CN104465534A - Substrate with support - Google Patents
Substrate with support Download PDFInfo
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- CN104465534A CN104465534A CN201410783247.5A CN201410783247A CN104465534A CN 104465534 A CN104465534 A CN 104465534A CN 201410783247 A CN201410783247 A CN 201410783247A CN 104465534 A CN104465534 A CN 104465534A
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- substrate
- supporting plate
- supporting frame
- present
- belt
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Abstract
The invention provides a substrate with a support. The substrate comprises a substrate body and a support plate, wherein the substrate body comprises effective regions used for forming devices and an edge region located on the peripheries of the effective regions, the support plate corresponds to the edge region of the substrate body in shape and comprises an attachment surface used for being attached to the substrate body, and the support plate is fixed to the substrate body through the attachment surface in an attached mode. The substrate with the support has the advantages that the support plate is attached to the edge region of the substrate body, so the support plate plays a role in reinforcing the edge region of the substrate body, and the substrate body can be prevented from warping to some extent. The support plate is attached to the substrate and does not need to be dismantled. Compared with a support dismantling mode in the prior art, the probability that the substrate is damaged can be lowered.
Description
Technical field
The present invention relates to field of semiconductor package, be specifically related to a kind of substrate improving substrate warp and damaged belt supporting frame.
Background technology
Along with the development of integrated circuit technique, electronic product is more and more to miniaturized, intellectuality, high-performance and high reliability future development.And integrated antenna package not only directly affects the performance of integrated circuit, electronic module and even complete machine, but also govern the miniaturization of whole electronic system, low cost and reliability.Progressively reduce in integrated circuit (IC) wafer size, when integrated level improves constantly, electronics industry proposes more and more higher requirement to integrated antenna package technology.These requirements cause the thickness of base plate for packaging more and more thinner.
But the thinning meeting of substrate thickness causes occurring in encapsulation process that the factor incidence such as the probability of warpage and the easy breakage of edges of boards of substrate increases.Warpage and the damaged meeting of substrate be made troubles and risk to follow-up encapsulation process, and then affect product yield.
Summary of the invention
The problem that the present invention solves is to provide a kind of substrate of belt supporting frame, to improve substrate warp and breakage odds as far as possible.
For solving the problem, the invention provides a kind of substrate of belt supporting frame, comprising:
Substrate, described substrate comprises the effective district for the formation of device, and is positioned at the marginal zone around described effective district;
The supporting plate corresponding with described substrate edges district shape, described supporting plate comprises the binding face for fitting with substrate; Described supporting plate fits fixing by described binding face and described substrate.
Optionally, described supporting plate comprises resin material.
Optionally, described supporting plate is BT resin or epoxide resin material.
Optionally, described supporting plate is the supporting plate of resin material, or has the resin plate of Copper Foil for surface coverage, or is that resin superposes the force fit plate of pressing with Copper Foil compartment of terrain.
Optionally, the thickness range of described substrate is 65 ~ 115 microns.
Optionally, the thickness of described supporting plate is 200 ~ 400 microns.
Optionally, effective district of described substrate comprises multiple separate effectively trivial piece, the arrangement in array-like between multiple effectively trivial piece;
Described marginal zone be located at each effectively trivial piece around;
Described supporting plate has multiple openwork part corresponding to described effectively trivial piece.
Optionally, described supporting plate is the supporting plate formed by injection moulding.
Optionally, described supporting plate is the supporting plate that supporting plate material is formed through cutting or punching press.
Optionally, the binding face of described supporting plate is provided with adhesion layer, and described supporting plate is fitted by the marginal zone of described adhesion layer and described substrate.
Compared with prior art, technical scheme of the present invention has the following advantages:
Fit in the marginal zone of described supporting plate and described substrate, such supporting plate just serves the effect of reinforcing substrate edges district, and then can prevent substrate generation warpage to a certain extent.Supporting plate and substrate bonded to each other and need not remove, relative to the mode of striking in prior art, the present invention also can reduce substrate and sustain damage, produces damaged probability.
