CN104419921B - A kind of water-soluble silver protecting agent and preparation method thereof, chemical silver plating method and electroplate workpiece - Google Patents

A kind of water-soluble silver protecting agent and preparation method thereof, chemical silver plating method and electroplate workpiece Download PDF

Info

Publication number
CN104419921B
CN104419921B CN201310374346.3A CN201310374346A CN104419921B CN 104419921 B CN104419921 B CN 104419921B CN 201310374346 A CN201310374346 A CN 201310374346A CN 104419921 B CN104419921 B CN 104419921B
Authority
CN
China
Prior art keywords
water
silver
protecting agent
soluble silver
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310374346.3A
Other languages
Chinese (zh)
Other versions
CN104419921A (en
Inventor
董有军
连俊兰
林宏业
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Priority to CN201310374346.3A priority Critical patent/CN104419921B/en
Publication of CN104419921A publication Critical patent/CN104419921A/en
Application granted granted Critical
Publication of CN104419921B publication Critical patent/CN104419921B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1689After-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Chemically Coating (AREA)

Abstract

The invention provides a kind of water-soluble silver protecting agent and preparation method thereof; the water-soluble silver protecting agent is containing AEO, N benzyls phenyl acetamide and the aqueous solution for protecting additive, one or more of the protection additive in cyclododecane, 1 octadecylene, 7 octadecylenes, 1 laurylene.The electroplate workpiece obtained present invention also offers a kind of chemical silver plating method and by this method, including first chemical silvering, then carry out silver layer protection processing using the water-soluble silver protecting agent that the present invention is provided.The water-soluble silver protecting agent that the present invention is provided; the diaphragm of one layer of organic molecular structure can be formed on silvering surface; silver layer is avoided to be directly exposed in air or other corrosive environments; silver layer is prevented to be oxidized corrosion; with more preferable resistance to corrosion; ensure its good electric conductivity, the metallic luster for keeping silver coating good.

