CN104463306A - Holographic mirror surface high-grade double-interface wire-winding welding IC card - Google Patents
Holographic mirror surface high-grade double-interface wire-winding welding IC card Download PDFInfo
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- CN104463306A CN104463306A CN201310434607.6A CN201310434607A CN104463306A CN 104463306 A CN104463306 A CN 104463306A CN 201310434607 A CN201310434607 A CN 201310434607A CN 104463306 A CN104463306 A CN 104463306A
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Abstract
The invention relates to the technical field of electronic information, in particular to a holographic mirror surface high-grade double-interface wire-winding welding IC card. The IC card comprises a front-face glue film, a front-face printing layer, a front-face substrate layer, an antenna layer, a middle separation film layer, a back-face substrate layer, a back-face printing layer and a back-face glue film, the front-face glue film, the front-face printing layer, the front-face substrate layer, the antenna layer, the middle separation film layer, the back-face substrate layer, the back-face printing layer and the back-face glue film are attached in sequence, and a double-interface chip is patched on the outer surface of the front-face glue film through hot-melting adhesive tape. The IC card is characterized in that holographic mirror surface substrates are adopted in the front-face substrate layer and the back-face substrate layer, and the middle separation film layer is additionally arranged between the antenna layer and the back-face holographic mirror surface layer; length *width*distance*the number of turns of an antenna in the antenna layer is 81 mm*49 mm*0.2 mm*four turns. The appearance of the IC card has the metal color effect, the attractive effect and grade of the card are greatly improved, individuality is highlighted, the needs of high-end people can be met, and the card is mainly applied to the fields of finance, traffic, identity authentication, electronic payment and the like.
Description
Technical field
The present invention relates to electronic information technical field, especially a kind of holographic minute surface high-grade two interfaces coiling welding IC-card.
Background technology
At present both at home and abroad two interface (IC) clipping technique comparative maturity, coiling antenna two interface (IC) card, two interface (IC) the card principle of silk-screen antenna are the same, just different on sky Wiring technology and antenna material.These two kinds of double-interface cards all have contact and non-contact function, contact function is all undertaken by peripherals and contact point, non-contact function is sent out the electromagnetic wave of one group of fixed frequency, an IC series resonant circuit is had in card, its frequency is identical with the frequency of card reader, so just, electromagentic resonance can be produced, thus make in electric capacity, there has been electric charge, a unidirectional logical electronic pump is connected at the other end of electric capacity, electric charge in electric capacity is delivered to the storage of another capacitor memory, when the electric charge storing accumulation reaches 2V, this power supply can provide voltage for chip circuit, data in card are sent out or receive the data that card reader emits.
Existing coiling antenna two interfaces (IC) card, mainly include the front glued membrane, front printed layers, front-side substrate layer, antenna stack, medial septum layer, reverse side substrate layer, back face printing layer, the reverse side glued membrane that adhere to successively, and post two interface chip at front glued membrane outside surface by Hot melt adhesive tape dress; Wherein positive and negative substrate layer all adopts the common film of PVC that 0.17mm is thick, and its length of antenna × wide × spacing × number of turns=78 × 46.5 × 0.4mm × 5 are enclosed; Existing this IC-card appearance is very flat, cannot meet the requirement of high-end customer.
Summary of the invention
It is flat that object of the present invention will solve existing common coiling welding IC card appearance exactly, cannot meet the problem of high-end customer requirement, provide a kind of holographic minute surface high-grade two interfaces coiling welding IC-card.
Concrete scheme of the present invention is: improve for common coiling welding IC-card, it includes the front glued membrane, front printed layers, front-side substrate layer, antenna stack, medial septum layer, reverse side substrate layer, back face printing layer, the reverse side glued membrane that adhere to successively, and post two interface chip at front glued membrane outside surface by Hot melt adhesive tape dress, it is characterized in that: what described front-side substrate layer and reverse side substrate layer all adopted is holographic minute surface substrate, and have additional medial septum layer between antenna stack and the holographic minute surface substrate layer of reverse side; Length of antenna in the described antenna stack × wide × spacing × number of turns=81mm × 49mm × 0.2mm × 4 are enclosed.
The glued membrane of front described in the present invention and reverse side glued membrane are all the U.S. KP PVC glued membrane FL2 adopting 0.051mm thick.
Holographic minute surface substrate described in the present invention selects thickness to be 0.15mm.
The layer of medial septum described in the present invention selects thickness to be the general film of PVC of 0.08mm.
