CN104423173B - Alignment measurement apparatus and method - Google Patents

Alignment measurement apparatus and method Download PDF

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CN104423173B
CN104423173B CN201310379994.8A CN201310379994A CN104423173B CN 104423173 B CN104423173 B CN 104423173B CN 201310379994 A CN201310379994 A CN 201310379994A CN 104423173 B CN104423173 B CN 104423173B
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light
diffraction
measurement apparatus
diffraction light
senior
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CN104423173A (en
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陆海亮
王帆
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Shanghai Micro Electronics Equipment Co Ltd
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Abstract

The invention discloses a kind of alignment measurement apparatus and method, be used for detecting overlay error, this device includes: light source, is used for providing illuminating bundle;Object lens, for illuminating bundle converges to testing sample, and collect the diffraction light on testing sample surface;Spatial light modulator, is positioned at objective lens pupil face, passes through for controlling the diffracted beam of different diffraction level time;First spectrogrph, for measuring the diffraction light spectrum by spatial light modulator.The present invention measures by using spectral measurement to substitute angular spectrum, reduces the impact that the diffraction light correspondence order of diffraction time asymmetry is measured by illumination heterogeneity;Meanwhile, use the first spectrogrph that the most at the same level diffraction light is measured, reduce the impact that during angular spectrum is measured, the diffraction light correspondence order of diffraction time asymmetry is measured by ccd detector sensitivity heterogeneity.

Description

Alignment measurement apparatus and method
Technical field
The present invention relates to IC manufacturing field, particularly to a kind of alignment measurement apparatus and method.
Background technology
According to ITRS(ITRS) the lithography measurements Technology Roadmap that is given, along with litho pattern CD chi Little progress enters the extensive application of 22nm and following process node, particularly double exposure (Double Patterning) technology, to set The required precision that quarter (overlay) measures comes into sub-nm regime.Due to the restriction of the imaging resolution limit, traditional base Alignment in imaging and image recognition measures technology the most gradually can not meet the requirement that alignment is measured by new process node.Based on The alignment of diffraction light detection measures technology (DBO, Diffraction-Based overlay) the most progressively becomes the one of alignment measurement Plant the important means of supplementing out economy.
DBO is broadly divided into two big classes, and a class is referred to as DBO technology based on model, and such technology is by overlay mark CD, side wall angle (SWA), height and alignment parameter strictly model, and are calculated theoretical diffraction spectrum, by measured value with theoretical Value carries out contrast and extracts alignment parameter.As long as the major advantage of this kind of technology is that a labelling just can record a side in principle To alignment value, thus labelling cost is relatively low;But, measure due to alignment and need to extract the position deviation between two-layer graphic structure, A large amount of unknown parameters in this double-layer structure are both needed to when modeling embody, and make the calculating cost of modeling be greatly improved, usual one The computing cluster of tens CPU needs several days time to be modeled a layer pattern structure, along with the increase of the figure number of plies, modeling Time will increase in geometric index.Secondly, crosstalk the most mutually between these unknown parameters and alignment parameter, make measured value with theoretical When value is made comparisons, it is impossible to correct extraction alignment parameter.Therefore, this technology calculates cost, time, parameter extraction precision etc. due to it Reason, applies the most aborning.
Another kind of referred to as DBO technology based on experience, such technology directly uses lowfunction matching diffraction light diffraction to imitate Rate, with the situation of change of alignment parameter, by gathering signal on the labelling of multiple different predetermined deviation (offset), calculates To alignment parameter.This kind of technology common are two kinds of measuring methods, and a kind of method measures 0 order diffraction light spectrum of incident illumination many Signal on the individual labelling with certain predetermined deviation.Due to 0 order diffraction signal with alignment parameter be even function change, can use These signals of method matching such as quadratic function are in the hope of alignment value.The calculating cost of this method is almost nil, and can use tradition Reflectometer measure.But owing to diffraction light even function signal intensity is more complicated, multiple overlay mark need to be set to provide foot Enough signal samplings could obtain preferable fitting precision, thus obtains higher certainty of measurement.Typically, the minimum needs of the method 4 labellings measure the alignment parameter in a direction, and therefore labelling cost is the highest.
