CN104425110A - Coil structure and production method thereof - Google Patents
Coil structure and production method thereof Download PDFInfo
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- CN104425110A CN104425110A CN201310399381.0A CN201310399381A CN104425110A CN 104425110 A CN104425110 A CN 104425110A CN 201310399381 A CN201310399381 A CN 201310399381A CN 104425110 A CN104425110 A CN 104425110A
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Abstract
The invention discloses a coil structure and a production method thereof. The coil structure comprises a plurality of conducting plates and an insulating layer. The conducting plates are piled on one another and electrically connected to form the coil structure. The conducting plates are made of copper foil by the method of stamping forming, and the shape of the conducting plates is formed by spiral surrounding by at least one circle. Therefore, the coil structure is able to lower the skin effect generated by copper wires, also able to decrease the entirety height of inductance element products, and further able to protect the insulating paint films from damage during the production of the coil structure.
Description
Technical field
The present invention relates to a kind of coil manufacturing technology, particularly a kind of loop construction being applied to inductance element and preparation method thereof.
Background technology
The electronic component of loop construction designs the change for resisting electric current usually, and such as, when electric current can produce magnetic field through during inductor, and changes of magnetic field can be brought out voltage and changed and the change suppressing electric current, and namely the ability of this suppression curent change is called inductance.
Inductance is a kind of passive device, and it basic composition is magnetic core and coil.Current inductance manufacturer is for the making of this loop construction, and the various winding mode of many uses completes coiling to make the coil in inductance element.Before winding process, first must make the copper cash of coiling.The ductility that the making system of copper cash utilizes copper raw material itself to have, utilizes equipment repeatedly to be stretched by copper raw material and makes the copper cash of required wire diameter size.After completing drawing work, copper cash must be carried out insulation processing, namely be coated with insulating varnish on copper cash.Complete coating insulating varnish after copper line surface, because insulating varnish is liquid, therefore must carries out baking operation, insulating varnish is dried, depending on copper cash in order to do making insulating varnish.This kind coating-baking operation can be passed through repeatedly, depends on integrity degree on copper cash, avoid insulating varnish crawling to cause copper cash to expose, and have the possibility of short circuit to increase insulating varnish.After completing above-mentioned stretching, coating, baking operation, this copper wire winding can be become the coil of inductance element.
But the situation that the loop construction made by this kind of winding process still has short circuit occurs.When its reason is to use artificial or equipment coiling, copper cash has ductility and can suitably extend, but the ductility of insulation paint film is also good not as copper cash, therefore once copper cash extend degree exceed insulation paint film institute energy load degree, namely this insulation paint film likely can be destroyed, and copper cash is exposed, easily cause coil short, and then affect the characteristic of whole inductance element; Or after the extension of insulation paint film, its lower thickness, makes loop construction in use, insulation paint film must be born and easily come off and have the risk of short circuit, indirectly reduce the quality of inductance element.
Moreover, using copper cash as the conductor of loop construction, because of the impact of conductor temperature, the heat produced at conductor resistance is not easily dispersed, and conductive surface is due to rapid heat dissipation, and temperature can be lower relative to conductor, valence electron exploitation speed is low, cause electronics path relatively roomy, therefore conductive surface resistance is less, thus produces kelvin effect; In addition, when electronics moves in wire, supervene magnetic field in the vertical direction of its motion, and other electronics progressively move on guiding line top layer at magnetic fields, also have the generation of kelvin effect.So-called kelvin effect, circulate in " skin " position that namely electrons concentrates on conductor, the core of conductor does not almost have electric current to pass through.In other words, electronics is not evenly distributed in the sectional area of whole conductor, and this cross section being equivalent to wire reduces, resistance increases, and therefore kelvin effect can make the effective resistance of conductor increase, and remote-effects are to the operating efficiency of inductance element.In addition, winding process also additionally must use artificial or equipment, and extra artificial or equipment also can increase the cost of manufacturers produce virtually.