Description

A kind of water-soluble silver protecting agent and preparation method thereof, chemical silver plating method and surface plating Silver-colored workpiece
Technical field
The invention belongs to chemical plating field, more particularly to a kind of water-soluble silver protecting agent and preparation method thereof and one kind chemistry Silver-coating method and the electroplate workpiece obtained by the chemical silver plating method.
Background technology
Silvering have good electric conductivity, thermal conductivity, solderability, stability and with matrix reliable adhesion, and And the price of silver compares other noble metals, such as gold, platinum are also much lower, and therefore, argent is in electronics, communication, electrician and decoration It is widely used etc. industry, particularly in electronic connector, semiconductor, circuit lead frame and printed circuit board (PCB) Industry, is often required for carrying out silver-plated process.But, the production of above-mentioned electronic component, transport, installation and during use, With the H in environment2S、SO2、Cl2、NOxWhen being contacted Deng gas, or even when by ultraviolet light, all easily on silvering surface Corresponding corrosion product is generated, makes its blackening of turning to be yellow, can the big original electrical property of havoc silvering.
Using the method such as chemical passivation, electrolytic passivation, plating Au, Pd, Rh, Pd, Anti- tarnishing processing is carried out to silvering, all may be used It is corroded the phenomenon of discoloration with improving silvering to some extent.But, all there is Cr in chemical passivation method and electrolytic passivation method6+It is dirty The problem of dye, Au, Pd, Rh, Pd method are plated, its complex process, cost is also high.At present, also have by using silver in the prior art Protective agent can for example use BTA and/or benzo tetrazole in silver-plated layer surface formation diaphragm, but it is to silver layer Protecting effect is undesirable.
The content of the invention
The protecting effect that the present invention solves silver protecting agent in the prior art is poor, causes silver layer surface easily to aoxidize, drop The technical problem of low coating electric conductivity.
The invention provides a kind of water-soluble silver protecting agent, the water-soluble silver protecting agent is to contain aliphatic alcohol polyethenoxy Ether, N- benzyls phenyl acetamide and protect additive the aqueous solution, the protection additive be selected from cyclododecane, 1- octadecylenes, One or more in 7- octadecylenes, 1- laurylenes.
Present invention also offers the preparation method of the water-soluble silver protecting agent, including by AEO, N- Benzyl phenyl acetamide and protection additive are dissolved in the water, that is, obtain the water-soluble silver protecting agent.
Present invention also offers a kind of chemical silver plating method, this method includes workpiece to be plated being placed into chemical plating liquid Chemical plating is carried out, silver plate is obtained;Then silver plate is positioned over progress silver layer protection processing in water-soluble silver protecting agent again;Its It is characterised by, the water-soluble silver protecting agent that the water-soluble silver protecting agent provides for the present invention.
Finally, the invention provides a kind of electroplate workpiece, the electroplate workpiece include workpiece substrates to be plated and Plating is overlying on the silver coating on the workpiece substrates surface to be plated, and the surface of the silver coating is also covered with silver-colored protective layer;Its feature exists In the electroplate workpiece chemical silver plating method provided by the present invention is obtained.
The water-soluble silver protecting agent that the present invention is provided, by using AEO, N- benzyl phenyl acetamides With the compound system of protection additive;, should when protection processing is carried out to chemical silvering layer surface using the water-soluble silver protecting agent Water-soluble silver protecting agent can carry out parcel absorption on silvering surface, and form covalent bond and coordinate bond with silver atoms, mutually hand over For forming chain polymer, so that
Can silvering surface formed one layer of organic molecular structure diaphragm, it is to avoid silver layer be directly exposed to air or its In its corrosive environment, silver layer is prevented to be oxidized corrosion, with more preferable resistance to corrosion, it is ensured that its good electric conductivity.
Embodiment
The invention provides a kind of water-soluble silver protecting agent, the water-soluble silver protecting agent is to contain aliphatic alcohol polyethenoxy Ether, N- benzyls phenyl acetamide and protect additive the aqueous solution, the protection additive be selected from cyclododecane, 1- octadecylenes, One or more in 7- octadecylenes, 1- laurylenes.
The water-soluble silver protecting agent that the present invention is provided, by using AEO, N- benzyl phenyl acetamides With the compound system of protection additive;, should when protection processing is carried out to chemical silvering layer surface using the water-soluble silver protecting agent Water-soluble silver protecting agent can carry out parcel absorption on silvering surface, and form covalent bond and coordinate bond with silver atoms, mutually hand over For chain polymer is formed, the diaphragm of one layer of organic molecular structure can be formed on silvering surface, it is to avoid silver layer directly exposes In air or other corrosive environments, silver layer is prevented to be oxidized corrosion, with more preferable resistance to corrosion, it is ensured that it is good to lead Electrical property, the metallic luster for keeping silver coating good.
Specifically, in the water-soluble silver protecting agent that the present invention is provided, wherein AEO is non-ionic surface Activating agent.On the basis of the gross mass of the water-soluble silver protecting agent, the content of AEO is 13-15wt%.
