CN104451804A - Processing process for plating gold on insoluble metal wire - Google Patents
Processing process for plating gold on insoluble metal wire Download PDFInfo
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- CN104451804A CN104451804A CN201410763944.4A CN201410763944A CN104451804A CN 104451804 A CN104451804 A CN 104451804A CN 201410763944 A CN201410763944 A CN 201410763944A CN 104451804 A CN104451804 A CN 104451804A
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Abstract
The invention discloses a processing process for plating gold on an insoluble metal wire. The processing process comprises the following steps: a gold plating device which is provided with a wire release wheel, a plating bath, a heating furnace and a wire winding wheel is adopted, a plating solution inside a plating solution pool flows through a graphite pipe to form circulation so that the plating solution circularly passes through the plating bath, and the insoluble metal wire to be plated, which is wound on the wire release wheel, is wound on the wire winding wheel sequentially from the graphite pipe and the heating furnace; the graphite pipe is connected with the positive electrode of a power supply to form an anode, the insoluble metal wire to be plated is connected with the negative electrode of the power supply to form a cathode, and the graphite pipe and the insoluble metal wire to be plated form a closed circuit through the plating solution; the wire winding wheel rotates to enable the insoluble metal wire to be plated to penetrate through the plating solution at a certain speed to form the insoluble metal wire with a surface plated with gold; and the insoluble metal wire plated with the gold passes through the heating furnace for heating so that a gold plating layer and the insoluble metal wire are closely combined. The processing process disclosed by the invention ensures that the gold plating layer of the insoluble metal wire is uniform and compact in thickness by adopting a continuous gold plating manner, so that the gold plating layer with the high smoothness is obtained.
Description
Technical field
The invention belongs to metal surface treatment process, be specifically related to the complete processing that a kind of refractory metal silk is gold-plated.
Background technology
Fusing point and the intensity of refractory metal are high, add its good ray shield function, therefore have unique use value in high temperature, ultrahigh-temperature field, but refractory metal are at high temperature oxidizable, limits refractory metal development and application widely.In order to improve the antioxidant property of refractory metal, expand its range of application, need the oxidation preventing it at refractory metal surfaces plating antioxidant property and the good metal of conductivity, and gold due to good ductility, oxidation-resistance and conductivity be best materials.Refractory metal silk after gold-plated greatly can improve the electrology characteristic of a material, significantly reduces noise, enhance mechanical strength.Can be used as desirable erosion resistance electronic emission material, weather instrument material, X-ray detection X electrode materials, fast duplicating and information technology material etc.
At present, the craft of gilding of refractory metal silk is splendid attire electroplate liquid in a rectangle plating tank, refractory metal silk is placed in plating tank, dried after placing for some time, thus realize the gold-plated of refractory metal silk, because plating tank is rectangular, gold ion skewness in electroplate liquid, and refractory metal silk rests in plating tank, therefore this technique makes Gold plated Layer became uneven that refractory metal silk covers, surface irregularity, and the refractory metal silk after gold-plated is by naturally drying, combination between refractory metal silk and Gold plated Layer is poor, causes Gold plated Layer easily to come off; And processing diameter is the gold-plated refractory metal silk of 0.025 ~ 0.15mm, the thickness of its Gold plated Layer is only 0.3 ~ 1.2 μm, and the Gold plated Layer of refractory metal silk is thin, makes refractory metal silk oxidation-resistance poor.Electroplate liquid in tradition craft of gilding adopts prussiate mostly, gold adds prussiate with the form of KAu (SO3) 2, therefore bath stability is poor, gold ion is easily reduced Precipitation, cathode current density scope is narrower, containing a small amount of hazardous elements S in coating, and prussiate is originally as highly toxic substance, all forms have a strong impact on human health and physical environment.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, providing the complete processing that a kind of refractory metal silk is gold-plated, this complete processing is simple, and the wire surface of processing is even, smooth finish good, strong with basal body binding force, ensure that plated thickness.