The another kind of method of DBO technology based on experience is realized by the asymmetry measuring the positive and negative level of diffraction light time.Should Method, by measuring the angular spectrum of diffraction light, identifies the positive and negative level time of corresponding incident illumination and calculates their asymmetry.Due to just The asymmetry of negative level time approximates within the specific limits and is directly proportional with alignment parameter, and the method is minimum can use two to preset partially The labelling that difference is symmetrical realizes the measurement of a direction alignment parameter.Equally, this empirical method is also almost without calculating cost.
In sum, due to labelling low cost, almost without computational resource requirements and precision advantages of higher, based on experience The asymmetry using senior diffraction light is measured the technology of overlay error and is had advantage.This technology is by a big NA object lens light Pupil face records the angular spectrum of overlay mark diffraction light, calculates the asymmetry of the corresponding order of diffraction time in angular spectrum and tries to achieve alignment.This technology Mainly face problems with:
1, this technology uses the incident illumination of the multiple incident angles being spatially separating to measure the angular spectrum of diffraction light simultaneously, records angle Compose and affected by illumination heterogeneity;
2, this technology detects +/-level time diffraction light light intensity at the diverse location of ccd detector simultaneously, and asking, +/-level time is non- During symmetry, affected by ccd detector pixel sensitivity inhomogeneities.
Summary of the invention
The present invention provides a kind of alignment measurement apparatus and method, can reduce illumination spatial heterogeneity and detector is sensitive The degree heterogeneity impact on diffraction light nonuniform measurement.
For solving above-mentioned technical problem, the present invention provides a kind of alignment measurement apparatus, is used for detecting overlay error, including: Light source, is used for providing illuminating bundle;Object lens, for illuminating bundle converges to testing sample, and collect testing sample surface Diffraction light;Spatial light modulator, is positioned at objective lens pupil face, for controlling passing through of the diffracted beam of different diffraction level time;The One spectrogrph, for measuring the diffraction light spectrum by spatial light modulator.
As preferably, in described alignment measurement apparatus, described light source uses broadband light source.
As preferably, in described alignment measurement apparatus, described broadband light source includes: Xe lamp, halogen tungsten lamp and deuterium lamp.
As preferably, in described alignment measurement apparatus, the illuminating bundle that described light source sends by illumination path and After beam splitter, project on object lens.
As preferably, in described alignment measurement apparatus, another light beam after beam splitter projects on a detector.
As preferably, in described alignment measurement apparatus, described detector uses photodiode or the second spectrogrph.
As preferably, in described alignment measurement apparatus, described spatial light modulator uses iris or shutter.
As preferably, in described alignment measurement apparatus, described spatial light modulator is through mode spatial light modulator, Described through mode photomodulator includes transmission region and alternatively non-transparent region.
As preferably, in described alignment measurement apparatus, by the diffraction light of described spatial light modulator through an optics The first spectrogrph is entered after system.
As preferably, in described alignment measurement apparatus, described spatial light modulator is digital micromirror array.
A kind of alignment measuring method of the present invention, is applied in described alignment measurement apparatus, including: step 1: open light Source, moves to measuring hot spot on first set triplet labelling of testing sample;Step 2: switching spatial light modulator, makes one Senior the diffraction light in direction passes through and is transferred to the first spectrogrph, stops senior the diffraction light and zero in another direction simultaneously Level time diffraction light;Step 3: the spectrum of senior the diffraction light in first one direction of spectrometer measurement;Step 4: switching spatial light Manipulator, makes senior the diffraction light in another direction pass through and be transferred to the first spectrogrph;Step 5: the first spectrometer measurement The spectrum of senior the diffraction light in another direction;Step 6: measure hot spot and move to, on second set triplet labelling, repeat step Rapid 2~5;Step 7: calculate the asymmetry of first, second set senior diffraction light of triplet labelling;Step 8: according to non-right Title property calculates overlay error value.
