CN104464582A - Pressed connection jig for OLED panel - Google Patents
Pressed connection jig for OLED panel Download PDFInfo
- Publication number
- CN104464582A CN104464582A CN201410734662.1A CN201410734662A CN104464582A CN 104464582 A CN104464582 A CN 104464582A CN 201410734662 A CN201410734662 A CN 201410734662A CN 104464582 A CN104464582 A CN 104464582A
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- CN
- China
- Prior art keywords
- oled panel
- briquetting
- support
- pressing
- depression bar
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Abstract
The invention belongs to the technical field of OLED panel testing, and particularly relates to a pressed connection jig for an OLED panel. The pressed connection jig comprises a supporting plate, a PCB, a pressed connection device, an OLED panel containing plate and flexible circuit boards. The pressed connection device comprises a support, pressing rods and pressing blocks, wherein the middle of each pressing rod is hinged to the support, one end of each pressing rod protrudes out of one side of the support, the upper surface of the other end of each pressing rod makes contact with the bottom of a transverse shaft inside the corresponding pressing block, the pressing blocks are installed on the other side of the support and can slide up and down along the support through the pressing rods, and a pressing head is arranged on the edge of each pressing block. The flexible circuit boards are fixed to the bottoms of the pressing bocks, one end of each flexible circuit board is electrically connected with the PCB, the other end of each flexible circuit board is connected with the corresponding pressing head, hole grooves are formed in the portions, located at the bottoms of the pressing heads, of the supporting plate, and transparent structures are arranged in the hole grooves. Pressed connection is conducted on the flexible circuit boards and the OELD panel through the cooperation of the lever type pressing rods and the pressing blocks on the pressed connection device, the structure is simple, operation is convenient, and the pressed connection is uniform and stable.
Description
Technical field
The invention belongs to oled panel technical field of measurement and test, be specifically related to a kind of crimping jig of oled panel.
Background technology
Along with developing rapidly of hand-hold electronic equipments, oled panel is also developed fast.The quality of market to oled panel is had higher requirement, and this just requires to test it in the production run of oled panel.Crimping jig is device important in test process, and the impact of the product confrontation test of crimping jig is very large.Existing crimping jig needs manual pressure to crimp when crimping, but manually crimps uneven, pressing weak effect, often occurs the problem crimping instability, crimping contraposition offsets, thus makes the efficiency of test not high.
Summary of the invention
Object of the present invention is exactly the deficiency existed to solve above-mentioned background technology, provides the crimping jig that a kind of structure is simple, crimp stable oled panel.
The technical solution used in the present invention is: a kind of crimping jig of oled panel, comprise back up pad, pcb board, compression bonding apparatus, oled panel placement plate and flexible PCB, described pcb board and oled panel are placed plate and are individually fixed in back up pad both sides, and described compression bonding apparatus is installed in back up pad to be placed between plate at pcb board and oled panel; Described compression bonding apparatus comprises support, depression bar and briquetting, hinged with support in the middle part of described depression bar, described depression bar one end protrudes from support side, other end upper surface contacts with bottom the transverse axis of briquetting inside, described briquetting is installed on support opposite side and can slides up and down along support under depression bar effect, and described briquetting bottom margin is provided with pressure head; Described flexible PCB is fixed on bottom briquetting, and flexible PCB one end is electrically connected with pcb board, the other end is connected with pressure head, and the position described back up pad is positioned at bottom pressure head has hole slot, is provided with transparent configuration in hole slot.
Further, lower end, described support side is provided with the first transverse slat, support opposite side upper end is provided with the second transverse slat, depression bar protrudes between the bottom surface, one end of support side and the first transverse slat end face and is provided with the first stage clip, protruding from its both sides end face in the middle part of described briquetting stretches between the second transverse slat, is provided with the second stage clip between briquetting both sides end face and the second transverse slat bottom surface.
Further, described compression bonding apparatus comprises multiple depression bar and multiple briquetting, and described multiple depression bar matches with multiple briquetting respectively and is installed on support, and be equipped with flexible connecting plate bottom described multiple briquetting, multiple flexible connecting plate is all connected with pcb board.