Object of the present invention can be achieved through the following technical solutions:
The complete processing that a kind of refractory metal silk is gold-plated, it is characterized in that: adopt the plating apparatus being provided with actinobacillus wheel, plating tank, process furnace and take-up reel, plating tank comprises plating liquid pool and carbon tube, in described plating liquid pool, the electroplate liquid prepared is housed, electroplate liquid in plating liquid pool flows through in carbon tube and forms circulation, form electroplate liquid in the plating tank cycled through, the end wall of carbon tube both sides is provided with the via hole passed through for refractory metal silk; Its gold-plated step is as follows:
1), by the refractory metal silk one end of the electroplated be wrapped on actinobacillus wheel draw, after passing from the via hole of carbon tube, through process furnace, be finally wrapped on take-up reel;
2), by described carbon tube connect positive source and form anode, the refractory metal silk of described electroplated is connect power cathode, the refractory metal silk of electroplated forms negative electrode, and the refractory metal silk of carbon tube and electroplated forms closed circuit by electroplate liquid;
3), take-up reel rotates, make the refractory metal silk of electroplated with the speed of 5 ~ 10m/min from the electroplate liquid carbon tube by forming surface gold-plating refractory metal silk;
4), after gold-plated, refractory metal silk, from process furnace by heating, makes Gold plated Layer and refractory metal silk matrix combine closely.
Described electroplate liquid adopts strong aqua or sodium hydroxide to regulate pH value to be 8.5 ~ 9.
Described strong aqua refers to that concentration is the ammoniacal liquor of 25-28%.
Described power acquisition square wave pulsed current, dutycycle is 0.5 ~ 0.8, and frequency is 30 ~ 50HZ.
The electric current of the closed circuit that the refractory metal silk of described carbon tube and electroplated is consisted of electroplate liquid is 5-30mA.
The Heating temperature of described process furnace is 50 ~ 150 DEG C.
Plating apparatus also comprises the first guide deflection sheave and the second guide deflection sheave, described first guide deflection sheave is between actinobacillus wheel and plating tank, described second guide deflection sheave is between plating tank and process furnace, and the first or second guide deflection sheave is provided with cathode terminal, and the refractory metal silk of electroplated is connected with power cathode by cathode terminal, the refractory metal silk of electroplated is drawn from actinobacillus wheel, successively through the first guide deflection sheave, plating tank, the second guide deflection sheave, process furnace, is finally wrapped on take-up reel.
The two ends insulation plug sealing of described carbon tube, the center of circle of two insulation plugs is provided with the via hole passed for refractory metal silk.
The upper end of described carbon tube is provided with anode terminal, and carbon tube is connected with positive source by anode terminal.
Beneficial effect of the present invention:
1, production technique of the present invention is simpler, adopt carbon tube, plating liquid pool forms electroplate liquid in the plating tank cycled through, carbon tube ensure that the gold ion in plating liquid pool is evenly distributed, the each direction of refractory metal silk is all equidistant with anode electrode, electroplate liquid circulates from bottom to top between plating liquid pool and carbon tube, refractory metal silk to be plated is through the via hole of carbon tube, move from left to right with the speed of 5 ~ 10m/min, now in carbon tube, electroplate liquid flow direction is contrary with the direction of motion of refractory metal silk to be plated, prevent cladding portion from piling up, adopt continuous gold-plating mode, ensure that the thickness of refractory metal silk Gold plated Layer is even, fine and close, obtain the gold coating of best bright finish, thickness of coating about 2 ~ 4 μm, finer and close, evenly, refractory metal silk antioxidant property is also significantly improved.Simultaneously due to gold plating liquid in the mode of outwards taking out at carbon tube internal recycle, cause carbon tube internal negative pressure, thus effectively reduce or suppress electroplate liquid to flow out from the via hole of carbon tube both sides.Therefore the present invention expands the range of application of refractory metal silk, and particularly refractory metal silk material is in the application of the special dimensions such as energetic ray.
2, the present invention gold-plated after refractory metal silk carry out heat through process furnace, both added refractory metal silk coating surface smoothness, in turn enhance the bonding force of coating and refractory metal silk matrix, surface smoothness is better.