Summary of the invention
In view of the disappearance of above-mentioned prior art, the object of the present invention is to provide a kind of loop construction and preparation method thereof, to solve the kelvin effect may destroyed insulation paint film when carrying out winding process and cause the problem of short circuit, effectively reduction copper cash to produce, and save cost of manufacture and promote the quality of inductance element.
For reaching aforementioned object and other objects, the present invention proposes a kind of loop construction, is applied in inductance element, comprises: several guide cards, and those guide cards form at least one loop in the mode of spiral surrounding; And insulating barrier, to be arranged on those guide cards and to expose the two ends of those guide cards, making the two ends of those guide cards of this insulating barrier not coated form solder joint respectively; Wherein, those guide cards stack mutually, and the mode that the guide card that those stack mutually utilizes a solder joint of the superiors' guide card to be electrically connected another solder joint of a time guide card is sequentially electrically connected to orlop guide card downwards, to form this loop construction, and the solder joint system be not electrically connected in those guide cards mutually stacked is as the pin of this loop construction.
Secondly, the present invention proposes a kind of manufacture method of loop construction, comprise the following steps: A, Copper Foil is made several guide cards with impact forming method, and those guide cards forms at least one loop in the mode of spiral surrounding; B, insulating barrier is coated with invests on those guide cards, and expose two ends of those guide cards, make two ends of those guide cards of this insulating barrier not coated form solder joint respectively; C, each of those guide cards to be stacked mutually, and the mode utilizing a solder joint of the superiors' guide card in those guide cards to be electrically connected another solder joint of a time guide card is sequentially electrically connected to orlop guide card downwards, to form this loop construction, the flow direction in the loop construction that electric current is formed in the guide card that those stack mutually is all clockwise or counterclockwise; And D, by the outside of this loop construction this insulating barrier coated again, and expose the solder joint that is not electrically connected in those guide cards pin as this loop construction.
Compared to prior art, loop construction of the present invention and preparation method thereof, when effectively can solve coiling in prior art, may destroy insulation paint film and have the problem of coil short; Or avoid because of after insulation paint film extends, the lower thickness of insulation paint film and have easily to come off and cause the problem of short circuit, and the kelvin effect that effectively can reduce that copper cash produces.
Accompanying drawing explanation
Fig. 1 is the decomposing schematic representation of the first embodiment of loop construction of the present invention.
Fig. 2 is the decomposing schematic representation of the second embodiment of loop construction of the present invention.
Fig. 3 is the decomposing schematic representation of the 3rd embodiment of loop construction of the present invention.
Fig. 4 is the combination schematic diagram of the 3rd embodiment of loop construction of the present invention.
Fig. 5 is the decomposing schematic representation of the 4th embodiment of loop construction of the present invention.
Fig. 6 is the flow chart of the manufacture method of loop construction of the present invention.
Fig. 7 is the decomposing schematic representation of the 5th embodiment of loop construction of the present invention.
Embodiment
Below by way of particular specific embodiment, technology contents of the present invention is described, the personage haveing the knack of this technology can understand other advantages of the present invention and effect easily by content disclosed in the present specification, is also implemented by other different specific embodiments or applies.
Fig. 1 is the decomposing schematic representation of the first embodiment of loop construction of the present invention.The invention provides a kind of loop construction be applied in inductance element, comprise several guide cards and insulating barrier.In the present embodiment, loop construction cording has two guide cards 11,12 and is coated with the insulating barrier 13 invested on those guide cards 11,12, and this insulating barrier 13 insulating material forms, and is in a liquid state when coated, is the insulating barrier of solid after solid.And those guide cards 11,12 expose those guide cards 11,12 respectively after coated insulating barrier 13 at its two ends.In other words, insulating barrier 13 is that part painting invests on guide card 11,12, and not coated part then uses as solder joint.Such as, the not coated insulating barrier 13 of solder joint 111,112 at guide card 11 two ends is positioned at; Be positioned at the solder joint 121,122 at guide card 12 two ends, solder joint 112 and solder joint 122 are electrically connected the not coated insulating barrier 13 in face, place, therefore are not electrically connected face, place and are then coated with insulating barrier 13, as shown in solder joint in Fig. 1 122.In other words, guide card 12 is stack on guide card 11.
