CN104409407A - Leading wire framework welding point positioning method - Google Patents
Leading wire framework welding point positioning method Download PDFInfo
- Publication number
- CN104409407A CN104409407A CN201410609693.4A CN201410609693A CN104409407A CN 104409407 A CN104409407 A CN 104409407A CN 201410609693 A CN201410609693 A CN 201410609693A CN 104409407 A CN104409407 A CN 104409407A
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- CN
- China
- Prior art keywords
- lead frame
- pin
- solder joint
- leading wire
- welding point
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
Abstract
The invention discloses a leading wire framework welding point positioning method. The method comprises steps that, image acquisition for a leading wire framework pin welding zone arranged at a set position is carried out, analysis and processing on the acquired image are carried out to acquire the practical position of a leading wire framework pin welding point, the practical position of the leading wire framework pin welding point is contrasted with a design position of the leading wire framework pin welding point to acquire offset of the leading wire framework pin welding point, adjustment on a leading wire bonding head position is carried out according to the offset, and then leading wire bonding is carried out. Through the method, the offset of the leading wire framework pin welding point relative to the design position can be rapidly and accurately detected, the practical center coordinate position of the bonding welding point can be figured out, so welding quality of the leading wire bonding technology is improved, characteristic extraction steps are simplified, algorithm complexity is reduced, and algorithm detection efficiency is improved.
Description
Technical field
The present invention relates to chips welding encapsulation field, be specifically related to a kind of localization method of lead frame solder joint.
Background technology
Chip package refers to be installed chip, fix, is sealed in base plate for packaging, and the I/O point on it is wired to the process on package casing pin.The main flow of chip package comprises silicon test and selection, burst, paster, wire bonding, Plastic Package and final packaging and testing.Wherein, paster process is chip attach again, is the processing procedure be fixed on by chip on the chip substrate of base plate for packaging or lead frame.The mode of paster mainly contains eutectic mounting method, welding mounting method, conducting resinl mounting method and glass cement mounting method.
The paster error produced in paster process mainly comprises: the position error that when scale error that the deviate of chip predefined normal place relative to substrate, chip and lead frame produce in the fabrication process and wire bonding, anchor leg framework produces, these errors are all random errors, cannot be eliminated by the mode prejudging error size.Therefore, reduce by strengthening improving precision to the control of motion platform the growth requirement that error can not meet chip package merely.
Summary of the invention
The object of the present invention is to provide a kind of localization method of lead frame solder joint, it can effectively solve the problem, and for lead bonding joint provides location corrected parameter, improves the precision of wire bonding.
For achieving the above object, the present invention adopts following technical side to implement:
A kind of localization method of lead frame solder joint, comprise and IMAQ is carried out to pin welding region on the lead frame being positioned at desired location, analyzing and processing is carried out to the image gathered and draws pin pad physical location on lead frame, pin pad design attitude on pin pad physical location and lead frame is compared the side-play amount drawing pin pad on lead frame, according to side-play amount, lead bonding joint position is adjusted, then carry out wire bonding.
Concrete scheme is:
Concrete grammar pin welding region being carried out to IMAQ is: the image being positioned at the lead frame with chip of desired location by the collection of computer machine vision system, then extract the ROI region in image and preserve the coordinate parameters of ROI region, described RIO area image is the topography only including lead frame pin welding region.
The concrete grammar that the image gathered carries out analyzing and processing is: extract the envelope linear order of each pin welding region in ROI region and virtual angle point, according to the envelope linear order of extraction and the span of virtual angle point determination pin solder joint circumscribed circle central coordinate of circle, then determine the circumscribed circle diameter of solder joint according to the spot size set and redundancy distance, the home position satisfied condition is lead frame pin solder joint physical location.
When solder joint circumscribed circle diameter is less than the minimum value of pin width, by pad localization lead-in wire limb angular bisector on and tangent near chip one end with pin.
Detailed is operating as:
One, preliminary treatment is carried out to the image of the lead frame pin welding region of machine vision assembly collection, according to the type of lead frame and size, ROI region is set, when determining the ROI region of lead frame pin, should using the nucleus of this region as image procossing, the image be in outside this ROI region is not all considered.When mass process is carried out to the image of lead frame pin solder joint, no longer reset ROI region sum functions parameter, and ensure the condition that optical environment, lead frame model are constant.