Further, the supporting plate carrying resin material can reduce the probability of substrate generation warpage further, because the heat absorption rate of resin material is less, the part that substrate contacts with supporting plate is absorbed heat relatively less, whole different base board parts by thermal difference less, such substrate is not easy, because being heated inequality, buckling deformation occurs.
Accompanying drawing explanation
Fig. 1 to Fig. 3 is the structural representation of various piece in substrate one embodiment of belt supporting frame of the present invention;
Fig. 4 to Figure 12 is the structural representation of each step in manufacture method one embodiment of the substrate of belt supporting frame of the present invention.
Embodiment
Easily there is buckling deformation in existing substrate, so can install a whole plate at the back side of substrate in prior art.But the protection of this whole plate to substrate is inadequate; or can easily cause board warp deformation to increase the weight of the deformation extent of substrate because this whole plate easily causes basal plate heated uneven; and whole plate needs to remove after a procedure, demolishing process easily causes substrate to sustain damage.
Therefore, the invention provides a kind of substrate of belt supporting frame, be the substrate structural representation in the present embodiment of described belt supporting frame with reference to figure 1, the substrate of described belt supporting frame comprises following structure:
Substrate 100, the concrete structure of described substrate 100 can in conjunction with reference to figure 2, and described substrate 100 comprises the effective district 110 for the formation of device, and is positioned at the marginal zone 120 around described effective district 110;
In the present embodiment, effective district 110 of described substrate 100 comprises some separate effectively trivial piece 10, the arrangement in array-like between described effectively trivial piece 10.Accordingly, described marginal zone 120 be located at each effectively trivial piece 10 around.
But those skilled in the art it should be understood that, in the present embodiment, the shape in effective district and division rule should set according to actual conditions, accordingly, the shape of marginal zone 120 and scope also can change along with the change in effective district 110, therefore the present invention to the shape of effectively district 110 and marginal zone 120 be not limited in any way.
In the present embodiment, the thickness range of described substrate is at 65 ~ 115 microns.Such as, thickness can be provided at the substrate 100 of 100 microns.But it should be noted that, above parameter is only one embodiment of the present of invention.The actual (real) thickness of substrate 100 should be as the criterion with the demand of actual conditions, and the present invention is not construed as limiting this.
The substrate of belt supporting frame of the present invention also comprises the supporting plate 200 corresponding with marginal zone 120 shape of described substrate 100, and the structure of described supporting plate 200 can reference diagram 3, and supporting plate 200 comprises the binding face for fitting with substrate 100; Described supporting plate 200 fits fixing by described binding face and described substrate 100.
Due in the present embodiment, effective district 110 of described substrate 100 comprises some separate effectively trivial piece 10, so described supporting plate also has multiple openwork part corresponding to described effectively trivial piece accordingly.
In the present embodiment, described supporting plate 200 comprises resin material.
The thermal conductivity of this material is lower, and caloric receptivity is few, and the heat transmission of such supporting plate 200 pairs of substrates 100 is also less, and then substrate 100 regional area can be reduced to a certain extent to be heated too much and the problem of deformation warpage occurs.
Meanwhile, resin material lighter weight and easily processing, also simplifies manufacture craft to a certain extent.
Concrete, can be the supporting plate 200 of BT resin or epoxide resin material.
Concrete, the supporting plate 200 in the present embodiment is resin superposes pressing supporting plate 200 with Copper Foil compartment of terrain.
That is, the supporting plate 200 in the present embodiment is adopt sheet-like resin and Copper Foil interval to superpose the force fit plate formed.This force fit plate structure is closer to the structure of substrate 100, because existing substrate is generally the laminated construction of semi-conducting material and metal material, force fit plate structure in the present embodiment is not only closer to the structure of substrate 100 self, and its coefficient of expansion is also more close to substrate 100, such supporting plate 200 differs less with the coefficient of expansion between substrate 100, and the probability that buckling deformation occurs because being heated inequality substrate 100 is less.
Meanwhile, the mechanical strength that sheet-like resin and Copper Foil interval superpose the force fit plate formed is higher, and such supporting plate 200 pairs of substrates 100 also have better supportive.