The main material of guide card 11,12 is Copper Foil, and the mode made adopts hardware terminal forming technique, directly Copper Foil is made guide card 11,12 with impact forming method.And the stamping forming shape of guide card 11,12, guide card 11,12 is made to form at least one loop in the mode of spiral surrounding, and each guide card copline ground of those guide cards 11,12 is around this loop of formation, namely guide card 11 entirety system is positioned at same level, guide card 12 is also identical, and this is caused by impact forming method.In the present embodiment, namely guide card 11 extends from solder joint 111, changes bearing of trend, and extend internally gradually through several turning point 14, just like the spiral inwardly rotated.And guide card 11 forms the spiral of at least one loop, refer to through turning point 14 reach more than four.Namely guide card 11 shown in Fig. 1 has seven turning points 14, and the turning angle of those turning points 14 is 90 degree, and therefore guide card 11 inwardly spiral surrounding three loops of one and four point, form the square that has inside spin.But the present invention is not limited with the turning angle of the number of turns of the quantity of turning point 14, loop, turning point 14.Guide card 11 shown in Fig. 1 also only can have four, five turning points, as long as guide card 11,12 forms the polygon of at least one loop in the mode of spiral surrounding.In addition, polygon also can be triangle, pentagon etc.If triangle, then turning angle is 60 degree, and the quantity of turning point is at least more than three; If pentagon, then turning angle is 108 degree, and the quantity of turning point is at least more than five.
And the direction of spiral surrounding, inside spiral surrounding is to solder joint 112 by solder joint 111 for guide card 11, and direction is clockwise; Inside spiral surrounding is to solder joint 122 by solder joint 121 for guide card 12, and direction is counterclockwise.Mutually stacked to form loop construction of the present invention by those guide cards 11,12, what such as stacked by guide card 12 in guide card 11 is upper, and the solder joint 122 of guide card 12 is electrically connected the solder joint 112 of guide card 11.The solder joint 111 of the guide card 11 be not electrically connected and the solder joint 121 of guide card 12, then as the pin of loop construction.Complete guide card 11,12 stack be electrically connected and form loop construction after, at the outer coated insulating barrier 13 again of this loop construction, because solder joint 111,121 must as the pin of loop construction, therefore again this insulating barrier 13 coated time to note can not being coated on solder joint 111,121.In the present embodiment, so-called electric connection can use scolding tin and electric iron to be linked together by solder joint 112,122, also can adopt after solder joint 112,122 is contacted and make the circuit for conducting between solder joint 112,122 in the outside coated fixing glue of solder joint 112,122, the present invention is not limited in the mode be electrically connected.Due to guide card 11 inwardly spiral surrounding direction be clockwise, guide card 12 inwardly spiral surrounding direction be counterclockwise, therefore after mutually being stacked by guide card 11,12 and forming loop construction, the flow direction of electric current in this loop construction can be same direction.Such as electric current flows into from solder joint 111, when flowing out from solder joint 121, its flow direction is all clockwise in guide card 11,12, otherwise is counterclockwise.And in FIG, the solder joint 111,121 of guide card 11,12 perpendicular to guide card 11,12 stretch out formed after, start inside spiral surrounding again to solder joint 112,122, in order to designed by SMD processing procedure, reason is that this kind is perpendicular to the outward extending design of guide card, can be concaved solder joint 111,121 folding, to form the conventional inductance element external form of SMD processing procedure; But pin also can be designed to the electronic component of plug-in type by loop construction of the present invention, refers to shown in Fig. 2.In fig. 2, the solder joint 111,121 of guide card 11,12 is not perpendicular to guide card 11,12, but directly as the starting point to inside spin, inside spiral surrounding is to solder joint 111,121, the inductance element that this kind design is formed, namely two pins are had can to insert in the boring of pcb board, for follow-up soldering.Therefore, the pin of loop construction of the present invention, the visual demand that will be designed to SMD use or general plug-in type, decide to adopt the shape of solder joint 111,121 in Fig. 1 or Fig. 2, the present invention is not as limit.