3, the electroplating device that the present invention adopts also comprises the first guide deflection sheave and the second guide deflection sheave, first guide deflection sheave or the second guide deflection sheave are provided with cathode terminal, refractory metal silk is connected with power cathode by the first guide deflection sheave or the second guide deflection sheave, unwrapping wire is a little less than the first guide deflection sheave, by the first guide deflection sheave and the second guide deflection sheave, refractory metal silk led, support, stretching, improve the gold-plated effect of refractory metal silk.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the phantom view of plating tank of the present invention;
Fig. 3 is structural representation actinobacillus wheel of the present invention being arranged tension-adjusting gear;
Fig. 4 is structural representation the present invention first guide deflection sheave being arranged cathode terminal;
Fig. 5 is the side-view of the present invention first guide deflection sheave and cathode terminal;
Fig. 6 is the mechanical property of the refractory metal of electroplate liquid of the present invention plating;
Fig. 7 is the diagram of thickness of coating of the present invention;
Fig. 8 is the diagram of coating surface of the present invention distribution;
Fig. 9 is that coating of the present invention bends surperficial nothing;
Figure 10 is the diagram after coating surface acid corrosion of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further described.
See shown in Fig. 1 to Figure 10, the complete processing that a kind of refractory metal silk is gold-plated, this complete processing adopts the plating apparatus including plating liquid pool 1, carbon tube 2, vacuum primingpump 3, actinobacillus wheel 6, take-up reel 8, process furnace 9, first guide deflection sheave 10, second guide deflection sheave 11 and tension-adjusting gear 12, in described plating liquid pool 1, the electroplate liquid prepared is housed, described electroplate liquid adopts strong aqua or sodium hydroxide to regulate pH value to be 8.5 ~ 9, and described strong aqua refers to that concentration is the ammoniacal liquor of 25-28%.Electroplate liquid in plating liquid pool 1 is sucked in carbon tube 2 by vacuum primingpump 3 and forms circulation, forms electroplate liquid in the plating tank 4 cycled through, and the end wall of described carbon tube 2 both sides is provided with the via hole 2-11 passed through for refractory metal silk.
First electropolishing cleaning is carried out to the refractory metal silk of electroplated before plating, refractory metal silk after polishing is wrapped on actinobacillus wheel 1, the refractory metal silk of electroplated is more smooth through electropolishing process rear surface, without lubricants such as aquadags, Gold plated Layer is more easily covered on the refractory metal silk of electroplated.Its gold-plated step is as follows:
1), refractory metal silk 13 one end of the electroplated be wrapped on actinobacillus wheel 1 is drawn, successively through the first guide deflection sheave 10, the carbon tube 2 of plating tank 4, second guide deflection sheave 11, process furnace 9, finally be wrapped on take-up reel 8, the refractory metal silk of electroplated is supported on the first guide deflection sheave 10 and the second guide deflection sheave 11, by first, second guide deflection sheave 10,11 and tension-adjusting gear 12, the refractory metal silk 13 to the electroplated of drawing has stretching effect, ensure that the refractory metal silk surface of electroplated is all coated with Gold plated Layer.
2), the anode terminal 2-1 of described carbon tube 2 is connect positive source and form anode, the refractory metal silk of described electroplated is connect power cathode by the cathode terminal 15 of the first guide deflection sheave 10, the refractory metal silk 13 of electroplated forms negative electrode, the refractory metal silk 13 of carbon tube 2 and electroplated forms closed circuit by electroplate liquid, the electric current of closed circuit is 5-30mA, take electric current as the electric current of 10-20mA be most preferred embodiment, the size of current of closed circuit is relevant to the velocity of flow of gold ion in electroplate liquid, this electric current ensure that plated thickness and the compactness of the refractory metal silk 13 of plating, described power acquisition square wave pulsed current, dutycycle is 0.5 ~ 0.8, and frequency is 30 ~ 50HZ.