As preferably, in described alignment measuring method, use formula A=I+1-I-1, calculate asymmetry;Wherein, I+1、I-1When being respectively incident illumination normal incidence to testing sample, the light intensity of 1 grade of light of +/-.
As preferably, in described alignment measuring method, use formula
Calculate overlay error value;
Wherein, A1It is the asymmetry recorded on first set triplet labelling, A2It is to record on second set triplet labelling Asymmetry, Δ is predetermined deviation.
Compared with prior art, the invention have the advantages that
1, use spectral measurement to substitute angular spectrum to measure, diffraction light respective stages time light intensity is detected.Due to spectral measurement Record the spectrum of light source and illumination ensemble average value, solve during angular spectrum is measured by light source and asking that illumination heterogeneity is affected Topic.
2, by using spatial light modulator, make different diffraction level time diffraction light measure and separate in time;Use same The most at the same level diffraction light is measured by spectrogrph, solves during angular spectrum is measured and uses ccd detector different piece to spread out difference Penetrate light to measure, thus introduce the heteropical problem of detector pixel sensitivity.
3, the present invention is directed to use the technical scheme of the corresponding order of diffraction time diffraction intensity asymmetry to be optimized, make survey During amount different diffraction level time light intensity, precision is higher, concordance more preferable, thus improves overlay error accuracy of detection.
Accompanying drawing explanation
Fig. 1 is the structural representation of alignment measurement apparatus in the embodiment of the present invention 1;
Fig. 2 is the structural representation of a kind of spatial light modulator in the embodiment of the present invention 1;
Fig. 3 is overlay mark cross sectional representation in the embodiment of the present invention 1;
Fig. 4 a and Fig. 4 b is respectively the top view of overlay mark in the embodiment of the present invention 1;
Fig. 5 is the graph of a relation in the embodiment of the present invention 1 between 1 grade of light asymmetry of +/-and overlay error;
Fig. 6 is the flow chart of alignment measuring method in the embodiment of the present invention 1;
Fig. 7 is the structural representation of alignment measurement apparatus in the embodiment of the present invention 2.
In Fig. 1~6: 101-light source, 102-illumination path, 103-beam splitter, 104-object lens, 105-testing sample, 1051- First set triplet labelling, 1052-second set triplet labelling, 106-spatial light modulator, 1061-transmission region, 1062-are non- Transmission region, 107-optical system, 108-spectrogrph.
In Fig. 7: 203-beam splitter, 206-spatial light modulator, 209-detector.
Detailed description of the invention
Understandable, below in conjunction with the accompanying drawings to the present invention for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from Detailed description of the invention be described in detail.It should be noted that, accompanying drawing of the present invention all uses the form of simplification and all uses non-essence Accurate ratio, only in order to facilitate, to aid in illustrating lucidly the purpose of the embodiment of the present invention.
Embodiment 1
Refer to Fig. 1, the alignment measurement apparatus of the present embodiment, including:
Light source 101, is used for providing illuminating bundle, and described light source 101 is broadband light source, uses Xe lamp, halogen tungsten lamp and deuterium Lamps etc., the light that light source 101 sends includes visible ray, such as, comprise the light of 400nm~800nm wavelength, and infrared light, such as wave-length coverage The light of 1000nm~1500nm, and ultraviolet light, such as the light of wavelength as little as 200nm;
Object lens 104, for illuminating bundle converges to testing sample 105, and collect the diffraction on testing sample 105 surface Light, specifically: the light that light source 101 sends, after illumination path 102 and beam splitter 103, is converged to testing sample by object lens 104 On the overlay mark of 105;
Spatial light modulator 106, is positioned at object lens 104 pupil plane, passes through for controlling the diffracted beam of different diffraction level time, Further, described spatial light modulator 106 uses iris or shutter.