The N- benzyls phenyl acetamide is the protectant one kind of silver-colored complex coordination, and it can be by being conjugated phenyl ring and silvering The silver atoms formation covalent bond and/or coordinate bond on surface, and chain polymer is alternateed into, so as to be effectively isolated argent Contact with air, in silver surface one layer of fine and close transparent organic molecular film of formation, plays Anti- tarnishing, increase silver layer corrosion resistance and resists The effect of oxidation;Organic protective film layer does not influence the electric conductivity and solderability of silver layer simultaneously.With the water-soluble silver protecting agent Gross mass on the basis of, the contents of N- benzyl phenyl acetamides is 4-9wt%.
In the present invention, it is described protection additive in cyclododecane, 1- octadecylenes, 7- octadecylenes, 1- laurylenes one Plant or a variety of;These four protection additives are similar because of structure, and with conjugated electrons pair, conjugation is identical, has to argent Similar suction-operated, can carry out high-quality Absorptive complex wave to silver layer, further lift quality of protection.With the water-soluble silver On the basis of protectant gross mass, the content of protection additive is 3-7wt%.
In the water-soluble silver protecting agent that the present invention is provided, it can also be protected containing other silver-colored complex coordinations commonly used in the prior art Agent is protected, for example can be selectively containing one or both of benzo tetrazole, lauryl mercaptan, but be not limited to this.It is preferred that feelings Under condition, on the basis of the gross mass of the water-soluble silver protecting agent, the content of benzo tetrazole is 4-9wt%.With the water solubility On the basis of the gross mass of silver protecting agent, the content of lauryl mercaptan is 4-8wt%.
Present invention also offers the preparation method of the water-soluble silver protecting agent, including by AEO, N- Benzyl phenyl acetamide and protection additive are dissolved in the water, that is, obtain the water-soluble silver protecting agent.
As it was previously stated, benzo tetrazole and/or lauryl mercaptan can also be contained in the water-soluble silver protecting agent, therefore, When preparing the water-soluble silver protecting agent, correspondingly, in addition to benzo tetrazole and/or lauryl mercaptan are dissolved in the water Step.
Present invention also offers a kind of chemical silver plating method, this method includes workpiece to be plated being placed into chemical plating liquid Chemical plating is carried out, silver plate is obtained;Then silver plate is positioned over progress silver layer protection processing in water-soluble silver protecting agent again;Institute State the water-soluble silver protecting agent that water-soluble silver protecting agent provides for the present invention.At the water-soluble silver protecting agent provided using the present invention Silver coating after reason has good metallic luster, and with more preferable resistance to corrosion.
Wherein, used in plating process and obtain chemical plating liquid and chemical plating process condition for those skilled in the art It is known, it is not particularly limited in the present invention, here is omitted.
And to silver plate carry out silver layer protection handle the step of be then:The water solubility that directly silver plate is provided with the present invention Silver protecting agent is contacted.Specifically, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 40-44 DEG C, Processing time is 2-4min.
As the common knowledge of those skilled in the art, in order that to obtain adhesion more preferable for silver coating, it is preferable that this method is also The step of pre-treatment is carried out to workpiece to be plated before being included in chemical plating.The pre-treatment includes oil removing, acid etching.In oil removing and acid Repeatedly washed respectively after erosion.
Finally, the invention provides a kind of electroplate workpiece, the electroplate workpiece include workpiece substrates to be plated and Plating is overlying on the silver coating on the workpiece substrates surface to be plated, and the surface of the silver coating is also covered with silver-colored protective layer;Its feature exists In the electroplate workpiece chemical silver plating method provided by the present invention is obtained.
In order that technical problem solved by the invention, technical scheme and beneficial effect are more clearly understood, below in conjunction with Specific embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used to The present invention is explained, is not intended to limit the present invention.Raw material is commercially available employed in embodiment and comparative example, the present invention It is not particularly limited.
Embodiment 1
(1)Each component is dissolved in the water according to following proportionings, the water-soluble silver protecting agent S1 of the present embodiment is prepared:Fat Alcohol APEO 13wt%;Benzo tetrazole 4wt%;Lauryl mercaptan 4wt%;Cyclododecane 3wt%;N- benzyl phenylacetyls Amine 4wt%, surplus is water;
(2)Surface is subjected to ultrasonic oil removing for the workpiece to be plated of copper coating, soaked after washing using 5wt% sulfuric acid solution Except oxide layer, progress chemical silvering processing in silver plating liquid is put into after washing, silver plating liquid composition is:Pyrovinic acid silver 0.1g/L, Sodium citrate 0.2g/L, ethylenediamine 0.1 g/L, ceric sulfate 0.1ppm, BTA 0.2ppm, lauryl sodium sulfate 5ppm, peregal 1ppm, it is 9.2 to reconcile pH value with sodium hydroxide solution;Silver plating liquid temperature is 52 DEG C, and the silver-plated time is 10min;Silver plate is obtained after the completion of silver-plated, silver plate is impregnated in step after washing(1)The water-soluble silver protecting agent S1 of preparation In, 3min is handled at 42 DEG C, then washes and is dried with centrifuge, obtain plating piece S10.
Embodiment 2
Water-soluble silver protecting agent S2 is prepared using step same as Example 1, and carries out chemical silvering, difference exists In:
Step(1)In, water-soluble silver protecting agent S2 composition is:AEO 14wt%;Benzo tetrazole 7wt%;Lauryl mercaptan 6wt%;Cyclododecane 5wt%;N- benzyl phenyl acetamide 6wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 44 DEG C, processing time For 4min.