3), take-up reel 8 rotates, the refractory metal silk of electroplated is passed through from the electroplate liquid plating tank 4 with the speed of 5 ~ 10m/min, form gold-plated refractory metal silk, the speed of refractory metal silk is 6m/min is most preferred embodiment, the thickness of Gold plated Layer is relevant with the travelling speed of refractory metal silk, and the thickness of the faster Gold plated Layer of speed is thinner; Electroplate liquid is circulated between plating liquid pool 1 and carbon tube 2 from bottom to top by vacuum primingpump 3, when take-up reel 8 pulls the refractory metal silk of electroplated to move right from the left side of carbon tube 2, now in carbon tube 2, electroplate liquid flow direction is contrary with the direction of motion of refractory metal silk to be plated, prevent cladding portion from piling up, adopt continuous gold-plating mode, ensure that the thickness of refractory metal silk Gold plated Layer is even, fine and close, obtain the gold coating of best bright finish.
4), after gold-plated refractory metal silk from process furnace 9 by heating, Heating temperature is 50 ~ 150 DEG C, with Heating temperature be 100 DEG C for most preferred embodiment, Gold plated Layer is combined with refractory metal silk matrix tightr, and adds refractory metal silk coating surface smoothness.
Continuous gold-plating terminates to detect refractory metal silk plated surface layer gold distributing homogeneity, string diameter and binding force of cladding material afterwards, cuts off the refractory metal silk poor part of gold-plated effect such as end to end; Then the refractory metal silk through being up to the standards is carried out vacuum packaging.
The concrete structure of described plating apparatus is as follows:
Plating apparatus comprises plating liquid pool 1, carbon tube 2, vacuum primingpump 3, actinobacillus wheel 6, take-up reel 8, process furnace 9, first guide deflection sheave 10, second guide deflection sheave 11, described plating liquid pool 1 upper end is provided with cover plate 1-1 and baffle plate 1-2, the surrounding that described baffle plate 1-2 is arranged on cover plate 1-1 forms electroplate liquid receiving tank, described cover plate 1-1 is provided with inlet opening, fluid hole and diversion trench 1-3, described plating liquid pool 1 adopts synthetic glass to make, be loaded with the electroplate liquid configured in plating liquid pool 1, described diversion trench 1-3 communicates with plating liquid pool 1.
By bracket 14, columnar carbon tube 2 is installed above the cover plate 1-1 of described plating liquid pool 1, carbon tube 2 is high purity graphite pipes, the axial level of carbon tube 2, the two ends insulation plug 2-1 sealing of described carbon tube 2, insulation plug 2-1 is arranged on carbon tube 2 by thread fit, the center of circle of two insulation plug 2-1 is provided with the via hole 2-11 passed for refractory metal silk 13, refractory metal silk 13 and carbon tube 2 axis coinciding of electroplated, ensure that in electroplate liquid, wire all directions current density is identical, gold ion is evenly distributed, thus ensure that the homogeneity of Gold plated Layer.Carbon tube 2 is provided with liquid-inlet pipe 2-2, described liquid-inlet pipe 2-2 can be arranged on upper end or the lower end of carbon tube 2, the lower end that liquid-inlet pipe 2-2 is arranged on carbon tube 2 is most preferred embodiment, liquid-inlet pipe 2-2 extends in plating liquid pool 1, and described liquid-inlet pipe 2-2 stretches in plating liquid pool 1 by the fluid hole on cover plate 1-1, the upper end of carbon tube 2 is provided with drain pipe 2-3, drain pipe 2-3 is provided with vacuum primingpump 3, vacuum primingpump 3 is placed on the cover plate 1-1 of plating liquid pool 1, drain pipe 2-3 extends into plating liquid pool 1 by the inlet opening on cover plate 1-1 and electroplates more than liquid level, in described plating liquid pool 1, the electroplate liquid prepared is housed, start vacuum primingpump 3, electroplate liquid in plating liquid pool 1 is in liquid-inlet pipe 2-2 suction carbon tube 2, flow in plating liquid pool 1 through vacuum primingpump 3 and drain pipe 2-3 again, electroplate liquid is circulated between plating liquid pool 1 and carbon tube 2, form electroplate liquid in the plating tank 4 cycled through, by vacuum primingpump 3 electroplate liquid extracted out from carbon tube 2 and cause carbon tube 2 internal negative pressure, avoid electroplate liquid and flow out from via hole 2-11.The liquid-inlet pipe 2-2 of described carbon tube 2 is provided with variable valve 2-5, controls by variable valve 2-5 the uninterrupted entering electroplate liquid in carbon tube 2; Described carbon tube 2 is provided with anode terminal 2-4.The via hole 2-11 of described two seal plug 2-1 is interior large outer little tapered hole, in carbon tube, negative pressure is more remarkable, effectively can reduce electroplate liquid to flow out from the wire hole of carbon tube both sides, a small amount of electroplate liquid that the via hole 3-1 of insulation plug flows out is collected through diversion trench 1-3.
