CN104403087A - Flexible epoxy resin composition with hyperbranched structure and synthesis method thereof - Google Patents
Flexible epoxy resin composition with hyperbranched structure and synthesis method thereof Download PDFInfo
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- CN104403087A CN104403087A CN201410773074.9A CN201410773074A CN104403087A CN 104403087 A CN104403087 A CN 104403087A CN 201410773074 A CN201410773074 A CN 201410773074A CN 104403087 A CN104403087 A CN 104403087A
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Abstract
The invention relates to a flexible epoxy resin composition with a hyperbranched structure and a synthesis method thereof. The flexible epoxy resin composition comprises the following ingredients in parts by weight: 25-40 parts of epoxy resin, 15-20 parts of a hyperbranched polyester curing agent, 0-5 parts of other curing agents, 0.05-0.3 part of a curing accelerator and 30-55 parts of an inorganic filler. After the hyperbranched polyester curing agent is added, the synthesized polyester curing agent is applied to an epoxy electronic packaging material, the flexibility is excellent, the crosslinking density and the strength are large, the electronic packaging material is free of halogen, the machinability, the physical properties and the electrical property of the electronic packaging material are optimized, and the flexibility applied to the electronic packaging material is excellent, so that the cold and thermal shock resistances of the electronic packaging material is largely improved.
Description
Technical field
The invention belongs to electronic package material field, especially a kind of polyester solidifying agent and synthetic method thereof with dissaving structure.
Background technology
Epoxy resin is one of most widely used matrix resin in polymer matrix composite, polycondensation is carried out and obtained product by having the compound of epoxy group(ing) and multi-hydroxy or polyol compound, there is excellent cohesiveness, chemical resistance, electrical insulation properties, mechanical property, and be easy to processing, shrinking percentage is low, coefficient of linear expansion is little and the advantage such as with low cost, is widely used in the encapsulation of the electronic devices and components such as voltage dependent resistor, ceramic condenser, diode, triode.
But because the toughness of pure epoxy resin is not enough, cause curing material easily to become fragile, crack and cannot be used for the encapsulation that temperature cycle requires higher electronic devices and components, therefore, its application receives larger restriction.Based on this, Chinese scholars has carried out a large amount of study on the modification work to epoxy resin, summarizes many epoxy resin toughened methods: as adopted, expanded polystyrene veneer is epoxy resin toughened, liquid crystalline polymers is epoxy resin toughened, core-shell Polymer toughening epoxy resin, nano-particle toughening epoxy resin, macromole solidifying agent are epoxy resin toughened etc.
Although method for toughening is a lot, the actual method that can be applied to electronic package material, copper-clad plate base material and reinforcing bar protective system is also few.Because toughening material is used for electronic package material, copper-clad plate base material and reinforcing bar protective system must meet following five aspects: (1) toughening material is used for electronic package material, excellent stability in storage must be possessed; (2) toughening material is used for electronic package material, must ensure that electronic package material possesses excellent electrical property; (3) toughening material and epoxy resin have good consistency and can fully disperse in the epoxy; (4) toughening material is easy to process, makes modification be easy to carry out; Toughening material and epoxy resin mixing cured after, must ensure that electronic package material, copper-clad plate base material and reinforcing bar protective system possess excellent process based prediction model, as glass transition temperature Tg, thermotolerance, solvent-resisting should deteriorations.Therefore, the direct modified epoxy of macromole solidifying agent is adopted day by day to come into one's own; Wherein, the polymkeric substance of dissaving structure is owing to having low viscosity, high functionality, without the characteristic such as chain entanglement and good solubility, becoming a kind of epoxy resin toughened new way.
The present invention adopts a kind of multi-functional monomer synthesize polyester solidifying agent, thus makes polyester solidifying agent have dissaving structure, thus gives epoxy resin better snappiness.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part, there is provided a kind of composition epoxy resin that snappiness is good, product with stable quality, snappiness are good with dissaving structure, to meet electronic package material, copper-clad plate base material and reinforcing bar protective system to flexible requirement.
The technical scheme that the present invention realizes its object is:
There is a flexible composition epoxy resin for dissaving structure, its form component and mass fraction as follows:
Wherein, other solidifying agent do not comprise the polyester solidifying agent of dissaving structure;
The component of the polyester solidifying agent of described dissaving structure and parts by weight are stated as follows:
And the acid value 130-200mgKOH/g of the polyester solidifying agent of described dissaving structure, melt viscosity is 1500 ~ 4000mPas/180 DEG C, and softening temperature is 80 ~ 120 DEG C.
