CN104434388B - Implantable electric heating module for postoperation bacteriostasis and preparation method thereof - Google Patents
Implantable electric heating module for postoperation bacteriostasis and preparation method thereof Download PDFInfo
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- CN104434388B CN104434388B CN201410683998.XA CN201410683998A CN104434388B CN 104434388 B CN104434388 B CN 104434388B CN 201410683998 A CN201410683998 A CN 201410683998A CN 104434388 B CN104434388 B CN 104434388B
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Abstract
The invention relates to an implantable electric heating module for postoperation bacteriostasis and a preparation method thereof, and belongs to the technical field of biomedical engineering. The implantable electric heating module comprises a bioprotein flexible substrate, a heating layer and a bioprotein protective film. The preparation method of the module includes the three steps that first, bioprotein is dissolved in ultrapure water to obtain a bioprotein solution, then the solution is inverted on the substrate, a bioprotein thin film is stripped from the substrate after being dried and solidified at an indoor temperature, and accordingly the bioprotein substrate and the protective film are obtained; afterwards, a resistor, a coil and an insulating material are placed on the substrate in a thin film deposition mode, and the heating layer is prepared; at last, the bioprotein flexible substrate, the heating layer and the protective film are assembled in a hot stamping mode. The heating module not only has excellent biocompatibility but also has a series of advantages of being capable of achieving wireless controlled heating bacteriostasis, efficient, easy to prepare, capable of achieving in-vivo degradation and the like, the module can be directly applied to living bodies, and the application prospect is good.
Description
Technical field
The present invention relates to a kind of for postoperative antibacterial implantable electronics heating module and preparation method thereof, belong to biological
Engineering in medicine technical field.
Background technology
Surgical site infection has turned into the most common bacterium infection of shell, not only influences surgical effect, extends the hospital stays,
Also add or pain and financial burden.The infection of operative site is frequently occurred in the middle of surgical procedure, and its bacterium unit is main
Will from patient in itself, medical personnel and environment.Postoperative infection includes superficial surgery cut infection, deep operation infection of incisional wound
With three levels of organ infection, symptom include it is postoperative in a short time（Often in 1 month）There is purulent secretion, dense or honeycomb
Tissue inflammation etc..Bacterium infection essentially from including the endogenous microbes at the position such as skin, internal organ and coming from itself from patient
Surgical staff, operating theater instruments and surgical material etc. are in interior exogenous microbial.Cause the microbe species of POI numerous
It is many, it is common including staphylococcus aureus, Escherichia coli, Crane negative bacillus, streptococcus etc..
Surgical site infection is closely related with type of surgery and operating time.In general, the sufferer condition of the injury it is heavier, resistance
Power is lower, operative incision is bigger, operating time is more long, and the anti-infection ability of sufferer is lower, surgical site infection chance is more.
Postoperative use antibiotic is presently the most conventional postoperative antibacterial therapeutic modality.However, antibiotic excessive amount, can increase thin
Drug resistance of the bacterium to antibiotic.Additionally, antibiotic it is sterilized also exist administration not in time with the various problems such as not in place or excessive.
For example when being administered orally medicine is needed by organs such as stomach, livers, and the digestion of stomach and the first pass effect of liver are normal
Make some drugs partial failure or all failures before target is reached.Although and drug administration by injection can avoid being administered orally
Problem in technology, but need to be administered with the conventional needle piercing deep skin of syringe.Syringe needle stimulates deep skin god
Easily caused suffering to human body through cell, needle sizes are larger in addition, local trauma can be caused to skin, increase wound infection several
Rate.
The antibacterial technology of local heating is one and possesses efficient postoperative antibacterial mode.By wound local heating, can be with
Destroy bacterium shell and its part, reduce bacterium in enzyme activity, influence its eubolism so that it is dead.
Traditional local heating is antibacterial mainly to be heated by external heat means to wound site, but for deep operation wound
And internal organ wound is interior non-skin portion infection heat transfer is not in place, fungistatic effect is not notable.
Based on above-mentioned situation, design a kind of good biocompatibility, can implant that it is antibacterial to be directly used in wound location
Wireless electron heating module, has and its important meaning in biomedical applications field.