Spectrogrph 108, for measuring the diffraction light spectrum by spatial light modulator 106;Specifically, by described space The diffraction light of photomodulator 106 enters spectrogrph 108 after an optical system 107, and spectrogrph 108 receives different diffraction lights, And record the spectrum of this diffraction light, when carrying out overlay error and measuring, for each overlay mark, need to measure its positive level respectively Secondary diffraction light and negative level time diffraction light, then calculate the diffraction intensity asymmetry under different wave length, finally utilize two alignments The asymmetry recorded on labelling, obtains overlay error.
The present embodiment uses spectral measurement to substitute angular spectrum and measures, and detects diffraction light respective stages time light intensity.Due to light Spectrometry records the spectrum of light source and illumination ensemble average value, solves during angular spectrum is measured and is affected with illumination heterogeneity by light source Problem.Meanwhile, by using spatial light modulator 106, make different diffraction level time diffraction light measure and separate in time;Use The most at the same level diffraction light is measured by same spectrogrph 108, solves during angular spectrum is measured and uses ccd detector different piece pair Different diffraction light measures, thus introduces the heteropical problem of detector pixel sensitivity.
Further, the present embodiment preferably employs through mode spatial light modulator as shown in Figure 2, and described through mode light is adjusted Device processed includes transmission region 1061 and alternatively non-transparent region 1062;Specifically, when only measure-1 grade of light light time spectrum ,-1 grade can be made Light is in transmission region 1061, and 0 grade of light is in alternatively non-transparent region 1062 with+1 grade of light.When the light time spectrum of+1 grade of light of measurement, can So that this spatial light modulator 106 revolves turnback.
It should be noted that use scatterometry commercial measurement overlay error based on experience, need special set blaze Note.The labelling measured for diffraction light can be periodic intensive line markings, and this type of labelling can make measurement equipment be easier to Record the diffraction efficiency of each order of diffraction time.The structure of the overlay mark that the present embodiment uses is as it is shown on figure 3, Cu/ in Fig. 3 FSG grating is underlying label, and the photoresist grating on surface is upper strata labelling, is separated by other process layers between two-layer labelling, actual Then need according to different production technologies in producing and measuring and determine, do not repeat.Up and down between two-layer grating marker Position deviation is i.e. the overlay error produced by photoetching process.
Fig. 4 a and Fig. 4 b shows a kind of overlay mark measured for overlay error on testing sample 105, and it is by the One, second set triplet labelling 1051,1052 composition, be used for measuring horizontal direction overlay error;It is of course also possible to design week Phase is that the labelling of vertical characteristics is for measuring vertical overlay error.Between the grating of two-layer up and down of 2 set triplet labellings 1051,1052 There is certain predetermined deviation-Δ and Δ, when there is overlay error in upper and lower two-layer process interlayer, the position of labelling such as Fig. 4 b institute Show.Measuring the positive and negative level time light diffraction efficiency asymmetry on 2 set triplet labellings 1051,1052 respectively, the present embodiment is with +/- As a example by 1 grade of light diffraction efficiency asymmetry, obtain
A1(ε-Δ)=k (ε-Δ) ... ... ... ... .... (1)
A2(ε+Δ)=k (ε+Δ)
Wherein, A1It is the asymmetry recorded on first set triplet labelling 1051, A2It is second set triplet labelling 1052 On the asymmetry that records.So-called asymmetry refers to the diffraction efficiency difference of the corresponding order of diffraction time, when incident illumination is normal incidence During situation, for the difference of its 1 grade of light light intensity of +/-, i.e.