By above-mentioned steps, the plating piece S20 of the present embodiment is obtained.
Embodiment 3
Water-soluble silver protecting agent S3 is prepared using step same as Example 1, and carries out chemical silvering, difference exists In:
Step(1)In, water-soluble silver protecting agent S3 composition is:AEO 15wt%;Benzo tetrazole 9wt%;Lauryl mercaptan 8wt%;Cyclododecane 7wt%;N- benzyl phenyl acetamide 9wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 40 DEG C, processing time For 2min.
By above-mentioned steps, the plating piece S30 of the present embodiment is obtained.
Embodiment 4
Water-soluble silver protecting agent 4 is prepared using step same as Example 1, and carries out chemical silvering, difference exists In:
Step(1)In, water-soluble silver protecting agent S4 composition is:AEO 14wt%;Lauryl mercaptan 6wt%;Cyclododecane 5wt%;N- benzyl phenyl acetamide 6wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 40 DEG C, processing time For 2min.
By above-mentioned steps, the plating piece S40 of the present embodiment is obtained.
Embodiment 5
Water-soluble silver protecting agent 5 is prepared using step same as Example 1, and carries out chemical silvering, difference exists In:
Step(1)In, water-soluble silver protecting agent S5 composition is:AEO 14wt%;Benzo tetrazole 7wt%;Cyclododecane 5wt%;N- benzyl phenyl acetamide 6wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 40 DEG C, processing time For 2min.
By above-mentioned steps, the plating piece S50 of the present embodiment is obtained.
Embodiment 6
Water-soluble silver protecting agent 6 is prepared using step same as Example 1, and carries out chemical silvering, difference exists In:
Step(1)In, water-soluble silver protecting agent S6 composition is:AEO 14wt%;Cyclododecane 5wt%;N- benzyl phenyl acetamide 6wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 40 DEG C, processing time For 2min.
By above-mentioned steps, the plating piece S60 of the present embodiment is obtained.
Embodiment 7
Water-soluble silver protecting agent S7 is prepared using step same as Example 1, and carries out chemical silvering, difference exists In:
Step(1)In, water-soluble silver protecting agent S7 composition is:AEO 14wt%;Benzo tetrazole 7wt%;Lauryl mercaptan 6wt%;1- octadecylenes 5wt%;N- benzyl phenyl acetamide 6wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 44 DEG C, processing time For 4min.
By above-mentioned steps, the plating piece S70 of the present embodiment is obtained.
Embodiment 8
Water-soluble silver protecting agent S8 is prepared using step same as Example 1, and carries out chemical silvering, difference exists In:
Step(1)In, water-soluble silver protecting agent S8 composition is:AEO 14wt%;Benzo tetrazole 7wt%;Lauryl mercaptan 6wt%;7- octadecylenes 5wt%;N- benzyl phenyl acetamide 6wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 44 DEG C, processing time For 4min.
By above-mentioned steps, the plating piece S80 of the present embodiment is obtained.
Embodiment 9
Water-soluble silver protecting agent S9 is prepared using step same as Example 1, and carries out chemical silvering, difference exists In:
Step(1)In, water-soluble silver protecting agent S9 composition is:AEO 14wt%;Benzo tetrazole 7wt%;Lauryl mercaptan 6wt%;1- laurylenes 5wt%;N- benzyl phenyl acetamide 6wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 44 DEG C, processing time For 4min.
By above-mentioned steps, the plating piece S90 of the present embodiment is obtained.
Comparative example 1
Water-soluble silver protecting agent DS1 is prepared using step same as Example 1, and carries out chemical silvering, difference It is:
Step(1)In, water-soluble silver protecting agent DS1 composition is:AEO 14wt%;Benzo tetrazole 4wt%;BTA 4wt%;Lauryl mercaptan 6wt%;Surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 44 DEG C, processing time For 4min.
By above-mentioned steps, the plating piece DS10 of the present embodiment is obtained.
Comparative example 2
Water-soluble silver protecting agent DS2 is prepared using step same as Example 1, and carries out chemical silvering, difference It is:
Step(1)In, water-soluble silver protecting agent DS2 composition is:AEO 14wt%;Benzo tetrazole 4wt%;BTA 4wt%;Lauryl mercaptan 6wt%;Cyclododecane 5wt%;Surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 44 DEG C, processing time For 4min.
By above-mentioned steps, the plating piece DS20 of the present embodiment is obtained.
Comparative example 3
Water-soluble silver protecting agent DS3 is prepared using step same as Example 1, and carries out chemical silvering, difference It is:
Step(1)In, water-soluble silver protecting agent DS3 composition is:AEO 14wt%;Benzo tetrazole 4wt%;BTA 4wt%;Lauryl mercaptan 6wt%;N- benzyl phenyl acetamide 6wt%, surplus is water;
Step(2)In, the condition of silver layer protection processing includes:The temperature of water-soluble silver protecting agent is 44 DEG C, processing time For 4min.
By above-mentioned steps, the plating piece DS30 of the present embodiment is obtained.
Performance test
Neutral salt spray test condition:In salt-mist corrosion tester, with the salting liquid that sodium chloride content is 5 ± 1%:Temperature At 35 DEG C, the collection liquid after spraying, pH value is 6.5 ~ 7.2.Allow with the watery hydrochloric acid after dilution or sodium hydroxide adjustment pH value. 35 DEG C of test space temperature;The continuous spray testing time is 72H;Then protected after ordinary atmospheric conditions, stabilization are returned in case Hold 2H.Outward appearance to each plating piece is detected.Standard:Non-corroding, discoloration, coating come off, and are designated as OK, are otherwise designated as NG.Survey Test result is as shown in table 1.
Table 1
Compare from the test result of upper table 1 as can be seen that the water-soluble silver protecting agent provided using the present invention is to silvering Carry out after protection processing, plating piece appearance is good, non-corroding, discoloration, coating obscission, hence it is evident that better than the plating in comparative example Part sample.
Compared from S10-S30 with S40-S60 test result as can be seen that in the water-soluble silver protecting agent that the present invention is provided When preferably comprising benzo tetrazole, lauryl mercaptan, its protecting effect to silver layer is more preferably.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.