And the preparation process of the polyester solidifying agent of described dissaving structure is as follows:
(1) add neopentyl glycol and the TriMethylolPropane(TMP) that dissaving structure can be provided in a reservoir, heat up and stir, alcohol is melted;
(2) in the alcohol of fusing, add hexanodioic acid, m-phthalic acid and Mono-n-butyltin respectively, under logical nitrogen, be warming up to 150 DEG C, start esterification and produce esterification water to distillate;
(3) then carry out sectional type esterification, 150 ~ 180 DEG C of reacting by heating 2 ~ 4h, 180 ~ 220 DEG C of reacting by heating 1 ~ 3h, when esterification yield reaches more than 95%, vacuumize and carry out polycondensation, vacuum tightness-0.05 ~ 0MPa, the time 5 ~ 15min vacuumized;
(4) after polycondensation terminates, add trimellitic acid 1,2-anhydride end-blocking, stir, react 1 ~ 2h between 175 ~ 185 DEG C after, vacuumize, vacuum tightness-0.05 ~ 0MPa, time 5 ~ 10min;
(5) cooling discharge, through cooling compressing tablet, can obtain the polyester solidifying agent with dissaving structure.
And described epoxy resin requires that softening temperature is 60 ~ 110 DEG C, oxirane value is 0.12 ~ 0.25eq/100g.
And described epoxy resin comprises diglycidyl ether type epoxy resin, glycidyl ester type epoxy resin, preferred bisphenol A type epoxy resin.
And other solidifying agent described are at least one in organic acid or anhydrides.
And described curing catalyst is any one in imidazoles, imidazolines, trialkyl phosphorus, quaternary ammonium salt, quaternary phosphine salt, organic ureas;
And described mineral filler is at least one in silica flour, talcum powder, calcium carbonate, mica powder, wollastonite.
Have a method for the flexible composition epoxy resin of dissaving structure, step is as follows:
The polyester solidifying agent of epoxy resin, dissaving structure, other solidifying agent, curing catalyst and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded, wherein extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min, then carries out pulverizing and sieving obtaining described composition epoxy resin
Advantage of the present invention and positively effect are:
(1) the polyester solidifying agent of dissaving structure that adds when preparing epoxy resin of the present invention, this solidifying agent has dissaving structure, there is excellent snappiness and multi-functional, for the solidification of epoxy resin, not only can improve the snappiness of epoxy resin but also the cross-linking density of epoxy resin can be improved.
(2) the polyester solidifying agent of the dissaving structure of the present invention's selection, because the selected prices of raw and semifnished materials are cheap, for epoxy resin cure, can reduce the cost of epoxy resin; Synthesis technique is simple, condition is easy to control, administration measure.
(3) polyester solidifying agent provided by the invention has low viscosity, high functionality, without the characteristic such as chain entanglement and good solubility, makes the workability of electronic package material, physicals and electrical property etc. reach optimized degree.
(4) the present invention is after the polyester solidifying agent of the dissaving structure added, synthesized polyester solidifying agent is used for epoxy electronic package material, snappiness is good, cross-linking density is large, intensity is large and achieve the non-halogen of electronic package material, optimize the workability of electronic package material, physicals and electrical property, give the snappiness of electronic package material excellence thus increase substantially the cold-hot impact of electronic package material.
Embodiment
Below by specific embodiment, the invention will be further described, and following examples are descriptive, is not determinate, can not limit protection scope of the present invention with this.
Embodiment 1
Have a flexible composition epoxy resin for dissaving structure, its preparation method is as follows:
The polyester solidifying agent A of epoxy resin, dissaving structure, other solidifying agent, curing catalyst and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded (extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min), then carries out pulverizing and sieving obtaining described composition epoxy resin.Above-mentioned each material consumption is in table 1.
Wherein, the synthetic method of a kind of polyester solidifying agent A of dissaving structure, step is as follows:
(1) in the 1L four-hole boiling flask that heating jacket, agitator, thermometer, distillation column and prolong are housed, add 230g neopentyl glycol, 59g TriMethylolPropane(TMP), after being heated to about 120 DEG C stirring fusings, add
(2) enter 161g hexanodioic acid, 183g m-phthalic acid and 0.5g Mono-n-butyltin, logical nitrogen protection, after it dissolves, be slowly warming up to 150 DEG C and start esterification, and have water byproduct to flow out, control distillation column temperature in reaction process not higher than 100 DEG C,
(3) then carry out sectional type esterification, 150 ~ 180 DEG C of reacting by heating 2 ~ 4h, 180 ~ 220 DEG C of reacting by heating 1 ~ 3h, when esterification yield reaches more than 95%, vacuumize and carry out polycondensation, vacuum tightness-0.05 ~ 0MPa, the time 5 ~ 15min vacuumized; .