A=I+1-I-1……………….(2)
Fig. 5 shows the situation that 1 grade of light asymmetry of +/-changes with overlay error, and wherein transverse axis is overlay error and mark The ratio in note cycle.Visible, asymmetry is to be approximated to proportional relation with overlay error near 0 at overlay error, therefore, according to The asymmetry recorded can be calculated overlay error
ϵ = A 1 + A 2 A 2 - A 1 · Δ . . . . . . . . . . . . . . . . . . . . . ( 3 )
Refer to Fig. 6, and combine Fig. 1~5, the present embodiment also provides for a kind of set being applied in above-mentioned alignment measurement apparatus Carve measuring method, including:
Step 1: open light source 101, moves to first set triplet labelling 1051 of testing sample 105 by measurement hot spot On.
Step 2: switching spatial light modulator 106, makes senior the diffraction light in a direction pass through, stops another simultaneously Senior the diffraction light in direction and zero level time diffraction light;It is to say, diffraction light now only has senior time of first direction Diffraction light can pass through, and the diffraction light of i.e. only negative level time (or positive level time) can pass through, senior the diffraction in another direction Light and zero order light are then blocked, it is impossible to arrive spectrogrph 108.It should be noted that senior diffraction light in the present embodiment refers to Be time diffraction lights of other certain one-levels beyond zero order light, such as +/-1 grade, +/-2 grades ...
Step 3: the spectrum of senior the diffraction light in said one direction measured by spectrogrph 108;
Step 4: switching spatial light modulator 106, makes senior the diffraction light in another direction pass through;
Step 5: the spectrum of senior the diffraction light in another direction measured by spectrogrph 108;
Step 6: measure hot spot and move to, on second set triplet labelling 1052 of testing sample 105, repeat step 2~5 After, enter step 7;
Step 7: calculate the asymmetry of senior diffraction light of first, second set triplet labelling 1051,1052, i.e. The spectrum calculating the positive and negative level of the correspondence time diffraction light recorded on two set triplet labellings 1051,1052 according to formula (2) is asymmetric Property.
Step 8: utilize asymmetry to calculate overlay error value, i.e. utilize asymmetry to calculate according to formula (3) and obtain set Carve error amount.
Embodiment 2
The present embodiment is with the distinctive points of embodiment 1, and the spatial light modulator of selection is different.
Refer to Fig. 7, the present embodiment uses reflective spatial light modulator 206 realize each order of diffraction time diffraction light Selection.Specifically, described spatial light modulator 206 uses digital micromirror array, it is possible to obtain more flexible space is adjusted Mode processed and faster modulating speed.
Continuing referring to Fig. 7, the present embodiment uses a detector 209 to measure the another light beam separated from beam splitter 203, Further, this detector 209 is photodiode, for measuring the bulk strength change of incident illumination;Certainly, described photoelectricity two Pole pipe can also replace with the second spectrogrph, to measure the drift of incident illumination overall spectrum.Remaining feature of the present embodiment and reality Executing example 1 identical, here is omitted.
To sum up, the present invention provides a kind of alignment measurement apparatus and method, is used for detecting overlay error, and this device includes: light Source, is used for providing illuminating bundle;Object lens, for illuminating bundle converges to testing sample, and collect testing sample surface Diffraction light;Spatial light modulator, is positioned at objective lens pupil face, for controlling passing through of the diffracted beam of different diffraction level time;First Spectrogrph, for measuring the diffraction light spectrum by spatial light modulator.Compared with prior art, the present invention has following excellent Point:
1, use spectral measurement to substitute angular spectrum to measure, diffraction light respective stages time light intensity is detected.Due to spectral measurement Record the spectrum of light source and illumination ensemble average value, solve during angular spectrum is measured by light source and asking that illumination heterogeneity is affected Topic;
2, by using spatial light modulator, make different diffraction level time diffraction light measure and separate in time;Use same The most at the same level diffraction light is measured by spectrogrph, solves during angular spectrum is measured and uses ccd detector different piece to spread out difference Penetrate light to measure, thus introduce the heteropical problem of detector pixel sensitivity;
3, the present invention is directed to use the technical scheme of the corresponding order of diffraction time diffraction intensity asymmetry to be optimized, make survey During amount different diffraction level time light intensity, precision is higher, concordance more preferable, thus improves overlay error accuracy of detection.