Further, be provided with contiguous block bottom described briquetting, described flexible PCB is sandwiched between briquetting bottom surface and contiguous block end face.
Further, described oled panel is placed plate upper surface and is had multiple groove.
Further, described transparent configuration is clear glass bar.
Further, described back up pad two ends are respectively equipped with handle.
Further, described back up pad is provided with reference column, and described support has pilot hole, and described compression bonding apparatus to be coordinated with reference column by pilot hole and is installed in back up pad.
The present invention is matched with briquetting by the depression bar on compression bonding apparatus, crimps flexible PCB and oled panel, and depression bar and briquetting form the form of similar lever, and structure is simple, easy to operate, and crimping is even, stable.Tool is arranged multiple flexible PCB, one end of pcb board is connected with multiple flexible PCB, and the other end has multiple interfaces corresponding with it, and once can test polylith oled panel, testing efficiency is high.
Accompanying drawing explanation
Fig. 1 is schematic top plan view of the present invention.
Fig. 2 is the schematic diagram of compression bonding apparatus of the present invention.
Fig. 3 is the sectional view of compression bonding apparatus of the present invention.
In figure: 1-back up pad; 2-PCB plate; 3-compression bonding apparatus; 30 supports; 31-depression bar; 32-briquetting; 33-pressure head; 34-first transverse slat; 35-second transverse slat; 36 first stage clips; 37-second stage clip; 38-contiguous block; 39-transverse axis; 4-transparent configuration; Plate placed by 5-OLED panel; 51-groove; 6-flexible PCB; 7-handle; 8-reference column.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail, is convenient to be well understood to the present invention, but they do not form restriction to the present invention.
As Figure 1-3, the present invention includes back up pad 1, pcb board 2, compression bonding apparatus 3, oled panel placement plate 5 and flexible PCB 6, described pcb board 2 and oled panel are placed plate 5 and are individually fixed in back up pad 1 both sides, and described compression bonding apparatus 3 is installed in back up pad 1 to be placed between plate 5 at pcb board 2 and oled panel; Described compression bonding apparatus 3 comprises support 30, depression bar 31 and briquetting 32, hinged with support 30 in the middle part of described depression bar 31, described depression bar 31 one end protrudes from support 30 side, other end upper surface contacts with bottom the transverse axis 39 of briquetting 32 inside, and described briquetting 32 is installed on support 30 opposite side.Depression bar 31 forms lever construction, and by exerting pressure to its one end, the briquetting 32 contacted with its other end upper surface is slided up and down along support 30, described briquetting 32 bottom margin is provided with pressure head 33; Described flexible PCB 6 is fixed on bottom briquetting 32, flexible PCB 6 one end is electrically connected with pcb board 2, the other end is connected with pressure head 33, in described back up pad 1, the position be positioned at bottom pressure head 33 has hole slot, is provided with transparent configuration 4 in hole slot, and transparent configuration is transparent glass bar.
In such scheme, lower end, support 30 side is provided with the first transverse slat 34, support opposite side upper end is provided with the second transverse slat 35, depression bar 31 protrudes between the bottom surface, one end of support 30 side and the first transverse slat 34 end face and is provided with the first stage clip 36, protruding from its both sides end face in the middle part of described briquetting 32 stretches between the second transverse slat 35, is provided with the second stage clip 37 between briquetting 32 both sides end face and the second transverse slat 35 bottom surface.First stage clip 36 and the second stage clip 37 can make the action of depression bar 31 and briquetting 32 rapider, and briquetting 32 crimps more stable.
In such scheme, compression bonding apparatus 3 comprises multiple depression bar 31 and multiple briquetting 32, described multiple depression bar 31 matches with multiple briquetting 32 respectively and is installed on support 30, and be equipped with flexible connecting plate 6 bottom described multiple briquetting 32, multiple flexible connecting plate 6 is all connected with pcb board 2.One end of pcb board 2 is connected with multiple flexible PCB 6, and the other end has multiple interfaces corresponding with it, can realize testing polylith oled panel.