(4) add 254g trimellitic acid 1,2-anhydride end-blocking, react 2h at 175 ~ 185 DEG C after, vacuumize, vacuum tightness-0.05 ~ 0MPa, time 5 ~ 10min;
(5) discharging, through cooling compressing tablet, can obtain the polyester solidifying agent of light yellow clear shape dissaving structure.
The acid number of this solidifying agent A is 185mgKOH/g, and melt viscosity is 2250mPas/150 DEG C, and softening temperature is 109 DEG C.
Embodiment 2:
Have a flexible composition epoxy resin for dissaving structure, its preparation method is as follows:
The polyester solidifying agent B of epoxy resin, dissaving structure, other solidifying agent, curing catalyst and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded (extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min), then carries out pulverizing and sieving obtaining described composition epoxy resin.Above-mentioned each material consumption is in table 1.
A synthetic method of the polyester solidifying agent B of dissaving structure, step is as follows:
(1), in the 1L four-hole boiling flask that heating jacket, agitator, thermometer, distillation column and prolong are housed, add 230g neopentyl glycol, 56g TriMethylolPropane(TMP), after being heated to about 120 DEG C stirring fusings,
(2) add 175g hexanodioic acid, 150g m-phthalic acid and 0.6g Mono-n-butyltin, logical nitrogen protection, after it dissolves, be slowly warming up to 150 DEG C and start esterification, and have water byproduct to flow out, control distillation column temperature in reaction process not higher than 100 DEG C,
(3) then carry out sectional type esterification, 150 ~ 180 DEG C of reacting by heating 2 ~ 4h, 180 ~ 220 DEG C of reacting by heating 1 ~ 3h, when esterification yield reaches more than 95%, vacuumize and carry out polycondensation, vacuum tightness-0.05 ~ 0MPa, the time 5 ~ 15min vacuumized; .
(4) add 243g trimellitic acid 1,2-anhydride end-blocking, react 2h at 175 ~ 185 DEG C after, vacuumize, vacuum tightness-0.05 ~ 0MPa, time 5 ~ 10min;
(5) discharging, through cooling compressing tablet, can obtain the snappiness flame retardant polyester solidifying agent of light yellow clear shape dissaving structure.
The acid number of this solidifying agent B is 178mgKOH/g, and melt viscosity is 1800mPas/150 DEG C, and softening temperature is 95 DEG C.
Comparative example:
Epoxy resin, solidifying agent, curing catalyst, fire retarding synergist and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded (extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min), then carries out pulverizing and sieving.
The proportioning of three groups of example composition components and the performance of coating curing thing as shown in table 1.
The cold-hot impact of table 1 epoxy composite component proportion and coating curing thing
| Component | Unit | Reference example | Embodiment 1 | Embodiment 2 |
| Epoxy resin (E-12) | g | 50 | 35 | 35 |
| Solidifying agent: trimellitic acid 1,2-anhydride | g | 3.9 | — | — |
| The snappiness flame retardant polyester solidifying agent A of dissaving structure | g | — | 15 | — |
| The snappiness flame retardant polyester solidifying agent B of dissaving structure | g | — | — | 15 |
| Curing catalyst; Triphenyl phosphorus | g | 0.09 | 0.1 | 0.1 |
| Mineral filler: silicon-dioxide | g | 50 | 50 | 50 |
| Cold-hot impact | Individual | 20 | 90 | 80 |
Form components description as follows:
Involved epoxy resin is diglycidyl ether type epoxy resin, glycidyl ester type epoxy resin, preferred bisphenol A type epoxy resin; Require that softening temperature is 60 ~ 110 DEG C, oxirane value is 0.12 ~ 0.25eq/100g, account for 25 ~ 40 mass parts of encapsulating material total amount.
The acid value of the polyester solidifying agent of involved dissaving structure is 130-200mgKOH/g, and melt viscosity is 1500 ~ 4000mPas/180 DEG C, and softening temperature is 80 ~ 120 DEG C.
Other designed solidifying agent are at least one in organic acid or anhydrides, account for 0 ~ 5 mass parts of encapsulating material total amount.
Involved curing catalyst is any one in imidazoles, imidazolines, trialkyl phosphorus, quaternary ammonium salt, quaternary phosphine salt, organic ureas, accounts for 0.05 ~ 0.3 mass parts of encapsulating material total amount.