But the structure of the present invention to the described supporting plate 200 containing resin is not construed as limiting, and in other embodiments of the invention, described supporting plate 200 can also be the supporting plate that resin is formed, and is namely the supporting plate of resin material; Or, can also be that surface coverage has the resin plate of Copper Foil as being supporting plate 200.
In the present embodiment, the thickness of described supporting plate is at 200 ~ 400 microns.Such as, thickness can be provided to be the supporting plate 200 of 300 microns, enough support force supporting substrates 100 can be had at the supporting plate of this thickness, also be unlikely to blocked up simultaneously.
In the present embodiment, described supporting plate 200 is the supporting plate 200 that a monoblock supporting plate material is formed through cutting or punching press.But the present invention forms described supporting plate 200 to which kind of mode of employing and is not construed as limiting.In other embodiments of the invention, described supporting plate 200 also can be the supporting plate formed by injection moulding.
Continue with reference to figure 1, in the present embodiment, the binding face of described supporting plate 200 is provided with adhesion layer 220, described supporting plate 200 is fitted with the marginal zone 120 of described substrate 100 by described adhesion layer 220, that is, supporting plate 200 and the marginal zone 120 of substrate 100 are combined and then play the effect supporting fixing described substrate 100, and supporting plate 200 exposes effective district 110 of substrate 100 simultaneously, can not hinder the carrying out of follow-up encapsulation step like this.
In the present embodiment, described adhesion layer 220 can adopt UV glue.UV glue be a kind of can to the aitiogenic glueing material of the UV-irradiation of special wavelength.UV glue can be divided into two kinds according to the change of viscosity after UV-irradiation, one is that UV solidifies glue, namely living radical or cation is produced after the light trigger in material or sensitising agent absorb ultraviolet light under ultraviolet irradiation, trigger monomer is polymerized, be cross-linked and connect a chemical reaction, ultraviolet cured adhesive is made to be solid-state by liquid conversion within the several seconds, thus the body surface bonding that will be in contact with it; Another kind is UV glue is very high without viscosity during Ultraviolet radiation, and the crosslinking chemical bond after UV-irradiation in material is interrupted and causes viscosity to decline to a great extent or disappear.
Adhesion layer 220 in the present embodiment is UV solidification glue.
In addition, the present invention also provides a kind of manufacture method of substrate of belt supporting frame, and described manufacture method can improve substrate warp and breakage odds as far as possible.
Fig. 4 to Figure 12 is the structural representation of each step in manufacture method one embodiment of the substrate of belt supporting frame of the present invention.
First with reference to figure 4, be the schematic flow sheet of manufacture method one embodiment of the substrate of belt supporting frame of the present invention.The manufacture method of the substrate of described belt supporting frame comprises the following steps in the present embodiment:
S101, form substrate, described substrate comprises the effective district for the formation of device, and is positioned at the marginal zone around described effective district;
S102, forms the supporting plate corresponding with described substrate edges district shape, and described supporting plate comprises the binding face for fitting with substrate;
S103, makes the marginal zone of the binding face of supporting plate and described substrate fit fixing.
It should be noted that, the present invention is not limited in any way the sequencing between step S101 and step S102.Because provide the step of the step of substrate and formation supporting plate not conflict, can carry out simultaneously, also can successively carry out.
Below in conjunction with accompanying drawing, each step is described further.
First perform step S101, as shown in Figure 5, provide substrate 100`, described substrate 100` comprises the effective district 110` being formed with semiconductor device, and is positioned at the marginal zone 120` around described effective district 110`.
Please continue to refer to Fig. 5, in the present embodiment, effective district 110` of described substrate 100` comprises some separate effectively trivial piece 10`, the arrangement in array-like between described effectively trivial piece 10`.Accordingly, described marginal zone 120` is located at around each effectively trivial piece 10` around ground.
But those skilled in the art it should be understood that, in the present embodiment, the shape in effective district and division rule should set according to actual conditions, accordingly, the shape of marginal zone 120` and scope also can change along with the change of effective district 110`, therefore the present invention to the shape of effective district 110` and marginal zone 120` be not limited in any way.