Can be after surgery the invention provides one kind（Before wound suture）It is implanted into the electronics heating module of wound site.Should
Electronics heating module is formed by a series of material processing and manufacturings with good biocompatibility, can be coupled by electromagnetic wave
It is antibacterial for local heating that energy is wirelessly transmitted to the module by mode.Taken or injection of antibiotics suppresses postoperative with traditional
Infection and external heating method for disinfection are compared, implantable electronics heating module have good biocompatibility, can controlled in wireless
Heat time and stabilization, in a series of advantages such as wound infection position local heatings, it is possible to resolve traditional POI exist one
Series of problems, with fine application and development prospect.
The content of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of with excellent bio-compatible
Property, implantable wireless electron heating module, for postoperative antibacterial, it is possible to resolve bacterium is resistance in the existing antibacterial technology based on antibiotic
The property of medicine is improved, effect of drugs not in time and based on the sterilized heat transmission of external heating it is not in place a series of problems, such as.
To achieve the above object, the present invention provides a kind of for postoperative antibacterial implantable electronics heating module, and it is special
Levy and be, the electronics heating module is made up of bioprotein flexible substrates, zone of heating and the part of bioprotein diaphragm three.
The preparation method for postoperative antibacterial implantable electronics heating module, follows the steps below：
（1）Prepare bio-flexible substrate and bioprotein diaphragm with good biocompatibility：
A. bioprotein solution is prepared：
Bioprotein is dissolved in ultra-pure water, wherein optional bioprotein includes but is not limited to fibroin, deer horn
Albumen, spider
Spider's thread protein etc..
Described bioprotein solution concentration is 1-500mg/mL.
B. bioprotein film is prepared：
Bioprotein solution is upside down in substrate, waits solution to dry at room temperature and solidify, it is then that bioprotein is thin
Film is peeled off
Substrate, respectively obtains bioprotein substrate and bioprotein diaphragm.
The ratio of bioprotein wherein used and substrate is 0.01-1 mL/cm2；
The drying time is 1-48 hours；
The substrate is glass, silicon chip, PDMS（Poly dimethyl oxosilane）、Teflon（Polytetrafluoroethylene (PTFE), i.e. Teflon）
Deng；
The curing mode is to be annealed using curing agent or vapor；Curing agent is methyl alcohol, and hardening time is 1 min ~ 120
min；
Vapor annealing temperature is 4 DEG C ~ 100 DEG C, and the time is 0.1 h ~ 100 h, and pressure is 0.1 Pa ~ 101.325
kPa。
The stripping means is mechanical stripping.
（2）Prepare the zone of heating with good biocompatibility：
A. resistance is placed in above-mentioned bioprotein flexible substrates by way of thin film deposition, the side of metal deposit
Formula includes but is not limited to vacuum evaporation, sputter coating etc., and the thickness of metal deposit is 20-5000nm；The material of resistance include but
It is not limited to magnesium, silicon, iron etc..
B. placed the coil in by way of thin film deposition in above-mentioned bioprotein flexible substrates, coil head and the tail two ends and
The two ends of above-mentioned metallic resistance communicate, and realize being electrically connected, and the mode of metal deposit includes but is not limited to vacuum evaporation, sputtering
Plated film etc., the thickness of coil is 20-5000nm；The material of coil includes but is not limited to magnesium, silicon, iron etc..
C. insulating materials is placed on above-mentioned resistance and coil by way of thin film deposition, the side of insulative material deposition
Formula includes but is not limited to vacuum evaporation, sputter coating, whirl coating smearing etc., and the thickness of insulating materials is 10-10000nm；Insulation material
Material includes but is not limited to silica, magnesia, silicon nitride, fibroin etc..
（3）By bioprotein flexible substrates, processing zone of heating on a flexible substrate and the assembling of bioprotein diaphragm：
Bioprotein flexible substrates and bioprotein diaphragm containing zone of heating are cut into preliminary dimension, size is 10
~10000 mm2;By hot padding mode, by the bioprotein flexible substrates containing zone of heating and bioprotein protection film edge
It is bonded together, hot padding temperature is 40 DEG C ~ 150 DEG C, the time is 1 ~ 60 minute.