Two, for the lead frame pin welding region image in ROI region, extract image border and simulate the envelope linear order of welding region, the closed quadrilateral area that this linear order is formed is exactly the welding region of pin, and the intersection point of linear order is exactly the virtual angle point of welding region.To the parameter of record preprocessing function, fitting a straight line and virtual Robust Algorithm of Image Corner Extraction during ROI region process.The preconditioned functions of predefined parameter, fitting a straight line and virtual Robust Algorithm of Image Corner Extraction are called to predefined ROI region, extracts the envelope linear order of lead frame pin welding region and virtual angle point one by one.
Three, go out linear order and virtual angle point by the Fitting Calculation and calculate the home position of solder joint circumscribed circle in the quadrilateral area closed by linear order in conjunction with the solder joint circumscribed circle of predefine radius, using this home position as the actual location parameter of solder joint in welding region.
Four, the coordinate offset amount relative to design attitude is calculated by the coordinate parameters of lead frame pin solder joint physical location.Location corrected parameter using side-play amount as lead bonding joint, carries out on-line amending for every sheet chip to lead bonding joint location, improves lead key connection quality.
After carrying out preliminary treatment to image, what obtain is the image of single edges pixel.There is certain error in lead frame, and anchor leg framework can produce random position error in the mill when wire bonding, but the error of these kinds can not impact the shape of lead frame pin.Matching the envelope linear order of pin welding region can be obtained by the edge image extracted, the welding region of lead frame pin when the closed quadrilateral area that this linear order surrounds is exactly wire bonding, this quadrilateral area is strip region, calculates the virtual location angle point of four summits as this region of this closed quadrilateral area respectively.Because spot size during wire bonding adds the circumscribed circle diameter of solder joint edge to the redundancy distance formation solder joint at pin edge, therefore solder joint circumscribed circle home position can be calculated inside the quadrilateral area closed.The two long limits that solder joint circumradius and central coordinate of circle meet circumscribed circle and pin are tangent, and solder joint circumscribed circle does not exceed the condition of closed quadrilateral area.By solving of the solder joint circumscribed circle central coordinate of circle to interior tangent condition satisfied in each pin welding region of lead frame, the real coordinate position of lead frame pin solder joint can be obtained.Can calculate the side-play amount relative to design coordinate position by the real coordinate position of each pin solder joint on lead frame, this side-play amount is as the adjustment parameter of lead bonding joint tuning on-line correction.
Due to chip and substrate existing a lot of straightway, and these straightways are not the lead frame pin welding region edge needing to detect, and this brings very large interference and difficulty to Edge Gradient Feature.Therefore in the digital picture first collected in Vision Builder for Automated Inspection, ROI region is set, directly rejects other line segments that may produce interference.Determine extract the envelope linear order function parameter of each pin welding region and extract the function parameter of virtual angle point for the pin welding region image in ROI region.
When testing environment is constant, for chip and the lead frame of model of the same race, carry out mass process according to predefined ROI region and image processing function and parameter.Each pin welding region image of every width lead frame is processed, extracts the envelope linear order of lead frame pin welding region and virtual angle point.The closed area be made up of the envelope linear order of each pin is exactly each pin welding region of lead frame.Four virtual angle points of each pin welding region are as the foundation judging wire bonding pad circumscribed circle diameter span and solder joint circumscribed circle central coordinate of circle scope, wherein the size of solder joint Diameter of Solder Ball is decided through weld strength test, adds solder joint circumscribed circle and leg edge and certain redundancy distance will be kept to constitute the external diameter of a circle of solder joint.Ensure welding quality, then the actual Diameter of Solder Ball of this solder joint will meet the requirement of weld strength and redundancy distance.Lead frame pin welding region is the strip region of aspect ratio, and the basis on location of circumscribed circle in welding region of solder joint is tangent with two of welding region long limits, and circumscribed circle does not exceed the welding region that linear order surrounds.The home position satisfied condition is the physical location of lead frame pin solder joint.
The physical location of lead frame pin solder joint obtains do geometric transformation relative to design attitude.The coordinate offset amount (Δ x, Δ y) of each pin solder joint of lead frame can be calculated, as the foundation of lead bonding joint reorientation with pin solder joint actual coordinate parameter and the contrast of design coordinate parameters.