Actinobacillus wheel support 5 is arranged on the front of plating tank 4, actinobacillus wheel 6 is installed in rotation on actinobacillus wheel support 5, for straining the tension-adjusting gear 12 of refractory metal silk on actinobacillus wheel support 5, described tension-adjusting gear 12 comprises axle sleeve 12-1, back shaft 12-2, first fitting nut 12-3, second fitting nut 12-4, tensioning spring 12-5, first metallic gasket 12-6, second metallic gasket 12-7, actinobacillus wheel pad 12-8, rubber sheet gasket 12-9 and fastening screw 12-10, described axle sleeve 12-1 is laterally fixed on actinobacillus wheel support 5, back shaft 12-2 is arranged in axle sleeve 12-1, axle sleeve 12-1 is extended at two ends, one end of back shaft 12-2 is arranged with actinobacillus wheel 6 and the first fitting nut 12-3, described first fitting nut 12-3 is used for pushing against actinobacillus wheel, the other end of back shaft 12-2 is arranged with the first metallic gasket 12-6 successively, tensioning spring 12-5, second metallic gasket 12-7, second fitting nut 12-4, second fitting nut 12-4 is fixed on 12-2 on back shaft by fastening screw 12-10, described tensioning spring 12-5 one end is against on the first metallic gasket 12-6, the other end is against on the second metallic gasket 12-7.The both sides of described actinobacillus wheel 6 are provided with actinobacillus wheel pad 12-8, be provided with rubber sheet gasket 12-9, push against actinobacillus wheel by tensioning spring between described first metallic gasket 12-6 and axle sleeve 12-1, stretching refractory metal silk to be plated.
Described take-up reel support 7 is arranged on the rear of plating tank 4, take-up reel 8 is installed in rotation on take-up reel support 7, ceaselessly being rotated by take-up reel 8 drives refractory metal silk 13 to move, due to gold plating liquid in the mode of outwards taking out at carbon tube internal recycle, cause carbon tube internal negative pressure, make negative pressure in carbon tube more remarkable, thus effectively reduce or suppress electroplate liquid to flow out from the via hole 2-11 of carbon tube both sides.
Be provided with a process furnace 9 between take-up reel support 7 and plating tank 4, the refractory metal silk 13 after gold-plated, after process furnace 9 heating, drying, makes Gold plated Layer be combined with refractory metal silk matrix tightr, adds refractory metal silk 13 coating surface smoothness.