In the present embodiment, guide card 11,12 is by Copper Foil with the flat pattern made by impact forming method, and the thickness of guide card 11,12 is thinner compared to the diameter of copper cash of the prior art.The diameter being flat pattern and its Thickness Ratio copper cash of the prior art by guide card 11,12 also wants thin technical characteristic, the inevitable kelvin effect that can produce lower than copper cash of the prior art of the kelvin effect that it produces.Therefore, loop construction of the present invention is compared to copper cash of the prior art, and the operating efficiency of inductance element can be better.In addition, guide card 11,12, when forming loop construction, does not need the guide card 11,12 that extends again, but is directly mutually stacked by guide card 11,12 and be electrically connected solder joint 112,122 to form loop construction.Therefore, when can avoid coiling in prior art, the problem of insulation paint film may be destroyed; Or extend insulation paint film after, its lower thickness and have hold caducous problem, can more effectively prevent the situation of short circuit from occurring.
Fig. 3 is the decomposing schematic representation of the 3rd embodiment of loop construction of the present invention, and Fig. 4 is the combination schematic diagram of the 3rd embodiment of loop construction of the present invention, please refer to the 3rd, 4 figure.In the present embodiment, guide card 31,32,33,34,37,38 is for mutually to stack composition loop construction, and those coated insulating barriers 35 of guide card 31,32,33,38 upper part expose the two ends of those guide cards 31,32,33,38, make the two ends of those guide cards 31,32,33,38 of this insulating barrier 35 not coated form solder joint 311,312,321,322,331,332,381.The another guide card 37,34 be not coated with insulating barrier also has solder joint 371,341,342.
When stacking into loop construction, guide card 34 is placed in orlop, more sequentially stacks guide card 38,33,32,37, finally stack on guide card 37 by guide card 31, guide card 31 is the superiors.The spiral surrounding direction of those guide cards 31,32,33,34, guide card 31 be namely from solder joint 311 inside spiral surrounding to solder joint 312, namely guide card 33 is that inside spiral surrounding is to solder joint 332 from solder joint 331, and both guide cards 31,33 are all clockwise Indian club circle inwards; And namely guide card 32 is that inside spiral surrounding is to solder joint 322 from solder joint 321, namely guide card 34 is that inside spiral surrounding is to solder joint 342 from solder joint 341, and both guide cards 32,34 are all counterclockwise Indian club circle inwards.When mutually stacking, also be intersect with suitable, counterclockwise guide card the mode stacked, this is the flow direction in order to make electric current in loop construction is same direction, and electric current flows into from solder joint 311, when flowing out from solder joint 341, its flow direction is all clockwise, otherwise is counterclockwise.