As described above, implantable electronics heating module of the present invention, has the advantages that：
Can be used for postoperative antibacterial implantable electronics heating module the present invention relates to a kind of, it is possible to resolve existing based on antibiosis
Bacterial drug resistance raising, effect of drugs are not in time and not in place etc. based on the sterilized heat transmission of external heating in the antibacterial technology of element
A series of problems.Organism can be used directly for, good performance is respectively provided with various environmental disturbances, answered with preferable
Use DEVELOPMENT PROSPECT.
Brief description of the drawings
Fig. 1 is the schematic diagram provided by the present invention for postoperative antibacterial implantable electronics heating module.
1 is the schematic diagram of bioprotein flexible substrates in Fig. 1, and 2 is the schematic diagram of zone of heating, and 3 is biological protein protection film
Schematic diagram.
Fig. 2 is to be put into lab diagram in animal body for postoperative antibacterial implantable electronics heating module, and sample size is
1cm*1cm。
Fig. 3 is in postoperative antibacterial implantable electronics heating module implantation animal body, by an external line
Circle is wirelessly transferred energy, in animal body local heating.
Fig. 4 is to receive the heating after energy is taught in outside for postoperative antibacterial implantable electronics heating module
Figure, picture is that infrared thermoviewer shooting is formed.
Fig. 5 is for wirelessly heating sterilization in 10 minutes in postoperative antibacterial implantable electronics heating module implantation animal body
Effect, Control in figure:Room temperature, High Temp:49 DEG C, Low Temp: 42℃.
Specific embodiment
The present invention is better illustrated with reference to specific embodiment, but protection scope of the present invention not limited to this.
Step S1 is first carried out, fibroin solutions are prepared, the preparation method of the fibroin solutions is：
By molecular weight for the fibroin powder of 30-400kDa is dissolved in ultra-pure water.The fibroin is dispersed in super
Mode in pure water is that ultrasonic disperse or magnetic agitation are disperseed.The power of the ultrasonic disperse is 25 W ~ 500W, and frequency is
10kHz ~ 100 kHz, the time is 0.1h ~ 720h；The scattered mixing speed of magnetic agitation is 50r/min ~ 1500r/min,
Mixing time is 0.1h ~ 2400h.The fibroin solutions concentration is 1-100mg/mL.
Then, described fibroin electronics heating module, preparation process also has following steps：
Step S2, making fibroin flexible substrates；
A) fibroin solutions are upside down in substrate, volume used is 0.01-1 mL/cm2。
B) solution is waited to dry at room temperature and solidify, the time used is 1-48 hours.
C) by fibroin film stripping group bottom；
D) fibroin flexible substrates are obtained.
The curing mode is to be annealed using curing agent or vapor.Curing agent is methyl alcohol, and hardening time is 1 min ~ 120
min；Vapor annealing temperature is 4 DEG C ~ 100 DEG C, and the time is 0.1 h ~ 100 h, and pressure is -0.1 Pa ~ 101.325 kPa.
The stripping means is mechanical stripping.
Step S3, making fibroin diaphragm；
A) fibroin solutions are upside down in substrate, volume used is 0.01-1 mL/cm2。
B) solution is waited to dry at room temperature and solidify, the time used is 1-48 hours.
C) by fibroin film stripping group bottom；
D) fibroin diaphragm is obtained.
The curing mode is to be annealed using curing agent or vapor.Curing agent is methyl alcohol, and hardening time is 1 min ~ 120
min；Vapor annealing temperature is 4 DEG C ~ 100 DEG C, and the time is 0.1 h ~ 100 h, and pressure is -100 KPa of KPa ~ -25.It is described
Stripping means is mechanical stripping.
The zone of heating of step S4, preparation based on magnesium：
By way of vacuum sputtering, magnesium is deposited in fibroin flexible substrates by advance prepared mask plate,
Heating module in zone of heating（Including resistance and coil）Shape determine that the thickness of magnesium is 20- by the opening shape of mask plate
2000nm.By way of vacuum sputtering, magnesia is deposited on the fibroin flexible substrates of the resistance comprising magnesium and coil
On, the thickness of magnesia is 20-2000nm.