Designing points of the present invention is: for improving card appearance, introduce the holographic minute surface substrate with metallic luster effect especially; But because holographic minute surface substrate is metal material; larger to the influence of magnetic field of card reader; make the response Distance Shortened of minute surface double-interface card; have impact on the normal work of card; the present invention is by adjusting the parameter of antenna for this reason; and add one deck medial septum (and adopting usual substrate static elimination method to reduce electrostatic in processing), thus after making the present invention adopt holographic minute surface substrate, still can ensure the normal response of card, work.
Outward appearance of the present invention has metallic luster effect, substantially increases aesthetic and the class of card, shows individual character, can meet the needs of high-end crowd, be mainly used in the fields such as finance, traffic, authentication, E-Payment.
Accompanying drawing explanation
Fig. 1 is partial structurtes section zoomed-in view of the present invention;
Fig. 2 is antenna arrangement figure of the present invention.
In figure: 1-bis-interface chip, 2-Hot melt adhesive tape, 3-front glued membrane, 4-front printed layers, 5-front-side substrate layer, 6-antenna stack, 7-medial septum layer, 8-reverse side substrate layer, 9-back face printing layer, 10-reverse side glued membrane.
Embodiment
See Fig. 1,2, the present invention includes the front glued membrane 3, front printed layers 4, front-side substrate layer 5, antenna stack 6, reverse side substrate layer 8, back face printing layer 9, the reverse side glued membrane 10 that adhere to successively, and post two interface chip 1 at front glued membrane 3 outside surface by Hot melt adhesive tape 2 dress, particularly: what described front-side substrate layer 5 and reverse side substrate layer 8 all adopted is holographic minute surface substrate, and have additional medial septum layer 7 between the holographic minute surface substrate layer of antenna stack 6 and reverse side; Length of antenna in the described antenna stack 6 × wide × spacing × number of turns=81mm × 49mm × 0.2mm × 4 are enclosed.
The glued membrane of front described in the present embodiment 3 and reverse side glued membrane 10 are all the U.S. KP PVC glued membrane FL2 adopting 0.051mm thick.
Holographic minute surface substrate described in the present embodiment selects thickness to be 0.15mm.
The layer of medial septum described in the present embodiment 7 selects thickness to be the general film of PVC of 0.08mm.
Claims (4)
1. holographic minute surface high-grade two interfaces coiling welding IC-card, include the front glued membrane, front printed layers, front-side substrate layer, antenna stack, medial septum layer, reverse side substrate layer, back face printing layer, the reverse side glued membrane that adhere to successively, and post two interface chip at front glued membrane outside surface by Hot melt adhesive tape dress, it is characterized in that: what described front-side substrate layer and reverse side substrate layer all adopted is holographic minute surface substrate, and have additional medial septum layer between antenna stack and the holographic minute surface substrate layer of reverse side; Length of antenna in the described antenna stack × wide × spacing × number of turns=81mm × 49mm × 0.2mm × 4 are enclosed.
2. coiling welding IC-card in holographic minute surface high-grade two interfaces according to claim 1, is characterized in that: described front glued membrane and reverse side glued membrane are all the U.S. KP PVC glued membrane FL2 adopting 0.051mm thick.
3. coiling welding IC-card in holographic minute surface high-grade two interfaces according to claim 1, is characterized in that: described holographic minute surface substrate selects thickness to be 0.15mm.
4. holographic minute surface according to claim 1 high-grade two interfaces coiling welding IC-card, is characterized in that: described medial septum layer selects thickness to be the general film of PVC of 0.08mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310434607.6A CN104463306A (en) | 2013-09-23 | 2013-09-23 | Holographic mirror surface high-grade double-interface wire-winding welding IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310434607.6A CN104463306A (en) | 2013-09-23 | 2013-09-23 | Holographic mirror surface high-grade double-interface wire-winding welding IC card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104463306A true CN104463306A (en) | 2015-03-25 |
Family
ID=52909311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310434607.6A Pending CN104463306A (en) | 2013-09-23 | 2013-09-23 | Holographic mirror surface high-grade double-interface wire-winding welding IC card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104463306A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108364057A (en) * | 2018-03-21 | 2018-08-03 | 捷德（中国）信息科技有限公司 | A kind of bis- interface chip smart cards of 6PIN and preparation method thereof |
-
2013
- 2013-09-23 CN CN201310434607.6A patent/CN104463306A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108364057A (en) * | 2018-03-21 | 2018-08-03 | 捷德（中国）信息科技有限公司 | A kind of bis- interface chip smart cards of 6PIN and preparation method thereof |
| CN108364057B (en) * | 2018-03-21 | 2022-01-11 | 捷德(中国)科技有限公司 | 6PIN double-interface chip smart card and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |
|
| WD01 | Invention patent application deemed withdrawn after publication |