Meanwhile, in the present embodiment, provide thickness range at the substrate of 65 ~ 115 microns; Such as, thickness can be provided at the substrate 100` of 100 microns.But it should be noted that, above parameter is only one embodiment of the present of invention.The actual (real) thickness of substrate 100` should be as the criterion with the demand of actual conditions, and the present invention is not construed as limiting this.
In conjunction with reference to figure 6 and Fig. 7, perform step S102, the supporting plate 200` (with reference to figure 7) corresponding with described substrate 100` marginal zone 120` shape is provided, described supporting plate 200` comprises the binding face for fitting with substrate 100`, in subsequent step, described supporting plate 200` is fitted by described binding face and substrate 100`.
In the present embodiment, can the supporting plate 200` of providing package resinous material.
The thermal conductivity of this material is lower, and caloric receptivity is few, and the heat transmission of such supporting plate 200` to substrate 100` is also less, and then substrate 100` regional area can be reduced to a certain extent to be heated too much and the problem of deformation warpage occurs.
Meanwhile, resin material lighter weight and easily processing, also simplifies manufacture craft to a certain extent.
Concrete, such as can adopt the supporting plate 200` of BT resin or epoxide resin material.
Concrete, can form resin superposes pressing supporting plate 200` with Copper Foil compartment of terrain in the present embodiment, that is, the supporting plate 200` in the present embodiment adopts sheet-like resin and Copper Foil interval to superpose the force fit plate formed.This force fit plate structure is closer to the structure of substrate 100`, because existing substrate is generally the laminated construction of semi-conducting material and metal material, force fit plate structure in the present embodiment is not only closer to the structure of substrate 100` self, and its coefficient of expansion is also more close to substrate 100`, such supporting plate 200` differs less with the coefficient of expansion between substrate 100`, and the probability that buckling deformation occurs because being heated inequality substrate 100` is less.
Meanwhile, the mechanical strength that sheet-like resin and Copper Foil interval superpose the force fit plate formed is higher, and such supporting plate 200` also has better supportive to substrate 100`.
But the structure of the present invention to the described supporting plate 200` containing resin is not construed as limiting, and in other embodiments of the invention, can also adopt the supporting plate that resin is formed, namely be the supporting plate of resin material; Or, surface coverage can also be adopted to have the resin plate of Copper Foil as being supporting plate 200`.
Concrete, in the present embodiment, described supporting plate 200` can be formed in the following ways:
With reference to figure 6, provide a plate-shaped carrier plate material 210`;
With reference to figure 7, remove the supporting plate material 210` corresponding to the effective district 110` of substrate 100`, remaining supporting plate material 210` is just corresponding with described substrate 100` marginal zone 120` shape, and then forms described supporting plate 200`.As mentioned before, effective district 110` in substrate 100` in the present embodiment comprises some separate effectively trivial piece 10`, therefore the supporting plate material 210` corresponding to the effective district 110` of substrate is removed in the present embodiment, to form some empty window region 201` so that exposed by effective district 110` after fitting with substrate 100` in supporting plate material 210`.
Concrete, the mode that milling cutter can be adopted to cut removes the supporting plate material 210` corresponding to the effective district of substrate.The cutting accuracy of this mode is higher, and the trimming of the empty window region 201` of formation is more neat.
But the present invention is not construed as limiting the concrete supporting plate material 210` adopting which kind of mode to remove corresponding to the effective district of substrate, in other embodiments of the invention, can also adopt the mode of punching press or laser cutting, but the present invention is not construed as limiting to this.
Meanwhile, the present invention to how forming the supporting plate 200` corresponding with described substrate 100` marginal zone 120` shape is also not construed as limiting.In other embodiments of the invention, such as, as mentioned before, when adopting resin to form described supporting plate, described corresponding with described substrate 100` marginal zone 120` shape supporting plate 200` can also be formed: first provide the supporting plate mould corresponding with described substrate edges district 120` shape by the mode of injection moulding, then, fill the supporting plate material of melting in the mold, to form described supporting plate 200`; After the described supporting plate of formation, remove described mould.