Involved mineral filler is at least one in silica flour, talcum powder, calcium carbonate, mica powder, wollastonite.The median size of these mineral fillers is between 1 ~ 50 micron.When median size is less, easily cause resin combination viscosity to rise, cause its packaging process to be deteriorated; And when median size is larger, can cause again resin and filler distribution uneven, thus have influence on its physical and mechanical properties.The addition of this mineral filler accounts for 30 ~ 55 mass parts of composition epoxy resin gross weight.
The using method of the flexibilized epoxies composition of this excellence:
By in 160 ± 10 DEG C of baking ovens the electronic devices and components such as voltage dependent resistor, ceramic condenser of preheating 30min to immerse in previously prepared powder powder (composition epoxy resin provided by the invention), then be put in 160 DEG C ± 10 baking ovens and solidify 1 ~ 2h.
Testing performance index method involved in the present invention is as follows:
(1) the mensuration of acid number: according to GB6743-86 " assay method of paint and varnish paint base acid number " described mensuration;
(2) melt viscosity: use Brookfield cone-and-plate viscometer to measure the melt viscosity of phosphorous-containing polyester solidifying agent at different temperature;
(3) softening temperature: measure according to the method described in GB12007.6-89 " epoxy resin softening point measurement method ring and ball method ";
(4) cold-hot impact: be that the destructive test that ftractures is occurred in the environment of high temperature and low temperature successively alternation to the coating of electronic devices and components; The design temperature of high temperature and time length all can require to set according to difference, and low temperature is also like this; The resistance to high temperature of coating and a low temperature, be called a circulation; The cycle index of coating before cracking is more, and its cold-hot impact property is better.
Cold-hot impact condition involved in the present invention: high temperature is set as+125 DEG C, and low temperature is set as-40 DEG C, and a high temperature and a low temperature continuous time are 30min, voltage dependent resistor magnetic sheet used, diameter 20 Φ, often organizes experiment 10 prints.
Claims (9)
1. there is a flexible composition epoxy resin for dissaving structure, it is characterized in that: its form component and mass fraction as follows:
Wherein, other solidifying agent do not comprise the polyester solidifying agent of dissaving structure;
The component of the polyester solidifying agent of described dissaving structure and parts by weight are stated as follows:
2. the flexible composition epoxy resin with dissaving structure according to claim 1, it is characterized in that: the acid value 130-200mgKOH/g of the polyester solidifying agent of described dissaving structure, melt viscosity is 1500 ~ 4000mPas/180 DEG C, and softening temperature is 80 ~ 120 DEG C.
3. the flexible composition epoxy resin with dissaving structure according to claim 1, is characterized in that: the preparation process of the polyester solidifying agent of described dissaving structure is as follows:
(1) add neopentyl glycol and the TriMethylolPropane(TMP) that dissaving structure can be provided in a reservoir, heat up and stir, alcohol is melted;
(2) in the alcohol of fusing, add hexanodioic acid, m-phthalic acid and Mono-n-butyltin respectively, under logical nitrogen, be warming up to 150 DEG C, start esterification and produce esterification water to distillate;
(3) then carry out sectional type esterification, 150 ~ 180 DEG C of reacting by heating 2 ~ 4h, 180 ~ 220 DEG C of reacting by heating 1 ~ 3h, when esterification yield reaches more than 95%, vacuumize and carry out polycondensation, vacuum tightness-0.05 ~ 0MPa, the time 5 ~ 15min vacuumized;
(4) after polycondensation terminates, add trimellitic acid 1,2-anhydride end-blocking, stir, react 1 ~ 2h between 175 ~ 185 DEG C after, vacuumize, vacuum tightness-0.05 ~ 0MPa, time 5 ~ 10min;
(5) cooling discharge, through cooling compressing tablet, can obtain the polyester solidifying agent with dissaving structure.
4. the flexible composition epoxy resin with dissaving structure according to claim 1, is characterized in that: described epoxy resin requires that softening temperature is 60 ~ 110 DEG C, oxirane value is 0.12 ~ 0.25eq/100g.
5. the flexible composition epoxy resin with dissaving structure according to claim 1, is characterized in that: described epoxy resin comprises diglycidyl ether type epoxy resin, glycidyl ester type epoxy resin, preferred bisphenol A type epoxy resin.
6. the flexible composition epoxy resin with dissaving structure according to claim 1, is characterized in that: other solidifying agent described are at least one in organic acid or anhydrides.
7. the flexible composition epoxy resin with dissaving structure according to claim 1, is characterized in that: described curing catalyst is any one in imidazoles, imidazolines, trialkyl phosphorus, quaternary ammonium salt, quaternary phosphine salt, organic ureas.