The first guide wheel bracket 10-1 is provided with between plating tank 4 and actinobacillus wheel support 5, first guide deflection sheave 10 is rotating to be arranged on the first guide wheel bracket 10-1, the second guide wheel bracket is provided with between plating tank 4 and process furnace 9, second guide deflection sheave 11 is rotating to be arranged on the second guide wheel bracket, first or second guide deflection sheave is provided with cathode terminal 15, the present embodiment arranges cathode terminal 15 on the first guide deflection sheave, described first guide wheel bracket 10-1 is provided with the screw mandrel 10-2 of arranged transversely by guide pin bushing and set nut, one end of described screw mandrel 10-2 is provided with outside screw, described first guide deflection sheave 10 is arranged on the thread end of screw mandrel 10-2 by bearing 10-3, falling stop cover 10-4 is arranged on the end of screw mandrel 10-2 by bolt 10-5, bearing 10-3 is pushed against by falling stop cover 10-4, prevent the first guide deflection sheave 10 pulley, cathode terminal 15 is clamped and installed in the thread end of screw mandrel 10-2 by two fitting nut 10-6, and between cathode terminal 15 and fitting nut 10-6, be provided with terminal stud pad 10-7, one end of cathode terminal 15 contacts with the first guide deflection sheave 10, the other end is connected with power cathode, the via hole 2-11 supplying refractory metal silk 13 to pass in the insulation plug 2-1 center of circle of first, second guide deflection sheave 10,11 and plating tank 4 is positioned on same level straight line, take-up reel 8 is connected with the rotating shaft of electrode, rotated by driven by motor take-up reel 8, drive the refractory metal silk 13 of electroplated to pass from the electroplate liquid in carbon tube with certain speed, and the refractory metal silk 13 after gold-plated is wound on take-up reel 8.
Actinobacillus wheel 6 is lower than the first guide deflection sheave 10, ensure silk material and the good contact of guide deflection sheave 10, there is stretching effect by the silk material tension-adjusting gear 12 of actinobacillus wheel 6, first, second guide deflection sheave 10,11 and the take-up refractory metal silk to the electroplated of drawing, ensure that the refractory metal silk surface of electroplated is all coated with Gold plated Layer.
Described electroplate liquid is to configure 1000ml electroplate liquid, in electroplate liquid, the components by weight percent of each composition is: gold trichloride 10-30g, sodium sulphite anhydrous 99.3 130 ~ 150g, Tripotassium Citrate 80 ~ 110g, Repone K 90 ~ 120g, disodium ethylene diamine tetraacetate 5 ~ 10g, soluble saccharin 0.5 ~ 1g makes, the preparation method of electroplate liquid is as follows: first to measure in 700-800ml deionized water to beaker and to heat, keep maintaining 40 ~ 60 DEG C in preparation electroplate liquid process, first add anhydrous sodium, stirring and dissolving, add disodium ethylene diamine tetraacetate again, stirring and dissolving, stir and add Repone K successively more simultaneously, soluble saccharin and Tripotassium Citrate also dissolve, now solution answers clear, colorless, finally add gold trichloride, stirring and dissolving is to golden yellow liquid, without precipitation, add deionized water more while stirring and reach 1000ml to solution, finally PH is regulated to be 8.5 ~ 9 with strong aqua or sodium hydroxide, described strong aqua refers to that concentration is the ammoniacal liquor of 25-28%.Gold plating liquid in use should maintain the temperature at 30 ~ 50 DEG C.
Three. experiment
See shown in Fig. 6 to Figure 10: adopt embodiment electroplate liquid, plating is in refractory metal silk, and obtain the gold-plated silk of refractory metal, its test result is as follows:
1. the mechanical property of gold-plated silk
Matrix string diameter φ 0.05mm, maximum pull 6.48N, tensile strength 3288MPa; Gold-plated rear string diameter φ 0.053-0.054mm, maximum pull 6.48N, and matrix silk material maintains an equal level, because silk material increases thick, tensile strength slightly declines, but silk material unit elongation obviously increases, in table 1 and Fig. 6;
Table 1
2. the performance of Gold plated Layer
Amplify 3000 times to test in scanning electron microscope, plated thickness: 2 ~ 4 μm, be evenly distributed (Fig. 7), and Gold plated Layer is continuous, exposes phenomenon (Fig. 8) without matrix silk, stretching after bending 90 degree for twice with hand, amplify 400 times to observe without bubbling and Fragmentation Phenomena (Fig. 9), soak 30 minutes in concentrated nitric acid, coating is without considerable change, outward appearance without pit, in even Gold production (Figure 10).