In the present embodiment, as the thickness of the guide card of this loop construction pin, the thickness of other guide cards must be less than.Specifically, the thickness H1 of guide card 31,34 must be less than the thickness H2 of guide card 32,33.Because the thickness of Copper Foil is thicker, the DC impedance of its Copper Foil will be less, but the thick i.e. bad bending of thickness.Guide card 31,34 has solder joint 311,341 must as the pin of loop construction respectively, and in order to be easy to bending in response to pin, reduce and flatten or the processing process such as impression, therefore the thickness H1 of guide card 31,34 must be thinned to and can bend.The thickness H2 of guide card 32,33 in addition, being to reduce DC impedance, must having certain thickness.Therefore the design that guide card 31,34 thickness H1 must be less than guide card 32,33 thickness H2 must be adopted, so that thickness and be easy to bending between obtain a balance point, such as guide card 31,34 thickness be designed between 0.2 ~ 0.3cm, the design of guide card 32,33 thickness is at about 0.8cm, and adopt the guide card that impact forming method makes, its thickness can reach unanimity.In addition, prevent the impact that the different institute of guide card thickness brings electric current, the present invention lies in guide card and is pasted with guide card 37 again 31 times and makes both be electrically connected, and the shape of guide card 37 is consistent with guide card 31, and the joint face of guide card 37 and guide card 31 there is no coated insulating barrier.Therefore after guide card 37 is incorporated into guide card 31, the thickness (H1) that can obtain solder joint 311 is the thickness (H1+H3) being thinner than guide card after the combination except solder joint 311, such as guide card 31 thickness is 0.2cm, guide card 32 thickness is 0.8cm, then guide card 37 thickness can be designed to 0.6cm, thickness (H1+H3) after making guide card 37 combine guide card 31, can be identical with the thickness (H2) of other guide cards 32,33.Thus, the thickness of the solder joint 311 of guide card 31, is namely thinned to and can bends, and also can not be different because of thickness between guide card, and has DC impedance difference to cause the phenomenon of electric current shakiness.Another guide card 37 not must be attached between guide card 31 and guide card 32, also can be attached on guide card 31, and namely as the outermost layer of loop construction, the present invention is not as limit.Guide card 34 and the design of guide card 38, be also same as guide card 31 and guide card 37, do not repeat them here.
The loop construction that such thickness forms, time in prior art with the coil of copper wire winding same number of turns, loop construction whole height of the present invention must be less than with the coil of copper wire winding in prior art, and its reason is that copper thickness of the present invention is less than the diameter of copper cash in prior art.Therefore, adopt the inductance element that loop construction of the present invention forms, also can effectively reduce product height.
Form loop construction in the present embodiment, solder joint 371 is electrically connected solder joint 322, solder joint 321 is electrically connected solder joint 331, solder joint 332 is electrically connected solder joint 381.Should be noted that, must intercept with insulating barrier between two solder joints of non-electric connection, namely between solder joint 322 and solder joint 332 must coated insulating barrier 35(figure do not show), in order to avoid make two solder joints 322,332 that originally should not contact contact, and affect the characteristic of whole inductance element.In brief, the side be electrically connected between solder joint, namely can not coated insulating barrier; The another side of non-electric connection, then want coated insulating barrier.Though the present embodiment is using six guide cards as explanation, loop construction is formed as wanted multilayer guide card, as long as what increase guide card 32,33 again is combined between guide card 32,33, as long as guarantee there is coated insulating barrier between each guide card to prevent short circuit, the present invention does not limit the number of guide card, and the 3rd all the other technological means of embodiment are also identical with the first embodiment, do not repeat them here.In addition, the solder joint between guide card is dislocation design.So-called dislocation design, be namely the solder joint that is electrically connected of one group and another organize the solder joint be electrically connected, be not positioned at same position both it.Such as, after solder joint 321 and solder joint 331 are electrically connected, not correspond to the position after solder joint 322 or solder joint 332 electric connection, but have the segment distance that staggers.This has been when preventing solder joint to be electrically connected, and is coated on insulating barrier on solder joint if any coated inequality, can cause the solder joint that should not be electrically connected and have the situation of electric connection, and then causes short circuit and lose the effect of coil.Therefore, part solder joint of the present invention can be the coated insulating barrier of one side, and is dislocation design, to prevent the situation of above-mentioned short circuit.Fig. 7 is the decomposing schematic representation of the 5th embodiment of loop construction of the present invention.In the figure 7, using six guide cards 71,72,73,74,75,76 as explanation, and also can recognize that solder joint 712,722,721,732,731,741,742,752,751,762 of the present invention is for dislocation design in the present embodiment, and be the coated insulating barrier 77 of one side, solder joint 711,761 pins as this loop construction.The present invention does not limit the number of guide card.
