CN104427850A - 零件安装线操作方法 - Google Patents
零件安装线操作方法 Download PDFInfo
- Publication number
- CN104427850A CN104427850A CN201410038232.6A CN201410038232A CN104427850A CN 104427850 A CN104427850 A CN 104427850A CN 201410038232 A CN201410038232 A CN 201410038232A CN 104427850 A CN104427850 A CN 104427850A
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- China
- Prior art keywords
- hookup wire
- chip mounter
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- result
- part hookup
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000005457 optimization Methods 0.000 claims abstract description 65
- 238000004364 calculation method Methods 0.000 claims description 21
- 230000009467 reduction Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 4
- 238000011900 installation process Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 238000003860 storage Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- General Factory Administration (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130106674A KR20150028053A (ko) | 2013-09-05 | 2013-09-05 | 부품 실장 라인 운영 방법 |
KR10-2013-0106674 | 2013-09-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104427850A true CN104427850A (zh) | 2015-03-18 |
CN104427850B CN104427850B (zh) | 2018-02-09 |
Family
ID=
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100402965B1 (ko) * | 1997-07-25 | 2004-01-24 | 삼성테크윈 주식회사 | 표면실장기에서의 피더배치 최적화방법 |
CN1596567A (zh) * | 2001-09-28 | 2005-03-16 | 松下电器产业株式会社 | 最优化装置、安装装置和电子部件安装系统 |
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100402965B1 (ko) * | 1997-07-25 | 2004-01-24 | 삼성테크윈 주식회사 | 표면실장기에서의 피더배치 최적화방법 |
CN1596567A (zh) * | 2001-09-28 | 2005-03-16 | 松下电器产业株式会社 | 最优化装置、安装装置和电子部件安装系统 |
Also Published As
Publication number | Publication date |
---|---|
KR20150028053A (ko) | 2015-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: Samsung Techwin Co.,Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: Free format text: CORRECT: APPLICANT; FROM: SAMSUNG TAI KEWEI CO., LTD. TO: HANWHA TECHWIN CO., LTD. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Gyeongnam Changwon City, South Korea Patentee after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA TECHWIN Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190415 Address after: Gyeongnam Changwon City, South Korea Patentee after: Hanwha Precision Machinery Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA AEROSPACE Co.,Ltd. |