In such scheme, be provided with contiguous block 38 bottom briquetting 32, described flexible PCB 6 is sandwiched between briquetting 32 bottom surface and contiguous block 38 end face.
In such scheme, the upper surface placing plate 5 at oled panel has multiple groove 51, the surface of contact that the groove 51 arranged makes oled panel and oled panel place between plate reduces, reduce oled panel and oled panel and place adsorptive power between plate, oled panel can be prevented to be placed into oled panel and place after on plate and cause not easy-offtaking because absorption is too tight.
In such scheme, be respectively equipped with handle 7 at the two ends of back up pad 1, staff can carry crimping jig by handle 7.
In such scheme, described back up pad 1 is provided with reference column 8, and described support 30 has pilot hole, and described compression bonding apparatus 3 to be coordinated with reference column by pilot hole and is installed in back up pad 1.
Principle of work of the present invention is: apply pressure by device for exerting to the side of depression bar 31, briquetting 32 lifts by opposite side and second stage clip 37 of depression bar 31, oled panel carrying is placed into oled panel and places after on plate 5 by device to be handled, alignment device observes the whether contraposition of oled panel to be measured and flexible PCB 6 in bottom by transparent configuration 4, if contraposition failure, employing oled panel Handling device is reorientated, through contraposition success.After contraposition completes, unclamp device for exerting, briquetting 32 is put down by the first stage clip 36 and the second stage clip 37 by depression bar 31, crimps oled panel, and oled panel is placed above plate and is provided with rational groove structure, can realize easily picking and placeing oled panel.
The content be not described in detail in this instructions belongs to the known prior art of professional and technical personnel in the field.
Claims (8)
1. the crimping jig of an oled panel, comprise back up pad (1), pcb board (2), compression bonding apparatus (3), oled panel places plate (5) and flexible PCB (6), described pcb board (2) and oled panel are placed plate (5) and are individually fixed in back up pad (1) both sides, described compression bonding apparatus (3) is installed on and back up pad is positioned at pcb board (2) and oled panel is placed between plate (5), it is characterized in that: described compression bonding apparatus (3) comprises support (30), depression bar (31) and briquetting (32), described depression bar (31) middle part is hinged with support (30), described depression bar (31) one end protrudes from support side, other end upper surface contacts with bottom the transverse axis of briquetting inside, described briquetting (32) is installed on support opposite side and can slides up and down along support under depression bar effect, described briquetting (32) bottom margin is provided with pressure head (33), described flexible PCB (6) is fixed on bottom briquetting, flexible PCB one end is electrically connected with pcb board (2), the other end is connected with pressure head (33), in described back up pad (1), the position be positioned at bottom pressure head has hole slot, is provided with transparent configuration (4) in hole slot.
2. the crimping jig of a kind of oled panel according to claim 1, it is characterized in that: described support (30) lower end, side is provided with the first transverse slat (34), opposite side upper end is provided with the second transverse slat (35), described depression bar (31) protrudes between the bottom surface, one end of support side and the first transverse slat end face and is provided with the first stage clip (36), described briquetting (32) middle part protrudes from its both sides end face and stretches between the second transverse slat (35), is provided with the second stage clip (37) between briquetting both sides end face and the second transverse slat bottom surface.
3. the crimping jig of a kind of oled panel according to claim 1, it is characterized in that: described compression bonding apparatus (3) comprises multiple depression bar (31) and multiple briquetting (32), described multiple depression bar (31) coordinates with multiple briquetting phase (32) respectively and is installed on support, be equipped with flexible connecting plate bottom described multiple briquetting, multiple flexible connecting plate is all connected with pcb board.
4. the crimping jig of a kind of oled panel according to claim 1, it is characterized in that: described briquetting (32) bottom is provided with contiguous block (38), and described flexible PCB (6) is sandwiched between briquetting (32) bottom surface and contiguous block (38) end face.
5. the crimping jig of a kind of oled panel according to claim 1, is characterized in that: described transparent configuration (4) is clear glass bar.
6. the crimping jig of a kind of oled panel according to claim 1, is characterized in that: described oled panel is placed plate (5) upper surface and had multiple groove (51).