Can find out, the method for this injection moulding can form described supporting plate 200` equally.Therefore, the present invention is not construed as limiting the supporting plate material 210` how formed corresponding to the effective district 110` of substrate, specifically should determine according to actual conditions such as the structures of the material of described supporting plate, supporting plate.
In the present embodiment, provide thickness range at the supporting plate of 200 ~ 400 microns.Such as, thickness can be provided to be the supporting plate 200` of 300 microns, enough support force supporting substrate 100` can be had at the supporting plate of this thickness, also be unlikely to blocked up simultaneously.
With reference to figure 8, perform step S103, the marginal zone 120` of the binding face of supporting plate 200` and described substrate 100` is fitted fixing.
Concrete, the marginal zone 120` of the binding face of supporting plate 200` and described substrate 100` can be fitted by following steps fixing:
The binding face of described supporting plate 200` arranges adhesion layer 220`; In follow-up step of being fitted by supporting plate 200` and substrate 100`, described supporting plate 200` is fitted by the marginal zone 120` of described adhesion layer 220` and described substrate 100`
In the present embodiment, the step arranging adhesion layer 220` comprises the following steps:
Gluing on the binding face of described supporting plate 200`; The available material of glue used by gluing has multiple, can adopt UV glue in the present invention's preferred embodiment.UV glue be a kind of can to the aitiogenic glueing material of the UV-irradiation of special wavelength.UV glue can be divided into two kinds according to the change of viscosity after UV-irradiation, one is that UV solidifies glue, namely living radical or cation is produced after the light trigger in material or sensitising agent absorb ultraviolet light under ultraviolet irradiation, trigger monomer is polymerized, be cross-linked and connect a chemical reaction, ultraviolet cured adhesive is made to be solid-state by liquid conversion within the several seconds, thus the body surface bonding that will be in contact with it; Another kind is UV glue is very high without viscosity during Ultraviolet radiation, and the crosslinking chemical bond after UV-irradiation in material is interrupted and causes viscosity to decline to a great extent or disappear.
The glue adopted in the present embodiment is that UV solidifies glue.
But the present invention is not construed as limiting glue, in other embodiments of the invention, other glue such as BAC adhesive polymer polymer also may be used for forming described adhesion layer 220`.
After gluing, make described adhesive curing to form described adhesion layer 220`.
With reference to figure 9, in the present embodiment, in order to protect the adhesion layer 220` of formation, prevent described adhesion layer 220` from losing viscosity because to be exposed in production environment adhering dust or to be collided with etc., in the present embodiment, described adhesion layer 220` covers layer protecting film 230`; When supporting plate 200` and substrate 100` is fitted, more described diaphragm 230` is removed to expose described adhesion layer 220`.
After this, supporting plate 200` is made to be fitted by the marginal zone 120` of described adhesion layer 220` and described substrate 100`.With reference to Figure 10, it is the structural representation that supporting plate 200` and substrate 100` is fitted.
As mentioned before, the diaphragm 230` now in the present embodiment is removed, and supporting plate 200` is fitted by the marginal zone 120` of described adhesion layer 220` and described substrate 100`.Supporting plate 200` now can play the effect supporting fixing base 100`, prevents substrate 100` to be out of shape warpage, or sustains damage.Meanwhile, supporting plate 200` and substrate 100` is bonded to each other and need not remove, and relative to the mode of striking in prior art, the present invention also can reduce substrate and sustain damage, produces damaged probability.
With reference to Figure 11 and Figure 12, after supporting plate 200` and substrate 100` is fitted, further comprising the steps of:
According to the effectively trivial piece 10` in described substrate 100`, laminating after-poppet plate and substrate are split (please refer to the cut-off rule 11` in Fig. 7), and then by the substrate 100` containing multiple effectively trivial piece 10` together with the encapsulation unit 20` (with reference to figure 8) of supporting plate 200` segmentation in some fritters, be the carrying out of conveniently follow-up encapsulation step like this, but the present invention is not construed as limiting this step.