Step S5, fibroin flexible substrates and fibroin diaphragm comprising zone of heating are fitted together, step
It is as follows：
1）Fibroin flexible substrates containing zone of heating are cut into preliminary dimension, size is 2 ~ 100 mm2;
2）Fibroin diaphragm is cut into preliminary dimension, typically with above-mentioned bioprotein flexible substrates formed objects；
3）By hot padding mode mode, by the fibroin flexible substrates containing zone of heating and fibroin diaphragm side
Edge is bonded together, and hot padding temperature is 40 DEG C ~ 100 DEG C, and the time is 1 ~ 60 minute.
Embodiment 1：
First, step S1 is performed：Prepare fibroin solutions；
Specifically, in the present embodiment, the fibroin powder for taking 20mg purchases is dissolved in 20.00 mL water, by magnetic
Power stirring makes solution homogeneous, and rotating speed is 300r/min, the h of time 6.
Then fibroin solutions are upside down in the dimethyl silicone polymer substrate of horizontal positioned, dry and solidify.
Specifically, in the present embodiment, performing S2 and taking resulting fibroin solutions in 1mL steps S1,10cm is poured slowly into2
Dimethyl silicone polymer substrate on, 25 DEG C of normal pressures（0.1MPa）Under dry 1h, 1min is solidified in methyl alcohol.
The mode being by mechanically pulling off takes off fibroin flexible substrates and diaphragm from dimethyl silicone polymer substrate
From.
Perform S3 and take resulting fibroin solutions in 0.5mL steps S1, be poured slowly into 10cm2PDMS（Poly dimethyl
Siloxanes）In substrate, 25 DEG C of normal pressures（0.1MPa）Under dry 1h, 1min is solidified in methyl alcohol.
S4 is performed, the mask plate comprising resistance and coil dimension for realizing preparation is close to be placed on fibroin flexibility base
On bottom.The magnesium of 500nm is deposited in fibroin flexible substrates through mask plate by way of vacuum sputtering.Remove mask
Plate, the magnesia of 2000nm is deposited on the fibroin substrate of the resistance comprising magnesium and coil by way of vacuum sputtering
On.
S5 is performed, the fibroin flexible substrates containing zone of heating are cut into 10 * 10mm, can not broken in tailoring process
Resistance and loop construction in bad zone of heating.Fibroin diaphragm is cut into 10*10 mm, by fibroin flexible substrates
Alignd with fibroin diaphragm, by hot padding mode mode, by fibroin flexible substrates and silk containing zone of heating
Protein protection film edge is bonded together, and hot padding temperature is 40 DEG C, and the time is 5 minutes.
Above-mentioned packaged electronics heating module is placed under the skin of surgical wound, is then stitched by the regular flow of hospital
Close wound, with an external coil alignment of a diameter of 15mm near implanted electronics heating module, both centre distances are about
5mm, the alternating current that power is 100mW, frequency is 120MHz is applied to external coil, by way of near-field coupling, by energy
The electronic module of implanted is wirelessly transmitted to, is heated 10 minutes, temperature is about 42 DEG C（Low Temp, low temperature）, realize localized heat
It is sterilized.Power supply is then turned off, external coil is removed.Initial stage zoopery shows, can local bactericidal ~ 40%.
Embodiment 2：
First, step S1 is performed：Prepare fibroin solutions；
Specifically, in the present embodiment, the fibroin powder for taking 10g purchases is dissolved in 20.00 mL water, by magnetic
Power stirring makes solution homogeneous, and rotating speed is 300r/min, the h of time 6.
Then fibroin solutions are upside down in the Teflon substrates of horizontal positioned, dry and solidify.
Specifically, in the present embodiment, performing S2 and taking resulting fibroin solutions in 2mL steps S1,30cm is poured slowly into2
Teflon substrates on, 25 DEG C of normal pressures（0.1MPa）Under dry 24h, 120min is solidified in methyl alcohol.
The mode being by mechanically pulling off departs from fibroin flexible substrates and diaphragm from Teflon substrates.