The resistivity of the gold-plated silk of table 2
Claims (9)
1. the complete processing that a refractory metal silk is gold-plated, it is characterized in that: adopt and be provided with plating tank (4), actinobacillus wheel (6), the plating apparatus of take-up reel (8) and process furnace (9), plating tank (4) comprises plating liquid pool (1) and carbon tube (2), in described plating liquid pool (1), the electroplate liquid prepared is housed, electroplate liquid in plating liquid pool (1) flows through in carbon tube (2) and forms circulation, form electroplate liquid in the plating tank cycled through (4), the end wall of carbon tube (2) both sides is provided with the via hole (2-11) passed through for refractory metal silk, its gold-plated step is as follows:
1), refractory metal silk one end of the electroplated that will be wrapped on actinobacillus wheel (6) draws, and after passing, through process furnace (9), is finally wrapped on take-up reel (8) from the via hole of carbon tube (2);
2), described carbon tube (2) is connect positive source and form anode, the refractory metal silk of described electroplated is connect power cathode, the refractory metal silk of electroplated forms negative electrode, and the refractory metal silk of carbon tube and electroplated forms closed circuit by electroplate liquid;
3), take-up reel (8) rotates, make the refractory metal silk of electroplated with the speed of 5 ~ 10m/min from the electroplate liquid carbon tube (2) by forming surface gold-plating refractory metal silk;
4), after gold-plated, refractory metal silk, from process furnace (9) by heating, makes Gold plated Layer and refractory metal silk matrix combine closely.
2. the complete processing that refractory metal silk according to claim 1 is gold-plated, is characterized in that: described electroplate liquid adopts strong aqua or sodium hydroxide to regulate pH value to be 8.5 ~ 9.
3. the complete processing that refractory metal silk according to claim 2 is gold-plated, is characterized in that: described strong aqua refers to that concentration is the ammoniacal liquor of 25-28%.
4. the complete processing that refractory metal silk according to claim 1 is gold-plated, is characterized in that: described power acquisition square wave pulsed current, and dutycycle is 0.5 ~ 0.8, and frequency is 30 ~ 50HZ.
5. the complete processing that refractory metal silk according to claim 1 is gold-plated, is characterized in that: the electric current of the closed circuit that the refractory metal silk of described carbon tube and electroplated is consisted of electroplate liquid is 5-30mA.
6. the complete processing that refractory metal silk according to claim 1 is gold-plated, is characterized in that: the Heating temperature of described process furnace (9) is 50 ~ 150 DEG C.
7. the complete processing that refractory metal silk according to claim 1 is gold-plated, it is characterized in that: plating apparatus also comprises the first guide deflection sheave (10) and the second guide deflection sheave (11), described first guide deflection sheave (10) is positioned between actinobacillus wheel (6) and plating tank (4), described second guide deflection sheave (11) is positioned between plating tank (4) and process furnace (9), first or second guide deflection sheave is provided with cathode terminal (15), the refractory metal silk of electroplated is connected with power cathode by cathode terminal (15), the refractory metal silk of electroplated is drawn from actinobacillus wheel (6), successively through the first guide deflection sheave (10), plating tank (4), second guide deflection sheave (11), process furnace (9), finally be wrapped on take-up reel (8).
8. the complete processing that refractory metal silk according to claim 1 is gold-plated, it is characterized in that: two ends insulation plug (2-1) sealing of described carbon tube (2), the center of circle of two insulation plugs is provided with the via hole (2-11) passed for refractory metal silk.
9. the complete processing that the refractory metal silk according to claim 1 or 8 is gold-plated, it is characterized in that: the upper end of described carbon tube (2) is provided with anode terminal (2-4), and carbon tube (2) is connected with positive source by anode terminal (2-4).
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| CN101565842A (en) * | 2009-05-15 | 2009-10-28 | 重庆理工大学 | Copper cladding aluminum conductor manufacturing method using rolling electrodeposition method |
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| CN102586830A (en) * | 2011-01-10 | 2012-07-18 | 深圳市奥美特科技有限公司 | Equipment and method for plating gold or plating palladium on surface of metal wire |
| CN203393254U (en) * | 2013-07-26 | 2014-01-15 | 重庆材料研究院有限公司 | Electrolytic bath for electrolytic polishing for metal wire |
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