields of new-generation portable electronic products, military equipment and aerospace in narrow space and with a high heat dissipating requirement.
Description
Technical field
The present invention relates to heat sink material field, particularly one strengthens copper/diamond composite heat dissipation material and preparation method thereof.
Background technology
Along with the increase of electronic device power density, caloric value increases gradually, has higher requirement to heat sink material.Heat sink material mainly contains Metal Substrate heat sink material, ceramic base insulating heat-conduction material, Polymers highly heat-conductive material etc., wherein Metal Substrate heat sink material such as copper, aluminium etc. is dissipation from electronic devices material the most common, but these heat dissipation metal materials conventional are at present difficult to the high cooling requirements meeting electronic device gradually, therefore exploitation has the Novel heat dissipation material of high thermal conductivity has been inexorable trend.
Diamond is the material that occurring in nature heat conductivility is the highest, and under normal temperature, thermal conductivity can up to 2000W/ (mK), however due to diamond on the high side and be not easy to processing, cannot separately in field of radiating.And metallic copper has excellent heat conductivility, thermal conductivity is 400W/ (mK), is therefore matrix material with copper, diamond crystallites is wild phase copper-diamond composite is the most potential heat sink material of one.In order to give full play to the excellent heat conducting performance of diamond crystallites in composite, trace carbon nanotube can be added in the composite, make that CNT in composite is network-like to be dispersed in copper diamond body material, thus microcrystalline diamond is interconnected, form the diamond phase three-dimensional channel that phonon (heat) transmits fast, thus increase substantially the heat conductivility of composite.
Published Chinese patent (publication number: CN103334039A) discloses preparation of a kind of copper base diamond composite and preparation method thereof, wherein with the diamond crystallites of metallic copper, surperficial pre-galvanized copper, trace carbon nanotube and silica flour for raw material, prepared the carbon nanotube reinforced copper-diamond NEW TYPE OF COMPOSITE heat sink material with high thermal conductivity through vacuum hot pressing formation technique.But the preparation of its carbon nanotube reinforced copper-diamond composite needs to carry out electro-coppering pretreatment to diamond crystallites, technique relative complex, production cost is higher and there is the problems such as electroplating effluent pollution.
Therefore, develop a kind of good heat conductivity, technique is simple, cost is low heat sink material become problem demanding prompt solution in the industry.
Summary of the invention
For above problem, the object of the invention be to provide a kind of there is excellent heat conductivility and technique simple, be easy to control, repeatable strong, pollution-free, be suitable for carbon nanotube reinforced copper/diamond NEW TYPE OF COMPOSITE heat sink material that large-scale industrial produces and preparation method thereof.
The present invention directly adopts diamond crystallites to prepare carbon nanotube reinforced copper/diamond NEW TYPE OF COMPOSITE heat sink material, and without the need to using electroplating technology to carry out the coated pretreatment of metallic copper to diamond crystallites.In order to strengthen diamond, adhesion between CNT and copper, the present invention, by adding trace chromium active element, makes it to form a carbon-coating in diamond, carbon nano tube surface, increases the interface binding power of three, thus improves the heat conductivility of composite.The concrete technology of the present invention is realized by following scheme:
A kind of enhancing copper/diamond composite heat dissipation material, described enhancing copper/diamond composite heat dissipation material is prepared by vacuum hot pressing formation technique by copper powder, diamond crystallites, CNT and chromium powder, and the mass ratio of described copper powder, diamond crystallites, CNT and chromium powder is (69 ~ 85): (10 ~ 25): (0.1 ~ 3): (1 ~ 5).
Further, the average grain diameter of copper powder of the present invention is 45 ~ 50 microns.
Further, the average grain diameter of diamond crystallites of the present invention is 70 ~ 170 microns.
Further, the average grain diameter of chromium powder of the present invention is 45 ~ 50 microns.
The present invention also provides a kind of preparation method strengthening copper/diamond composite heat dissipation material, comprises the steps:
A) copper powder reduction treatment, be placed on by copper powder with hydrogen reducing in reduction furnace, controlling reduction temperature is 300 ~ 450 DEG C, and the recovery time is 20 ~ 90 minutes, to reduce the oxygen content of copper powder;
B) by steps A) described copper powder after reduction treatment is (69 ~ 85) with diamond crystallites, CNT and chromium powder in mass ratio: (10 ~ 25): (0.1 ~ 3): the ratio of (1 ~ 5) fully mixes, prepare mix powder;
C) described mix powder loaded in graphite jig, then put into vacuum sintering funace and carry out hot pressed sintering, controlling sintering temperature is 650 ~ 1000 DEG C, and pressure is 5 ~ 40MPa, and sintering time is 0.5 ~ 3 hour;
D), after having sintered, sintering furnace is allowed to naturally cool to room temperature.