S4 is performed, the mask plate comprising resistance and coil dimension for realizing preparation is close to be placed on fibroin flexibility base
On bottom.The magnesium of 5000nm is deposited in fibroin flexible substrates through mask plate by way of vacuum sputtering.Remove and cover
Lamina membranacea, by the nitride deposition of 5000nm in the resistance comprising magnesium and the fibroin substrate of coil by way of vacuum sputtering
On.
S5 is performed, the fibroin flexible substrates containing zone of heating are cut into 20*20 mm, can not broken in tailoring process
Resistance and loop construction in bad zone of heating.Fibroin diaphragm is cut into 20*20 mm, by fibroin flexible substrates
Alignd with fibroin diaphragm, by hot padding mode mode, by fibroin flexible substrates and silk containing zone of heating
Protein protection film edge is bonded together, and hot padding temperature is 150 DEG C, and the time is 60 minutes.
Above-mentioned packaged electronics heating module is placed under the skin of surgical wound, is then stitched by the regular flow of hospital
Close wound, with an external coil alignment of a diameter of 25mm near implanted electronics heating module, both centre distances are about
5mm, to external coil apply power be 500mW, frequency for 60MHz alternating current, by way of near-field coupling, by energy without
Line passes to the electronic module of implanted, heats 5 minutes, and temperature is about 49 DEG C（High Temp, high temperature）, realize that localized heat is killed
Bacterium.Power supply is then turned off, external coil is removed.Initial stage zoopery shows, locally can completely kill bacterium.
Embodiment 3：
First, step S1 is performed：Prepare fibroin solutions；
Specifically, in the present embodiment, the fibroin powder for taking 5g purchases is dissolved in 20.00 mL water, by magnetic force
Stirring makes solution homogeneous, and rotating speed is 300r/min, the h of time 6.
Then fibroin solutions are upside down in the dimethyl silicone polymer substrate of horizontal positioned, dry and solidify.
Specifically, in the present embodiment, performing S2 and taking resulting fibroin solutions in 1mL steps S1,20cm is poured slowly into2
Dimethyl silicone polymer substrate on, 25 DEG C of normal pressures（0.1MPa）Under dry 24h, 120min is solidified in methyl alcohol.
The mode being by mechanically pulling off takes off fibroin flexible substrates and diaphragm from dimethyl silicone polymer substrate
From.
S4 is performed, the mask plate comprising resistance and coil dimension for realizing preparation is close to be placed on fibroin flexibility base
On bottom.The iron of 100nm is deposited in fibroin flexible substrates through mask plate by way of vacuum sputtering.Remove mask
Plate, the silica of 300nm is deposited on the fibroin substrate of the resistance comprising iron and coil by way of vacuum sputtering
On.
S5 is performed, the fibroin flexible substrates containing zone of heating are cut into 15*15 mm2, can not be broken in tailoring process
Resistance and loop construction in bad zone of heating.Fibroin diaphragm is cut into 15*15 mm2, by fibroin flexible substrates
Alignd with fibroin diaphragm, by hot padding mode mode, by fibroin flexible substrates and silk containing zone of heating
Protein protection film edge is bonded together, and hot padding temperature is 90 DEG C, and the time is 10 minutes.
Above-mentioned packaged electronics heating module is placed under the skin of surgical wound, is then stitched by the regular flow of hospital
Close wound, with an external coil alignment of a diameter of 20mm near implanted electronics heating module, both centre distances are about
5mm, to external coil apply power be 300mW, frequency for 80MHz alternating current, by way of near-field coupling, by energy without
Line passes to the electronic module of implanted, heats 10 minutes, and temperature is about 49 DEG C（High Temp, high temperature）, realize that localized heat is killed
Bacterium.Power supply is then turned off, external coil is removed.Initial stage zoopery shows, locally can completely kill bacterium.
In sum, the present invention proposes a kind of simple and effective technical scheme, there is provided one kind has superior bio compatible
The preparation method that can be used for postoperative antibacterial implantable electronics heating module of property.Can solve existing based on the antibacterial skill of antibiotic
Bacterial drug resistance is improved in art, effect of drugs a series of is asked not in time and based on the sterilized heat transmission of external heating is not in place etc.
