CN104467457A - 一种高压晶闸管换流阀阀塔 - Google Patents
一种高压晶闸管换流阀阀塔 Download PDFInfo
- Publication number
- CN104467457A CN104467457A CN201410510452.4A CN201410510452A CN104467457A CN 104467457 A CN104467457 A CN 104467457A CN 201410510452 A CN201410510452 A CN 201410510452A CN 104467457 A CN104467457 A CN 104467457A
- Authority
- CN
- China
- Prior art keywords
- valve
- cooling water
- tower
- module
- valve module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Rectifiers (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410510452.4A CN104467457A (zh) | 2014-09-28 | 2014-09-28 | 一种高压晶闸管换流阀阀塔 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410510452.4A CN104467457A (zh) | 2014-09-28 | 2014-09-28 | 一种高压晶闸管换流阀阀塔 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104467457A true CN104467457A (zh) | 2015-03-25 |
Family
ID=52912975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410510452.4A Pending CN104467457A (zh) | 2014-09-28 | 2014-09-28 | 一种高压晶闸管换流阀阀塔 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104467457A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110535354A (zh) * | 2018-05-25 | 2019-12-03 | 全球能源互联网研究院有限公司 | 一种紧凑型智能化换流阀 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090257212A1 (en) * | 2006-08-09 | 2009-10-15 | Honda Motor Co., | Semiconductor device |
CN102169859A (zh) * | 2011-03-21 | 2011-08-31 | 许继集团有限公司 | 一种用于高压直流输电的晶闸管换流阀阀塔 |
CN103594490A (zh) * | 2012-08-13 | 2014-02-19 | 无锡维赛半导体有限公司 | 晶闸管及晶闸管封装件 |
CN104009651A (zh) * | 2014-05-30 | 2014-08-27 | 许继电气股份有限公司 | 换流阀阀塔及使用该换流阀阀塔的阀厅 |
-
2014
- 2014-09-28 CN CN201410510452.4A patent/CN104467457A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090257212A1 (en) * | 2006-08-09 | 2009-10-15 | Honda Motor Co., | Semiconductor device |
CN102169859A (zh) * | 2011-03-21 | 2011-08-31 | 许继集团有限公司 | 一种用于高压直流输电的晶闸管换流阀阀塔 |
CN103594490A (zh) * | 2012-08-13 | 2014-02-19 | 无锡维赛半导体有限公司 | 晶闸管及晶闸管封装件 |
CN104009651A (zh) * | 2014-05-30 | 2014-08-27 | 许继电气股份有限公司 | 换流阀阀塔及使用该换流阀阀塔的阀厅 |
Non-Patent Citations (3)
Title |
---|
廖敏等: "±660kV直流输电工程换流阀结构设计", 《电力建设》 * |
李健生等: "葛上±500kV直流输电系统技术特性及其调试", 《华中电力》 * |
郭焕: "直流输电换流阀杂散电容和冲击电压分布的计算", 《中国电机工程学报》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110535354A (zh) * | 2018-05-25 | 2019-12-03 | 全球能源互联网研究院有限公司 | 一种紧凑型智能化换流阀 |
CN110535354B (zh) * | 2018-05-25 | 2020-07-24 | 全球能源互联网研究院有限公司 | 一种紧凑型智能化换流阀 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170609 Address after: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Applicant after: State Grid Corporation of China Applicant after: China-EPRI Electric Power Engineering Co., Ltd. Applicant after: Electric Power Research Institute of State Grid Shandong Electric Power Company Address before: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Applicant before: State Grid Corporation of China Applicant before: State Grid Smart Grid Institute Applicant before: China-EPRI Electric Power Engineering Co., Ltd. Applicant before: Electric Power Research Institute of State Grid Shandong Electric Power Company |
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TA01 | Transfer of patent application right | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150325 |
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RJ01 | Rejection of invention patent application after publication |