7. the crimping jig of a kind of oled panel according to claim 1, is characterized in that: described back up pad (1) two ends are respectively equipped with handle (7).
8. the crimping jig of a kind of oled panel according to claim 1, it is characterized in that: described back up pad (1) is provided with reference column (8), described support has pilot hole, and described compression bonding apparatus (3) to be coordinated with reference column by pilot hole and is installed in back up pad (1).
Priority Applications (1)
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CN201410734662.1A CN104464582B (en) | 2014-12-04 | 2014-12-04 | Pressed connection jig for OLED panel |
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CN201410734662.1A CN104464582B (en) | 2014-12-04 | 2014-12-04 | Pressed connection jig for OLED panel |
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CN104464582A true CN104464582A (en) | 2015-03-25 |
CN104464582B CN104464582B (en) | 2017-02-01 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105848464A (en) * | 2016-06-08 | 2016-08-10 | 蔡威宏 | Convenient-to-use chip assembly jig capable of greatly improving assembly efficiency |
CN107481654A (en) * | 2017-09-08 | 2017-12-15 | 武汉精测电子技术股份有限公司 | A kind of pressure head for being used to align the FPC of crimping |
WO2019114040A1 (en) * | 2017-12-15 | 2019-06-20 | 昆山精讯电子技术有限公司 | Press ram |
CN110595739A (en) * | 2019-09-24 | 2019-12-20 | 苏州精濑光电有限公司 | Automatic crimping mechanism |
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CN101043770A (en) * | 2006-03-20 | 2007-09-26 | 三星电子株式会社 | Diplay device and method of manufacturing the same |
CN201233483Y (en) * | 2008-07-18 | 2009-05-06 | 比亚迪股份有限公司 | Tool for adhering LCD and light conducting board |
CN103341839A (en) * | 2013-06-09 | 2013-10-09 | 深圳市普耐光电科技有限公司 | LED back light source light guide plate component installation system |
KR101382267B1 (en) * | 2013-12-19 | 2014-04-07 | 주식회사 성진하이메크 | Automatic flatness controllable bonding tool and method of automatic flatness control therefor |
CN204242559U (en) * | 2014-12-04 | 2015-04-01 | 昆山精讯电子技术有限公司 | A kind of crimping jig of oled panel |
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2014
- 2014-12-04 CN CN201410734662.1A patent/CN104464582B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101043770A (en) * | 2006-03-20 | 2007-09-26 | 三星电子株式会社 | Diplay device and method of manufacturing the same |
CN201233483Y (en) * | 2008-07-18 | 2009-05-06 | 比亚迪股份有限公司 | Tool for adhering LCD and light conducting board |
CN103341839A (en) * | 2013-06-09 | 2013-10-09 | 深圳市普耐光电科技有限公司 | LED back light source light guide plate component installation system |
KR101382267B1 (en) * | 2013-12-19 | 2014-04-07 | 주식회사 성진하이메크 | Automatic flatness controllable bonding tool and method of automatic flatness control therefor |
CN204242559U (en) * | 2014-12-04 | 2015-04-01 | 昆山精讯电子技术有限公司 | A kind of crimping jig of oled panel |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105848464A (en) * | 2016-06-08 | 2016-08-10 | 蔡威宏 | Convenient-to-use chip assembly jig capable of greatly improving assembly efficiency |
CN105848464B (en) * | 2016-06-08 | 2018-09-07 | 蔡威宏 | Chip assembled fixture that is a kind of easy to use and can significantly promoting packaging efficiency |
CN107481654A (en) * | 2017-09-08 | 2017-12-15 | 武汉精测电子技术股份有限公司 | A kind of pressure head for being used to align the FPC of crimping |
CN107481654B (en) * | 2017-09-08 | 2023-10-27 | 武汉精测电子集团股份有限公司 | A pressure head for counterpoint crimping FPC |
WO2019114040A1 (en) * | 2017-12-15 | 2019-06-20 | 昆山精讯电子技术有限公司 | Press ram |
CN110595739A (en) * | 2019-09-24 | 2019-12-20 | 苏州精濑光电有限公司 | Automatic crimping mechanism |
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