Claims (12)

1. a kind of water-soluble silver protecting agent, it is characterised in that the water-soluble silver protecting agent be containing AEO, The aqueous solution of N- benzyls phenyl acetamide and protection additive, the protection additive is selected from cyclododecane, 1- octadecylenes, 7- ten One or more in eight alkene, 1- laurylenes;In the water-soluble silver protecting agent, the content of AEO is 13- The content of 15wt%, N- benzyl phenyl acetamide is 4-9wt%, and the content of protection additive is 3-7wt%.
2. water-soluble silver protecting agent according to claim 1, it is characterised in that also contain in the water-soluble silver protecting agent Benzo tetrazole.
3. water-soluble silver protecting agent according to claim 2, it is characterised in that in the water-soluble silver protecting agent, benzo The content of tetrazole is 4-9wt%.
4. water-soluble silver protecting agent according to claim 1, it is characterised in that also contain in the water-soluble silver protecting agent Lauryl mercaptan.
5. water-soluble silver protecting agent according to claim 4, it is characterised in that in the water-soluble silver protecting agent, 12 The content of mercaptan is 4-8wt%.
6. water-soluble protectant preparation method described in claim 1, it is characterised in that including by aliphatic alcohol polyethenoxy Ether, N- benzyls phenyl acetamide and protection additive are dissolved in the water, that is, obtain the water-soluble silver protecting agent.
7. preparation method according to claim 6, it is characterised in that also including by benzo tetrazole and/or lauryl mercaptan The step of being dissolved in the water.
8. a kind of chemical silver plating method, it is characterised in that this method, which includes workpiece to be plated being placed into chemical plating liquid, to be carried out Chemical plating, obtains silver plate;Then silver plate is positioned over progress silver layer protection processing in water-soluble silver protecting agent again;Its feature It is, the water-soluble silver protecting agent is the water-soluble silver protecting agent described in claim any one of 1-5.
9. chemical silver plating method according to claim 8, it is characterised in that the condition of silver layer protection processing includes:It is water-soluble Property silver protecting agent temperature be 40-44 DEG C, processing time is 2-4min.
10. chemical silver plating method according to claim 8, it is characterised in that this method is additionally included in before chemical silvering The step of pre-treatment is carried out to workpiece to be plated.
11. chemical silver plating method according to claim 10, it is characterised in that the pre-treatment includes oil removing, acid etching.
12. a kind of electroplate workpiece, the electroplate workpiece includes workpiece substrates to be plated and plating is overlying on the workpiece to be plated The silver coating of substrate surface, the surface of the silver coating is also covered with silver-colored protective layer;Characterized in that, the electroplate workpiece Obtained as the chemical silver plating method described in claim any one of 8-11.
CN201310374346.3A 2013-08-26 2013-08-26 A kind of water-soluble silver protecting agent and preparation method thereof, chemical silver plating method and electroplate workpiece Active CN104419921B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310374346.3A CN104419921B (en) 2013-08-26 2013-08-26 A kind of water-soluble silver protecting agent and preparation method thereof, chemical silver plating method and electroplate workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310374346.3A CN104419921B (en) 2013-08-26 2013-08-26 A kind of water-soluble silver protecting agent and preparation method thereof, chemical silver plating method and electroplate workpiece