In addition, manufacture method of the present invention can be, but not limited to the substrate forming belt supporting frame of the present invention.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (10)
1. a substrate for belt supporting frame, is characterized in that, comprising:
Substrate, described substrate comprises the effective district for the formation of device, and is positioned at the marginal zone around described effective district;
The supporting plate corresponding with described substrate edges district shape, described supporting plate comprises the binding face for fitting with substrate; Described supporting plate fits fixing by described binding face and described substrate.
2. the substrate of belt supporting frame as claimed in claim 1, it is characterized in that, described supporting plate comprises resin material.
3. the substrate of belt supporting frame as claimed in claim 1 or 2, it is characterized in that, described supporting plate is the supporting plate of resin material, or has the resin plate of Copper Foil for surface coverage, or is that resin superposes the force fit plate of pressing with Copper Foil compartment of terrain.
4. the substrate of belt supporting frame as claimed in claim 1, it is characterized in that, described supporting plate is BT resin or epoxide resin material.
5. the substrate of belt supporting frame as claimed in claim 1, it is characterized in that, the thickness range of described substrate is 65 ~ 115 microns.
6. the substrate of belt supporting frame as claimed in claim 1, it is characterized in that, the thickness of described supporting plate is 200 ~ 400 microns.
7. the substrate of belt supporting frame as claimed in claim 1, is characterized in that, effective district of described substrate comprises multiple separate effectively trivial piece, the arrangement in array-like between multiple effectively trivial piece;
Described marginal zone be located at each effectively trivial piece around;
Described supporting plate has multiple openwork part corresponding to described effectively trivial piece.
8. the substrate of belt supporting frame as claimed in claim 1, it is characterized in that, described supporting plate is the supporting plate formed by injection moulding.
9. the substrate of belt supporting frame as claimed in claim 1, is characterized in that, described supporting plate is the supporting plate that supporting plate material is formed through cutting or punching press.
10. the substrate of belt supporting frame as claimed in claim 1, it is characterized in that, the binding face of described supporting plate is provided with adhesion layer, and described supporting plate is fitted by the marginal zone of described adhesion layer and described substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410783247.5A CN104465534A (en) | 2014-12-16 | 2014-12-16 | Substrate with support |
| US14/967,986 US20160172313A1 (en) | 2014-12-16 | 2015-12-14 | Substrate with a supporting plate and fabrication method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410783247.5A CN104465534A (en) | 2014-12-16 | 2014-12-16 | Substrate with support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104465534A true CN104465534A (en) | 2015-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410783247.5A Pending CN104465534A (en) | 2014-12-16 | 2014-12-16 | Substrate with support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465534A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1163480A (en) * | 1996-03-19 | 1997-10-29 | 松下电器产业株式会社 | Chip carrier and semiconductor device with it |
| CN102177580A (en) * | 2006-08-31 | 2011-09-07 | Ati科技无限责任公司 | Flip chip semiconductor package with encapsulant retaining structure and strip |
| CN102683296A (en) * | 2011-03-17 | 2012-09-19 | 台湾积体电路制造股份有限公司 | Reinforcement structure for flip-chip packaging |
| CN103108502A (en) * | 2011-11-14 | 2013-05-15 | 无锡江南计算技术研究所 | Method for laminating cover film in soft board |
-
2014
- 2014-12-16 CN CN201410783247.5A patent/CN104465534A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1163480A (en) * | 1996-03-19 | 1997-10-29 | 松下电器产业株式会社 | Chip carrier and semiconductor device with it |
| CN102177580A (en) * | 2006-08-31 | 2011-09-07 | Ati科技无限责任公司 | Flip chip semiconductor package with encapsulant retaining structure and strip |
| CN102683296A (en) * | 2011-03-17 | 2012-09-19 | 台湾积体电路制造股份有限公司 | Reinforcement structure for flip-chip packaging |
| CN103108502A (en) * | 2011-11-14 | 2013-05-15 | 无锡江南计算技术研究所 | Method for laminating cover film in soft board |
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Address after: Jiangsu province Nantong City Chongchuan road 226006 No. 288 Applicant after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant before: Fujitsu Microelectronics Co., Ltd., Nantong |
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Application publication date: 20150325 |