Guide card of the present invention does not need to be limited to the polygonal form with turning point yet, can be circle, as shown in Figure 5 yet.In this embodiment, guide card 51 from solder joint 511 with circle shape clockwise direction in around to solder joint 512, guide card 51 be coated with except solder joint 511,512 except has insulating barrier 53; Guide card 52 be from solder joint 521 with circle the counterclockwise Indian club circle inwards of shape to solder joint 522, guide card 52 be coated with except solder joint 521,522 except has insulating barrier 53.And guide card 51,52 is around more than at least one loop.The present embodiment and other embodiment differences aforesaid are only not have turning point, and all the other technical characteristics are all identical, do not repeat them here.
In the manufacture method of loop construction of the present invention, refer to the flow chart that Fig. 6 discloses.Copper Foil is made several guide cards with impact forming method by step S01, and those guide cards form at least one loop in the mode of spiral surrounding; Insulating barrier is coated with to invest on those guide cards and to expose the two ends of those guide cards by step S02, makes the two ends of those guide cards of this insulating barrier not coated form solder joint respectively; Those guide cards are stacking by step S03 mutually, and the mode utilizing a solder joint of the superiors' guide card in those guide cards to be electrically connected another solder joint of a time guide card is sequentially electrically connected to orlop guide card downwards, to form this loop construction, the flow direction in the loop construction that electric current is formed in the guide card that those stack mutually is all clockwise or counterclockwise; Step S04 is by the outside of this loop construction this insulating barrier coated again, and exposes outside the solder joint that is not electrically connected in those guide cards pin as this loop construction.
In step S01, the spiral-shaped polygon for comprising circle or more than four turning points that those guide cards are formed, in the present embodiment, the turning angle of turning point is 90 degree, to form the foursquare guide card around shape, but the present invention is not as limit, and those guide card copline ground are around this loop of formation.In step S03, those guide cards are stacked mutually, as the thickness of the guide card of this loop construction pin, be less than the thickness of other guide cards of loop construction.In order to allow the solder joint be not electrically connected in guide card, easily can bend and must not flatten or the processing process of impression.And in step S04, coated insulating barrier is the thickness in order to reinforced insulation layer again, prevent from coming off cause the risk of short circuit because insulating barrier crossing Bao Eryou.And coated insulating barrier also can make the outward appearance of whole coil structure reach unanimity again, can increase attractive in appearance and integrity degree.
In sum, loop construction provided by the present invention and preparation method thereof, when effectively can solve coiling in prior art, may destroy insulation paint film and have the problem of coil short; Or avoid because of after insulation paint film extends, the lower thickness of insulation paint film and have easily to come off and cause the problem of short circuit, and the kelvin effect that effectively can reduce that copper cash produces.And the present invention adopts impact forming method, also can avoid as winding process of the prior art must adopt extra artificial or equipment, to save cost of manufacture.In addition, disclosed guide card thickness is thinner than copper wire diameter of the prior art, therefore adopt the inductance element that loop construction of the present invention forms, the inductance element of winding mode is adopted by its whole height system lower than prior art coil, and can have better sales advantage.
The various embodiments described above are illustrative principle of the present invention and effect only, but not for limiting the present invention.Any personage haveing the knack of technique all without prejudice under spirit of the present invention and category, can carry out modifying to above-described embodiment and changes.Therefore, the scope of the present invention, should listed by follow-up claim.
Claims (10)
1. a loop construction, is applied in inductance element, it is characterized in that, comprising:
Several guide cards, those guide cards form at least one loop in the mode of spiral surrounding; And
Insulating barrier, to be arranged on those guide cards and to expose the two ends of those guide cards, making the two ends of those guide cards of this insulating barrier not coated form solder joint respectively;
Wherein, those guide cards stack mutually, and the mode that the guide card that those stack mutually utilizes a solder joint of the superiors' guide card to be electrically connected another solder joint of a time guide card is sequentially electrically connected to orlop guide card downwards, to form this loop construction, and the solder joint be not electrically connected in those guide cards mutually stacked is as the pin of this loop construction.
2. loop construction according to claim 1, is characterized in that, the spiral-shaped polygon for comprising circle or more than four turning points that those guide cards are formed.