Further, the average grain diameter of copper powder of the present invention is 45 ~ 50 microns.
Further, the average grain diameter of diamond crystallites of the present invention is 70 ~ 170 microns.
Further, the average grain diameter of chromium powder of the present invention is 45 ~ 50 microns.
Compared with prior art, the present invention carries out the coated pretreatment of metallic copper without using electroplating technology to diamond crystallites, and technique simplifies greatly, and the problem of environmental pollutions such as electroless plating waste liquid, be suitable for large-scale industrial and produce.This heat dissipation composite material has excellent heat conductivility, is applicable in the higher electronic device of cooling requirements, especially at narrow space and to the field such as New Generation of Portable electronic product, military hardware, Aero-Space had higher requirements of dispelling the heat.
Specific embodiment
The invention provides and a kind ofly there is excellent heat conductivility and the simple carbon nanotube reinforced copper of technique/diamond NEW TYPE OF COMPOSITE heat sink material and preparation method thereof.Direct employing diamond crystallites prepares carbon nanotube reinforced copper/diamond NEW TYPE OF COMPOSITE heat sink material, and without the need to using electroplating technology to carry out the coated pretreatment of metallic copper to diamond crystallites.In order to strengthen diamond, adhesion between CNT and copper, by adding trace chromium active element, making it to form a carbon-coating in diamond, carbon nano tube surface, increasing the interface binding power of three, thus improve the heat conductivility of composite.
The heat conductivility of enhancing copper/diamond composite heat dissipation material prepared by the inventive method is more than 1.5 times of metallic copper, 610 ~ 640W/mK can be reached, heat conductivility is superior, can be used in the higher electronic device of cooling requirements, especially at narrow space and to the field such as New Generation of Portable electronic product, military hardware, Aero-Space had higher requirements of dispelling the heat.
The present invention is described in further detail for specific embodiment below.
Embodiment one:
First, copper powder is used hydrogen reducing in reduction furnace, and reduction temperature is 400 DEG C, and the recovery time is 30 minutes.Then, the copper powder after reduction treatment, diamond crystallites (average grain diameter 100 ~ 110 microns), CNT and chromium powder are fully mixed for the ratio of 81:15:1:3 is inserted in ball mill in mass ratio, prepares mix powder.Finally, compound is loaded in graphite jig, put into vacuum sintering funace, sintering temperature is 950 DEG C, pressing pressure is 40MPa, sintering time is 2 hours, naturally cools to room temperature afterwards with body of heater, and the thermal conductivity factor of the carbon nanotube reinforced copper prepared/diamond NEW TYPE OF COMPOSITE heat sink material is 610W/mK.Embodiment two:
First, copper powder is used hydrogen reducing in reduction furnace, and reduction temperature is 450 DEG C, and the recovery time is 30 minutes.Then, the copper powder after reduction treatment, diamond crystallites (average grain diameter 100 ~ 110 microns), CNT and chromium powder are fully mixed for the ratio of 74:20:3:3 is inserted in ball mill in mass ratio, prepares mix powder.Finally, compound is loaded in graphite jig, put into vacuum sintering funace, sintering temperature is 950 DEG C, pressing pressure is 40MPa, sintering time is 2.5 hours, naturally cools to room temperature afterwards with body of heater, and the thermal conductivity factor of the carbon nanotube reinforced copper prepared/diamond NEW TYPE OF COMPOSITE heat sink material is 620W/mK.
Embodiment three:
First, copper powder is used hydrogen reducing in reduction furnace, and reduction temperature is 350 DEG C, and the recovery time is 50 minutes.Then, the copper powder after reduction treatment, diamond crystallites (average grain diameter 150 ~ 170 microns), CNT and chromium powder are fully mixed for the ratio of 75:20:2:3 is inserted in ball mill in mass ratio, prepares mix powder.Finally, compound is loaded in graphite jig, put into vacuum sintering funace, sintering temperature is 800 DEG C, pressing pressure is 30MPa, sintering time is 2 hours, naturally cools to room temperature afterwards with body of heater, and the thermal conductivity factor of the carbon nanotube reinforced copper prepared/diamond NEW TYPE OF COMPOSITE heat sink material is 640W/mK.
The above the specific embodiment of the present invention, does not form limiting the scope of the present invention.Various other that any technical conceive according to the present invention is made change and distortion accordingly, all should be included in the protection domain of the claims in the present invention.