Publications (2)

Publication Number Publication Date
CN104419921A CN104419921A (en) 2015-03-18
CN104419921B true CN104419921B (en) 2017-07-21

Family

ID=52970028

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310374346.3A Active CN104419921B (en) 2013-08-26 2013-08-26 A kind of water-soluble silver protecting agent and preparation method thereof, chemical silver plating method and electroplate workpiece

Country Status (1)

Country Link
CN (1) CN104419921B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107268214A (en) * 2017-06-20 2017-10-20 丹阳市斯鲍特体育用品有限公司 A kind of method that infusion process prepares conductive fencing metallic plastron fabric
CN110484901B (en) * 2018-05-15 2022-11-01 上海新阳半导体材料股份有限公司 Chemical silver plating solution, preparation method and application thereof
CN109853014B (en) * 2019-01-29 2020-10-27 广州鸿葳科技股份有限公司 Potassium sulfide-resistant silver antioxidant and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101225259A (en) * 2007-01-19 2008-07-23 李碧洁 Anticorrosion preservative used for silver layer surface
CN101974759A (en) * 2010-11-23 2011-02-16 海宁市科泰克金属表面技术有限公司 Post-treatment protective agent for rare and precious metals
CN102162095A (en) * 2011-03-01 2011-08-24 济南德锡科技有限公司 Anti-discoloring protective agent for silver plating and preparation method as well as application method thereof
CN102747372A (en) * 2011-04-22 2012-10-24 比亚迪股份有限公司 Copper protective agent and its preparation method and copper protection method
CN102747350A (en) * 2012-07-18 2012-10-24 深圳市成功科技有限公司 Gold/silver plating layer surface protective agent
CN102816462A (en) * 2012-08-13 2012-12-12 中国科学院宁波材料技术与工程研究所 Preparation method for nano-silver particles coated with organic protection agent on surfaces