Said method can detect the deviation post of lead frame pin phase of solder joint for design attitude fast and accurately, calculate the practical center coordinate position of bonding welding point, improve the welding quality in lead key closing process, the impact of characteristic factor of the same race in non-relevant areas is eliminated by the method for human assistance, simplify the step of feature extraction, shorten the efficiency of the complexity of algorithm and the detection of raising algorithm, also pass through the mode of manual intervention to the screening of noise spot, improve the accuracy that algorithm detects.
Accompanying drawing explanation
Fig. 1 be the collection of computer machine vision system be positioned at the image of desired location with the lead frame of chip;
Fig. 2 is the schematic diagram after the partial enlargement of pin location.
Embodiment
In order to make objects and advantages of the present invention clearly understand, below in conjunction with embodiment, the present invention is specifically described.Should be appreciated that following word only in order to describe one or more concrete execution modes of the present invention, considered critical is not carried out to the protection range that the present invention specifically asks.
Principle of the present invention is as follows: set up one be enclosed within welding region solve inscribed circle central coordinate of circle method to each pin image calibration of lead frame, obtain the deviate of physical location relative to predefined normal place of lead frame pin solder joint, pigtail splice is adjusted according to deviate, effectively achieve chip in chip package and lead frame solder joint is accurately located.
Embodiment 1
A localization method for lead frame solder joint, comprises the steps:
One, at the mensuration flow stages determining preconditioned functions, envelope linear order detection function and virtual Corner Detection function parameter, the lead-bonding chip collected by computer machine vision system and the image of lead frame, as shown in Figure 1.In the image collected, arrange ROI region and preserve the coordinate parameters of ROI region, the RIO region of setting only includes the topography of lead frame pin, completes the setting of ROI region Image semantic classification function parameter, and removal of images disturbs.
Two, at the mensuration flow stages determining preconditioned functions, envelope linear order detection function and virtual Corner Detection function parameter, extract the envelope linear order of each pin welding region of lead frame and virtual angle point respectively for pretreated ROI region image, and the parameter extracting function is set.
Three, at the mensuration flow stages determining preconditioned functions, envelope linear order detection function and virtual Corner Detection function parameter, according to the span of envelope linear order and virtual angle point determination pin solder joint circumscribed circle central coordinate of circle.
Four, at the mensuration flow stages determining preconditioned functions, envelope linear order detection function and virtual Corner Detection function parameter, the spot size provided according to user and redundancy distance calculate the circumscribed circle diameter of solder joint.When solder joint circumscribed circle diameter is less than the minimum value of pin width, can by pad localization on the angular bisector of lead-in wire limb, and tangent to reduce wire length near chip one end with pin, the efficiency of raising wire bonding, as shown in Figure 2.The physical location of solder joint is considered as carry out translation to theoretical position and rotate the result of compound X-Y scheme conversion, the foundation physical location of lead frame and the deviation of design attitude can calculate the grid deviation that lead frame is located, this straggling parameter can locate the adjustment parameter of on-line amending as lead bonding joint, can be improved the quality of wire bonding by the location of dynamic conditioning bonding head further.
Five, in the batch detection stage of lead frame pin solder joint, under ensureing the condition that optical environment and chip to be checked and lead frame model are constant, adopt the Preprocessing Algorithm of ROI region and the test passes determined in experimental stage, envelope linear order and virtual angle point algorithm parameter to carry out mass process to lead frame image, calculate each pin solder joint offset parameter.
The above is only the preferred embodiment of the present invention; should be understood that; for those skilled in the art; to know in the present invention after contents; under the premise without departing from the principles of the invention; can also make some equal conversion to it and substitute, these convert on an equal basis and substitute and also should be considered as belonging to protection scope of the present invention.
Claims (4)
1. the localization method of a lead frame solder joint, comprise and IMAQ is carried out to pin welding region on the lead frame being positioned at desired location, analyzing and processing is carried out to the image gathered and draws pin pad physical location on lead frame, pin pad design attitude on pin pad physical location and lead frame is compared the side-play amount drawing pin pad on lead frame, according to side-play amount, lead bonding joint position is adjusted, then carry out wire bonding.
2. the localization method of lead frame solder joint according to claim 1, it is characterized in that, concrete grammar pin welding region being carried out to IMAQ is: the image being positioned at the lead frame with chip of desired location by the collection of computer machine vision system, then extract the ROI region in image and preserve the coordinate parameters of ROI region, described RIO area image is the topography only including lead frame pin welding region.