Topic.Organism can be used directly for, good performance is respectively provided with various environmental disturbances, before preferable application and development
Scape.With fine application and development prospect.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
The personage for knowing this technology all can carry out modifications and changes under without prejudice to spirit and scope of the invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete with institute under technological thought without departing from disclosed spirit such as
Into all equivalent modifications or change, should be covered by claim of the invention.
Claims (8)
1. a kind of implantable heating module, it is characterised in that the implantable heating module includes bioprotein flexibility base
Bottom, zone of heating and bioprotein diaphragm；The bioprotein flexible substrates, zone of heating and bioprotein diaphragm are biology
Absorbable material；The mode of operation of the implantable heating module is wireless heating mode；
The implantable heating module follows the steps below preparation：
（1）Prepare bio-flexible substrate and bioprotein diaphragm with good biocompatibility：
A. bioprotein solution is prepared：
Bioprotein is dissolved in ultra-pure water, wherein optional bioprotein includes fibroin, deer horn albumen, spider silk protein
In vain；Described bioprotein solution concentration is 1-500mg/mL；
B. bioprotein film is prepared：
Bioprotein solution is upside down in substrate, waits solution to dry at room temperature and solidify, then shell bioprotein film
From substrate, bioprotein substrate and bioprotein diaphragm are respectively obtained；
（2）Prepare the zone of heating with good biocompatibility：
Resistance and coil are placed on step（1）In prepared bioprotein flexible substrates, coil head and the tail two ends and resistance
Two ends are communicated, and realize being electrically connected, and insulating materials is placed on above-mentioned resistance and coil again then；
Wherein resistance, coil and insulating materials are placed by way of thin film deposition；
（3）By bioprotein flexible substrates, processing zone of heating on a flexible substrate and the assembling of bioprotein diaphragm：
Bioprotein flexible substrates and bioprotein diaphragm containing zone of heating are cut into preliminary dimension respectively；By hot pressing
India side formula, the bioprotein flexible substrates containing zone of heating and bioprotein protection film edge are bonded together；
Step（3）Described in the bioprotein flexible substrates containing zone of heating and bioprotein diaphragm size for 10 ~
10000 mm2, thickness is 0.02-5mm.
2. a kind of implantable heating module according to claim 1, it is characterised in that step（1）In biological egg used
The ratio of white and substrate is 0.01-1 mL/cm2, and wherein substrate is glass, silicon chip, PDMS（Dimethyl silicone polymer）Or
Teflon。
3. a kind of implantable heating module according to claim 1, it is characterised in that step（1）Described in when drying
Between be 1-48 hours；The curing mode is to be annealed using curing agent or vapor；Curing agent is methyl alcohol, and hardening time is 1
min~120 min；Vapor annealing temperature be 4 DEG C ~ 100 DEG C, the time be 0.1 h ~ 100 h, pressure be 0.1 Pa ~
101.325 kPa。
4. a kind of implantable heating module according to claim 1, it is characterised in that step（1）Described in stripping side
Method is mechanical stripping.
5. a kind of implantable heating module according to claim 1, it is characterised in that step（2）Described in resistance and
The metal deposit thickness of coil is 20-5000nm；The material of the resistance and coil is magnesium, silicon or iron；The insulating materials
The thickness of deposition is 10-10000nm；Insulating materials is silica, magnesia, silicon nitride or fibroin.
6. a kind of implantable heating module according to claim 1, it is characterised in that step（2）Described in deposition
Mode is that vacuum evaporation, sputter coating or whirl coating are smeared.
7. a kind of implantable heating module according to claim 1, it is characterised in that step（3）Described in hot padding
Temperature is 40 DEG C ~ 150 DEG C, and the time is 1 ~ 60 minute.
8. a kind of implantable heating module according to claim 1, it is characterised in that described implantable heated mould
Block is used for by near-field coupling, and it is antibacterial that the wireless mode for heating carries out postoperative localized hyperthermia.
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| EP2559101B1 (en) * | 2010-04-12 | 2016-02-24 | Tufts University | Silk electronic components |
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