8. the flexible composition epoxy resin with dissaving structure according to claim 1, is characterized in that: described mineral filler is at least one in silica flour, talcum powder, calcium carbonate, mica powder, wollastonite.
9. there is a method for the flexible composition epoxy resin of dissaving structure as claimed in claim 1, it is characterized in that: step is as follows:
The polyester solidifying agent of epoxy resin, dissaving structure, other solidifying agent, curing catalyst and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded, wherein extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min, then carries out pulverizing and sieving obtaining described composition epoxy resin.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104987495A (en) * | 2015-08-04 | 2015-10-21 | 安徽泰达新材料股份有限公司 | Trimellitic anhydride modifier and powder composition thereof |
| CN105440263A (en) * | 2015-12-15 | 2016-03-30 | 广东广山新材料有限公司 | Epoxy resin curing agent, and preparation method and use thereof |
| CN106188512A (en) * | 2016-07-22 | 2016-12-07 | 哈尔滨理工大学 | A kind of low dielectric, the preparation method of high-toughness epoxy resin solidfied material |
| CN108940227A (en) * | 2017-05-19 | 2018-12-07 | 宁波大学 | It is a kind of to remove polymer adsorbing material of formaldehyde in air and preparation method thereof |
| CN109943269A (en) * | 2019-03-22 | 2019-06-28 | 重庆东吴道路工程有限公司 | Solvent-free environment-friendly and high-performance modified epoxy gluing material and preparation method thereof |
| CN112724598A (en) * | 2020-12-28 | 2021-04-30 | 广东盈骅新材料科技有限公司 | Resin composition, prepreg and preparation method and application thereof |
| US11286386B1 (en) | 2021-01-15 | 2022-03-29 | Wuhan Choice Technology Co., Ltd. | Circuit build-up film for wafer-level packaging, and fabrication method and use thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1962717A (en) * | 2006-11-14 | 2007-05-16 | 广州擎天实业有限公司 | Preparation method of polyester resin for mixing type powdery coating |
| CN101307171A (en) * | 2008-07-10 | 2008-11-19 | 天津市凯华绝缘材料有限公司 | Phosphorus-containing polyester fire retardant epoxy resin composition |
-
2014
- 2014-12-15 CN CN201410773074.9A patent/CN104403087A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1962717A (en) * | 2006-11-14 | 2007-05-16 | 广州擎天实业有限公司 | Preparation method of polyester resin for mixing type powdery coating |
| CN101307171A (en) * | 2008-07-10 | 2008-11-19 | 天津市凯华绝缘材料有限公司 | Phosphorus-containing polyester fire retardant epoxy resin composition |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104987495A (en) * | 2015-08-04 | 2015-10-21 | 安徽泰达新材料股份有限公司 | Trimellitic anhydride modifier and powder composition thereof |
| CN105440263A (en) * | 2015-12-15 | 2016-03-30 | 广东广山新材料有限公司 | Epoxy resin curing agent, and preparation method and use thereof |
| CN106188512A (en) * | 2016-07-22 | 2016-12-07 | 哈尔滨理工大学 | A kind of low dielectric, the preparation method of high-toughness epoxy resin solidfied material |
| CN106188512B (en) * | 2016-07-22 | 2018-06-29 | 哈尔滨理工大学 | A kind of low dielectric, the preparation method of high-toughness epoxy resin solidfied material |
| CN108940227A (en) * | 2017-05-19 | 2018-12-07 | 宁波大学 | It is a kind of to remove polymer adsorbing material of formaldehyde in air and preparation method thereof |
| CN108940227B (en) * | 2017-05-19 | 2020-12-29 | 宁波大学 | Polymer adsorption material capable of removing formaldehyde in air and preparation method thereof |
| CN109943269A (en) * | 2019-03-22 | 2019-06-28 | 重庆东吴道路工程有限公司 | Solvent-free environment-friendly and high-performance modified epoxy gluing material and preparation method thereof |
| CN112724598A (en) * | 2020-12-28 | 2021-04-30 | 广东盈骅新材料科技有限公司 | Resin composition, prepreg and preparation method and application thereof |
| CN112724598B (en) * | 2020-12-28 | 2023-01-06 | 广东盈骅新材料科技有限公司 | Resin composition, prepreg and preparation method and application thereof |
| US11286386B1 (en) | 2021-01-15 | 2022-03-29 | Wuhan Choice Technology Co., Ltd. | Circuit build-up film for wafer-level packaging, and fabrication method and use thereof |
| WO2022151517A1 (en) * | 2021-01-15 | 2022-07-21 | 武汉市三选科技有限公司 | Circuit laminate film for wafer-level packaging and sealing, preparation method therefor, and application thereof |
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