Claims (8)
1. one kind strengthens copper/diamond composite heat dissipation material, it is characterized in that, described enhancing copper/diamond composite heat dissipation material is prepared by vacuum hot pressing formation technique by copper powder, diamond crystallites, CNT and chromium powder, and the mass ratio of described copper powder, diamond crystallites, CNT and chromium powder is (69 ~ 85): (10 ~ 25): (0.1 ~ 3): (1 ~ 5).
2. enhancing copper/diamond composite heat dissipation material according to claim 1, is characterized in that, the average grain diameter of described copper powder is 45 ~ 50 microns.
3. enhancing copper/diamond composite heat dissipation material according to claim 1, is characterized in that, the average grain diameter of described diamond crystallites is 70 ~ 170 microns.
4. enhancing copper/diamond composite heat dissipation material according to claim 1, is characterized in that, the average grain diameter of described chromium powder is 45 ~ 50 microns.
5. strengthen a preparation method for copper/diamond composite heat dissipation material, it is characterized in that, comprise the steps:
A) copper powder reduction treatment, be placed on by copper powder with hydrogen reducing in reduction furnace, controlling reduction temperature is 300 ~ 450 DEG C, and the recovery time is 20 ~ 90 minutes, to reduce the oxygen content of copper powder;
B) by steps A) described copper powder after reduction treatment is (69 ~ 85) with diamond crystallites, CNT and chromium powder in mass ratio: (10 ~ 25): (0.1 ~ 3): the ratio of (1 ~ 5) fully mixes, prepare mix powder;
C) described mix powder loaded in graphite jig, then put into vacuum sintering funace and carry out hot pressed sintering, controlling sintering temperature is 650 ~ 1000 DEG C, and pressure is 5 ~ 40MPa, and sintering time is 0.5 ~ 3 hour;
D), after having sintered, sintering furnace is allowed to naturally cool to room temperature.
6. the preparation method of enhancing copper/diamond composite heat dissipation material according to claim 5, is characterized in that, the average grain diameter of described copper powder is 45 ~ 50 microns.
7. the preparation method of enhancing copper/diamond composite heat dissipation material according to claim 5, is characterized in that, the average grain diameter of described diamond crystallites is 70 ~ 170 microns.
8. the preparation method of enhancing copper/diamond composite heat dissipation material according to claim 5, is characterized in that, the average grain diameter of described chromium powder is 45 ~ 50 microns.
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| GB1354262A (en) * | 1970-03-30 | 1974-06-05 | Composite Sciences | Process for preparing layers of particulate fillers in a metallic matrix |
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| EP1992015A2 (en) * | 2006-03-09 | 2008-11-19 | Austrian Research Centers GmbH-ARC | Composite material and method for production thereof |
| CN101615600A (en) * | 2009-07-08 | 2009-12-30 | 中国航空工业第一集团公司北京航空材料研究院 | A kind of high-thermal conductivity electronic packaging material and preparation method thereof |
| CN101649400A (en) * | 2009-07-20 | 2010-02-17 | 温州宏丰电工合金有限公司 | Diamond reinforced metal-base composite material for electronic packaging and preparation method thereof |
| CN103334039A (en) * | 2013-07-15 | 2013-10-02 | 深圳市东维丰电子科技股份有限公司 | Copper-based nano diamond composite material and preparation method thereof |
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2014
- 2014-12-16 CN CN201410781364.8A patent/CN104475731A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1354262A (en) * | 1970-03-30 | 1974-06-05 | Composite Sciences | Process for preparing layers of particulate fillers in a metallic matrix |
| US6031285A (en) * | 1997-08-19 | 2000-02-29 | Sumitomo Electric Industries, Ltd. | Heat sink for semiconductors and manufacturing process thereof |
| EP1992015A2 (en) * | 2006-03-09 | 2008-11-19 | Austrian Research Centers GmbH-ARC | Composite material and method for production thereof |
| CN101615600A (en) * | 2009-07-08 | 2009-12-30 | 中国航空工业第一集团公司北京航空材料研究院 | A kind of high-thermal conductivity electronic packaging material and preparation method thereof |
| CN101649400A (en) * | 2009-07-20 | 2010-02-17 | 温州宏丰电工合金有限公司 | Diamond reinforced metal-base composite material for electronic packaging and preparation method thereof |
| CN103334039A (en) * | 2013-07-15 | 2013-10-02 | 深圳市东维丰电子科技股份有限公司 | Copper-based nano diamond composite material and preparation method thereof |
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Application publication date: 20150401 |