3. loop construction according to claim 2, is characterized in that, the turning angle of those turning points is 90 degree.
4. loop construction according to claim 1, is characterized in that, those guide cards are by Copper Foil with made by impact forming method, and those guide card copline ground are around this loop of formation.
5. loop construction according to claim 1, is characterized in that, the flow direction in the loop construction that the guide card that electric current stacks mutually at those is formed all is all clockwise or counterclockwise.
6. loop construction according to claim 1, is characterized in that, the thickness as the guide card of the pin of this loop construction is less than the thickness of other guide cards of this loop construction.
7. a manufacture method for loop construction, is characterized in that, comprises the following steps:
A, Copper Foil is made several guide cards with impact forming method, and those guide cards form at least one loop in the mode of spiral surrounding;
B, insulating barrier is coated with invests on those guide cards, and expose the two ends of those guide cards, make the two ends of those guide cards of this insulating barrier not coated form solder joint respectively;
C, those guide cards to be stacked mutually, and the mode utilizing a solder joint of the superiors' guide card in those guide cards to be electrically connected another solder joint of a time guide card is sequentially electrically connected to orlop guide card downwards, to form this loop construction, the flow direction in the loop construction that electric current is formed in the guide card that those stack mutually is all clockwise or counterclockwise; And
D, by the outside of this loop construction this insulating barrier coated again, and expose the solder joint that is not electrically connected in those guide cards pin as this loop construction.
8. the manufacture method of loop construction according to claim 7, is characterized in that, each of those guide cards formed spiral-shaped be the polygon comprising circle or more than four turning points.
9. the manufacture method of loop construction according to claim 8, is characterized in that, the turning angle of those turning points is 90 degree.
10. the manufacture method of loop construction according to claim 7, is characterized in that, the thickness as the guide card of this loop construction pin is less than the thickness of other guide cards of this loop construction, and those guide card copline ground are around this loop of formation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310399381.0A CN104425110A (en) | 2013-09-05 | 2013-09-05 | Coil structure and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310399381.0A CN104425110A (en) | 2013-09-05 | 2013-09-05 | Coil structure and production method thereof |
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| CN104425110A true CN104425110A (en) | 2015-03-18 |
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| CN201310399381.0A Pending CN104425110A (en) | 2013-09-05 | 2013-09-05 | Coil structure and production method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511183A (en) * | 2018-03-07 | 2018-09-07 | 东莞领益精密制造科技有限公司 | Wireless charging coil manufacturing process |
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| JPS61166013A (en) * | 1985-01-17 | 1986-07-26 | Sharp Corp | Coil body |
| JP2007012969A (en) * | 2005-07-01 | 2007-01-18 | Shinji Kudo | Laminated coil and method for manufacturing the same |
| CN201348924Y (en) * | 2009-02-10 | 2009-11-18 | 田先平 | Planar transformer winding |
| US20110254649A1 (en) * | 2010-04-16 | 2011-10-20 | World Properties, Inc. | Integral planar transformer and busbar |
| CN203521126U (en) * | 2013-09-05 | 2014-04-02 | 重庆美桀电子科技有限公司 | Coil structure |
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- 2013-09-05 CN CN201310399381.0A patent/CN104425110A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61166013A (en) * | 1985-01-17 | 1986-07-26 | Sharp Corp | Coil body |
| JP2007012969A (en) * | 2005-07-01 | 2007-01-18 | Shinji Kudo | Laminated coil and method for manufacturing the same |
| CN201348924Y (en) * | 2009-02-10 | 2009-11-18 | 田先平 | Planar transformer winding |
| US20110254649A1 (en) * | 2010-04-16 | 2011-10-20 | World Properties, Inc. | Integral planar transformer and busbar |
| CN203521126U (en) * | 2013-09-05 | 2014-04-02 | 重庆美桀电子科技有限公司 | Coil structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108511183A (en) * | 2018-03-07 | 2018-09-07 | 东莞领益精密制造科技有限公司 | Wireless charging coil manufacturing process |
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