3. the localization method of lead frame solder joint according to claim 1 and 2, it is characterized in that, the concrete grammar that the image gathered carries out analyzing and processing is: extract the envelope linear order of each pin welding region in ROI region and virtual angle point, according to the envelope linear order of extraction and the span of virtual angle point determination pin solder joint circumscribed circle central coordinate of circle, then determine the circumscribed circle diameter of solder joint according to the spot size set and redundancy distance, the home position satisfied condition is lead frame pin solder joint physical location.
4. the localization method of lead frame solder joint according to claim 3, is characterized in that: when solder joint circumscribed circle diameter is less than the minimum value of pin width, by pad localization lead-in wire limb angular bisector on and tangent near chip one end with pin.
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| CN201410609693.4A CN104409407A (en) | 2014-11-03 | 2014-11-03 | Leading wire framework welding point positioning method |
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| CN201410609693.4A CN104409407A (en) | 2014-11-03 | 2014-11-03 | Leading wire framework welding point positioning method |
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| CN104409407A true CN104409407A (en) | 2015-03-11 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942496A (en) * | 2015-06-29 | 2015-09-30 | 湖南大学 | Car body-in-white welding spot positioning method and device based on robot visual servo |
| CN105374700A (en) * | 2015-11-26 | 2016-03-02 | 北京时代民芯科技有限公司 | High density integrated circuit bonding precision control method |
| CN113146622A (en) * | 2021-03-22 | 2021-07-23 | 哈尔滨工业大学 | Visual identification method for laser welding of framework skin structure |
| CN114713978A (en) * | 2022-05-13 | 2022-07-08 | 深圳市新浩科技有限公司 | Laser spot welding machine for processing optical photoelectron product |
| CN115642098A (en) * | 2022-09-14 | 2023-01-24 | 深圳源明杰科技股份有限公司 | Chip mounting and positioning method, device and equipment and readable storage medium |
| CN116309319A (en) * | 2023-01-29 | 2023-06-23 | 凌波微步半导体设备(常熟)有限公司 | Welding spot detection method |
| CN117245266A (en) * | 2023-11-17 | 2023-12-19 | 深圳市大族封测科技股份有限公司 | Welding spot correction method and device, computer equipment and storage medium |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942496A (en) * | 2015-06-29 | 2015-09-30 | 湖南大学 | Car body-in-white welding spot positioning method and device based on robot visual servo |
| CN105374700A (en) * | 2015-11-26 | 2016-03-02 | 北京时代民芯科技有限公司 | High density integrated circuit bonding precision control method |
| CN105374700B (en) * | 2015-11-26 | 2018-01-16 | 北京时代民芯科技有限公司 | A kind of high density integrated circuit is bonded accuracy control method |
| CN113146622A (en) * | 2021-03-22 | 2021-07-23 | 哈尔滨工业大学 | Visual identification method for laser welding of framework skin structure |
| CN113146622B (en) * | 2021-03-22 | 2022-07-05 | 哈尔滨工业大学 | Visual identification method for laser welding of framework skin structure |
| CN114713978A (en) * | 2022-05-13 | 2022-07-08 | 深圳市新浩科技有限公司 | Laser spot welding machine for processing optical photoelectron product |
| CN114713978B (en) * | 2022-05-13 | 2022-09-06 | 深圳市新浩科技有限公司 | Laser spot welding machine for processing optical photoelectron product |
| CN115642098A (en) * | 2022-09-14 | 2023-01-24 | 深圳源明杰科技股份有限公司 | Chip mounting and positioning method, device and equipment and readable storage medium |
| CN115642098B (en) * | 2022-09-14 | 2023-12-26 | 深圳源明杰科技股份有限公司 | Chip mounting and positioning method, device, equipment and readable storage medium |
| CN116309319A (en) * | 2023-01-29 | 2023-06-23 | 凌波微步半导体设备(常熟)有限公司 | Welding spot detection method |
| CN117245266A (en) * | 2023-11-17 | 2023-12-19 | 深圳市大族封测科技股份有限公司 | Welding spot correction method and device, computer equipment and storage medium |
| CN117245266B (en) * | 2023-11-17 | 2024-02-23 | 深圳市大族封测科技股份有限公司 | Welding spot correction method and device, computer equipment and storage medium |
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