Obviously, those skilled in the art can carry out various change and the modification spirit without deviating from the present invention to invention And scope.So, if the present invention these amendment and modification belong to the claims in the present invention and equivalent technologies thereof scope it In, then the present invention is also intended to change and including modification include these.

Claims (13)

1. an alignment measurement apparatus, is used for detecting overlay error, it is characterised in that including:
Light source, is used for providing illuminating bundle;
Object lens, for illuminating bundle converges to testing sample, and collect the diffraction light on testing sample surface;
Spatial light modulator, is positioned at objective lens pupil face, for controlling passing through of the diffracted beam of different diffraction level time;
First spectrogrph, for measuring the diffraction light spectrum by spatial light modulator.
2. alignment measurement apparatus as claimed in claim 1, it is characterised in that described light source uses broadband light source.
3. alignment measurement apparatus as claimed in claim 2, it is characterised in that described broadband light source includes: Xe lamp, halogen tungsten lamp And deuterium lamp.
4. alignment measurement apparatus as claimed in claim 1, it is characterised in that the illuminating bundle that described light source sends is by illumination After light path and beam splitter, project on object lens.
5. alignment measurement apparatus as claimed in claim 4, it is characterised in that another light beam after beam splitter projects a spy Survey on device.
6. alignment measurement apparatus as claimed in claim 5, it is characterised in that described detector is photodiode or the second light Spectrometer.
7. alignment measurement apparatus as claimed in claim 1, it is characterised in that described spatial light modulator use iris or Shutter.
8. alignment measurement apparatus as claimed in claim 1, it is characterised in that described spatial light modulator is through mode spatial light Manipulator, described through mode photomodulator includes transmission region and alternatively non-transparent region.
9. alignment measurement apparatus as claimed in claim 1, it is characterised in that by the diffraction light warp of described spatial light modulator The first spectrogrph is entered after one optical system.
10. alignment measurement apparatus as claimed in claim 1, it is characterised in that described spatial light modulator is digital micro-reflection Lens array.
11. 1 kinds of alignment measuring methods, are applied in the alignment measurement apparatus as described in any one of claim 1~10, and it is special Levy and be, including:
Step 1: open light source, moves to measuring hot spot on first set triplet labelling of testing sample;
Step 2: switching spatial light modulator, makes senior the diffraction light in a direction pass through and be transferred to the first spectrogrph, with Time stop senior the diffraction light in another direction and zero level time diffraction light;
Step 3: the spectrum of senior the diffraction light in first one direction of spectrometer measurement;
Step 4: switching spatial light modulator, makes senior the diffraction light in another direction pass through and be transferred to the first spectrogrph;
Step 5: the spectrum of senior the diffraction light in first another direction of spectrometer measurement;
Step 6: measure hot spot and move to, on second set triplet labelling, repeat step 2~5;
Step 7: calculate first set asymmetry of senior diffraction light of triplet labelling, second set triplet labelling spreads out for senior time Penetrate the asymmetry of light;
Step 8: calculate overlay error value according to asymmetry,
Described senior diffraction light refers to other certain one-levels time diffraction light beyond zero level time diffraction light, and described asymmetry refers to Senior the diffraction light in one direction and the diffraction efficiency difference of senior the diffraction light in another direction.
12. alignment measuring methods as claimed in claim 11, it is characterised in that use formula A=I+1-I-1, calculate asymmetric Property;
Wherein, I+1、I-1When being respectively incident illumination normal incidence to testing sample, the light intensity of 1 grade of light of +/-.
13. alignment measuring methods as claimed in claim 11, it is characterised in that use formulaCalculate alignment Error amount,
Wherein, A1It is the asymmetry recorded on first set triplet labelling, A2Be second set triplet labelling on record non-right Title property, Δ is predetermined deviation.
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Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai

Patentee before: Shanghai Micro Electronics Equipment Co., Ltd.

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