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6627317B2 (en) * 2001-05-17 2003-09-30 Guardian Industries Corp. Heat treatable coated articles with anti-migration barrier layer between dielectric and solar control layers, and methods of making same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101225259A (en) * 2007-01-19 2008-07-23 李碧洁 Anticorrosion preservative used for silver layer surface
CN101974759A (en) * 2010-11-23 2011-02-16 海宁市科泰克金属表面技术有限公司 Post-treatment protective agent for rare and precious metals
CN102162095A (en) * 2011-03-01 2011-08-24 济南德锡科技有限公司 Anti-discoloring protective agent for silver plating and preparation method as well as application method thereof
CN102747372A (en) * 2011-04-22 2012-10-24 比亚迪股份有限公司 Copper protective agent and its preparation method and copper protection method
CN102747350A (en) * 2012-07-18 2012-10-24 深圳市成功科技有限公司 Gold/silver plating layer surface protective agent
CN102816462A (en) * 2012-08-13 2012-12-12 中国科学院宁波材料技术与工程研究所 Preparation method for nano-silver particles coated with organic protection agent on surfaces

Also Published As

Publication number Publication date
CN104419921A (en) 2015-03-18

Similar Documents

Publication Publication Date Title
EP1716949B1 (en) Immersion method
CA1172525A (en) Copper-containing articles with a corrosion inhibitor coating and method of producing the coating
CN101705482A (en) Alkyl sulfonic acid chemical tinning solution and chemical tinning solution based tinning process
JP6231124B2 (en) Method for producing a wire-bondable and solderable surface on a noble metal electrode
CN104419921B (en) A kind of water-soluble silver protecting agent and preparation method thereof, chemical silver plating method and electroplate workpiece
KR20160113304A (en) Pre-treatment process for electroless plating
JP6603756B2 (en) Eco-friendly nickel electroplating composition and method
CN104342643B (en) A kind of chemical plating liquid and silver-coating method
EP2182097B1 (en) Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
TW201413846A (en) Manufacture of coated copper pillars
KR101264460B1 (en) Aqueous solution and method for removing ionic contaminants from the surface of a workpiece
TWI660068B (en) Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same
KR102137300B1 (en) Iron boron alloy coatings and a process for their preparation
CN104451617B (en) A kind of water-soluble nickel protective agent and preparation method thereof, chemical nickel plating method and plating nickel on surface workpiece
CN102560451B (en) Chemical nano-silver plating solution and preparation method thereof, and silver plating method for copper part
KR20010042625A (en) Method for coating surfaces of copper or of a copper alloy with a tin or tin alloy layer
TWI395832B (en) Method for enhancing the solderability of a surface
KR100321205B1 (en) Anti-tarnishing solution and a method for preventing tarnishing of copper or copper alloy
MY143782A (en) Method for coating substrates containing antimony compounds with tin and tin alloys
CN104342645B (en) A kind of chemical plating liquid and silver-coating method
CA2481133A1 (en) Acidic solution for silver deposition and method for silver layer deposition on metal surfaces
JP4552550B2 (en) Method for producing tin plating film
CN104342644B (en) A kind of chemical plating liquid and silver-coating method
JP2014084491A (en) Surface treatment agent for copper and surface treatment method
JP3994295B2 (en) Method for preventing discoloration of copper or copper alloy material and copper or copper alloy material

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant